JP2008539599A5 - - Google Patents

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Publication number
JP2008539599A5
JP2008539599A5 JP2008509150A JP2008509150A JP2008539599A5 JP 2008539599 A5 JP2008539599 A5 JP 2008539599A5 JP 2008509150 A JP2008509150 A JP 2008509150A JP 2008509150 A JP2008509150 A JP 2008509150A JP 2008539599 A5 JP2008539599 A5 JP 2008539599A5
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Prior art keywords
substrate
package
assembly
die
area
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JP2008509150A
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Japanese (ja)
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JP4503677B2 (ja
JP2008539599A (ja
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Priority claimed from US11/394,635 external-priority patent/US7429786B2/en
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JP2008509150A 2005-04-29 2006-04-27 上側および下側の基板表面を露出させた半導体パッケージ Active JP4503677B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US59471105P 2005-04-29 2005-04-29
US69284205P 2005-06-20 2005-06-20
US11/394,635 US7429786B2 (en) 2005-04-29 2006-03-31 Semiconductor package including second substrate and having exposed substrate surfaces on upper and lower sides
PCT/US2006/016143 WO2006118982A2 (en) 2005-04-29 2006-04-27 Semiconductor substrate with exposed upper and lower sides

Publications (3)

Publication Number Publication Date
JP2008539599A JP2008539599A (ja) 2008-11-13
JP2008539599A5 true JP2008539599A5 (enExample) 2009-07-02
JP4503677B2 JP4503677B2 (ja) 2010-07-14

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JP2008509150A Active JP4503677B2 (ja) 2005-04-29 2006-04-27 上側および下側の基板表面を露出させた半導体パッケージ

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Country Link
US (1) US7429786B2 (enExample)
JP (1) JP4503677B2 (enExample)
KR (1) KR101120122B1 (enExample)
TW (1) TWI322489B (enExample)
WO (1) WO2006118982A2 (enExample)

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