CN102786665A - 固化催化剂、组合物、电子器件和相关方法 - Google Patents
固化催化剂、组合物、电子器件和相关方法 Download PDFInfo
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- CN102786665A CN102786665A CN2012102704518A CN201210270451A CN102786665A CN 102786665 A CN102786665 A CN 102786665A CN 2012102704518 A CN2012102704518 A CN 2012102704518A CN 201210270451 A CN201210270451 A CN 201210270451A CN 102786665 A CN102786665 A CN 102786665A
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- catalyzer
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- lewis acid
- resin
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- 239000000203 mixture Substances 0.000 title claims abstract description 108
- 239000003054 catalyst Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title abstract description 12
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims abstract description 41
- -1 heterocyclic aromatic organic compound Chemical class 0.000 claims abstract description 35
- 239000002841 Lewis acid Substances 0.000 claims abstract description 27
- 150000007517 lewis acids Chemical class 0.000 claims abstract description 27
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims abstract description 20
- 150000001412 amines Chemical class 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 34
- 229910000679 solder Inorganic materials 0.000 claims description 31
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 150000008065 acid anhydrides Chemical class 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 9
- 125000006615 aromatic heterocyclic group Chemical group 0.000 claims description 8
- 125000005843 halogen group Chemical group 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 7
- 125000000538 pentafluorophenyl group Chemical group FC1=C(F)C(F)=C(*)C(F)=C1F 0.000 claims description 7
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 7
- 239000003351 stiffener Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 claims description 6
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 5
- 150000003512 tertiary amines Chemical class 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 229910052796 boron Inorganic materials 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 claims description 3
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 3
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 3
- 229910052733 gallium Inorganic materials 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229910052716 thallium Inorganic materials 0.000 claims description 3
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- 229910000085 borane Inorganic materials 0.000 claims description 2
- 239000003063 flame retardant Substances 0.000 claims description 2
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000049 pigment Substances 0.000 claims description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- GRSMWKLPSNHDHA-UHFFFAOYSA-N Naphthalic anhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=CC3=C1 GRSMWKLPSNHDHA-UHFFFAOYSA-N 0.000 claims 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- CHIHQLCVLOXUJW-UHFFFAOYSA-N benzoic anhydride Chemical compound C=1C=CC=CC=1C(=O)OC(=O)C1=CC=CC=C1 CHIHQLCVLOXUJW-UHFFFAOYSA-N 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 abstract 2
- 230000000052 comparative effect Effects 0.000 description 30
- 239000000463 material Substances 0.000 description 20
