CN102272252B - 环氧树脂的金属稳定剂和分散方法 - Google Patents
环氧树脂的金属稳定剂和分散方法 Download PDFInfo
- Publication number
- CN102272252B CN102272252B CN200980153953.9A CN200980153953A CN102272252B CN 102272252 B CN102272252 B CN 102272252B CN 200980153953 A CN200980153953 A CN 200980153953A CN 102272252 B CN102272252 B CN 102272252B
- Authority
- CN
- China
- Prior art keywords
- varnish
- dispersion
- epoxy resin
- acid
- metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 33
- 239000002184 metal Substances 0.000 title claims abstract description 33
- 239000006185 dispersion Substances 0.000 title claims abstract description 28
- 238000000034 method Methods 0.000 title claims abstract description 28
- 229920000647 polyepoxide Polymers 0.000 title claims description 65
- 239000003822 epoxy resin Substances 0.000 title claims description 57
- 239000003381 stabilizer Substances 0.000 title abstract description 9
- 230000008569 process Effects 0.000 title description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title description 2
- 239000002966 varnish Substances 0.000 claims abstract description 31
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims description 36
- 239000003795 chemical substances by application Substances 0.000 claims description 34
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 19
- 235000013824 polyphenols Nutrition 0.000 claims description 17
- 239000011159 matrix material Substances 0.000 claims description 15
- 229910000765 intermetallic Inorganic materials 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 11
- 150000008065 acid anhydrides Chemical class 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 11
- 239000011787 zinc oxide Substances 0.000 claims description 11
- 239000000945 filler Substances 0.000 claims description 10
- 229920000768 polyamine Polymers 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000011701 zinc Substances 0.000 claims description 8
- 150000004982 aromatic amines Chemical class 0.000 claims description 7
- 239000000843 powder Substances 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 3
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 claims description 3
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 claims description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims description 2
- 238000004176 ammonification Methods 0.000 claims description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims description 2
- 150000003751 zinc Chemical class 0.000 claims description 2
- 150000003752 zinc compounds Chemical class 0.000 claims description 2
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 claims description 2
- 229910021511 zinc hydroxide Inorganic materials 0.000 claims description 2
- 229940007718 zinc hydroxide Drugs 0.000 claims description 2
- 125000004402 polyphenol group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 abstract description 13
- 239000002270 dispersing agent Substances 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 2
- -1 glycidyl ester Chemical class 0.000 description 48
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 38
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 36
- 229910052757 nitrogen Inorganic materials 0.000 description 28
- 239000007787 solid Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 27
- 239000003351 stiffener Substances 0.000 description 26
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 24
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 18
- 239000002585 base Substances 0.000 description 17
- 229920003986 novolac Polymers 0.000 description 17
- 239000004593 Epoxy Substances 0.000 description 15
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 12
- LSDPWZHWYPCBBB-UHFFFAOYSA-N Methanethiol Chemical compound SC LSDPWZHWYPCBBB-UHFFFAOYSA-N 0.000 description 12
- 150000002118 epoxides Chemical class 0.000 description 12
- 150000008442 polyphenolic compounds Chemical class 0.000 description 12
- MNAHQWDCXOHBHK-UHFFFAOYSA-N 1-phenylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=C1 MNAHQWDCXOHBHK-UHFFFAOYSA-N 0.000 description 11
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 10
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 10
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 239000002253 acid Substances 0.000 description 9
- 150000002148 esters Chemical class 0.000 description 8
- 239000000835 fiber Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 8
- CMQUQOHNANGDOR-UHFFFAOYSA-N 2,3-dibromo-4-(2,4-dibromo-5-hydroxyphenyl)phenol Chemical compound BrC1=C(Br)C(O)=CC=C1C1=CC(O)=C(Br)C=C1Br CMQUQOHNANGDOR-UHFFFAOYSA-N 0.000 description 7
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 7
- 229930185605 Bisphenol Natural products 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 7
- 150000002500 ions Chemical class 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- XYFCBTPGUUZFHI-UHFFFAOYSA-N phosphine group Chemical group P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 235000010290 biphenyl Nutrition 0.000 description 5
- 239000004305 biphenyl Substances 0.000 description 5
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 150000001896 cresols Chemical class 0.000 description 5
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 239000006210 lotion Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 150000002989 phenols Chemical class 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- CWERGRDVMFNCDR-UHFFFAOYSA-M thioglycolate(1-) Chemical compound [O-]C(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-M 0.000 description 5
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000004927 clay Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 4
