BRPI0612009A2 - catalisador de cura, composição, dispositivo eletrÈnico e método associado - Google Patents
catalisador de cura, composição, dispositivo eletrÈnico e método associado Download PDFInfo
- Publication number
- BRPI0612009A2 BRPI0612009A2 BRPI0612009-1A BRPI0612009A BRPI0612009A2 BR PI0612009 A2 BRPI0612009 A2 BR PI0612009A2 BR PI0612009 A BRPI0612009 A BR PI0612009A BR PI0612009 A2 BRPI0612009 A2 BR PI0612009A2
- Authority
- BR
- Brazil
- Prior art keywords
- catalyst
- composition
- anhydride
- lewis acid
- fact
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
- B01J31/0235—Nitrogen containing compounds
- B01J31/0237—Amines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
- B01J31/0235—Nitrogen containing compounds
- B01J31/0244—Nitrogen containing compounds with nitrogen contained as ring member in aromatic compounds or moieties, e.g. pyridine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
- B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
- B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
- B01J31/14—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron
- B01J31/146—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides of aluminium or boron of boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/70—Chelates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07234—Using a reflow oven
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07231—Techniques
- H10W72/07236—Soldering or alloying
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/853—On the same surface
- H10W72/856—Bump connectors and die-attach connectors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Polyurethanes Or Polyureas (AREA)
- Catalysts (AREA)
- Polymerization Catalysts (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/167,847 US8048819B2 (en) | 2005-06-23 | 2005-06-23 | Cure catalyst, composition, electronic device and associated method |
| US11/167.847 | 2005-06-23 | ||
| PCT/US2006/022587 WO2007001803A2 (en) | 2005-06-23 | 2006-06-09 | Cure catalyst, composition, electronic device and associated method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BRPI0612009A2 true BRPI0612009A2 (pt) | 2010-10-13 |
Family
ID=37074187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0612009-1A BRPI0612009A2 (pt) | 2005-06-23 | 2006-06-09 | catalisador de cura, composição, dispositivo eletrÈnico e método associado |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8048819B2 (enExample) |
| EP (2) | EP1926554A2 (enExample) |
| JP (1) | JP2008544067A (enExample) |
| KR (1) | KR101391784B1 (enExample) |
| CN (2) | CN101257973B (enExample) |
| BR (1) | BRPI0612009A2 (enExample) |
| RU (1) | RU2008102366A (enExample) |
| WO (1) | WO2007001803A2 (enExample) |
Families Citing this family (82)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI0810290A2 (pt) * | 2007-05-09 | 2014-11-04 | Dow Global Technologies Inc | "processo para curar uma composição termofixa, composição termofixa e processo para formar um compósito." |
| NO20075120L (no) * | 2007-05-23 | 2008-11-24 | Mi Llc | Anvendelse av direkte epoksyemulsjoner for borehullstabilisering |
| AR063177A1 (es) | 2007-05-23 | 2008-12-30 | Mi Llc | Uso de emulsiones epoxicas inversas para la estabilizacion de perforaciones de pozos |
| WO2008147641A1 (en) * | 2007-05-29 | 2008-12-04 | Dow Global Technologies Inc. | Isocyanate-epoxy formulations for improved cure control |
| KR20100058521A (ko) | 2007-08-02 | 2010-06-03 | 다우 글로벌 테크놀로지스 인크. | 열경화된 완충재 |
