JP2008021993A - 全背面接点構成を含む光起電力デバイス及び関連する方法 - Google Patents
全背面接点構成を含む光起電力デバイス及び関連する方法 Download PDFInfo
- Publication number
- JP2008021993A JP2008021993A JP2007171329A JP2007171329A JP2008021993A JP 2008021993 A JP2008021993 A JP 2008021993A JP 2007171329 A JP2007171329 A JP 2007171329A JP 2007171329 A JP2007171329 A JP 2007171329A JP 2008021993 A JP2008021993 A JP 2008021993A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- semiconductor layer
- amorphous semiconductor
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 146
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 239000002019 doping agent Substances 0.000 claims description 59
- 238000000151 deposition Methods 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 15
- 239000000203 mixture Substances 0.000 claims description 12
- 238000010348 incorporation Methods 0.000 claims description 4
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 206
- 229910052751 metal Inorganic materials 0.000 description 22
- 239000002184 metal Substances 0.000 description 22
- 238000006243 chemical reaction Methods 0.000 description 17
- 239000002800 charge carrier Substances 0.000 description 14
- 230000008021 deposition Effects 0.000 description 14
- 239000007789 gas Substances 0.000 description 13
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 12
- 238000005215 recombination Methods 0.000 description 12
- 230000006798 recombination Effects 0.000 description 12
- 239000002243 precursor Substances 0.000 description 11
- 238000005229 chemical vapour deposition Methods 0.000 description 10
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- 229910021417 amorphous silicon Inorganic materials 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 230000008859 change Effects 0.000 description 8
- 239000001257 hydrogen Substances 0.000 description 8
- 229910052739 hydrogen Inorganic materials 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 125000004429 atom Chemical group 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000005137 deposition process Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000011787 zinc oxide Substances 0.000 description 3
- 230000003667 anti-reflective effect Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 2
- 239000012159 carrier gas Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 239000005038 ethylene vinyl acetate Substances 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- CMWTZPSULFXXJA-VIFPVBQESA-N naproxen Chemical compound C1=C([C@H](C)C(O)=O)C=CC2=CC(OC)=CC=C21 CMWTZPSULFXXJA-VIFPVBQESA-N 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000012686 silicon precursor Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000013084 building-integrated photovoltaic technology Methods 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 210000001520 comb Anatomy 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003745 diagnosis Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 150000002440 hydroxy compounds Chemical class 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000000391 spectroscopic ellipsometry Methods 0.000 description 1
- 230000007847 structural defect Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0236—Special surface textures