- 150000002367 halogens Chemical class 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- 125000005358 mercaptoalkyl group Chemical group 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000001294 propane Substances 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YNAVUWVOSKDBBP-UHFFFAOYSA-N Morpholine Natural products C1COCCN1 YNAVUWVOSKDBBP-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- CUJRVFIICFDLGR-UHFFFAOYSA-N acetylacetonate Chemical compound CC(=O)[CH-]C(C)=O CUJRVFIICFDLGR-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 3
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000011133 lead Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 3
- 230000011218 segmentation Effects 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical class OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 2
- HORKYAIEVBUXGM-UHFFFAOYSA-N 1,2,3,4-tetrahydroquinoxaline Chemical compound C1=CC=C2NCCNC2=C1 HORKYAIEVBUXGM-UHFFFAOYSA-N 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 2
- CNDCQWGRLNGNNO-UHFFFAOYSA-N 2-(2-sulfanylethoxy)ethanethiol Chemical compound SCCOCCS CNDCQWGRLNGNNO-UHFFFAOYSA-N 0.000 description 2
- UUODQIKUTGWMPT-UHFFFAOYSA-N 2-fluoro-5-(trifluoromethyl)pyridine Chemical compound FC1=CC=C(C(F)(F)F)C=N1 UUODQIKUTGWMPT-UHFFFAOYSA-N 0.000 description 2
- ULPDSNLBZMHGPI-UHFFFAOYSA-N 4-methyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C)CCC2OC21 ULPDSNLBZMHGPI-UHFFFAOYSA-N 0.000 description 2
- YVPZFPKENDZQEJ-UHFFFAOYSA-N 4-propylcyclohexan-1-ol Chemical compound CCCC1CCC(O)CC1 YVPZFPKENDZQEJ-UHFFFAOYSA-N 0.000 description 2
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 2
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 2
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 2
- OXQXGKNECHBVMO-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptane-4-carboxylic acid Chemical class C1C(C(=O)O)CCC2OC21 OXQXGKNECHBVMO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical group [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- 239000005870 Ziram Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000005660 chlorination reaction Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- XLJMAIOERFSOGZ-UHFFFAOYSA-N cyanic acid Chemical compound OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 2
- PPNKDDZCLDMRHS-UHFFFAOYSA-N dinitrooxybismuthanyl nitrate Chemical compound [Bi+3].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O PPNKDDZCLDMRHS-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 229940015043 glyoxal Drugs 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 150000004693 imidazolium salts Chemical class 0.000 description 2
- 125000002883 imidazolyl group Chemical group 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 229940043265 methyl isobutyl ketone Drugs 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- VAUOPRZOGIRSMI-UHFFFAOYSA-N n-(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CNC1=CC=CC=C1 VAUOPRZOGIRSMI-UHFFFAOYSA-N 0.000 description 2
- RZJRJXONCZWCBN-UHFFFAOYSA-N octadecane Chemical compound CCCCCCCCCCCCCCCCCC RZJRJXONCZWCBN-UHFFFAOYSA-N 0.000 description 2
- 235000006408 oxalic acid Nutrition 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 229940059574 pentaerithrityl Drugs 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920001515 polyalkylene glycol Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- YMBCJWGVCUEGHA-UHFFFAOYSA-M tetraethylammonium chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC YMBCJWGVCUEGHA-UHFFFAOYSA-M 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- DUBNHZYBDBBJHD-UHFFFAOYSA-L ziram Chemical compound [Zn+2].CN(C)C([S-])=S.CN(C)C([S-])=S DUBNHZYBDBBJHD-UHFFFAOYSA-L 0.000 description 2
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 1
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- ZMAMKNPVAMKIIC-UHFFFAOYSA-N (5-benzyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical class OCC=1N=C(C=2C=CC=CC=2)NC=1CC1=CC=CC=C1 ZMAMKNPVAMKIIC-UHFFFAOYSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- CIRMGZKUSBCWRL-LHLOQNFPSA-N (e)-10-[2-(7-carboxyheptyl)-5,6-dihexylcyclohex-3-en-1-yl]dec-9-enoic acid Chemical compound CCCCCCC1C=CC(CCCCCCCC(O)=O)C(\C=C\CCCCCCCC(O)=O)C1CCCCCC CIRMGZKUSBCWRL-LHLOQNFPSA-N 0.000 description 1
- QTKIQLNGOKOPOE-UHFFFAOYSA-N 1,1'-biphenyl;propane Chemical compound CCC.C1=CC=CC=C1C1=CC=CC=C1 QTKIQLNGOKOPOE-UHFFFAOYSA-N 0.000 description 1
- JRNVQLOKVMWBFR-UHFFFAOYSA-N 1,2-benzenedithiol Chemical compound SC1=CC=CC=C1S JRNVQLOKVMWBFR-UHFFFAOYSA-N 0.000 description 1
- BIGYLAKFCGVRAN-UHFFFAOYSA-N 1,3,4-thiadiazolidine-2,5-dithione Chemical compound S=C1NNC(=S)S1 BIGYLAKFCGVRAN-UHFFFAOYSA-N 0.000 description 1
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- ZBOLWTQGSURPGN-UHFFFAOYSA-N 1-methyl-2-phenylimidazole-4,5-diol Chemical compound CN1C(O)=C(O)N=C1C1=CC=CC=C1 ZBOLWTQGSURPGN-UHFFFAOYSA-N 0.000 description 1
- BUZMJVBOGDBMGI-UHFFFAOYSA-N 1-phenylpropylbenzene Chemical compound C=1C=CC=CC=1C(CC)C1=CC=CC=C1 BUZMJVBOGDBMGI-UHFFFAOYSA-N 0.000 description 1
- DCYGAPKNVCQNOE-UHFFFAOYSA-N 2,2,2-triphenylacetic acid Chemical compound C=1C=CC=CC=1C(C=1C=CC=CC=1)(C(=O)O)C1=CC=CC=C1 DCYGAPKNVCQNOE-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- HREXIBFZDJHFCF-UHFFFAOYSA-N 2,6-dibromo-4-propylphenol Chemical compound CCCC1=CC(Br)=C(O)C(Br)=C1 HREXIBFZDJHFCF-UHFFFAOYSA-N 0.000 description 1
- MLPBASQNOQYIGL-UHFFFAOYSA-N 2-(2-propan-2-yl-1h-imidazol-5-yl)propanenitrile Chemical compound CC(C)C1=NC=C(C(C)C#N)N1 MLPBASQNOQYIGL-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- KNYBHVROORUQCP-UHFFFAOYSA-N 2-(cyclohexa-2,4-dien-1-yloxymethyl)oxirane Chemical compound C1=CC=CC(C1)OCC1CO1 KNYBHVROORUQCP-UHFFFAOYSA-N 0.000 description 1
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- SZIFAVKTNFCBPC-UHFFFAOYSA-N 2-chloroethanol Chemical compound OCCCl SZIFAVKTNFCBPC-UHFFFAOYSA-N 0.000 description 1