| KR20150063590A (ko) * | 2007-08-02 | 2015-06-09 | 다우 글로벌 테크놀로지스 엘엘씨 | 열경화성 중합체의 성능을 개선시키기 위한 양친매성 블록 공중합체 및 무기 나노충진제 |
| EP2207827A1 (en) | 2007-10-26 | 2010-07-21 | Dow Global Technologies Inc. | Epoxy resin composition containing isocyanurates for use in electrical laminates |
| ATE509053T1 (de) * | 2007-11-29 | 2011-05-15 | Dow Global Technologies Llc | Dimethylformamidfreie formulierungen mit dicyanadiamid als härtemittel für wärmehärtende epoxidharze |
| CN101878101A (zh) * | 2007-11-29 | 2010-11-03 | 陶氏环球技术公司 | 可微波加热的单乙烯基芳族聚合物 |
| WO2009089145A1 (en) * | 2008-01-08 | 2009-07-16 | Dow Global Technologies Inc. | High tg epoxy systems for composite application |
| US7629203B2 (en) * | 2008-03-31 | 2009-12-08 | Intel Corporation | Thermal interface material for combined reflow |
| EP2268697B1 (en) | 2008-04-14 | 2014-01-29 | Dow Global Technologies LLC | Epoxy-imidazole catalysts useful for powder coating applications |
| CN102197041A (zh) * | 2008-08-28 | 2011-09-21 | 陶氏环球技术有限责任公司 | 含磷化合物和包含其的聚合物组合物 |
| WO2010075006A1 (en) | 2008-12-16 | 2010-07-01 | Dow Global Technologies Inc. | Homogeneous bismaleimide - triazine - epoxy compositions useful for the manufacture of electrical laminates |
| WO2010078690A1 (en) * | 2009-01-06 | 2010-07-15 | Dow Global Technologies Inc. | Metal stabilizers for epoxy resins and dispersion process |
| US20120010329A1 (en) | 2009-02-24 | 2012-01-12 | Hunter Gary A | Curable epoxy resin compositions and cured products therefrom |
| CN102449019A (zh) | 2009-05-27 | 2012-05-09 | 陶氏环球技术有限责任公司 | 聚合缩水甘油醚活性稀释剂 |
| CN106832224A (zh) | 2009-06-22 | 2017-06-13 | 蓝立方知识产权有限责任公司 | 环氧树脂的硬化剂组合物 |
| WO2011037892A1 (en) | 2009-09-22 | 2011-03-31 | Dow Global Technologies Llc | Process for preparing episulfide resins |
| CA2770354A1 (en) | 2009-09-25 | 2011-03-31 | Dow Global Technologies Llc | Curable epoxy resin compositions and composites made therefrom |
| CN102549069B (zh) | 2009-09-30 | 2015-06-10 | 陶氏环球技术有限责任公司 | 环氧树脂组合物 |
| JP5527600B2 (ja) * | 2009-10-07 | 2014-06-18 | 日立化成株式会社 | エポキシ樹脂組成物及びそれを用いた電子部品装置 |
| CN105713179A (zh) | 2009-11-12 | 2016-06-29 | 陶氏环球技术有限责任公司 | 聚噁唑烷酮树脂 |
| SG181486A1 (en) | 2009-12-02 | 2012-07-30 | Dow Global Technologies Llc | Coating compositions |
| EP2507285A2 (en) | 2009-12-02 | 2012-10-10 | Dow Global Technologies LLC | Composite compositions |
| SG181461A1 (en) | 2009-12-02 | 2012-07-30 | Dow Global Technologies Llc | Epoxy resin compositions |
| WO2011068858A1 (en) | 2009-12-03 | 2011-06-09 | Dow Global Technologies Llc | Adducts based on divinylarene oxides |
| CN102666636B (zh) | 2009-12-08 | 2015-11-25 | 陶氏环球技术有限责任公司 | 羟基官能聚酯树脂 |
| CN102666520B (zh) | 2009-12-09 | 2015-05-20 | 陶氏环球技术有限责任公司 | 二乙烯基芳烃二氧化物树脂 |
| KR20120114295A (ko) | 2009-12-09 | 2012-10-16 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지 조성물 |
| WO2011097009A2 (en) | 2010-02-02 | 2011-08-11 | Dow Global Technologies Llc | Curable epoxy resin compositions |
| EP2550310B1 (en) | 2010-03-24 | 2018-05-02 | Blue Cube IP LLC | Epoxy resin compositions comprising poly(propylene oxide) polyol as toughening agent |
| TWI557100B (zh) | 2010-05-21 | 2016-11-11 | 藍色立方體有限責任公司 | 用於可熱固樹脂組成物之硬化劑 |
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| JP2014528982A (ja) | 2011-08-18 | 2014-10-30 | ダウ グローバル テクノロジーズ エルエルシー | 硬化型樹脂組成物 |
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| BR112014008701A2 (pt) | 2011-11-08 | 2017-04-25 | Dow Global Technologies Llc | agente enrijecedor bimodal, composição de resina epóxi termofixável, processo para preparar uma composição de resina epóxi termofixável e produto |