- H01L31/02363—Special surface textures of the semiconductor body itself, e.g. textured active layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/065—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the graded gap type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0745—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
- H01L31/0747—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/20—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof such devices or parts thereof comprising amorphous semiconductor materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Sustainable Development (AREA)
- Photovoltaic Devices (AREA)
Abstract
【解決手段】本半導体構造は、前面(12)及び背面(14)を有する1つの導電型の半導体基板(10)を含む。第1のアモルファス半導体層(16)は、半導体基板(10)の前面(12)上に付加され、また第2(22)及び第3(32)のアモルファス半導体層は、半導体基板(10)の背面(14)の一部分上に配置される。第2及び第3の層は各々、その深さにわたって基板(10)との界面における実質的に真性からその反対面における実質的に導電性まで組成傾斜している。幾つかの事例では、第1の半導体層(16)はまた、組成傾斜しているが、他の事例では第1の半導体層(16)は、真性であることを特徴とする。半導体構造は、太陽電池として機能することができ、また多数のそのような電池を含むモジュールは、本発明の別の実施形態を表す。光起電力デバイスを作る方法についてもまた、説明している。
【選択図】 図1
Description
(a)前面及び背面を有する1つの導電型の半導体基板と、
(b)半導体基板の前面上に配置された第1のアモルファス半導体層と、
(c)半導体基板の背面の一部分上に配置され、その深さにわたって基板との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜し、また選択ドーパント原子の組み込みによって得られた選択導電型を有する第2のアモルファス半導体層と、
(d)半導体基板の背面の別の部分上にかつ第2のアモルファス半導体層から間隔をおいて配置され、その深さにわたって基板との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜し、また第2のアモルファス層の型とは異なりかつ選択ドーパント原子の組み込みによって得られた導電型を有する第3のアモルファス半導体層と、を含む。
(I)半導体基板の前面上に第1のアモルファス半導体層を形成する段階と、
(II)第2のアモルファス半導体層がその深さにわたって基板の背面との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜した状態になるように、半導体材料及びドーパントを該ドーパントの濃度を変更しながら背面部分上に連続的に堆積させることによって、半導体基板の背面の一部分上に第2のアモルファス半導体層を形成する段階と、
(III)第3のアモルファス半導体層がその深さにわたって基板の背面との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜した状態になるように、半導体材料及びドーパントを該ドーパントの濃度を変更しながら背面部分上に連続的に堆積させることによって、半導体基板の背面の別の部分上に第3のアモルファス半導体層を形成する段階と、を含む。
12 基板の前面
14 基板の背面
16 第1のアモルファスシリコン層
18 透明膜/層
20 層18の上面
22 第2のアモルファス半導体層
24 第2のアモルファス層の領域
26 第2のアモルファス層の領域
28 電極層
30 金属接点層
32 第3のアモルファス半導体層
34 半導体層32の領域
36 半導体層32の領域
38 電極層
40 金属接点層
42 溝
50 組成傾斜アモルファス半導体層
52 層50の領域
54 層50の領域
56 透明層
60 テクスチャ加工特徴形状部
Claims (15)
- (a)前面(12)及び背面(14)を有する1つの導電型の半導体基板(10)と、
(b)前記半導体基板(10)の前面(12)上に配置された第1のアモルファス半導体層(16)と、
(c)前記半導体基板(10)の背面(14)の一部分上に配置され、その深さにわたって前記基板(10)との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜し、また選択ドーパント原子の組み込みによって得られた選択導電型を有する第2のアモルファス半導体層(22)と、
(d)前記半導体基板(10)の背面(14)の別の部分上にかつ前記第2のアモルファス半導体層(22)から間隔をおいて配置され、その深さにわたって前記基板(10)との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜し、また前記第2のアモルファス層(22)の型とは異なりかつ選択ドーパント原子の組み込みによって得られた導電型を有する第3のアモルファス半導体層(32)と、
を含む半導体構造。 - 前記第2のアモルファス半導体層(22)及び第3のアモルファス半導体層(32)の両方について、前記基板(10)との界面におけるドーパント原子の濃度が、実質的にゼロであり、またその反対側におけるドーパント原子の濃度が、約1×1016cm−3〜約1×1021cm−3の範囲内である、請求項1記載の半導体構造。
- 少なくとも1つの電気接点(30)が、前記第2のアモルファス半導体層(22)上に配置され、また少なくとも1つの電気接点(40)が、前記第3のアモルファス半導体層(32)上に配置される、請求項1記載の半導体構造。
- 電極層(28)が、前記第2のアモルファス半導体層(22)とその上にある電気接点(30)との間に配置され、また電極層(38)が、前記第3のアモルファス半導体層(32)とその上にある電気接点(40)との間に配置される、請求項3記載の半導体構造。
- 前記第2のアモルファス半導体層(22)が、分離溝(42)によって前記第3のアモルファス半導体層(32)から間隔をおいて配置される、請求項1記載の半導体構造。
- 透明層(18)が、前記第1のアモルファス半導体層(16)上に配置される、請求項1記載の半導体構造。
- 前記透明層(18)が、反射防止構造を含む、請求項6記載の半導体構造。