- FNRMMDCDHWCQTH-UHFFFAOYSA-N 2-chloropyridine;3-chloropyridine;4-chloropyridine Chemical group ClC1=CC=NC=C1.ClC1=CC=CN=C1.ClC1=CC=CC=N1 FNRMMDCDHWCQTH-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical class CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 150000008614 2-methylimidazoles Chemical class 0.000 description 1
- ZXTHWIZHGLNEPG-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1,3-oxazole Chemical compound O1CCN=C1C1=CC=CC=C1 ZXTHWIZHGLNEPG-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- ZSLUVFAKFWKJRC-IGMARMGPSA-N 232Th Chemical compound [232Th] ZSLUVFAKFWKJRC-IGMARMGPSA-N 0.000 description 1
- WDGCBNTXZHJTHJ-UHFFFAOYSA-N 2h-1,3-oxazol-2-id-4-one Chemical group O=C1CO[C-]=N1 WDGCBNTXZHJTHJ-UHFFFAOYSA-N 0.000 description 1
- GRWFFFOEIHGUBG-UHFFFAOYSA-N 3,4-Epoxy-6-methylcyclohexylmethyl-3,4-epoxy-6-methylcyclo-hexanecarboxylate Chemical compound C1C2OC2CC(C)C1C(=O)OCC1CC2OC2CC1C GRWFFFOEIHGUBG-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- XMTQQYYKAHVGBJ-UHFFFAOYSA-N 3-(3,4-DICHLOROPHENYL)-1,1-DIMETHYLUREA Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C(Cl)=C1 XMTQQYYKAHVGBJ-UHFFFAOYSA-N 0.000 description 1
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- GEMWDXVZXZBXDG-UHFFFAOYSA-N 3-(cycloocten-1-yl)-1,4,5,6,7,8-hexahydrodiazocine Chemical compound C1CCCCCC(C=2CCCCCNN=2)=C1 GEMWDXVZXZBXDG-UHFFFAOYSA-N 0.000 description 1
- WVRNUXJQQFPNMN-VAWYXSNFSA-N 3-[(e)-dodec-1-enyl]oxolane-2,5-dione Chemical compound CCCCCCCCCC\C=C\C1CC(=O)OC1=O WVRNUXJQQFPNMN-VAWYXSNFSA-N 0.000 description 1
- UZHSSKXUDQUQLN-UHFFFAOYSA-N 3-amino-2-oxobutanal Chemical compound CC(N)C(=O)C=O UZHSSKXUDQUQLN-UHFFFAOYSA-N 0.000 description 1
- CCTFMNIEFHGTDU-UHFFFAOYSA-N 3-methoxypropyl acetate Chemical compound COCCCOC(C)=O CCTFMNIEFHGTDU-UHFFFAOYSA-N 0.000 description 1
- DOFIAZGYBIBEGI-UHFFFAOYSA-N 3-sulfanylphenol Chemical compound OC1=CC=CC(S)=C1 DOFIAZGYBIBEGI-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- KLSLBUSXWBJMEC-UHFFFAOYSA-N 4-Propylphenol Chemical compound CCCC1=CC=C(O)C=C1 KLSLBUSXWBJMEC-UHFFFAOYSA-N 0.000 description 1
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 1
- UWFMCQSNYFEYAW-UHFFFAOYSA-N 4-oxo-2,3-bis(sulfanyl)-4-(2-sulfanylethoxy)butanoic acid Chemical compound OC(=O)C(S)C(S)C(=O)OCCS UWFMCQSNYFEYAW-UHFFFAOYSA-N 0.000 description 1
- DTRIDVOOPAQEEL-UHFFFAOYSA-N 4-sulfanylbutanoic acid Chemical compound OC(=O)CCCS DTRIDVOOPAQEEL-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical class CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- RZJKZTPKSRPUFJ-UHFFFAOYSA-N 5,5-dimethyl-1,3-bis(oxiran-2-ylmethyl)imidazolidine-2,4-dione Chemical compound O=C1N(CC2OC2)C(=O)C(C)(C)N1CC1CO1 RZJKZTPKSRPUFJ-UHFFFAOYSA-N 0.000 description 1
- YATKABCHSRLDGQ-UHFFFAOYSA-N 5-benzyl-2-phenyl-1h-imidazole Chemical compound C=1C=CC=CC=1CC(N=1)=CNC=1C1=CC=CC=C1 YATKABCHSRLDGQ-UHFFFAOYSA-N 0.000 description 1
- AHNGUGDMAGMLGV-UHFFFAOYSA-N 5-benzyl-3-methyl-2-phenylimidazol-4-ol Chemical class N1=C(C=2C=CC=CC=2)N(C)C(O)=C1CC1=CC=CC=C1 AHNGUGDMAGMLGV-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- WDOBSYDOLMPPEN-UHFFFAOYSA-N C(#N)C(C)C(=O)C=O Chemical compound C(#N)C(C)C(=O)C=O WDOBSYDOLMPPEN-UHFFFAOYSA-N 0.000 description 1
- ZBKZQKMCXHDEDX-UHFFFAOYSA-N C(CC)(=O)O.C(CC)(=O)O.[S] Chemical compound C(CC)(=O)O.C(CC)(=O)O.[S] ZBKZQKMCXHDEDX-UHFFFAOYSA-N 0.000 description 1
- PGUJDPXUMCLPLI-UHFFFAOYSA-N C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.ClCOCC Chemical compound C1(=CC=CC=C1)O.C1(=CC=CC=C1)O.ClCOCC PGUJDPXUMCLPLI-UHFFFAOYSA-N 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical group NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- KGWDUNBJIMUFAP-KVVVOXFISA-N Ethanolamine Oleate Chemical compound NCCO.CCCCCCCC\C=C/CCCCCCCC(O)=O KGWDUNBJIMUFAP-KVVVOXFISA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 1
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- SZLIAMBFVKDXKC-UHFFFAOYSA-N S1SC=CS1.C1=CC=CC=C1 Chemical compound S1SC=CS1.C1=CC=CC=C1 SZLIAMBFVKDXKC-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- 229910052776 Thorium Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910052770 Uranium Inorganic materials 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- 125000005595 acetylacetonate group Chemical group 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 150000007933 aliphatic carboxylic acids Chemical class 0.000 description 1
- 239000004844 aliphatic epoxy resin Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 230000029936 alkylation Effects 0.000 description 1
- 238000005804 alkylation reaction Methods 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229920003180 amino resin Polymers 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- FAPDDOBMIUGHIN-UHFFFAOYSA-K antimony trichloride Chemical compound Cl[Sb](Cl)Cl FAPDDOBMIUGHIN-UHFFFAOYSA-K 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical group [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- SWMGXDBEGAZFEW-UHFFFAOYSA-N benzyl(trimethyl)azanium;cyanide Chemical compound N#[C-].C[N+](C)(C)CC1=CC=CC=C1 SWMGXDBEGAZFEW-UHFFFAOYSA-N 0.000 description 1
- VRPKUXAKHIINGG-UHFFFAOYSA-N biphenyl-4,4'-dithiol Chemical group C1=CC(S)=CC=C1C1=CC=C(S)C=C1 VRPKUXAKHIINGG-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000004799 bromophenyl group Chemical group 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000007766 curtain coating Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- YMHQVDAATAEZLO-UHFFFAOYSA-N cyclohexane-1,1-diamine Chemical compound NC1(N)CCCCC1 YMHQVDAATAEZLO-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- PNOXNTGLSKTMQO-UHFFFAOYSA-L diacetyloxytin Chemical compound CC(=O)O[Sn]OC(C)=O PNOXNTGLSKTMQO-UHFFFAOYSA-L 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- HEYYNPBHZQPMJJ-UHFFFAOYSA-L dibenzoyloxylead Chemical compound C=1C=CC=CC=1C(=O)O[Pb]OC(=O)C1=CC=CC=C1 HEYYNPBHZQPMJJ-UHFFFAOYSA-L 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- KIQKWYUGPPFMBV-UHFFFAOYSA-N diisocyanatomethane Chemical compound O=C=NCN=C=O KIQKWYUGPPFMBV-UHFFFAOYSA-N 0.000 description 1