- 238000007711 solidification Methods 0.000 description 14
- 230000008023 solidification Effects 0.000 description 14
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 12
- 239000004593 Epoxy Substances 0.000 description 9
- 239000000654 additive Substances 0.000 description 9
- 230000000996 additive effect Effects 0.000 description 9
- 239000012530 fluid Substances 0.000 description 7
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 6
- 230000004907 flux Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 239000011541 reaction mixture Substances 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 4
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000004087 circulation Effects 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- PQNFLJBBNBOBRQ-UHFFFAOYSA-N indane Chemical compound C1=CC=C2CCCC2=C1 PQNFLJBBNBOBRQ-UHFFFAOYSA-N 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 235000019994 cava Nutrition 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000005496 eutectics Effects 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- SEULWJSKCVACTH-UHFFFAOYSA-N 1-phenylimidazole Chemical compound C1=NC=CN1C1=CC=CC=C1 SEULWJSKCVACTH-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- 150000001335 aliphatic alkanes Chemical class 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- 235000010290 biphenyl Nutrition 0.000 description 2
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- 235000013877 carbamide Nutrition 0.000 description 2
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 235000019439 ethyl acetate Nutrition 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 229940015043 glyoxal Drugs 0.000 description 2
- 150000002391 heterocyclic compounds Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 239000011968 lewis acid catalyst Substances 0.000 description 2
- HZVOZRGWRWCICA-UHFFFAOYSA-N methanediyl Chemical compound [CH2] HZVOZRGWRWCICA-UHFFFAOYSA-N 0.000 description 2
- 239000011859 microparticle Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
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- 150000003003 phosphines Chemical group 0.000 description 2
- 239000001294 propane Substances 0.000 description 2
- 239000000376 reactant Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000036962 time dependent Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- CIRMGZKUSBCWRL-LHLOQNFPSA-N (e)-10-[2-(7-carboxyheptyl)-5,6-dihexylcyclohex-3-en-1-yl]dec-9-enoic acid Chemical compound CCCCCCC1C=CC(CCCCCCCC(O)=O)C(\C=C\CCCCCCCC(O)=O)C1CCCCCC CIRMGZKUSBCWRL-LHLOQNFPSA-N 0.000 description 1
- GCWAFWMUTOXMIT-HWKANZROSA-N (e)-heptadec-2-ene Chemical compound CCCCCCCCCCCCCC\C=C\C GCWAFWMUTOXMIT-HWKANZROSA-N 0.000 description 1
- KVGQQRWGHWRPJF-UHFFFAOYSA-N 1,1'-biphenyl;butylphosphane Chemical compound CCCCP.C1=CC=CC=C1C1=CC=CC=C1 KVGQQRWGHWRPJF-UHFFFAOYSA-N 0.000 description 1
- WACNXHCZHTVBJM-UHFFFAOYSA-N 1,2,3,4,5-pentafluorobenzene Chemical compound FC1=CC(F)=C(F)C(F)=C1F WACNXHCZHTVBJM-UHFFFAOYSA-N 0.000 description 1
- ZWOULFZCQXICLZ-UHFFFAOYSA-N 1,3-dimethyl-1-phenylurea Chemical compound CNC(=O)N(C)C1=CC=CC=C1 ZWOULFZCQXICLZ-UHFFFAOYSA-N 0.000 description 1
- YDIZFUMZDHUHSH-UHFFFAOYSA-N 1,7-bis(ethenyl)-3,8-dioxatricyclo[5.1.0.02,4]oct-5-ene Chemical compound C12OC2C=CC2(C=C)C1(C=C)O2 YDIZFUMZDHUHSH-UHFFFAOYSA-N 0.000 description 1