| WO2013081895A2 (en) | 2011-12-01 | 2013-06-06 | Dow Global Tecnologies LLC | Liquid accelerator composition for hardeners |
| CN104470983A (zh) * | 2011-12-29 | 2015-03-25 | 3M创新有限公司 | 可固化聚硅氧烷组合物 |
| KR20140119053A (ko) | 2011-12-30 | 2014-10-08 | 다우 글로벌 테크놀로지스 엘엘씨 | 저온 경화성 에폭시 계 |
| WO2013155061A1 (en) | 2012-04-09 | 2013-10-17 | M-I L.L.C. | Triggered heating of wellbore fluids by carbon nanomaterials |
| JP5815463B2 (ja) * | 2012-04-27 | 2015-11-17 | 株式会社日本触媒 | カチオン硬化触媒の製造方法 |
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| US20200190390A1 (en) | 2017-08-15 | 2020-06-18 | Covestro Llc | Additive to flexibilize epoxy-based resins for use in oil field applications |
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| US12540254B2 (en) | 2018-06-22 | 2026-02-03 | Ennis-Flint, Inc. | Epoxy compositions and methods of use |
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| CN113924330B (zh) | 2019-06-04 | 2023-01-24 | 美国陶氏有机硅公司 | 甲硅烷基氢化物与甲硅烷基醚和/或硅烷醇之间的热引发的酸催化反应 |
| KR102952089B1 (ko) | 2019-06-04 | 2026-04-14 | 다우 실리콘즈 코포레이션 | 실릴 수소화물과 알파-베타 불포화 에스테르 사이의 열적으로 개시되는 산 촉매 반응 |
| JP7306903B2 (ja) * | 2019-07-17 | 2023-07-11 | 株式会社ダイセル | 硬化性組成物、及び繊維強化複合材料 |
| KR102775243B1 (ko) * | 2020-04-20 | 2025-03-04 | 삼성디스플레이 주식회사 | 표시 장치, 접합 장치 및 이를 이용하는 표시 장치 제조 방법 |
| WO2021247210A1 (en) | 2020-06-04 | 2021-12-09 | Dow Silicones Corporation | Epoxy-curable silicone release coating composition and methods for its preparation and use |
| EP4172243A1 (en) | 2020-06-24 | 2023-05-03 | Dow Silicones Corporation | Methods for making polyfunctional organosiloxanes and compositions containing same |
| US12473404B2 (en) | 2020-06-24 | 2025-11-18 | Dow Global Technologies Llc | Composition and method for silyl hydride reaction catalyzed by fluorinated arylborane Lewis acids |
| EP4172241B1 (en) | 2020-06-24 | 2024-02-28 | Dow Silicones Corporation | Composition and method for reacting an organosilicon compound and a silyl hydride catalyzed by a fluorinated arylborane lewis acid |
| CN121969667A (zh) | 2023-10-10 | 2026-05-01 | 株式会社日本触媒 | 热潜伏性阳离子聚合引发剂、固化性树脂组合物及金属接合体 |
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-
2005
- 2005-06-23 US US11/167,847 patent/US8048819B2/en not_active Expired - Fee Related
-
2006
- 2006-06-09 EP EP06784726A patent/EP1926554A2/en not_active Withdrawn
- 2006-06-09 CN CN200680022834.6A patent/CN101257973B/zh not_active Expired - Fee Related
- 2006-06-09 EP EP10014910.3A patent/EP2283922A3/en not_active Withdrawn
- 2006-06-09 BR BRPI0612009-1A patent/BRPI0612009A2/pt not_active Application Discontinuation
- 2006-06-09 WO PCT/US2006/022587 patent/WO2007001803A2/en not_active Ceased
- 2006-06-09 CN CN2012102704518A patent/CN102786665A/zh active Pending
- 2006-06-09 JP JP2008518211A patent/JP2008544067A/ja active Pending
- 2006-06-09 RU RU2008102366/04A patent/RU2008102366A/ru not_active Application Discontinuation
- 2006-06-09 KR KR1020087001868A patent/KR101391784B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR101391784B1 (ko) | 2014-05-07 |
| RU2008102366A (ru) | 2009-07-27 |
| JP2008544067A (ja) | 2008-12-04 |
| EP2283922A3 (en) | 2013-07-03 |
| CN102786665A (zh) | 2012-11-21 |
| EP1926554A2 (en) | 2008-06-04 |
| WO2007001803A3 (en) | 2007-03-15 |
| US20060293172A1 (en) | 2006-12-28 |
| CN101257973A (zh) | 2008-09-03 |
| WO2007001803A2 (en) | 2007-01-04 |
| CN101257973B (zh) | 2014-07-30 |
| KR20080034438A (ko) | 2008-04-21 |
| US8048819B2 (en) | 2011-11-01 |
| EP2283922A2 (en) | 2011-02-16 |
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