BR112012023949A2 - composição de resina epóxi curável - Google Patents

composição de resina epóxi curável

Info

Publication number
BR112012023949A2
BR112012023949A2 BR112012023949A BR112012023949A BR112012023949A2 BR 112012023949 A2 BR112012023949 A2 BR 112012023949A2 BR 112012023949 A BR112012023949 A BR 112012023949A BR 112012023949 A BR112012023949 A BR 112012023949A BR 112012023949 A2 BR112012023949 A2 BR 112012023949A2
Authority
BR
Brazil
Prior art keywords
resin composition
epoxy resin
curable epoxy
curable
composition
Prior art date
Application number
BR112012023949A
Other languages
English (en)
Inventor
Karunakran Radhakrishnan
H Tukakhia Rajesh
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BR112012023949A2 publication Critical patent/BR112012023949A2/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/02—Polyalkylene oxides

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
BR112012023949A 2010-03-24 2011-03-22 composição de resina epóxi curável BR112012023949A2 (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US31696210P 2010-03-24 2010-03-24
PCT/US2011/000522 WO2011119216A2 (en) 2010-03-24 2011-03-22 Epoxy resin compositions comprising poly ( propylene oxide) polyol as toughening agent

Publications (1)

Publication Number Publication Date
BR112012023949A2 true BR112012023949A2 (pt) 2017-08-08

Family

ID=44511820

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112012023949A BR112012023949A2 (pt) 2010-03-24 2011-03-22 composição de resina epóxi curável

Country Status (7)

Country Link
US (1) US8927677B2 (pt)
EP (1) EP2550310B1 (pt)
KR (1) KR20130062915A (pt)
CN (1) CN102884100B (pt)
BR (1) BR112012023949A2 (pt)
PL (1) PL2550310T3 (pt)
WO (1) WO2011119216A2 (pt)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013096635A2 (en) 2011-12-22 2013-06-27 Dow Global Technologies Llc Epoxy elastomer compositions
US20150210846A1 (en) 2012-04-27 2015-07-30 Dow Global Technologies Llc Curable epoxy resin compositions and composites made therefrom
BR112015008189A2 (pt) * 2012-10-19 2017-07-04 Dow Global Technologies Llc composição, processo para sua preparação e compósito
US9845387B2 (en) * 2012-10-19 2017-12-19 Blue Cube Ip Llc Toughened epoxy thermosets containing core shell rubbers and polyols
US20150368457A1 (en) * 2013-03-15 2015-12-24 Blue Cube Llc Toughened epoxy thermosets containing core shell rubbers and polyols
EP3052540B1 (de) * 2013-10-01 2017-11-15 Basf Se Mehrkomponenten-epoxidharzzusammensetzung
BR112016029036A2 (pt) * 2014-06-26 2017-08-22 Dow Global Technologies Llc composições de resina de cura rápida, fabricação e uso das mesmas
US10519271B2 (en) * 2014-10-13 2019-12-31 Dow Global Technologies Llc Epoxy composition containing acrylate based toughening agent
US9296915B1 (en) 2015-04-10 2016-03-29 Dow Global Technologies Llc Toughened arylcyclobutene polymers
EP3444302B1 (en) 2016-04-13 2020-07-08 Kaneka Corporation Toughened epoxy resin composition
DE102016006910A1 (de) * 2016-06-08 2017-12-14 Hexion GmbH Zusammensetzung enthaltend ein Polymer auf der Basis von Epoxidverbindungen
EP3649114A4 (en) * 2017-06-09 2021-10-20 Hexion Research Belgium SA EPOXY RESIN SYSTEMS FOR COMPOSITES
KR102161451B1 (ko) * 2019-07-12 2020-10-06 주식회사 삼양사 무수당 알코올 기반 우레탄 변성 폴리올 조성물 및 이를 포함하는 에폭시 수지용 강인화제, 및 이 강인화제를 포함하는 에폭시 수지 조성물
EP3825115A1 (de) 2019-11-22 2021-05-26 Henkel AG & Co. KGaA Peo-ppo-peo triblockcopolymere als additive für epoxid-anhydrid-systeme
CN116535820B (zh) * 2023-07-06 2023-09-29 道生天合材料科技(上海)股份有限公司 一种拉挤用环氧酸酐树脂系统料及其制备方法和应用