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 1
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- 238000004293 19F NMR spectroscopy Methods 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- OPHSKKPSEMOQLM-UHFFFAOYSA-N 2-(2-phenylethenyl)-1h-imidazole Chemical class N=1C=CNC=1C=CC1=CC=CC=C1 OPHSKKPSEMOQLM-UHFFFAOYSA-N 0.000 description 1
- FALRKNHUBBKYCC-UHFFFAOYSA-N 2-(chloromethyl)pyridine-3-carbonitrile Chemical compound ClCC1=NC=CC=C1C#N FALRKNHUBBKYCC-UHFFFAOYSA-N 0.000 description 1
- SHKUUQIDMUMQQK-UHFFFAOYSA-N 2-[4-(oxiran-2-ylmethoxy)butoxymethyl]oxirane Chemical compound C1OC1COCCCCOCC1CO1 SHKUUQIDMUMQQK-UHFFFAOYSA-N 0.000 description 1
- YECWFFFKBCTNQX-UHFFFAOYSA-N 2-[[2-(cyclopenten-1-yl)phenoxy]methyl]oxirane Chemical compound C1OC1COC1=CC=CC=C1C1=CCCC1 YECWFFFKBCTNQX-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- DYWAPFDKPAHSED-UHFFFAOYSA-N 2-cycloheptyloxepane Chemical compound C1CCCCCC1C1OCCCCC1 DYWAPFDKPAHSED-UHFFFAOYSA-N 0.000 description 1
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- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- WBDSXISQIHMTGL-UHFFFAOYSA-N 2-methyl-4,5-diphenyl-1h-imidazole Chemical compound N1C(C)=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 WBDSXISQIHMTGL-UHFFFAOYSA-N 0.000 description 1
- GXDHCNNESPLIKD-UHFFFAOYSA-N 2-methylhexane Natural products CCCCC(C)C GXDHCNNESPLIKD-UHFFFAOYSA-N 0.000 description 1
- GSKPCWYORDSBPC-UHFFFAOYSA-N 2-naphthalen-2-yl-4,5-diphenyl-1h-imidazole Chemical compound C1=CC=CC=C1C1=C(C=2C=CC=CC=2)NC(C=2C=C3C=CC=CC3=CC=2)=N1 GSKPCWYORDSBPC-UHFFFAOYSA-N 0.000 description 1
- SDQVYUNYDAWYIK-UHFFFAOYSA-N 2-oxobut-3-enal Chemical compound C=CC(=O)C=O SDQVYUNYDAWYIK-UHFFFAOYSA-N 0.000 description 1
- RRMINFSIXCUCNS-UHFFFAOYSA-N 2-oxobutanamide Chemical compound CCC(=O)C(N)=O RRMINFSIXCUCNS-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- UPOLYUOBDJSLRC-UHFFFAOYSA-N 2-undec-1-enyl-1h-imidazole Chemical class CCCCCCCCCC=CC1=NC=CN1 UPOLYUOBDJSLRC-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- AEXMKKGTQYQZCS-UHFFFAOYSA-N 3,3-dimethylpentane Chemical compound CCC(C)(C)CC AEXMKKGTQYQZCS-UHFFFAOYSA-N 0.000 description 1
- AGULWIQIYWWFBJ-UHFFFAOYSA-N 3,4-dichlorofuran-2,5-dione Chemical compound ClC1=C(Cl)C(=O)OC1=O AGULWIQIYWWFBJ-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- YGOFNNAZFZYNIX-UHFFFAOYSA-N 3-N-phenylbenzene-1,2,3-triamine Chemical compound NC=1C(=C(C=CC1)NC1=CC=CC=C1)N YGOFNNAZFZYNIX-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical compound C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- XDKUKGIJDNUFGK-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CN=C[N]1 XDKUKGIJDNUFGK-UHFFFAOYSA-N 0.000 description 1
- FKBMTBAXDISZGN-UHFFFAOYSA-N 5-methyl-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1C(C)CCC2C(=O)OC(=O)C12 FKBMTBAXDISZGN-UHFFFAOYSA-N 0.000 description 1
- MJZYCDYAVCQQEQ-UHFFFAOYSA-N 5-tert-butyl-2-(4,5-diphenyl-1H-imidazol-2-yl)phenol Chemical compound OC1=CC(C(C)(C)C)=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 MJZYCDYAVCQQEQ-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- WDOBSYDOLMPPEN-UHFFFAOYSA-N C(#N)C(C)C(=O)C=O Chemical compound C(#N)C(C)C(=O)C=O WDOBSYDOLMPPEN-UHFFFAOYSA-N 0.000 description 1