- HBGGXOJOCNVPFY-UHFFFAOYSA-N diisononyl phthalate Chemical compound CC(C)CCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC(C)C HBGGXOJOCNVPFY-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- UVCJGUGAGLDPAA-UHFFFAOYSA-N ensulizole Chemical compound N1C2=CC(S(=O)(=O)O)=CC=C2N=C1C1=CC=CC=C1 UVCJGUGAGLDPAA-UHFFFAOYSA-N 0.000 description 1
- 229960000655 ensulizole Drugs 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- ZTFPVUVWTIJYHK-UHFFFAOYSA-N ethyl prop-2-enoate;methyl 2-methylprop-2-enoate;oxiran-2-ylmethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C=C.COC(=O)C(C)=C.CC(=C)C(=O)OCC1CO1 ZTFPVUVWTIJYHK-UHFFFAOYSA-N 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000009730 filament winding Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 239000011086 glassine Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002357 guanidines Chemical class 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- GFMIDCCZJUXASS-UHFFFAOYSA-N hexane-1,1,6-triol Chemical compound OCCCCCC(O)O GFMIDCCZJUXASS-UHFFFAOYSA-N 0.000 description 1
- JYVPKRHOTGQJSE-UHFFFAOYSA-M hexyl(trimethyl)azanium;bromide Chemical compound [Br-].CCCCCC[N+](C)(C)C JYVPKRHOTGQJSE-UHFFFAOYSA-M 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 125000004029 hydroxymethyl group Chemical group [H]OC([H])([H])* 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 description 1
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- KOARAHKGQSHYGJ-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;oxiran-2-ylmethyl prop-2-enoate Chemical compound COC(=O)C(C)=C.C=CC(=O)OCC1CO1 KOARAHKGQSHYGJ-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 description 1
- BMLIZLVNXIYGCK-UHFFFAOYSA-N monuron Chemical compound CN(C)C(=O)NC1=CC=C(Cl)C=C1 BMLIZLVNXIYGCK-UHFFFAOYSA-N 0.000 description 1
- 239000000206 moulding compound Substances 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- 239000002071 nanotube Substances 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical class C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000000269 nucleophilic effect Effects 0.000 description 1
- 229940038384 octadecane Drugs 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 125000002524 organometallic group Chemical group 0.000 description 1
- YPNZYYWORCABPU-UHFFFAOYSA-N oxiran-2-ylmethyl 2-methylprop-2-enoate;styrene Chemical compound C=CC1=CC=CC=C1.CC(=C)C(=O)OCC1CO1 YPNZYYWORCABPU-UHFFFAOYSA-N 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- FIKAKWIAUPDISJ-UHFFFAOYSA-L paraquat dichloride Chemical group [Cl-].[Cl-].C1=C[N+](C)=CC=C1C1=CC=[N+](C)C=C1 FIKAKWIAUPDISJ-UHFFFAOYSA-L 0.000 description 1
- 150000003009 phosphonic acids Chemical class 0.000 description 1
- 150000003053 piperidines Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229960001866 silicon dioxide Drugs 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium group Chemical group [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- GTCDARUMAMVCRO-UHFFFAOYSA-M tetraethylazanium;acetate Chemical compound CC([O-])=O.CC[N+](CC)(CC)CC GTCDARUMAMVCRO-UHFFFAOYSA-M 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 229940032021 tetramune Drugs 0.000 description 1
- PXJUBOLFJDSAQQ-UHFFFAOYSA-M tetrapropylazanium;acetate Chemical compound CC([O-])=O.CCC[N+](CCC)(CCC)CCC PXJUBOLFJDSAQQ-UHFFFAOYSA-M 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N tolylenediamine group Chemical group CC1=C(C=C(C=C1)N)N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 125000005270 trialkylamine group Chemical group 0.000 description 1
- NGMGUXLLXCGIDN-UHFFFAOYSA-N triethyl(hexadecyl)azanium;azide Chemical compound [N-]=[N+]=[N-].CCCCCCCCCCCCCCCC[N+](CC)(CC)CC NGMGUXLLXCGIDN-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- RXJKFRMDXUJTEX-UHFFFAOYSA-N triethylphosphine Chemical compound CCP(CC)CC RXJKFRMDXUJTEX-UHFFFAOYSA-N 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- WHAFDJWJDDPMDO-UHFFFAOYSA-N trimethyl(phenyl)phosphanium Chemical compound C[P+](C)(C)C1=CC=CC=C1 WHAFDJWJDDPMDO-UHFFFAOYSA-N 0.000 description 1
- DNYWZCXLKNTFFI-UHFFFAOYSA-N uranium Chemical compound [U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U][U] DNYWZCXLKNTFFI-UHFFFAOYSA-N 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/014—Stabilisers against oxidation, heat, light or ozone
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/04—Epoxynovolacs
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/45—Anti-settling agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/80—Processes for incorporating ingredients
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
本发明公开了一种方法，其包括(a)将包括含金属的化合物的稳定剂混合进分散剂中，得到分散体，其中所述含金属的化合物包括金属，其选自第11-13族金属及其组合；和(b)将所述分散体添加到清漆中。
Description
技术领域
本申请公开的实施方式涉及分散体。更特别地，本申请公开的实施方式涉及用于包含环氧树脂的清漆中的分散体。
背景技术
由于最新颁布的法规要求无铅焊料，印刷电路板(PCB)暴露的温度已经增至～260℃。除了普通板(其一些失效是可接受的)之外，这些温度已经超过了现有溴化环氧树脂-双氰胺(DICY)固化技术的固有热稳定性。这种增加的温度转化为电层压材料暴露于极端不同的温度曲线波动的焊接和返工，需要提高的耐热性。作为该问题的结果，工业中将DICY转换为酚类固化剂。尽管使用酚类固化剂导致可接受的耐热性，但是又引入了新问题，包括脆性、与铜和玻璃的差粘合性、和在生产厚度容限内的层压板中的一些困难。脆性是特别重要的问题，因为其导致粗糙的钻孔表面，其由此引起与镀铜有关的问题，最终导致板失效。
因此，需要提高环氧树脂的热稳定性，而不会显著地不利影响其它层压材料的性质。一种方法是将金属稳定剂添加到环氧树脂中。然而，金属稳定剂会随着时间而沉淀，从而妨碍储存稳定性。环氧树脂的期望储存寿命为12个月，然而金属稳定剂会在若干天内沉淀。从商业角度，这种非均质性是所不期望的。因此，需要使金属稳定剂结合进环氧树脂从而减少沉淀量的方式。
发明内容
在本发明的一种实施方式中，公开了一种方法，其包括下列步骤、由下列步骤组成、或基本由下列步骤组成：(a)将包括含金属的化合物的稳定剂混合进分散剂中，得到分散体，其中所述含金属的化合物包括金属，所述金属选自第11-13族金属及其组合；和(b)将所述分散体添加到清漆中。
具体实施方式
在本发明的一种实施方式中，公开了一种方法，其包括下列步骤、由下列步骤组成、或基本由下列步骤组成：(a)将包括含金属的化合物的稳定剂混合进分散剂中，得到分散体，其中所述含金属的化合物包括金属，所述金属选自第11-13族金属及其组合；和(b)将所述分散体添加到清漆中。
任何适宜的含金属的化合物可以用作本申请公开的实施方式中的稳定剂。通常，所述含金属的化合物中的金属选自元素周期表的第11-13族金属及其组合。这些金属包括铜、银、金、锌、镉、汞、硼、铝、镓、铟、和铊。除了第11-13族金属之外，也可以使用铅和锡。在一种实施方式中，金属是锌。
在本申请公开的实施方式中，含金属的化合物通常可以是金属盐、金属氢氧化物、金属氧化物、金属乙酰丙酮化物、有机金属化合物、以及其任何两种或更多种的组合。在其中金属是锌的实施方式中，含金属的化合物选自锌盐、氢氧化锌、氧化锌、乙酰丙酮化锌、有机锌化合物以及其任何两种或更多种的组合。在一种实施方式中，含金属的化合物可以是氧化锌。在一种实施方式中，含金属的化合物是二甲基二硫代氨基甲酸锌(也称为‘福美锌’)。