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3018262A (en) 1957-05-01 1962-01-23 Shell Oil Co Curing polyepoxides with certain metal salts of inorganic acids
US4052349A (en) 1975-10-28 1977-10-04 Olin Corporation Epoxy composition containing a chlorine-containing polyol and its use as an adhesive
JPS5628253A (en) * 1979-08-17 1981-03-19 Mitsubishi Electric Corp Epoxy resin composition for powder coating
US4497945A (en) * 1983-06-20 1985-02-05 General Motors Corporation Tough epoxy polymers formable by reaction injection molding
US5135993A (en) 1990-09-11 1992-08-04 Dow Corning Corporation High modulus silicones as toughening agents for epoxy resins
GB9411367D0 (en) 1994-06-07 1994-07-27 Ici Composites Inc Curable Composites
US5696225A (en) 1996-02-28 1997-12-09 Arco Chemical Technology, L.P. Process for making high-performance polyetherester resins and thermosets
US6613839B1 (en) 1997-01-21 2003-09-02 The Dow Chemical Company Polyepoxide, catalyst/cure inhibitor complex and anhydride
US6153719A (en) 1998-02-04 2000-11-28 Lord Corporation Thiol-cured epoxy composition
US6632893B2 (en) 1999-05-28 2003-10-14 Henkel Loctite Corporation Composition of epoxy resin, cyanate ester, imidazole and polysulfide tougheners
US6572971B2 (en) 2001-02-26 2003-06-03 Ashland Chemical Structural modified epoxy adhesive compositions
US6632860B1 (en) 2001-08-24 2003-10-14 Texas Research International, Inc. Coating with primer and topcoat both containing polysulfide, epoxy resin and rubber toughener
GB0212062D0 (en) 2002-05-24 2002-07-03 Vantico Ag Jetable compositions
US7163973B2 (en) 2002-08-08 2007-01-16 Henkel Corporation Composition of bulk filler and epoxy-clay nanocomposite
US7056978B2 (en) * 2002-11-06 2006-06-06 National Starch And Chemical Investment Holding Corporation Toughened epoxy-anhydride no-flow underfill encapsulant
US6887574B2 (en) 2003-06-06 2005-05-03 Dow Global Technologies Inc. Curable flame retardant epoxy compositions
JP2006063135A (ja) * 2004-08-25 2006-03-09 Dainippon Ink & Chem Inc 紫外線硬化型樹脂組成物
CN101056933B (zh) 2004-11-10 2012-11-21 陶氏环球技术有限责任公司 两亲嵌段共聚物增韧的环氧树脂和由其制成的电层压材料
US8048819B2 (en) 2005-06-23 2011-11-01 Momentive Performance Materials Inc. Cure catalyst, composition, electronic device and associated method
JP5306814B2 (ja) * 2005-09-13 2013-10-02 スリーディー システムズ インコーポレーテッド Ａｂｓ類似物品製造を目的とした光硬化性組成物
US7435982B2 (en) 2006-03-31 2008-10-14 Energetiq Technology, Inc. Laser-driven light source
WO2010121392A1 (en) 2009-04-21 2010-10-28 Dow Global Technologies Inc. Thermosettable composition containing a half ester of a cycloaliphatic diol and a thermoset product therefrom

Also Published As

Publication number Publication date
EP2550310A2 (en) 2013-01-30
KR20130062915A (ko) 2013-06-13
US8927677B2 (en) 2015-01-06
CN102884100B (zh) 2018-02-06
PL2550310T3 (pl) 2018-10-31
EP2550310B1 (en) 2018-05-02
WO2011119216A3 (en) 2012-01-05
CN102884100A (zh) 2013-01-16
US20130131217A1 (en) 2013-05-23
WO2011119216A2 (en) 2011-09-29

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]
B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]