- ZFCGXAIESSFJPT-UHFFFAOYSA-N C(CCCCCCCCCCC)C(C(=O)C=O)C1=CC=CC=C1 Chemical compound C(CCCCCCCCCCC)C(C(=O)C=O)C1=CC=CC=C1 ZFCGXAIESSFJPT-UHFFFAOYSA-N 0.000 description 1
- OQRJCLKYEDLZDX-UHFFFAOYSA-N C1CCC2=CC=CC=C12.[O] Chemical compound C1CCC2=CC=CC=C12.[O] OQRJCLKYEDLZDX-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
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Abstract
本发明提供一种固化催化剂、组合物、电子器件和相关方法。所述固化催化剂可包含路易斯酸并包含含氮分子或非叔膦中的一种或两种。所述含氮分子可包含单胺或杂环芳族有机化合物。可固化组合物可包含所述固化催化剂。电子器件可包含所述可固化组合物。本发明也提供了与上述有关的方法。
Description
本申请是申请号为200680022834.6、申请日为2006年6月9日的中国国家专利申请的分案申请。
背景技术
本发明包括涉及可固化组合物和相关方法的实施方案。本发明包括涉及引入所述组合物的器件的实施方案。
一些电子部件可通过熔点为约183摄氏度(℃)的低共熔锡/铅(Sn/Pb)焊料而连接。希望的是使用无铅焊料而不是低共熔焊料。但是无铅焊料的熔点与低共熔焊料的熔点可能不同。可替代的焊料的熔点范围可为约218摄氏度至约230摄氏度。焊料的熔点更高使得在回流过程中峰值温度可由约220摄氏度变为约240摄氏度至约260摄氏度范围的新的峰值。作为对该更高温度的响应,市售的非流动底部填料(NUF)可引发极度快速的固化,该快速固化可限制焊球并抑制良好的电连接的形成。
制造与无铅焊料一起使用的NUF用催化剂材料的尝试至今仍存在问题。所遇到的问题包括不可接受的电产率。希望的是具有这样一种可固化组合物,该组合物可用作底部填充材料并使无铅焊料具有改善的或不同的性能。
发明概述
在一个实施方案中,本发明提供了一种固化催化剂。所述固化催化剂可包含路易斯酸、并包含含氮分子或非叔膦中的一种或两种,其中所述含氮分子可包含单胺或杂环芳族有机化合物。
在一个实施方案中,本发明提供了一种组合物,其可包含第一混合物或第二混合物。所述第一混合物可包含可固化第一树脂和第一催化剂。所述第一催化剂可包含路易斯酸、并包含非叔胺或非叔膦中的一种或两种。所述第二混合物可包含可固化有机第二树脂和第二催化剂。所述第二催化剂可包含路易斯酸、并包含胺或膦中的一种或两种。在一个实施方案中,所述组合物可包含所述第一混合物和所述第二混合物。
在一个实施方案中,本发明提供了一种膜,其包含第一混合物,所述第一混合物包含固化的第一树脂和第一催化剂,所述第一催化剂包括路易斯酸、并包括非叔胺或非叔膦中的一种或两种;第二混合物,所述第二混合物包括路易斯酸、并包含胺或膦中的一种或两种;或所述第一混合物和所述第二混合物。
在一个实施方案中,本发明提供了一种电子器件。所述器件可包含含有无铅焊料和底部填充材料的电连接。所述底部填充材料可包含膜,其中所述膜可包含第一混合物、第二混合物或所述第一混合物和所述第二混合物。所述第一混合物可包含固化的第一树脂和第一催化剂。所述第一催化剂可包含路易斯酸并包含非叔胺或非叔膦中的一种或两种。所述第二混合物可包含可固化有机第二树脂和第二催化剂。所述第二催化剂可包含路易斯酸并包含胺或膦中的一种或两种。
在一个实施方案中,本发明提供了一种电子器件。所述器件可包括对区域和电连接进行填充的装置。所述区域可为管芯的内表面和基板的内表面所限定。所述电连接可包含无铅焊料,并且可使管芯固定到基板上。
附图简述
图1是包含本发明实施方案的电子器件的示意性剖视图。
图2是粘度随时间变化的图。
图3是两条热流固化曲线对温度的图。
图4是粘度随时间变化的图。
发明详述
本发明包括涉及与可固化组合物一起使用的催化剂的实施方案。本发明包括涉及可固化组合物和相关方法的实施方案。本发明包括涉及引入所述可固化组合物的器件的实施方案。
如说明书和权利要求全文中所述,可用近似语来修饰任何数量上的表达,所述表达可有变化但不会导致其所涉及的基本功能的变化。因此,通过术语如“约”和“基本上”修饰的值不局限于具体的精确值。催化剂指通常不会被引入聚合物链中的交联引发用物质。硬化剂指可被引入聚合物链中的交联引发用物质。
根据本发明的至少一些实施方案,可固化组合物(有时可选择性地称为底部填充组合物或底部填充材料)可具有对应于无铅焊料的熔点或熔点范围的固化初始温度或固化温度。与无铅焊料一起使用的情况下的合适的固化温度可以为大于约220摄氏度,或者为约220摄氏度至约240摄氏度,或者为约240摄氏度至约260摄氏度。
合适的无铅焊料的熔点可为约210摄氏度至约240摄氏度。市售的无铅焊料可以以商品名ALPHA VACULOY SACX0307得自CooksonElectronics Assembly Materials(Jersey City,New Jersey),其熔点为约231.8摄氏度。另一种市售的无铅焊料可以以商品名ENVIROMARK907得自Kester Co.(Des Plaines,Illinois),其回流温度范围为约180摄氏度至约240摄氏度。
合适的催化剂可包含路易斯酸,路易斯酸可与含氮分子或非叔膦中的一种或两种形成加合物或复合物。含氮分子可包含单胺或杂环芳族有机化合物。
合适的路易斯酸催化剂可以通过式(I)所示的结构来描述:
MRbXc(I)
其中M是B、Al、Ga、In或Tl;R各自独立地可相同或不同,可代表具有约6到约14个碳原子的一价芳烃基,这种一价芳烃基可具有至少一个吸电子元素或基团例如-CF3、-NO2或-CN,或可被至少两个卤素原子取代,并且b可为1、2或3;X可为卤素原子,c可为0、1或2;条件为b+c=3。
在一个实施方案中,路易斯酸催化剂可以通过式(II)所示的结构来描述:
BRbXc(II)
其中R各自独立地可相同或不同,可代表具有约6到约14个碳原子的一价芳烃基,这种一价芳烃基优选具有至少一个吸电子元素或基团例如-CF3、-NO2或-CN,或可被至少两个卤素原子取代,并且b为1、2或3;X为卤素原子,c为0、1或2;条件为b+c=3。
在一个实施方案中,路易斯酸可包括与含氮分子或非叔膦中的一种或两种的三芳基硼烷加合物或复合物。含氮分子可包括单胺或杂环芳族有机化合物。在一个实施方案中,路易斯酸可包括一个或多个不可水解的卤素。
三芳基硼烷组成中合适的芳基可包括下列基团中的一种或多种:五氟苯基、2,3,5,6-四氟苯基、2,3,4,5-四氟苯基、3,4,5-三氟苯-1-基和4-(五氟苯基)-2,3,5,6-四氟苯基等。芳基可以是彼此相同的或不同的,如果是不同的,其可在无需参照另一种侧基的情况下进行选择。在一个实施方案中,三芳基硼烷是五氟苯基硼烷[B(C6F5)3],复合物的芳基部分可基本上由五氟苯基构成。