稳定剂的存在量通常可以为约0.1wt％至约40wt％，基于树脂制剂的总重量。
可以使用任何适宜的分散剂。实例包括但不限于多酚、聚环氧化物、酐、和多胺。
多酚的实例包括线型酚醛清漆，如苯酚线型酚醛清漆，甲酚线型酚醛清漆，双酚A线型酚醛清漆，双酚例如双酚F(双(4-羟基苯基)-甲烷)、双酚A、四溴双酚A，和通过过量多酚与二环氧化物的缩合制备的酚类低聚物。
聚环氧化物的实例包括以上列出的多酚的缩水甘油醚，作为多酚与聚环氧化物的缩合产物的固体环氧树脂(其具体实例为D.E.H.TM系列低聚物例如D.E.H.TM 661和663以及流动改性剂例如D.E.R.TM 692和D.E.R.TM 6508)。其它实例包括含溴环氧化物例如四溴双酚A二缩水甘油醚和溴化低聚物例如D.E.R.TM 592、D.E.R.TM 593、D.E.R.TM 539、D.E.R.TM 530、D.E.R.TM 538、D.E.R.TM 514和D.E.R.TM 560。
酐的实例包括纳迪克酸酐、六氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、马来酸酐与烯烃例如苯乙烯的共聚物。
多胺的实例包括双氰胺，芳族胺例如亚甲基二苯胺和甲苯二胺，脂环族胺例如乙醇胺、氨化多元醇、乙二胺、二亚乙基三胺及相关低聚物，和脂环族胺例如N-氨基乙基哌嗪、异佛尔酮二胺、1，4-双(氨基甲基)环己烷及异构体。
在一种实施方式中，高剪切混合可以用来将稳定剂与分散剂混合。这些通常包括驱动的垂直轴和高剪切盘状叶片。该叶片在固定混合容器内产生径向流动模式。该叶片产生涡流，其将容器的内容物拉向叶片的锋利边缘。然后该叶片的边缘将固体扯开，减小它们的尺寸，同时使固体粒子分散到分散剂中。这些混合机具有非常高的速度，通常为至少500rpm。
用于将稳定剂与分散剂混合的另一种方法是通过共挤出进行的。将稳定剂和分散剂添加到粉末混合机中，从而使固体碎成较小的粒度。然后将各组分引入到挤出机中，在高于环氧树脂的玻璃化转变温度的温度(通常为0℃至200℃)将其共挤出。通过其将各组分共挤出的螺杆速度通常为0至500rpm。
用于将稳定剂与分散剂混合的另一种方法是球磨机。将稳定剂/分散剂混合物与一定量的玻璃珠一起填装到垂直柱室中。在两个圆盘的搅动下，玻璃珠相互碰撞和碾磨，这产生强剪切力，其容易更有效地碾碎固体聚集体，得到最终混合物中稳定剂的较小平均粒度。在工业规模上，隔膜泵与水平碾磨室相连，从而更有效地填装稳定剂/分散剂混合物，和用具有远远更高硬度的氧化锆涂覆的玻璃珠替代玻璃珠。
然后可以将分散体加入到清漆中。然后无需首先必须搅拌沉淀的固体粒子，清漆就可以呈备用状态。除了环氧树脂之外，清漆也可以包含固化剂、硬化剂、和催化剂。
环氧树脂组分可以是用于模塑组合物的任何类型的环氧树脂，包括包含一个或多个反应性环氧乙烷基团(本申请称为“环氧基团”或“环氧官能度”)的任何物质。用于本申请公开的实施方式的环氧树脂可以包括单官能环氧树脂、多官能环氧树脂、及其组合。单体及聚合的环氧树脂可以是脂族的、脂环族的、芳族的、或杂环的环氧树脂。聚合环氧化物包括包含末端环氧基团的线型聚合物(例如，聚亚烷基二醇的二缩水甘油醚)，聚合物骨架的环氧乙烷单元(例如，聚丁二烯聚环氧化物)和包含悬垂环氧基团的聚合物(例如，甲基丙烯酸缩水甘油酯聚合物或共聚物)。环氧化物可以是纯化合物，但是通常为混合物或每分子包含一个、两个或多个环氧基团的化合物。在一些实施方式中，环氧树脂也可以包括反应性-OH基团，其可以在较高的温度与酐、有机酸、氨基树脂、酚类树脂反应，或与环氧基团(当催化时)反应，导致另外的交联。在一种实施方式中，环氧树脂通过以下过程生产，即使缩水甘油醚与双酚化合物例如双酚A或四溴双酚A接触，形成
唑烷酮基团。
通常，环氧树脂可以是缩水甘油化树脂、脂环族树脂、环氧化油等。缩水甘油化树脂通常是缩水甘油醚例如表氯醇和双酚化合物例如双酚A的反应产物；C4至C28烷基缩水甘油醚；C2至C28烷基缩水甘油酯和C2至C28烯基缩水甘油酯；C1至C28烷基缩水甘油醚、一元酚缩水甘油醚和多酚缩水甘油醚；下述多价酚的多缩水甘油醚，如邻苯二酚、间苯二酚、对苯二酚、4，4′-二羟基二苯基甲烷(或双酚F)、4，4′-二羟基-3，3′-二甲基二苯基甲烷、4，4′-二羟基二苯基二甲基甲烷(或双酚A)、4，4′-二羟基二苯基甲基甲烷、4，4′-二羟基二苯基环己烷、4，4′-二羟基-3，3′-二甲基二苯基丙烷、4，4′-二羟基二苯基砜、和三(4-羟基苯基)甲烷；上述二元酚的氯化和溴化产物的多缩水甘油醚；线型酚醛清漆的多缩水甘油醚；通过使下述二元酚的醚酯化得到的二元酚的多缩水甘油醚，所述二元酚通过用二卤代烷烃或二卤素二烷基醚使芳族氢化羧酸(hydrocarboxylic acid)的盐酯化得到；通过使苯酚和包含至少两个卤素原子的长链卤素石蜡缩合得到的多酚的多缩水甘油醚。用于本申请公开的实施方式的环氧树脂的其它实例包括双-4，4′-(1-甲基乙叉)苯酚二缩水甘油醚和(氯甲基)环氧乙烷双酚A二缩水甘油醚。
在一些实施方式中，环氧树脂可以包括缩水甘油醚类型；缩水甘油酯类型；脂环族类型；杂环类型，和卤化环氧树脂等。适宜的环氧树脂的非限制性实例可以包括甲酚线型酚醛清漆环氧树脂、酚类线型酚醛清漆环氧树脂、联苯环氧树脂、对苯二酚环氧树脂、芪环氧树脂、及其混合物和组合物。
适宜的聚环氧化合物可以包括间苯二酚二缩水甘油醚(1，3-双-(2，3-环氧丙氧基)苯)，双酚A的二缩水甘油醚(2，2-双(对-(2，3-环氧丙氧基)苯基)丙烷)，三缩水甘油基对氨基苯酚(4-(2，3-环氧丙氧基)-N，N-双(2，3-环氧丙基)苯胺)，溴代双酚A(2，2-双(4-(2，3-环氧丙氧基)3-溴-苯基)丙烷)的二缩水甘油醚，双酚F的二缩水甘油醚(2，2-双(对-(2，3-环氧丙氧基)苯基)甲烷)，间氨基苯酚和/或对氨基苯酚的三缩水甘油醚(3-(2，3-环氧丙氧基)N，N-双(2，3-环氧丙基)苯胺)，和四缩水甘油基亚甲基二苯胺(N，N，N′，N′-四(2，3-环氧丙基)4，4′-二氨基二苯基甲烷)，和两种或多种聚环氧化合物的混合物。有用的环氧树脂的更为详尽的列举可在Lee，H.and Neville，K.，Handbook of Epoxy Resins，McGraw-HillBook Company，1982reissue中找到。
其它适宜的环氧树脂包括基于芳族胺和表氯醇的聚环氧化合物，如N，N′-二缩水甘油基-苯胺；N，N′-二甲基-N，N′-二缩水甘油基-4，4′-二氨基二苯基甲烷；N，N，N′，N′-四缩水甘油基-4，4′-二氨基二苯基甲烷；N-二缩水甘油基-4-氨基苯基缩水甘油醚；和N，N，N′，N′-四缩水甘油基-1，3-亚丙基双-4-氨基苯甲酸酯。环氧树脂也可以包括下列物质中一种或多种的缩水甘油基衍生物：芳族二胺、芳族一元伯胺、氨基酚、多元酚、多元醇、多羧酸。
有用的环氧树脂包括，例如，多元醇的多缩水甘油醚，所述多元醇如乙二醇、二缩三乙二醇、1，2-丙二醇、1，5-戊二醇、1，2，6-己三醇、甘油、和2，2-双(4-羟基环己基)丙烷；脂族和芳族多羧酸的多缩水甘油醚，所述脂族和芳族多羧酸例如，草酸、琥珀酸、戊二酸、对苯二甲酸、2，6-萘二羧酸、和二聚亚油酸；多酚的多缩水甘油醚，例如，双酚A，双酚F，1，1-双(4-羟基苯基)乙烷，1，1-双(4-羟基苯基)异丁烷，和1，5-二羟基萘；包含丙烯酸酯或氨基甲酸酯基团的改性环氧树脂；缩水甘油基胺环氧树脂；和线型酚醛清漆树脂。
环氧化合物可以是脂环族环氧化物。脂环族环氧化物的实例包括二羧酸的脂环族酯的二环氧化物，如草酸二(3，4-环氧环己基甲基)酯、己二酸二(3，4-环氧环己基甲基)酯、己二酸二(3，4-环氧-6-甲基环己基甲基)酯、庚二酸二(3，4-环氧环己基甲基)酯；乙烯基环己烯二环氧化物；柠檬烯二环氧化物；二环戊二烯二环氧化物；和类似物。其它适宜的二羧酸的脂环族酯的二环氧化物描述于，例如，美国专利2,750,395。
其它脂环族环氧化物包括3，4-环氧环己基甲基-3，4-环氧环己烷羧酸酯类，如3，4-环氧环己基甲基-3，4-环氧环己烷羧酸酯；3，4-环氧-1-甲基环己基-甲基-3，4-环氧-1-甲基环己烷羧酸酯；6-甲基-3，4-环氧环己基甲基甲基-6-甲基-3，4-环氧环己烷羧酸酯；3，4-环氧-2-环氧环己基甲基-3，4-环氧-2-甲基环己烷羧酸酯；3，4-环氧-3-甲基环己基-甲基-3，4-环氧-3-甲基环己烷羧酸酯；3，4-环氧-5-甲基环己基-甲基-3，4-环氧-5-甲基环己烷羧酸酯等。其它适宜的3，4-环氧环己基甲基-3，4-环氧环己烷羧酸酯类描述于，例如，美国专利2,890,194。
也有用的包含环氧基团的物质包括基于缩水甘油醚单体的那些。实例是多元酚的二缩水甘油醚或多缩水甘油醚，其通过使多元酚例如双酚化合物与过量的氯乙醇例如表氯醇反应获得。这样的多元酚包括间苯二酚、双(4-羟基苯基)甲烷(称为双酚F)、2，2-双(4-羟基苯基)丙烷(称为双酚A)、2，2-双(4′-羟基-3′，5′-二溴苯基)丙烷、1，1，2，2-四(4′-羟基-苯基)乙烷或苯酚与甲醛在酸性条件下得到的缩合物例如苯酚线型酚醛清漆和甲酚线型酚醛清漆。这种类型的环氧树脂的实例描述于美国专利3,018,262。其它实例包括多元醇例如1，4-丁二醇的二缩水甘油醚或多缩水甘油醚，或聚亚烷基二醇例如聚丙二醇的二缩水甘油醚或多缩水甘油醚，和脂环族多元醇例如2，2-双(4-羟基环己基)丙烷的二缩水甘油醚或多缩水甘油醚。其它实例是单官能树脂，如甲苯基缩水甘油醚或丁基缩水甘油醚。
另一类的环氧化合物是多价羧酸的多缩水甘油酯和聚(β-甲基缩水甘油基)酯，所述多价羧酸例如邻苯二甲酸、对苯二甲酸、四氢邻苯二甲酸或六氢邻苯二甲酸。再另一类的环氧化合物是胺、酰胺和杂环氮碱的N-缩水甘油基衍生物，如N，N-二缩水甘油基苯胺、N，N-二缩水甘油基甲苯胺、N，N，N′，N′-四缩水甘油基双(4-氨基苯基)甲烷、异氰尿酸三缩水甘油酯、N，N′-二缩水甘油基乙基脲、N，N′-二缩水甘油基-5，5-二甲基己内酰脲、和N，N′-二缩水甘油基-5-异丙基己内酰脲。
再其它包含环氧基团的物质是缩水甘油的丙烯酸酯例如丙烯酸缩水甘油酯和甲基丙烯酸缩水甘油酯与一种或多种可共聚的乙烯基化合物的共聚物。这样的共聚物的实例是1∶1的苯乙烯-甲基丙烯酸缩水甘油酯、1∶1的甲基丙烯酸甲酯-丙烯酸缩水甘油酯和62.5∶24∶13.5的甲基丙烯酸甲酯-丙烯酸乙酯-甲基丙烯酸缩水甘油酯。
容易购得的环氧化合物包括环氧十八烷；甲基丙烯酸缩水甘油酯；双酚A的二缩水甘油醚；D.E.R.TM 331(双酚A液体环氧树脂)和D.E.R.TM 332(双酚A的二缩水甘油醚)，其购自The Dow Chemical Company，Midland，Michigan；乙烯基环己烯二氧化物；3，4-环氧环己基甲基-3，4-环氧环己烷羧酸酯；3，4-环氧-6-甲基环己基-甲基-3，4-环氧-6-甲基环己烷羧酸酯；己二酸二(3，4-环氧-6-甲基环己基甲基)酯；双(2，3-环氧环戊基)醚；使用聚丙二醇改性的脂族环氧树脂；二戊烯二氧化物；环氧化聚丁二烯；包含环氧官能度的有机硅树脂；阻燃环氧树脂(如溴化双酚类型环氧树脂，以商业名称D.E.R.TM530、539、542、560、592、和593购自The Dow Chemical Company，Midland，Michigan)；酚醛线型酚醛清漆的多缩水甘油醚(如以D.E.N.TM 431和D.E.N.TM438的商品名购自The Dow Chemical Company，Midland，Michigan的那些)；和间苯二酚二缩水甘油醚。尽管并非特别指出，也可以使用其它环氧树脂，其以D.E.R.TM和D.E.N.TM的商品名标记购自The Dow Chemical Company。
其它适宜的环氧树脂披露于，例如，美国专利7,163,973、6,632,893、6,242,083、7,037,958、6,572,971、6,153,719、和5,405,688和美国专利申请公开20060293172和20050171237，各篇参考文献通过参考并入本申请。
其它适宜的环氧树脂包括酚类树脂、苯并
嗪树脂、氰酸芳酯树脂、芳基三嗪树脂、和马来酰亚胺树脂。当然也可以使用以上列举的环氧树脂中任何的混合物。
可以提供硬化剂(或固化剂)来促进可固化组合物的交联，从而形成热固性组合物。硬化剂可以单独使用或作为两种或多种的混合物使用。在一些实施方式中，硬化剂可以包括双氰胺(dicy)或酚类固化剂例如线型酚醛清漆、甲酚、双酚。其它硬化剂可以包括高级(低聚)环氧树脂，其中一些如上披露。高级环氧树脂硬化剂的实例可以包括，例如，由双酚A二缩水甘油醚(或四溴双酚A的二缩水甘油醚)和过量的双酚或(四溴双酚)制备的环氧树脂。也可以使用酐例如聚(苯乙烯-共聚-马来酸酐)。
硬化剂也可以包括伯多胺和仲多胺及其加合物、酐、和聚酰胺。例如，多官能胺可以包括脂族胺化合物，如二亚乙基三胺(D.E H.TM 20，购自TheDow Chemical Company，Midland，Michigan)，三亚乙基四胺(D.E H.TM24，购自The Dow Chemical Company，Midland，Michigan)，四亚乙基五胺(D.E H.TM26，购自The Dow Chemical Company，Midland，Michigan)，以及以上胺与环氧树脂、稀释剂、或其它胺反应性化合物的加合物。也可以使用下列：芳族胺，如间苯二胺和二胺二苯基砜；脂族多胺，如氨基乙基哌嗪和多亚乙基多胺；和芳族多胺，如间苯二胺、二氨基二苯基砜、和二乙基甲苯二胺。