- 前記透明層(18)が、窒化ケイ素を含む材料で形成される、請求項6記載の半導体構造。
- 前記基板(10)が、単結晶又は多結晶であり、かつn型又はp型である、請求項1記載の半導体構造。
- 前記第1のアモルファス半導体層(16)が、真性である、請求項1記載の半導体構造。
- 前記第1のアモルファス半導体層(16)が、その深さにわたって前記基板(10)との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜している、請求項1記載の半導体構造。
- 前記基板(10)の前面(12)が、テクスチャ加工される、請求項1記載の半導体構造。
- 前記第2のアモルファス半導体層(22)上に配置された少なくとも1つの電気接点(30)が、前記第3のアモルファス半導体層(32)上に配置された少なくとも1つの電気接点(40)と交互かみ合いする、請求項3記載の半導体構造。
- 全背面接点構成を有する半導体構造を含み、
前記構造の少なくとも1つのアモルファス半導体層が、組成傾斜ドーパント原子プロフィールを含む、
太陽電池。 - 光起電力デバイスを作る方法であって、
(I)半導体基板(10)の前面(12)上に第1のアモルファス半導体層(16)を形成する段階と、
(II)第2のアモルファス半導体層(22)がその深さにわたって前記基板の背面(14)との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜した状態になるように、半導体材料及びドーパントを該ドーパントの濃度を変更しながら前記背面部分上に堆積させることによって、前記半導体基板(10)の背面(14)の一部分上に第2のアモルファス半導体層(22)を形成する段階と、
(III)第3のアモルファス半導体層(32)がその深さにわたって前記基板(10)の背面(14)との界面における実質的に真性からその反対側における実質的に導電性まで組成傾斜した状態になるように、半導体材料及びドーパントを該ドーパントの濃度を変更しながら前記背面部分上に堆積させることによって、前記半導体基板(10)の背面(14)の別の部分上に第3のアモルファス半導体層(32)を形成する段階と、
を含む方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/480,161 US20080000522A1 (en) | 2006-06-30 | 2006-06-30 | Photovoltaic device which includes all-back-contact configuration; and related processes |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008021993A true JP2008021993A (ja) | 2008-01-31 |
JP2008021993A5 JP2008021993A5 (ja) | 2010-07-29 |
Family
ID=38535964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007171329A Pending JP2008021993A (ja) | 2006-06-30 | 2007-06-29 | 全背面接点構成を含む光起電力デバイス及び関連する方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080000522A1 (ja) |
EP (1) | EP1873840A1 (ja) |
JP (1) | JP2008021993A (ja) |
KR (1) | KR20080002657A (ja) |
CN (1) | CN101097969A (ja) |
AU (1) | AU2007202844A1 (ja) |
Cited By (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009524916A (ja) * | 2006-01-26 | 2009-07-02 | アライズ テクノロジーズ コーポレーション | 太陽電池 |
JP2009200267A (ja) * | 2008-02-21 | 2009-09-03 | Sanyo Electric Co Ltd | 太陽電池 |
JP2010087520A (ja) * | 2008-10-02 | 2010-04-15 | Commiss Energ Atom | デュアルドーピングを備えたヘテロ接合光電池及びその製造方法 |
JP2010147324A (ja) * | 2008-12-19 | 2010-07-01 | Kyocera Corp | 太陽電池素子および太陽電池素子の製造方法 |
JP2010183080A (ja) * | 2009-02-04 | 2010-08-19 | Lg Electronics Inc | 太陽電池及びその製造方法 |
WO2010098446A1 (ja) * | 2009-02-26 | 2010-09-02 | 三洋電機株式会社 | 太陽電池の製造方法 |
JP2010283408A (ja) * | 2010-09-30 | 2010-12-16 | Sanyo Electric Co Ltd | 太陽電池 |
JP2011009615A (ja) * | 2009-06-28 | 2011-01-13 | Sino-American Silicon Products Inc | 太陽電池の製造方法 |
JP2011044749A (ja) * | 2010-11-30 | 2011-03-03 | Sanyo Electric Co Ltd | 太陽電池 |
JP2011061197A (ja) * | 2009-09-04 | 2011-03-24 | Lg Electronics Inc | 太陽電池およびその製造方法 |
JP2011523230A (ja) * | 2008-06-12 | 2011-08-04 | サンパワー コーポレイション | ポリシリコンドープ領域を有するバックコンタクト型太陽電池のトレンチプロセス及び構造 |
JP2012164961A (ja) * | 2011-02-08 | 2012-08-30 | Samsung Sdi Co Ltd | 太陽電池およびその製造方法 |
WO2012132615A1 (ja) * | 2011-03-25 | 2012-10-04 | 三洋電機株式会社 | 光電変換装置及びその製造方法 |
WO2012132758A1 (ja) * | 2011-03-28 | 2012-10-04 | 三洋電機株式会社 | 光電変換装置及び光電変換装置の製造方法 |
JP2013513965A (ja) * | 2009-12-21 | 2013-04-22 | ヒュンダイ ヘビー インダストリーズ カンパニー リミテッド | 裏面電界型のヘテロ接合太陽電池及びその製造方法 |
JP2013513964A (ja) * | 2009-12-14 | 2013-04-22 | トタル ソシエテ アノニム | 裏面接点・ヘテロ接合太陽電池 |
JP2013115262A (ja) * | 2011-11-29 | 2013-06-10 | Sharp Corp | 光電変換素子 |