合适的含氮分子包括单胺或杂环芳族有机化合物(例如苯胺、吡啶、嘧啶、吡咯、吡咯烷、吲哚或氮杂化合物)。在一个实施方案中,含氮分子或杂环芳族有机化合物可包括下列物质中的一种或多种:甘氨酸、五氟苯胺、甲基苯胺、二亚乙基三胺、二氨基二苯基胺、1-甲基咪唑、2-甲基咪唑、1-苯基咪唑、1,8-二氮杂双环[5,4,0]十一碳-7-烯(DBU)、2-乙基-4-甲基咪唑、2,4-二甲基咪唑、丁基咪唑、2-十七碳烯基-4-甲基咪唑、2-十一碳烯基咪唑、1-乙烯基-2-甲基咪唑、2-正十七烷基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基咪唑、2-乙基4-甲基咪唑、l-苄基-2-甲基咪唑、l-丙基-2-甲基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、1-氰基乙基-2-十一烷基咪唑、1-氰基乙基-2-苯基咪唑、1-胍氨基乙基-2-甲基咪唑、芳基取代的咪唑、苯基咪唑、苄基咪唑、2-甲基-4,5-二苯基咪唑、2,3,5-三苯基咪唑、2-苯乙烯基咪唑、1-(十二烷基苄基)-2-甲基咪唑、2-(2-羟基-4-叔丁基苯基)-4,5-二苯基咪唑、2-(2-甲氧基苯基)-4,5-二苯基咪唑、2-(3-羟基苯基)-4,5-二苯基咪唑、2-(对二甲氨基苯基)-4,5-二苯基咪唑、2-(2-羟基苯基)-4,5-二苯基咪唑、二(4,5-二苯基-2-咪唑)-苯-1,4,2-萘基-4,5-二苯基咪唑、1-苄基-2-甲基咪唑、2-对甲氧基苯乙烯基咪唑或2-苯基-4,5-二羟甲基咪唑。在一个实施方案中,含氮分子或杂环芳族有机化合物可包括咪唑和偏苯三酸的加成产物。在一个实施方案中,胺可基本上由咪唑构成。
合适的氮杂化合物可包括1,4-二氮杂双环[2,2,2]辛烷等。另一种合适的含氮分子可具有如下所示的结构。
合适的膦可包括一种或多种含磷组合物,例如三丁基膦、二苯基丁基膦、三苯基膦等。在一个实施方案中,膦可包括一种或多种非叔膦。在一个实施方案中,膦可基本上由一种或多种非叔膦构成。
路易斯酸与胺组合物和/或膦组合物的加合物可通过将这些化合物合并入惰性稀释剂(例如脂肪族或芳族烃)中而制得。可以使用过量的任一反应物,但是两个反应物可以以下列摩尔比合并:约0.5:1至约0.95:1、约1:0.95至约1:1、约1:1至约1:5或大于约1:5。反应可以在室温下进行,或在约-78摄氏度至约+150摄氏度的温度下进行。最终的加合物可通过过滤或溶剂蒸发来分离。
基于组合物总重量,合适的固化催化剂的量可为小于约5重量%(wt.%)。在一个实施方案中,固化催化剂可为组合物总重量的约0.001重量%至约0.01重量%、约0.01重量%至约0.1重量%或约0.1重量%至约1重量%。在一个实施方案中,固化催化剂可基于组合物中的树脂和硬化剂的重量而不是基于可包含填料重量的总重量。在这样的实施方案中,基于树脂和硬化剂的重量,固化催化剂的量可以小于约0.1重量%、约0.1重量%至约0.3重量%、约0.3重量%至约0.1重量%或大于约0.1重量%。
在一个实施方案中,可固化组合物(例如底部填充材料)可包括与可固化树脂(例如可固化有机树脂或诸如聚硅氧烷之类的可固化无机树脂)混合的固化催化剂。如果聚合物主链的特征是有机的,有机树脂可包含氧、杂原子等。在一个实施方案中,可固化有机树脂可包括环氧树脂。
合适的环氧树脂可包括如下的一种或多种:脂肪族环氧树脂、脂环族环氧树脂或芳族环氧树脂。合适的脂肪族环氧树脂可包括下列物质中的一种或多种:丁二烯二氧化物、二甲基戊烷二氧化物、二缩水甘油醚、1,4-丁二醇二缩水甘油醚、二甘醇二缩水甘油醚和二戊烯二氧化物等。在一个实施方案中,脂肪族环氧单体可包括下列物质中的一种或多种:1,4-丁二醇二缩水甘油醚、二甘醇二缩水甘油醚或二戊烯二氧化物二缩水甘油醚等。
合适的脂环族环氧树脂可包括下列物质中的一种或多种:3-环己烯基甲基-3-环己烯基羧酸酯二环氧化物、2-(3,4-环氧)环己基-5,5-(3,4-环氧)环己烷-间-二烷、3,4-环氧环己基烷基-3,4-环氧环己烷羧酸酯、3,4-环氧-6-甲基环己基甲基-3,4-环氧-6-甲基环己烷羧酸酯、乙烯基环己烷二氧化物、双(3,4-环氧环己基甲基)己二酸酯、双(3,4-环氧-6-甲基环己基甲基)己二酸酯、双(2,3-环氧环戊基)醚、2,2-双(4-(2,3-环氧丙氧基)环己基)丙烷、2,6-双(2,3-环氧丙氧基环己基-对-二烷)、2,6-双(2,3-环氧丙氧基)降冰片烯、亚油酸二聚体的二缩水甘油醚、柠檬烯二氧化物、2,2-双(3,4-环氧环己基)丙烷、二环戊二烯二氧化物、1,2-环氧-6-(2,3-环氧丙氧基)六氢-4,7-亚甲基茚满、对(2,3-环氧)环戊基苯基-2,3-环氧丙醚、1-(2,3-环氧丙氧基)苯基-5,6-环氧六氢-4,7-亚甲基茚满、(2,3-环氧)环戊基苯基-2,3-环氧丙醚、1,2-双(5-(1,2-环氧)-4,7-六氢亚甲基茚满氧基)乙烷、环戊烯基苯基缩水甘油醚、环己二醇二缩水甘油醚、二缩水甘油基六氢邻苯二甲酸酯和3-环己烯基甲基-3-环己烯基羧酸酯二环氧化物等。在一个实施方案中,脂环族环氧单体可包括如下的一种或多种:3-环己烯基甲基-3-环己烯基羧酸酯二环氧化物、3-(1,2-环氧乙基)-7-氧杂双环庚烷、己二酸双(7-氧杂双环庚基甲基)酯、2-(7-氧杂双环庚-3-基)-螺-(1,3-二氧杂-5,3’-(7)-氧杂双环庚烷和3,4-环氧环己烷羧酸甲酯等。
合适的芳族环氧树脂可包括下列物质中的一种或多种:双酚-A环氧树脂、双酚-F环氧树脂、苯酚酚醛清漆环氧树脂、甲酚-酚醛清漆环氧树脂、双酚环氧树脂、联苯环氧树脂、4,4’-联苯基环氧树脂、多官能环氧树脂、二乙烯基苯二氧化物、间苯二酚二缩水甘油醚和2-缩水甘油基苯基缩水甘油基醚。
根据本发明实施方案,树脂含量可用作其它成分的量的基础。如果存在,合适的树脂含量可以大于约1重量%。在一个实施方案中,树脂含量可以为约1至约5重量%、约5至约10重量%、约10重量%至约15重量%、约15重量%至约25重量%、约25重量%至约50重量%、约50重量%至约75重量%、约75重量%至约85重量%、约85重量%至约95重量%或大于约95重量%。可以在诸如其它成分的摩尔量和应用的特定参数之类的因素的基础上,对树脂的量进行调整、选择或确定。
合适的硬化剂可包括酸酐,例如羧酸酐。合适的羧酸酐可包括一种或多种芳族酸酐、脂肪族酸酐或脂环族酸酐,并且其可具有相对低的熔点(低于约100摄氏度)或在约室温下可以是液态的。
合适的羧酸酐可通过使羧酸与酰卤反应或通过使羧酸脱水(即脱去两个羧酸分子之间的水,从而形成酸酐)而制备。可选择地,羧酸酐可购自普通的化学品供应商。合适的羧酸酐可包括一种或多种芳族羧酸酐、脂肪族羧酸酐或脂环族羧酸酐。
在一个实施方案中,酸酐可以包括如下的一种或多种:甲基六氢邻苯二甲酸酐(MHHPA)、甲基四氢邻苯二甲酸酐、1,2-环己烷二羧酸酐、双环[2.2.1]庚-5-烯-2,3-二羧酸酐、甲基双环[2.2.1]庚-5-烯-2,3-二羧酸酐、邻苯二甲酸酐、均苯四酸二酐、六氢邻苯二甲酸酐、十二碳烯基琥珀酸酐、二氯代马来酸酐、氯茵酸酐、四氯邻苯二甲酸酐、十二碳烯基琥珀酸酐、2,2-二甲基戊二酸酐、戊二酸酐、六氟戊二酸酐、衣康酸酐、四丙烯基琥珀酸酐、马来酸酐、2-甲基戊二酸酐、2-甲基丙酸酐、1,2-环己烷二羧酸酐、十八烷基琥珀酸酐、2-或正辛烯基琥珀酸酐、2-苯基戊二酸酐、丙酸酐、3,3-四亚甲基戊二酸酐等。
如果使用,基于总的树脂含量的重量,所存在的硬化剂的量可以为约0.1重量%至约0.5重量%、约0.5至约1重量%、约1至约3重量%、约3至约5重量%、约5重量%至约10重量%、约10重量%至约15重量%、约15重量%至约25重量%、约25重量%至约50重量%或大于约50重量%。
可以使用可任选的添加剂。合适的添加剂包括如下的一种或多种:增挠剂、甲醇、增韧剂、流动改性剂、表面活性剂、润湿剂、消泡剂、有机稀释剂、阻燃剂或颜料。如果使用,基于组合物的总重量,所存在的添加剂的量可大于约0.5重量%。在一个实施方案中,基于树脂的总重量,所存在的添加剂的量可为约0.5重量%至约1重量%、约1重量%至约1.5重量%、约1.5重量%至约2.5重量%、约2.5重量%至约3.5重量%、约3.5重量%至约4.5重量%、约4.5重量%至约5.5重量%、约5.5重量%至约10重量%、约10重量%至约15重量%、约15重量%至约20重量%或大于约20重量%。
在一个实施方案中,根据本发明实施方案的可固化或固化的组合物可不含多硫化物基增韧剂。在一个实施方案中,根据本发明实施方案的可固化或固化的组合物可不含下列物质中的一种或多种:DBU-酚盐、DBU-己酸盐、DBU-甲酸盐、DBU-对甲苯磺酸盐,苯基二甲基脲、甲苯双二甲基脲、或亚甲基联苯双二甲基脲。