酐硬化剂可以包括，例如，纳迪克甲基酐、六氢邻苯二甲酸酐、偏苯三酸酐、十二碳烯基琥珀酸酐、邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、四氢邻苯二甲酸酐、和甲基四氢邻苯二甲酸酐等。
硬化剂可以包括得自苯酚或得自取代的苯酚的线型酚醛清漆或酐。适宜的硬化剂的非限制性实例包括苯酚线型酚醛清漆硬化剂，甲酚线型酚醛清漆硬化剂，二环戊二烯双酚硬化剂，柠檬烯类型的硬化剂、酐、及其混合物。
在一些实施方式中，苯酚线型酚醛清漆硬化剂可以包含联苯部分或萘基部分。酚羟基基团可以连接于化合物的联苯部分或萘基部分。这种类型的硬化剂可以根据例如EP915118A1中描述的方法制备。例如，包含联苯部分的硬化剂可以通过使苯酚与双甲氧基-亚甲基联苯反应制备。
在其它实施方式中，硬化剂可以包括双氰胺、三氟化硼单乙胺、和二氨基环己烷。硬化剂也可以包括咪唑、它们的盐、和加合物。这些环氧硬化剂在室温典型地为固体。适宜的咪唑硬化剂的实例披露于EP906927A1。其它硬化剂包括酚类、苯并嗪、芳族胺、酰氨基胺、脂族胺、酐、和苯酚。
在一些实施方式中，硬化剂可以是聚酰胺或每个氨基基团的分子量为至多500的氨基化合物，如芳族胺或胍衍生物。氨基固化剂的实例包括4-氯苯基-N，N-二甲基-脲和3，4-二氯苯基-N，N-二甲基-脲。
用于本申请公开的实施方式中的硬化剂的其它实例包括：3，3′-二氨基二苯基砜和4，4′-二氨基二苯基砜；亚甲基二苯胺；双(4-氨基-3，5-二甲基-苯基)-1，4-二异丙基苯，其以EPON 1062购自Hexion Chemical Co.；和双(4-氨基苯基)-1，4-二异丙基苯，其以EPON 1061购自Hexion Chemical Co。
也可以使用环氧化合物的硫醇硬化剂，其描述于，例如，美国专利5,374,668。如本申请所使用，“硫醇”也包括多硫醇固化剂。说明性的硫醇包括脂族硫醇，如甲烷二硫醇、丙烷二硫醇、环己烷二硫醇、2-巯基乙基-2，3-二巯基-琥珀酸酯、2，3-二巯基-1-丙醇(2-巯基乙酸酯)、二甘醇双(2-巯基乙酸酯)、1，2-二巯基丙基甲基醚、双(2-巯基乙基)醚、三羟甲基丙烷三(巯基乙酸酯)、季戊四醇四(巯基丙酸酯)、季戊四醇四(巯基乙酸酯)、乙二醇二巯基乙酸酯、三羟甲基丙烷三(β-硫代丙酸酯)、丙氧基化烷烃的三缩水甘油醚的三硫醇衍生物、和二季戊四醇聚(β-硫代丙酸酯)；脂族硫醇的卤素取代的衍生物；芳族硫醇，如二巯基苯、三巯基苯或四巯基苯、二(巯基烷基)苯、三(巯基烷基)苯或四(巯基烷基)苯、二巯基联苯、甲苯二硫醇和萘二硫醇；芳族硫醇的卤素取代的衍生物；包含杂环的硫醇，如氨基-4，6-二硫醇-均-三嗪、烷氧基-4，6-二硫醇-均-三嗪、芳氧基-4，6-二硫醇-均-三嗪和1，3，5-三(3-巯基丙基)异氰尿酸酯；包含杂环的硫醇的卤素取代的衍生物；包含至少两个巯基基团和除了巯基基团还包含硫原子的硫醇化合物，如二(巯基烷基硫基)苯、三(巯基烷基硫基)苯或四(巯基烷基硫基)苯、二(巯基烷基硫基)烷烃、三(巯基烷基硫基)烷烃或四(巯基烷基硫基)烷烃、双(巯基烷基)硫醚、羟基烷基硫醚双(巯基丙酸酯)、羟基烷基硫醚双(巯基乙酸酯)、巯基乙基醚双(巯基丙酸酯)、1，4-二硫代-2，5-二醇双(巯基乙酸酯)(1，4-dithian-2，5-diol bis(mercaptoacetate))、硫联二乙醇酸双(巯基烷基酯)、硫联二丙酸双(2-巯基烷基酯)、4，4-硫联丁酸双(2-巯基烷基酯)(4，4-thiobutyric acid bis(2-mercaptoalkyl ester))、3，4-噻吩二硫醇、铋硫醇和2，5-二巯基-1，3，4-噻二唑。
硬化剂也可以是亲核性物质，例如胺、叔膦、包含亲核性阴离子的季铵盐、包含亲核性阴离子的季
盐、咪唑、包含亲核性阴离子的叔砷盐、和包含亲核性阴离子的叔锍盐。
通过与环氧树脂、丙烯腈、或甲基丙烯酸酯加成而改性的脂族多胺也可以用作固化剂。此外，可以使用各种Mannich碱。也可以使用其中胺基团直接连接于芳环的芳族胺。
在本申请公开的实施方式中可用作硬化剂的包含亲核阴离子的季铵盐可以包括四乙基氯化铵、四丙基乙酸铵、己基三甲基溴化铵、苄基三甲基氰化铵、十六烷基三乙基叠氮化铵、N，N-二甲基异氰酸吡咯烷
、苯酚N-甲基吡啶、氯化N-甲基-邻氯吡啶
、甲基紫罗碱二氯化物等。
本申请使用的硬化剂的适合性可以参考生产商说明书或常规实验法确定。如果固化剂在用于与液体或固体环氧树脂混合的所需温度是非晶固体或结晶固体，则生产商说明书可以用来确定。可替换地，可以使用差示扫描量热法(DSC)测试固体固化剂，从而确定固体固化剂的非晶性质或结晶性质和确定用于与呈液体或固体形式的树脂组合物混合的固化剂的适用性。
也可以使用上述环氧硬化剂(或固化剂)中一种或多种的混合物。
任选地，可以将催化剂添加到如上所述的清漆中。催化剂可以包括但不限于咪唑化合物，其包括每分子包含一个咪唑环的化合物，如咪唑、2-甲基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、2-十七烷基咪唑、2-苯基咪唑、2-苯基-4-甲基咪唑、1-苄基-2-甲基咪唑、2-乙基咪唑、2-异丙基咪唑、2-苯基-4-苄基咪唑、1-氰基乙基-2-甲基咪唑、1-氰基乙基-2-乙基-4-甲基咪唑、1-氰基乙基-2-十一烷基咪唑、1-氰基乙基-2-异丙基咪唑、1-氰基乙基-2-苯基咪唑、2，4-二氨基-6-[2′-甲基咪唑基-(1)′]-乙基-s-三嗪、2，4-二氨基-6-[2′-乙基-4-甲基咪唑基-(1)′]-乙基-s-三嗪、2，4-二氨基-6-[2′-十一烷基咪唑基-(1)′]-乙基-s-三嗪、2-甲基-咪唑
-异氰尿酸加合物、2-苯基咪唑
-异氰尿酸加合物、1-氨基乙基-2-甲基咪唑、2-苯基-4，5-二羟基甲基咪唑、2-苯基-4-甲基-5-羟基甲基咪唑、2-苯基-4-苄基-5-羟基甲基咪唑等；和每分子包含2个或更多个咪唑环的化合物，其通过下述过程获得，使以上指定的包含羟基甲基的咪唑化合物例如2-苯基-4，5-二羟基甲基咪唑、2-苯基-4-甲基-5-羟基甲基咪唑和2-苯基-4-苄基-5-羟基-甲基咪唑脱水；和使它们与甲醛缩合，例如，4，4′-亚甲基-双-(2-乙基-5-甲基咪唑)等。
在其它实施方式中，适宜的催化剂可以包括胺催化剂，如N-烷基吗啉、N-烷基链烷醇胺、N，N-二烷基环己胺、和烷基胺，其中烷基基团是甲基、乙基、丙基、丁基及其异构形式、和杂环胺。
也可以使用非胺催化剂。可以使用下述金属的金属有机化合物：铋、铅、锡、钛、铁、锑、铀、镉、钴、钍、铝、汞、锌、镍、铈、钼、钒、铜、锰、和锆。说明性的实例包括硝酸铋、2-乙基己酸铅、苯甲酸铅、氯化铁、三氯化锑、乙酸亚锡、辛酸亚锡、和2-乙基己酸亚锡。可以使用的其它催化剂披露于，例如，PCT公开WO 00/15690，其通过参考全部并入本申请。
在一些实施方式中，适宜的催化剂可以包括亲核性胺和膦，特别是氮杂环例如烷基化咪唑：2-苯基咪唑、2-甲基咪唑、1-甲基咪唑、2-甲基-4-乙基咪唑；其它杂环物质，如二氮杂双环十一碳烯(DBU)、二氮杂双环辛烯、六亚甲基四胺、吗啉、哌啶；三烷基胺，如三乙胺、三甲胺、苄基二甲基胺；膦，如三苯基膦、三甲苯基膦、三乙基膦；季盐，如三乙基氯化铵、四乙基氯化铵、四乙基乙酸铵、三苯基乙酸
和三苯基碘化
也可以使用上述催化剂中的一种或多种的混合物。
在一种实施方式中，也可以将溶剂添加到清漆中。适宜的溶剂包括但不限于水和沸点低于200℃的有机溶剂。这些溶剂的实例包括丙酮、2-丁酮、甲基异丁基酮、环己酮、甲醇、乙醇、异丙醇、正丁醇和异丁醇、甲氧基丙醇(即DowanolTM PM)、乙酸甲氧基丙基酯(DowanolT M PMA)、和N，N’-二甲基甲酰胺。
可以有利地使用金属稳定剂，所述金属稳定剂已经进行过表面处理，有助于分散过程。这样的表面处理允许粒子相对容易分离，和降低重新凝聚的趋势。表面处理剂的实例包括羧酸、磺酸和硫酸、磷酸和膦酸以及有关表面活性剂。具体实例是脂族羧酸，如乙酸、油酸、和硬脂酸、苯基磺酸、甲苯磺酸、长链醇的硫酸酯。其它处理剂包括硅烷和有机硅。
设计这样的处理剂，从而改变固体的表面特征，其典型地通过形成惰性表面层进行。可替换地，可以设计处理剂从而涂覆表面和与本发明的组分相互作用。具体实例是氨基丙基三甲氧基硅烷、环氧硅烷、甲基丙烯酰氧基丙基三甲氧基硅烷。
添加到制剂中的分散助剂是本领域熟知的。可获得多种专利的添加剂例如得自BYK。
在一些实施方式中，可以使用填料。适宜的填料可以包括，例如，二氧化硅、氧化铝、玻璃、滑石、金属粉末、二氧化钛、润湿剂、颜料、着色剂、脱模剂、偶联剂、离子清除剂、UV稳定剂、增韧剂、和增粘剂。添加剂和填料也可以包括蒸气沉积二氧化硅、聚集体例如玻璃珠、聚四氟乙烯、多元醇树脂、聚酯树脂、酚类树脂、石墨、二硫化钼、研磨颜料、降粘剂、氮化硼、云母、成核剂、和稳定剂等。填料可以包括粒度为0.5nm至100微米的功能性或非功能性颗粒填料，其可以包括，例如，三水合氧化铝、氧化铝、氢氧化铝氧化物、金属氧化物、和纳米管)。在添加到环氧树脂组合物中之前，可以预加热填料和改性剂以驱除湿气。此外，这些任选的添加剂在固化之前和/或之后会对组合物的性质产生影响，而且当配制清漆和所需反应产物时应当予以考虑。可以使用硅烷处理的填料。
在其它实施方式中，本申请公开的清漆也可以包括纳米填料。纳米填料可以是无机的、有机的、或金属的，其可以呈粉末、晶须、纤维、片或膜的形式。纳米填料通常可以是任何填料或具有至少一个为约0.1至约100纳米的尺寸(长度、宽度、或厚度)的填料的组合。例如，对于粉末，所述至少一个尺寸可以表征为晶粒尺寸；对于晶须和纤维，所述至少一个尺寸是直径；而对于片和膜，所述至少一个尺寸是厚度。例如，粘土可以分散进基于环氧树脂的基体中，和当粘土在剪切作用下分散进环氧树脂中时，其可以破裂形成非常薄的组成层。纳米填料可以包括粘土，有机粘土，碳纳米管，纳米晶须(如SiC)，SiO2，一种或多种选自元素周期表的s、p、d、和f族的元素的元素、阴离子、或盐，金属，金属氧化物，和陶瓷。
在一些实施方式中，复合材料可以由本申请公开的固化清漆形成。在其它实施方式中，复合材料可以通过将可固化环氧树脂组合物施涂于基材或增强材料形成，如通过浸渍或涂覆所述基材或增强材料形成预浸料，和在压力下固化该预浸料形成电层压组合物进行。
在已经生产出清漆之后，如上所述，在电层压组合物的固化之前、过程中、或之后，其可以置于上述基材上、上述基材中、或上述基材之间。例如，复合材料可以通过使用清漆涂覆基材形成。涂覆可以通过各种过程进行，包括喷涂、帘幕涂布、使用辊涂机或凹版涂布机涂覆、刷涂、和浸渍或浸入涂覆。
在各种实施方式中，基材可以是单层或多层。例如，基材可以是两种合金的复合材料、多层聚合物制品、和镀金属聚合物等。在其它各种实施方式中，可固化组合物的一层或多层可以置于基材上。本申请也想到通过基材层和电层压组合物层的各种组合形成的其它多层复合材料。
在一些实施方式中，例如，清漆的加热可以固定，从而避免温度敏感基材的过热。在其它实施方式中，所述加热可以包括加热基体和组合物。
在若干分钟至至多为若干小时的时间内，本申请公开的清漆的固化可能需要至少约30℃、至多为约250℃的温度，这取决于环氧树脂、硬化剂、和催化剂，若使用的话。在其它实施方式中，在若干分钟至至多为若干小时的时间内，固化可以在至少100℃的温度进行。也可以使用后处理，这样的后处理通常在约100℃至250℃的温度进行。
在一些实施方式中，可以分段固化，从而防止放热。例如，分段包括在某温度固化一段时间，然后在较高的温度固化一段时间。分段固化可以包括两个或多个固化阶段，和在一些实施方式中可以在低于约180℃的温度开始，和在其它实施方式中在低于约150℃的温度开始。
在一些实施方式中，固化温度的范围可以为下述下限至下述上限：所述下限为30℃、40℃、50℃、60℃、70℃、80℃、90℃、100℃、110℃、120℃、130℃、140℃、150℃、160℃、170℃、或180℃，所述上限为250℃、240℃、230℃、220℃、210℃、200℃、190℃、180℃、170℃、160℃，其中所述范围可以为任一下限至任一上限。
本申请公开的清漆可以用于复合材料，其包含高强度细丝或纤维例如碳(石墨)、玻璃、硼等。在一些实施方式中，复合材料可以包含约30％至约70％的这些纤维，在其它实施方式中，复合材料可以包含40％至70％的这些纤维，基于该复合材料的总体积。
纤维增强复合材料，例如，可以通过热熔体预浸渍形成。预浸渍法的特征在于，使用呈熔融形式的本申请所描述的热固性组合物浸渍连续纤维的带或织物，得到预浸料，将其搁置和固化，从而提供纤维和环氧树脂的复合材料。
其它加工技术可以用来形成包含本申请公开的组合物的电层压复合材料。例如，细丝缠绕、溶剂预浸渍、和挤拉成型是其中可以使用清漆的典型的加工技术。此外，呈捆束形式的纤维可以使用清漆涂覆，通过细丝缠绕而搁置，并固化形成复合材料。
本申请的清漆和复合材料可以用作粘合剂、结构和电层压材料、涂料、船舶涂层、复合材料、粉末涂料、粘合剂、铸件、航天工业的结构，和电子工业的电路板等。
在一些实施方式中，清漆可以用于复合材料、涂料、粘合剂、或密封剂，其可以置于各种基材上、各种基材中、或各种基材之间。在其它实施方式中，可以将清漆施涂于基材，得到基于环氧树脂的预浸料。如本申请所使用，基材包括，例如，玻璃纤维织物、玻璃纤维、玻璃纸、纸、和聚乙烯和聚丙烯的类似基材。可以将得到的预浸料剪切成所需尺寸。导电层可以使用导电材料在层压材料/预浸料上形成。如本申请所使用，适宜的导电性材料包括导电金属，如铜、金、银、铂和铝。这样的电层压材料可以用作，例如，电气或电子设备的多层印刷电路板。由马来酰亚胺-三嗪-环氧聚合物共混物制造的层压材料特别适用于HDI(高密度互连)板的生产。HDI板的实例包括用于手机的那些或用于互连(IC)基材的那些。