在一个实施方案中,添加剂可包括纳米级微粒,例如平均直径为约1纳米至约999纳米的二氧化硅微粒。诸如纳米级二氧化硅微粒之类的填料可使用相容性材料(例如有机硅烷)进行处理。另外,可将处理后的填料进行钝化,例如通过使用硅氮烷进行处理,这可减少或消除微粒表面上的活性封端位点,例如硅烷醇基团。
在一个实施方案中,添加剂可用作导热性填料、导电性填料、热绝缘填料、电绝缘填料等中的一种或多种。在一个实施方案中,可将添加剂加入树脂侧。在一个实施方案中,添加剂可在催化剂与树脂混合之前加入催化剂中,或者在催化剂和树脂混合过程中加入。
根据本发明的实施方案的固化催化剂和/或可固化组合物可包含溶剂。合适的溶剂可包括一种或多种有机溶剂,例如1-甲氧基-2-丙醇、甲氧基丙醇乙酸酯、乙酸丁酯、甲氧基乙基醚、甲醇、乙醇、异丙醇、乙二醇、乙基溶纤剂、甲基乙基酮、环己酮、苯、甲苯、二甲苯和溶纤剂(例如乙酸乙酯、乙酸溶纤剂、丁基溶纤剂乙酸酯、卡必醇乙酸酯和丁基卡必醇乙酸酯)及其组合。这些溶剂可单独使用或以两种或多种联合的形式使用。
基于可固化组合物的总重量,所存在的溶剂的重量%可大于约1重量%。在一个实施方案中,基于可固化组合物的总重量,所存在的溶剂的量可为约1重量%至约10重量%、约10重量%至约25重量%、约25重量%至约50重量%或大于约50重量%。
根据实施方案催化的树脂或可固化组合物可具有稳定和相对较长的保存期。稳定性可通过在相对较低的温度(例如室温)下、在预定时间内的粘度增加而说明。
在一个实施方案中,可以在固化过程中原位产生助熔剂例如羧酸。原位形成的助熔剂可源于(例如)酸酐和甲醇的反应。在另一个实施方案中,助熔剂可响应于预定的标准(例如达到预定的温度)从束缚态中释放出来。在可选择的实施方案中,助熔剂可直接加入组合物中,从而免除诸如形成或释放助熔剂的步骤。
参照图1,示出了包含本发明实施方案的电子器件100。器件100包括固定至基板104的管芯102。由无铅焊料形成的一个或多个电连接106(示出两个)使管芯102和基板104连接。可固化组合物(底部填充组合物/材料)108占据由管芯102的内表面和基板104的内表面所限定的体积110的至少一部分。区域112是与管芯102的外表面相邻的,可被可任选的密封剂材料(未示出)所占据,例如导热界面(TIM)材料。
根据本发明实施方案的方法可包括将可固化但未固化或仅仅部分固化的例如B阶化的)底部填充材料108置于至少一部分体积110中。随后,可将该底部填充材料固化。在固化底部填充材料108的同时,无铅焊球可被加热至熔点。相应地,无铅焊球可熔融并流动,进而形成一个或多个电连接106。因此,底部填料的固化温度和无铅焊球的熔点可在预定的参数或各自的范围内。
根据本发明实施方案的方法可包括将可固化但此时仍是未固化的或仅仅部分固化的(例如B阶化的)底部填充材料108置于至少一部分体积110中。可将该底部填充材料固化。在固化底部填充材料108的同时,无铅焊球可被加热至熔点。相应地,无铅焊球可熔融并流动,进而形成一个或多个电连接106。因此,底部填料的固化温度和无铅焊球的熔点可在预定的参数或各自的范围内。
在一个实施方案中,固化温度和熔融温度可为大于约150摄氏度、约150摄氏度至约160摄氏度范围、约160摄氏度至约170摄氏度、约170摄氏度至约180摄氏度、约180摄氏度至约190摄氏度、约190摄氏度至约200摄氏度、约200摄氏度至约210摄氏度、约210摄氏度至约220摄氏度、约220摄氏度至约230摄氏度、约230摄氏度至约240摄氏度、约240摄氏度至约250摄氏度或大于约250摄氏度。
在一个实施方案中,可在助熔材料在预定的温度下的助熔能力的基础上选择助熔材料,并将其加入底部填充材料中。所述预定的温度可被选择在底部填料的固化温度和/或无铅焊球的熔点的预定参数或各自范围内。合适的熔剂材料可包括本文中所公开的一种或多种酸酐和一份或多份甲醇。助熔材料可增加电连接内的电连通性。
实施例
下面的实施例是希望用于描述根据本发明的方法和实施方案,不应该理解为对权利要求施加限制。除非另有说明,所有的成分都可购自普通的化学品供应商,例如Aldrich Chemical Company(Milwaukee,Wisconsin)、Air Products(Allentown,Pennsylvania)、GE Silicones(Wilton,Connecticut)、Resolution Performance Products(Pueblo,Colorado)和Dainippon Ink and Chemicals Inc.(Tokyo,Japan)等。
实施例1:催化剂的制备
将5克(g)三(五氟苯基)硼烷和15ml无水甲苯加入100毫升(ml)圆底烧瓶中,形成悬浮液。将所得悬浮液在室温(25摄氏度)下搅拌5分钟,形成反应混合物。随后,将在5ml无水甲苯中的0.81g N-甲基咪唑滴加至反应混合物中。在全部加完N-甲基咪唑后,反应混合物是透明的。将反应混合物在室温下再搅拌1小时。搅拌约5分钟后观察到形成白色固体。随后,将30ml己烷加入反应混合物中,并将烧瓶置于冰箱中过夜。次日,将白色固体过滤并真空干燥,产生4.33g产物复合物。复合物的结构通过1H、13C和19F NMR确定。
实施例2:可固化组合物的制备
将均为环氧基的第一树脂(RSL-1739)和第二树脂(EXA-4700)与4-甲基六氢邻苯二甲酸酐(MHHPA)、甘油、和5,5’-(1,1,3,3,5,5-六甲基-1,5-三硅氧烷二基)双[六氢-4,7-桥亚甲基异苯并呋喃-1,3-二酮](TriSNBA)在室温下共混,以形成混合物。将所得混合物在室温下共混30分钟。将催化剂(POLYCAT SA-1或根据本发明实施方案的催化剂)和下表中所列的可任选的添加剂加入混合物中,从而形成制剂。将该制剂在室温下混合约30分钟,并在室温下脱气至少30分钟以形成可固化组合物。将所得可固化组合物在-40摄氏度下存储。
通过采用差示扫描量热仪(DSC)TA Instruments Q1000系统进行的非等温DSC实验,测定了反应热、固化的开始、固化峰值温度和玻璃化转变温度(Tg)。使用差示扫描量热法(DSC)控制可固化组合物的固化动力学。将约10毫克(mg)的可固化组合物各自密封在单独的铝制可密封的盘中。将每个样品和盘以30摄氏度/分钟的速率从室温加热至300摄氏度,然后冷却。记录固化过程中的热流。基于相同的可固化组合物的第二次加热循环测定了玻璃化转变温度。
助熔能力的测定:
使用清洁的铜层压FR-4板进行焊料助熔试验。在铜层压体上分配一部分可固化组合物(0.2g),并在该液滴内放置数个焊球。随后,用载玻片覆盖该液滴,并使铜板通过峰值温度为230℃的回流烘箱。将焊球铺开,并在光学显微镜下检测聚集。
组装的过程和试验:
标准的FR-4和高Tg/低CTE FR-4板用于组装,其具有电解镍和金色闪光层表面加工。在两块试验板上的引线焊盘通过焊接掩模(Taiyo/PSSR 4000)之外蚀刻的矩形沟槽来限定。使用22-规格的针(EFDInc)以点/线的形式在预先于150摄氏度至220摄氏度烘干20分钟至最多2小时的试验板的部件印迹区域(component footprint area)的中央分配控制量的可固化组合物。使用MRSI 505自动拾取和贴装机器贴装倒装芯片,其中用150克的贴装力和500毫秒的贴装头停留时间。使用ZEPHER对流式回流烘箱,利用具有吸收(soak)区域的无铅曲线,在峰值温度为约250摄氏度至约260摄氏度的条件下,进行这些试验模型(test vehicle)的回流。在回流之后在160℃下、1小时的后固化步骤对完成固化步骤是必要的。组装的倒装芯片经历1000次循环(停留时间:每次极值10分钟)的空气对空气热冲击(AATS)(-55摄氏度至+150摄氏度)。通过热冲击试验来监测可固化组合物的开裂和电连接。
实施例3至实施例6和比较例1:与可固化组合物的固化性能有关的催化剂浓度
在实施例3至实施例6和比较例1中,使用单一树脂并按照与实施例2相同的方式制备了可固化组合物,变化在于所加入的催化剂(如实施例1中所制备)的重量%列于表1中。
表1:实施例3至实施例6和比较例1的成分
成分 | 比较例1 | 实施例3 | 实施例4 | 实施例5 | 实施例6 |
RSL 1739(g) | 3.0 | 3.0 | 3.0 | 3.0 | 3.0 |
MHHPA中20重量%的TriSNBA | 2.72 | 2.72 | 2.72 | 2.72 | 2.72 |
Ricon 130MA8(g) | 0.50 | 0.50 | 0.50 | 0.50 | 0.50 |
甘油(g) | 0.238 | 0.238 | 0.238 | 0.238 | 0.238 |
催化剂(重量%) | 0 | 0.1 | 0.2 | 0.4 | 0.6 |
实施例1的催化剂(g) | 0.000 | 0.0065 | 0.0129 | 0.0258 | 0.0388 |
使用下列级别来评价可固化组合物的助熔能力并评价可固化组合物的固化度。
A.助熔能力:
1.焊球的形状没有变化
2.焊料开始坍塌
3.焊球坍塌但没有聚集
4.焊球坍塌并观察到一些聚集
5.焊球坍塌并观察到完全聚集
B.固化度:
1.室温下回流后为粘性流体
2.升高的温度下回流后为低粘性流体,室温下为粘性固体
3.升高的温度下回流后为粘性流体,室温下为固体
4.升高的温度下回流后为软体,室温下为固体
5.升高的温度下回流后为固体
表2:实施例3至实施例6和比较例1的结果
结果 | 比较例1 | 实施例3 | 实施例4 | 实施例5 | 实施例6 |
助熔无铅焊料的能力 | 5 | 5 | 5 | 5 | 5 |
固化度 | 1 | 3 | 4 | 5 | 5 |
DSC峰值温度(℃) | 无 | 260.2 | 255.4 | 252.7 | 248.4 |
DSC H初始温度(℃) | 无 | 227.6 | 223.7 | 221.7 | 218.2 |
DSC H(J/g) | 无 | 172.8 | 189.6 | 232.0 | 235.4 |
DSC Tg(℃) | 无 | 66.8 | 80.95 | 98.4 | 100.6 |
催化剂对于有效的固化来说是必需的。在缺乏催化剂的情况下可固化组合物获得最小的固化。表2中所列的结果表明,在实施例3至6中,制剂具有用于无铅焊料应用中的可接受的固化特性。
图2是由标号114所表示的图,示出了五条粘度118(厘泊)随时间(小时)变化的曲线。五条曲线分别对应于实施例3-6或比较例1。结果表明,随着催化剂浓度的提高,可固化组合物的粘度在室温下随时间的增加而增加。在不存在催化剂的情况下,粘度随时间增加而增加很少或不增加,如曲线120所示。催化剂的浓度越高,粘度随时间增加而增加的越大,如曲线122、124、126和128所示。
实施例7和比较例2-6:催化剂浓度对固化性能的影响
在实施例7和比较例2-6中,按照与实施例2相似的方式制备了可固化组合物,变化在于催化剂(POLYCAT SA-1)的重量%如表3所示。EXR4700与RSL1739的比为1:4。
表3:实施例7和比较例2-6的成分
表4:实施例7和比较例2-6的结果
表4的结果表明,比较例2至比较例6在相对小的催化剂浓度范围内具有用于无铅焊料应用中的可接受的固化特性。结果也表明,相对于实施例7,比较例2至比较例6要求催化剂的量相对降低。
图3是由标号130所表示的图,示出了两条热流(W/g)134随温度(摄氏度)132变化的曲线。实施例7的可固化组合物的初始温度或固化温度曲线如曲线136所示。比较例2的可固化组合物的初始温度或固化温度曲线如曲线138所示。实施例7的可固化组合物的固化温度可与无铅焊料材料的熔点大致相同。另外,实施例7的可固化组合物的初始温度或固化温度可比比较例2的可固化组合物(适于与含铅焊料一起使用)的固化温度或固化温度高约30摄氏度。
实施例8和比较例7:室温稳定性.
在实施例8中,可固化组合物包含实施例1的催化剂。比较例7包含POLYCAT SA-1作为催化剂。实施例8和比较例7包含表5所示含量的成分。实施例8和比较例7以与实施例2所公开的类似的方式制备而得。
表5.实施例8和比较例7的成分
成分 | 实施例8 | 比较例7 |
EXR 4700(g) | 0.5 | 0.5 |
RSL 1739(g) | 2.000 | 2.000 |
MHHPA(g) | 2.269 | 2.269 |
甘油(g) | 0.210 | 0.210 |
实施例1的催化剂(重量%) | 0.6000 | 0 |
POLYCAT SA-1(重量%) | 0 | 0.0300 |
通过两次热循环分析每个样品。第一次循环捕获固化热。第二次循环提供用于除去与固化无关的热事件的基线。每次循环中均减去基线数据。分析铟标准数据以确定在样品分析前对DSC的温度和热流校准。铟校准为在预期的初始温度的0.5摄氏度范围内,在预期的热流的0.2焦耳/克(J/g)范围内。
图4是由标号140所表示的图,示出了两条室温下粘度118随时间116变化的曲线。曲线142示出了实施例8的粘度曲线,曲线144出了比较例7的粘度曲线。曲线142和144的对比表明,与实施例8相比,比较例7粘度随时间增加较大。即,相对于市售材料,根据本发明的实施方案在室温下可具有改善的或更长的储存期。
如表6所示,同时参照图4,结果表明,与使用市售催化剂(其量足够获得可接受固化)的材料相比,根据本发明的实施方案的可固化组合物在室温下存储8小时后具有相对更低的粘度。另外,为了获得所需的固化性能,表5示出相对于比较例8的催化剂浓度,比较例7中的催化剂浓度降低。比较例7中的催化剂浓度足够低至在所需浓度范围内相对困难地计量催化剂。
表6.实施例8和比较例7的结果
结果 | 实施例8 | 比较例7 |
助熔无铅焊料的能力 | 5 | 5 |
固化度 | 5 | 5 |
上述实施例仅仅是说明本发明,仅用来说明本发明的一些特征。所附的权利要求意指要求本发明如所设想的一样宽。此处给出的实施例是说明从所有可行的实施方案的多种形式中选择的实施方案。因此,申请人的目的是:所附的权利要求不应受限于用来说明本发明特征的实施例的选择。正如在权利要求中所用的,开放式措词“包含”和它的语法变化形式逻辑上也对应着并包含变化的和不同范围的措词,例如,但不限于“基本上包括”和“由……组成”。提供了范围,该范围可被联合和/或交换限定,那些范围包括它们之间的所有子区间。可以认识到:对本领域的普通技术人员而言,这些范围内的变化将显示它们自身,并且在没有对公知作出贡献时,那些变化用可能地认为被所附的权利要求覆盖。科技的进步可使得等同物和替换物成为可能,这些等同物和替换物因语言的不精确目前未被注意过,并且这些变化也应认为可以被所附的权利要求覆盖。
Claims (36)
1.一种可固化组合物,其包含可固化树脂和固化催化剂,其中所述固化催化剂包含:
路易斯酸,所述路易斯酸具有式(I)所示的结构:
MRbXc (I)
其中M是B、Al、Ga、In或Tl;每个出现的R独立地为具有约6到约14个碳原子的一价芳烃基,可任选地,所述一价芳烃基具有吸电子元素或基团,或被至少两个卤素原子取代,并且b为1、2或3;X为卤素原子,c为0、1或2;条件为b+c=3;以及
含氮分子或非叔膦中的一种或两种,其中所述含氮分子包含单胺或杂环芳族有机化合物,
其中所述路易斯酸包含一个或多个不可水解的卤素。
2.权利要求1所述的可固化组合物,其中所述路易斯酸是与所述含氮分子或所述非叔膦中的一种或两种形成的复合物或加合物。