实施例
下列实施例意在说明本发明和教导本领域普通技术人员实现和利用本发明。这些实施例不意图以任何方式限制本发明。
在下列实施例中，各组分如下：
D.E.R.TM 530-A80：溴化环氧树脂，其通过使过量双酚A二缩水甘油醚与四溴双酚A(80％固体在丙酮中)缩合制备
D.E.R.TM 592-A80：溴化环氧树脂，其通过使过量双酚A二缩水甘油醚与亚甲基二异氰酸酯和四溴双酚A(80％固体在丙酮中)缩合制备
D.E.R.TM 383：双酚A的二缩水甘油醚
D.E.N.TM 438EK85是线型酚醛清漆，其经丙酮和苯酚(85％固体在MEK中)的缩聚反应酯
Nano-ZnO是氧化锌，得自Aldrich，其平均粒度小于1μm
NanoTekTM ZnO是氧化锌，得自Nanophase Technologies，其平均粒度小于100nm
NanoGardTM ZnO是氧化锌，得自Nanophase Technologies，其平均粒度小于100nm
Zn(acac)2是乙酰丙酮化锌，得自Aldrich
MEK是甲基乙基酮，得自Aldrich
在以下实施例中，4批母料均使用高剪切混合机分散。
实施例1
量为50克的D.E.R.TM 530-A80和量为17.15克的Nano-ZnO在高剪切混合机中分散。高剪切混合机伴随放热以3000-5000rpm操作。加入30mL量的MEK调节粘度。混合物变成流体。使用20mL的MEK，则混合物为不流动的膏体。稳定剂的重量百分比为30.01wt％(相对于总固体)。总固体重量百分比为62.70％。
实施例2
量为50克的D.E.R.TM 530-A80和量为17.15克的Zn(acac)2在高剪切混合机中分散。高剪切混合机伴随放热以3000-5000rpm操作。不加入另外的溶剂，得到的混合物为可缓慢流动的膏体。稳定剂的重量百分比为30.01wt％(相对于总固体)。总固体重量百分比为85.11％。
实施例3
量为50克的D.E.R.TM 592-A80和量为17.15克的Nano-ZnO在高剪切混合机中分散。高剪切混合机伴随放热以3000-5000rpm操作。加入20mL量的MEK调节粘度。混合物为流体-膏体。稳定剂的重量百分比为30.01wt％(相对于总固体)。总固体重量百分比为68.73％。
实施例4
量为25克的D.E.R.TM 530-A80和量为8.57克的Zn(acac)2在高剪切混合机中分散。高剪切混合机伴随强烈的放热以3000-5000rpm操作，得到高粘性的膏体。加入量为10mL的MEK，但是必须摇动混合，从而得到均匀的膏体。稳定剂的重量百分比为30.00wt％(相对于总固体)。总固体重量百分比为85.11％。
实施例5-12
实施例5-12在以下表I中详述。
表I：经高剪切混合制备的分散体
实施例13
固体母料通过以下表II中详述的共挤出制备。称量纯D.E.R.TM 592和ZnO，将其装进2加仑的塑料桶。然后使该混合物在Prism混合机中以2300rpm在26℃的恒定温度共混15秒。将该共混过程再重复两次。然后将粉状混合物引入到以400rpm的螺杆速度操作的双螺杆挤出机(Prism TSE-24-PC粉末涂覆挤出机)中。挤出机装备有设定在25℃、75℃、90℃的三个加热区，得到的白色固体使用转鼓式刨片机刨片。
表II：通过共挤出制备的固体母料
实施例14
在该实施例中，分散体通过将预分散的氧化锌逐滴加入到环氧树脂中和然后伴随温和振荡搅拌一小时制备。这在以下表III中详述。
表III：使用预分散的稳定剂制备的分散体
实施例16
分散体经球磨机混合制备。将原料和玻璃珠在2L球磨机中以2800rpm搅拌30分钟，其中冷却水在护套中循环。然后通过临近筒体底部安装的过滤器移除玻璃珠。分散体中各组分的含量如以下表IV中详述。
表IV-经球磨机混合制备的分散体
尽管已经针对说明的目的详细描述了本发明，但是不应该认为其由此限制本发明的精神和范围，而是意味着其包括本申请精神和范围内的所有改变和修改。
Claims (17)
1.一种方法，其包括：
(a)将包括含金属的化合物的稳定剂混合进分散剂中，得到分散体，其中所述含金属的化合物包括金属，所述金属选自第11-13族金属及其组合，其中所述分散剂选自多酚、聚环氧化物、酐、多胺、及其组合，和所述酐选自纳迪克酸酐、六氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐、马来酸酐与烯烃的共聚物，和所述多胺选自双氰胺，芳族胺，脂环族胺、氨化多元醇、乙二胺、二亚乙基三胺及相关低聚物；
(b)将所述分散体添加到包含环氧树脂的清漆中。
2.根据权利要求1所述的方法，其中所述混合是高剪切混合。
3.根据权利要求2所述的方法，其中所述高剪切混合的速率为至少500rpm。
4.根据权利要求1所述的方法，其中所述混合是球磨机混合。
5.根据权利要求1所述的方法，其中所述混合是在粉末混合机中，然后通过共挤出进行。
6.根据权利要求1所述的方法，其中所述混合的时间为至少30秒。
7.根据权利要求1所述的方法，其中所述金属是锌。
8.根据权利要求7所述的方法，其中所述含金属的化合物选自锌盐、氢氧化锌、氧化锌、乙酰丙酮化锌、有机锌化合物以及其任何两种或更多种的组合。
9.根据权利要求1所述的方法，其中所述清漆还包括选自以下的组分：惰性填料、溶剂、及其混合物。
10.根据权利要求1所述的方法，其中所述稳定剂在所述分散体中的存在量为约5至约75wt%，基于所述分散体的总重量。
11.通过权利要求1中所述的方法生产的清漆。
12.一种由权利要求11中所述的清漆制备的预浸料。
13.一种由权利要求11中所述的清漆制备的电层压材料。
14.一种由权利要求11中所述的清漆制备的涂料。
15.一种由权利要求11中所述的清漆制备的复合材料。
16.一种由权利要求11中所述的清漆制备的铸件。
17.一种由权利要求11中所述的清漆制备的粘合剂。
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2009/000016 WO2010078690A1 (en) | 2009-01-06 | 2009-01-06 | Metal stabilizers for epoxy resins and dispersion process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102272252A CN102272252A (zh) | 2011-12-07 |
| CN102272252B true CN102272252B (zh) | 2014-05-28 |
Family
ID=42316190
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200980153953.9A Expired - Fee Related CN102272252B (zh) | 2009-01-06 | 2009-01-06 | 环氧树脂的金属稳定剂和分散方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20110224329A1 (zh) |
| EP (1) | EP2385974A4 (zh) |
| JP (1) | JP5853344B2 (zh) |
| KR (2) | KR20110119633A (zh) |
| CN (1) | CN102272252B (zh) |
| SG (1) | SG172875A1 (zh) |
| TW (1) | TWI519577B (zh) |
| WO (1) | WO2010078690A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI548673B (zh) * | 2015-11-05 | 2016-09-11 | 財團法人工業技術研究院 | 聚合物與分散液 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102272226B (zh) * | 2009-01-06 | 2015-06-10 | 陶氏环球技术有限责任公司 | 无溴阻燃环氧树脂中的金属化合物 |
| CN103108903B (zh) | 2010-09-17 | 2017-02-15 | 3M创新有限公司 | 纳米粒子挤拉成型加工助剂 |
| US8604115B1 (en) | 2013-03-07 | 2013-12-10 | King Fahd University Of Petroleum And Minerals | Ethylene/propylene copolymer nanocomposite |
| WO2019135857A1 (en) * | 2018-01-08 | 2019-07-11 | Dow Global Technologies Llc | Epoxy resin adhesive compositions |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975319A (en) * | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
| CN1074919A (zh) * | 1992-01-29 | 1993-08-04 | 陶氏化学公司 | 改性环氧树脂组合物、固化性组合物及低光泽涂料组合物 |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2750395A (en) * | 1954-01-05 | 1956-06-12 | Union Carbide & Carbon Corp | Diepoxides |
| US2890194A (en) * | 1956-05-24 | 1959-06-09 | Union Carbide Corp | Compositions of epoxides and polycarboxylic acid compounds |
| US3018262A (en) * | 1957-05-01 | 1962-01-23 | Shell Oil Co | Curing polyepoxides with certain metal salts of inorganic acids |
| CN1046741A (zh) * | 1988-04-30 | 1990-11-07 | 三井东圧化学株式会社 | 以多硫化物为基础的树脂，含有该树脂的塑料透镜以及制造该种透镜的方法 |
| JPH03111464A (ja) * | 1989-09-26 | 1991-05-13 | Matsushita Electric Works Ltd | プリント配線板用熱硬化性樹脂接着剤 |
| US5135993A (en) * | 1990-09-11 | 1992-08-04 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
| GB9121143D0 (en) * | 1991-10-04 | 1991-11-13 | Tioxide Chemicals Limited | Dispersions |
| WO1993015123A1 (en) * | 1992-01-28 | 1993-08-05 | The Dow Chemical Company | Blends of epoxy resins, phosphate esters of epoxy resins |
| GB9411367D0 (en) * | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
| EP0880561B1 (en) * | 1995-11-06 | 2003-01-08 | M & J Bos Consultants Pty. Ltd. | Uv absorbing compositions |
| US6190787B1 (en) * | 1997-07-02 | 2001-02-20 | Sumitomo Bakelite Company, Ltd. | Epoxy resin compositions for encapsulating semiconductors, and semiconductor devices |
| US6905634B2 (en) * | 1998-10-13 | 2005-06-14 | Peter Burnell-Jones | Heat curable thermosetting luminescent resins |
| JP2000239995A (ja) * | 1999-02-19 | 2000-09-05 | Matsushita Electric Ind Co Ltd | 絶縁基材とプリプレグおよびそれを用いた回路基板 |
| JP3707043B2 (ja) * | 1999-03-18 | 2005-10-19 | 三菱瓦斯化学株式会社 | プリント配線板用プリプレグ及び積層板 |
| US6632893B2 (en) * | 1999-05-28 | 2003-10-14 | Henkel Loctite Corporation | Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners |
| JP4348785B2 (ja) * | 1999-07-29 | 2009-10-21 | 三菱瓦斯化学株式会社 | 高弾性率ガラス布基材熱硬化性樹脂銅張積層板 |
| CA2337087C (en) * | 2000-03-08 | 2006-06-06 | Canon Kabushiki Kaisha | Magnetic toner, process for production thereof, and image forming method, apparatus and process cartridge using the toner |
| KR100867391B1 (ko) * | 2000-09-21 | 2008-11-06 | 롬 앤드 하스 캄파니 | 가볍게 개질된 점토 및 이를 포함하는 조성물의 에멀젼중합 방법 |
| US6572971B2 (en) * | 2001-02-26 | 2003-06-03 | Ashland Chemical | Structural modified epoxy adhesive compositions |
| US6534179B2 (en) * | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
| US6632860B1 (en) * | 2001-08-24 | 2003-10-14 | Texas Research International, Inc. | Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener |
| GB0212062D0 (en) * | 2002-05-24 | 2002-07-03 | Vantico Ag | Jetable compositions |
| JP2004035632A (ja) * | 2002-07-01 | 2004-02-05 | Tayca Corp | 高い透明性と紫外線遮蔽能を有する無機酸化物分散体および分散方法 |
| US7163973B2 (en) * | 2002-08-08 | 2007-01-16 | Henkel Corporation | Composition of bulk filler and epoxy-clay nanocomposite |
| KR20050093808A (ko) * | 2002-12-27 | 2005-09-23 | 티디케이가부시기가이샤 | 수지조성물, 수지경화물, 시트형상 수지경화물, 적층체,프리프레그, 전자부품 및 다층기판 |
| US7579251B2 (en) * | 2003-05-15 | 2009-08-25 | Fujitsu Limited | Aerosol deposition process |
| KR100549366B1 (ko) * | 2003-12-30 | 2006-02-03 | 주식회사 디피아이 | 양이온성 전착 도료 조성물 및 이의 제조 방법 |
| US20060194910A1 (en) * | 2004-05-19 | 2006-08-31 | Nobuo Miyatake | Stabilization of polymers with zinc oxide nanoparticles |
| TW200626659A (en) * | 2004-11-05 | 2006-08-01 | Hitachi Chemical Co Ltd | Thermosetting resin composition, and prepreg, metal-clad laminated board and printed wiring board using the same |
| US7261770B2 (en) * | 2004-11-24 | 2007-08-28 | Millennium Inorganic Chemicals, Inc. | Compositions and methods comprising pigments and polyprotic dispersing agents |
| DE602006019836D1 (de) * | 2005-04-07 | 2011-03-10 | Asahi Kasei Chemicals Corp | Epoxidharzzusammensetzung |
| US8048819B2 (en) * | 2005-06-23 | 2011-11-01 | Momentive Performance Materials Inc. | Cure catalyst, composition, electronic device and associated method |
| JP4525583B2 (ja) * | 2005-12-15 | 2010-08-18 | 東レ・ファインケミカル株式会社 | 酸化亜鉛分散ペーストの製造方法 |
| US20100264383A1 (en) * | 2006-06-15 | 2010-10-21 | Croda International Plc | Uv Absorbing Composition |
| US20080182927A1 (en) * | 2007-01-31 | 2008-07-31 | Air Products And Chemicals, Inc. | Polyisobutenyl containing dispersions and uses thereof |
| KR20100024936A (ko) * | 2007-05-16 | 2010-03-08 | 다우 글로벌 테크놀로지스 인크. | 난연성 조성물 |
| US20110218273A1 (en) * | 2009-01-06 | 2011-09-08 | Dow Global Technologies Llc | Metal stabilizers for epoxy resins and advancement process |
-
2009
- 2009-01-06 JP JP2011543960A patent/JP5853344B2/ja not_active Expired - Fee Related
- 2009-01-06 SG SG2011049277A patent/SG172875A1/en unknown
- 2009-01-06 KR KR1020117015493A patent/KR20110119633A/ko active Search and Examination
- 2009-01-06 CN CN200980153953.9A patent/CN102272252B/zh not_active Expired - Fee Related
- 2009-01-06 WO PCT/CN2009/000016 patent/WO2010078690A1/en active Application Filing
- 2009-01-06 US US13/127,837 patent/US20110224329A1/en not_active Abandoned
- 2009-01-06 KR KR1020167005929A patent/KR20160031560A/ko not_active Application Discontinuation
- 2009-01-06 EP EP09837249A patent/EP2385974A4/en not_active Withdrawn
-
2010
- 2010-01-05 TW TW099100085A patent/TWI519577B/zh not_active IP Right Cessation
-
2015
- 2015-07-09 US US14/794,985 patent/US20150315412A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4975319A (en) * | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
| CN1074919A (zh) * | 1992-01-29 | 1993-08-04 | 陶氏化学公司 | 改性环氧树脂组合物、固化性组合物及低光泽涂料组合物 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI548673B (zh) * | 2015-11-05 | 2016-09-11 | 財團法人工業技術研究院 | 聚合物與分散液 |
| US10213758B2 (en) | 2015-11-05 | 2019-02-26 | Industrial Technology Research Institute | Polymer and dispersion |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI519577B (zh) | 2016-02-01 |
| CN102272252A (zh) | 2011-12-07 |
| SG172875A1 (en) | 2011-08-29 |
| EP2385974A4 (en) | 2012-12-05 |
| KR20160031560A (ko) | 2016-03-22 |
| WO2010078690A1 (en) | 2010-07-15 |
| TW201038642A (en) | 2010-11-01 |
| US20110224329A1 (en) | 2011-09-15 |
| JP5853344B2 (ja) | 2016-02-09 |
| EP2385974A1 (en) | 2011-11-16 |
| KR20110119633A (ko) | 2011-11-02 |
| US20150315412A1 (en) | 2015-11-05 |
| JP2012514661A (ja) | 2012-06-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102272226B (zh) | 无溴阻燃环氧树脂中的金属化合物 | |
| CN102307924B (zh) | 用于制造电层压材料的均匀二马来酰亚胺-三嗪-环氧树脂组合物 | |
| CN101910238B (zh) | 用于复合材料应用的高Tg环氧体系 | |
| CN101998970B (zh) | 用于粉末涂料应用的环氧-咪唑催化剂 | |
| CN102272228B (zh) | 用于环氧树脂的金属稳定剂 | |
| CN102007158B (zh) | 经历吸热相变以降低基于环氧树脂的组合物的反应放热量的填料的应用 | |
| CN102471561A (zh) | 用于电工用层压板组合物的核/壳橡胶 | |
| CN101925629B (zh) | 使用双氰胺作为热固性环氧树脂用固化剂的不含二甲基甲酰胺的配方 | |
| US9340702B2 (en) | Coating compositions | |
| CN101772553A (zh) | 热固性阻尼材料 | |
| US7332557B2 (en) | Epoxy resin, epoxy resin composition thereof and cured product thereof | |
| KR101243511B1 (ko) | 에폭시 수지용 마이크로캡슐형 잠재성 경화제 및 그의 제조 방법, 및 일액성 에폭시 수지 조성물 및 그의 경화물 | |
| CN102272252B (zh) | 环氧树脂的金属稳定剂和分散方法 | |
| DE60200678T2 (de) | Wärmehärtbare harzzusammensetzung und herstellungsverfahren | |
| KR20110119634A (ko) | 에폭시 수지용 금속 안정화제 및 개선 방법 | |
| CN104704031A (zh) | 具有环氧硬化剂的聚合物粒子分散液 | |
| JP2010090295A (ja) | 粉末状エポキシ樹脂用潜在性硬化剤の製造方法、その方法によって得られた粉末状エポキシ樹脂用潜在性硬化剤、及び該粉末状エポキシ樹脂用潜在性硬化剤を含有してなる硬化性エポキシ樹脂組成物 | |
| JP7261580B2 (ja) | 樹脂組成物 | |
| JP2015178627A (ja) | エポキシ樹脂及び分散プロセスのための金属安定剤 | |
| JP5878568B2 (ja) | エポキシ樹脂のための金属安定剤 | |
| CN116615509A (zh) | 环氧树脂组合物、粘接薄膜、印刷电路板、半导体芯片封装体、半导体装置和粘接薄膜的使用方法 | |
| CN115124813A (zh) | 树脂组合物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160411 Address after: michigan Patentee after: BLUE CUBE INTELLECTUAL PROPERTY CO., LTD. Address before: michigan Patentee before: Dow Global Technologies Inc. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20180106 |