3.权利要求1所述的可固化组合物,其中所述含氮分子包括1,8-二氮杂双环[5,4,0]十一碳-7-烯或甲基咪唑中的一种或两种。
4.权利要求1所述的可固化组合物,其中所述路易斯酸包括三价硼烷。
5.权利要求4所述的可固化组合物,其中所述路易斯酸包括三芳基硼烷。
6.权利要求4所述的可固化组合物,其中所述三芳基硼烷包含苯基、五氟苯基、2,3,5,6-四氟苯基、2,3,4,5-四氟苯基、3,4,5-三氟苯-1-基或4-(五氟苯基)-2,3,5,6-四氟苯基中的一种或多种。
7.权利要求1所述的可固化组合物,其中所述可固化树脂是环氧树脂。
8.一种通用制品,其包含权利要求1所述的可固化组合物。
9.一种电子器件,其包含:
用于填充由管芯的内表面和基板的内表面所限定的区域的装置;以及
包含无铅焊料的电连接,所述电连接可将所述管芯固定至所述基板,
其中所述装置包含权利要求1所述的可固化组合物。
10.一种可固化组合物,其包含:
A)第一混合物,其包含可固化第一树脂和第一催化剂,所述第一催化剂包含路易斯酸并包含非叔胺或非叔膦中的一种或两种;
B)第二混合物,其包含可固化有机第二树脂和第二催化剂,所述第二催化剂包含路易斯酸并包含胺或膦中的一种或两种;或
A)和B)两者。
11.根据权利要求10的组合物,其中所述第一催化剂和所述第二催化剂是彼此不同的。
12.根据权利要求10的组合物,其中所述第一催化剂和所述第二催化剂是相同的。
13.权利要求10所述的组合物,其中所述第一催化剂可在大于150摄氏度的温度范围下固化所述第一树脂。
14.权利要求10所述的组合物,其中所述第二催化剂可在大于150摄氏度的温度范围下固化所述第二树脂。
15.权利要求10所述的组合物,该组合物还包含响应于预定的标准而可原位形成助熔剂的成分。
16.权利要求10所述的组合物,该组合物还包含响应于预定的标准而可释放助熔剂的成分。
17.权利要求10所述的组合物,其中所述路易斯酸包括三芳基硼烷。
18.权利要求17所述的组合物,其中所述三芳基硼烷包括B(C6F5)3。
19.权利要求17所述的组合物,其中所述三芳基硼烷包含苯基、五氟苯基、2,3,5,6-四氟苯基、2,3,4,5-四氟苯基、3,4,5-三氟苯-1-基或4-(五氟苯基)-2,3,5,6-四氟苯基中的一种或多种。
20.权利要求17所述的组合物,其中所述三芳基硼烷组分基本上由五氟苯基构成。
21.权利要求10所述的组合物,其中所述路易斯酸与所述非叔胺、非叔膦、胺或膦中的一种或多种形成复合物。
22.权利要求10所述的组合物,其中所述路易斯酸具有式(II)所示的结构:
MRbXc (II)
其中M是B、Al、Ga、In或Tl;每个出现的R独立地为具有约6到约14个碳原子的一价芳烃基,可任选地,所述一价芳烃基具有吸电子元素或基团,或被至少两个卤素原子取代,并且“b”为1、2或3;X为卤素原子,“c”为0、1或2;条件为(b+c)=3。
23.权利要求22所述的组合物,其中M为硼。
24.权利要求22所述的组合物,其中所述吸电子元素或基团包括-CF3、-NO2或-CN中的一种或多种。
25.权利要求10所述的组合物,其中所述路易斯酸包含一个或多个不可水解的卤素。
26.权利要求10所述的组合物,其中所述催化剂在所述组合物中的量为占所述组合物总重量的约0.01重量%至约5重量%。
27.权利要求10所述的组合物,其中所述可固化树脂包括脂肪族环氧树脂、脂环族环氧树脂或芳族环氧树脂中的一种或多种。
28.权利要求10所述的组合物,该组合物还包含增挠剂、有机稀释剂、阻燃剂、颜料、增韧剂或流动改性剂中的一种或多种。
29.权利要求10所述的组合物,该组合物还包含纳米级二氧化硅填料。
30.权利要求10所述的组合物,该组合物还包含硬化剂。
31.权利要求30所述的组合物,其中所述硬化剂包括一种或多种酸酐。
32.权利要求31所述的组合物,其中所述酸酐包括羧酸酐。
33.权利要求31所述的组合物,其中所述酸酐包括邻苯二甲酸酐、六氢邻苯二甲酸酐、甲基-六氢邻苯二甲酸酐、4-硝基邻苯二甲酸酐、萘四甲酸二酐、萘二甲酸酐、四氢邻苯二甲酸酐、苯甲酸酐或硅氧烷二酐中的一种或多种。
34.一种固化的膜,其包含:
A)第一混合物,其包含固化的第一树脂和第一催化剂,所述第一催化剂包含路易斯酸并包含单胺或杂环芳族有机化合物中的一种或两种;
B)第二混合物,其包含固化的有机第二树脂和第二催化剂,所述第二催化剂包含路易斯酸并包含含氮分子或非叔膦中的一种或两种;或
A)和B)两者。
35.一种电子器件,其包含:
底部填充材料,所述底部填充材料包含权利要求34所述的固化的膜;以及
电连接,所述电连接包含至少一部分置于所述膜内的无铅焊料。
36.一种电子器件,其包含:
用于填充由管芯的内表面和基板的内表面所限定的区域的装置;以及
包含无铅焊料的电连接,所述电连接可将所述管芯固定至所述基板。
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- 2006-06-09 BR BRPI0612009-1A patent/BRPI0612009A2/pt not_active Application Discontinuation
- 2006-06-09 CN CN2012102704518A patent/CN102786665A/zh active Pending
- 2006-06-09 WO PCT/US2006/022587 patent/WO2007001803A2/en active Application Filing
- 2006-06-09 JP JP2008518211A patent/JP2008544067A/ja active Pending
- 2006-06-09 EP EP10014910.3A patent/EP2283922A3/en not_active Withdrawn
- 2006-06-09 CN CN200680022834.6A patent/CN101257973B/zh not_active Expired - Fee Related
- 2006-06-09 EP EP06784726A patent/EP1926554A2/en not_active Withdrawn
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CN1622940A (zh) * | 2002-01-17 | 2005-06-01 | 通用电气公司 | 弱配位咪唑烷阴离子的鎓盐作为阳离子引发剂 |
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WO2007001803A3 (en) | 2007-03-15 |
WO2007001803A2 (en) | 2007-01-04 |
EP2283922A2 (en) | 2011-02-16 |
KR20080034438A (ko) | 2008-04-21 |
EP1926554A2 (en) | 2008-06-04 |
RU2008102366A (ru) | 2009-07-27 |
CN101257973A (zh) | 2008-09-03 |
CN101257973B (zh) | 2014-07-30 |
US20060293172A1 (en) | 2006-12-28 |
US8048819B2 (en) | 2011-11-01 |
KR101391784B1 (ko) | 2014-05-07 |
JP2008544067A (ja) | 2008-12-04 |
EP2283922A3 (en) | 2013-07-03 |
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