JP2013125890A (ja) * | 2011-12-15 | 2013-06-24 | Sharp Corp | 光電変換素子およびその製造方法 |
JP2013187287A (ja) * | 2012-03-07 | 2013-09-19 | Sharp Corp | 光電変換素子 |
JP2013239694A (ja) * | 2012-05-14 | 2013-11-28 | Sereebo Inc | トンネル酸化物を有する後面接合太陽電池 |
JP2014067888A (ja) * | 2012-09-26 | 2014-04-17 | Sharp Corp | 光電変換素子および光電変換素子の製造方法 |
JP2014112735A (ja) * | 2014-03-19 | 2014-06-19 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
JPWO2012132766A1 (ja) * | 2011-03-28 | 2014-07-28 | 三洋電機株式会社 | 光電変換装置及び光電変換装置の製造方法 |
JP2015507848A (ja) * | 2011-12-30 | 2015-03-12 | ソレクセル、インコーポレイテッド | マルチレベルソーラーセルメタライゼーション |
JP2015050411A (ja) * | 2013-09-04 | 2015-03-16 | 三洋電機株式会社 | 太陽電池 |
JP2015062232A (ja) * | 2010-03-04 | 2015-04-02 | サンパワー コーポレイション | バックコンタクトソーラーセルおよびソーラーセルの製造方法 |
JP2015188120A (ja) * | 2015-07-31 | 2015-10-29 | シャープ株式会社 | 光電変換素子 |
WO2015198978A1 (ja) * | 2014-06-27 | 2015-12-30 | シャープ株式会社 | 光電変換装置およびその製造方法 |
JP2016012623A (ja) * | 2014-06-27 | 2016-01-21 | シャープ株式会社 | 光電変換装置およびその製造方法 |
JP2016012624A (ja) * | 2014-06-27 | 2016-01-21 | シャープ株式会社 | 光電変換装置およびその製造方法 |
JP2016509376A (ja) * | 2013-03-08 | 2016-03-24 | ソイテックSoitec | 効率を改善するように構成された低バンドギャップ活性層を有する光活性デバイス及び関連する方法 |
JP2016092425A (ja) * | 2014-11-04 | 2016-05-23 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
WO2016114371A1 (ja) * | 2015-01-16 | 2016-07-21 | シャープ株式会社 | 光電変換素子、それを備えた太陽電池モジュールおよび太陽光発電システム |
JP2016143868A (ja) * | 2015-02-05 | 2016-08-08 | 信越化学工業株式会社 | 裏面接合型太陽電池 |
WO2016140309A1 (ja) * | 2015-03-04 | 2016-09-09 | シャープ株式会社 | 光電変換素子およびその製造方法 |
JP2017118112A (ja) * | 2015-12-21 | 2017-06-29 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
JPWO2016114271A1 (ja) * | 2015-01-14 | 2017-10-19 | シャープ株式会社 | 光電変換素子、それを備えた太陽電池モジュールおよび太陽光発電システム |
JP2019169599A (ja) * | 2018-03-23 | 2019-10-03 | 株式会社カネカ | 太陽電池の製造方法、および、太陽電池 |
Families Citing this family (80)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7057256B2 (en) | 2001-05-25 | 2006-06-06 | President & Fellows Of Harvard College | Silicon-based visible and near-infrared optoelectric devices |
US7442629B2 (en) | 2004-09-24 | 2008-10-28 | President & Fellows Of Harvard College | Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate |
WO2007029971A1 (en) * | 2005-09-07 | 2007-03-15 | Iferro Co., Ltd. | Method of forming organic layer on semiconductor substrate |
KR101198763B1 (ko) * | 2006-03-23 | 2012-11-12 | 엘지이노텍 주식회사 | 기둥 구조와 이를 이용한 발광 소자 및 그 형성방법 |
US20080174028A1 (en) * | 2007-01-23 | 2008-07-24 | General Electric Company | Method and Apparatus For A Semiconductor Structure Forming At Least One Via |
US9287430B1 (en) * | 2007-11-01 | 2016-03-15 | Sandia Corporation | Photovoltaic solar concentrator |
KR20090091562A (ko) * | 2008-02-25 | 2009-08-28 | 엘지전자 주식회사 | 태양전지 및 그 제조방법 |
KR101155343B1 (ko) * | 2008-02-25 | 2012-06-11 | 엘지전자 주식회사 | 백 콘택 태양전지의 제조 방법 |
US8212327B2 (en) | 2008-03-06 | 2012-07-03 | Sionyx, Inc. | High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme |
WO2009111748A2 (en) * | 2008-03-06 | 2009-09-11 | Sionyx, Inc. | High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme |
KR101032064B1 (ko) * | 2008-07-24 | 2011-05-02 | 주식회사 밀레니엄투자 | 태양 전지 및 이의 제조방법 |
US7820472B2 (en) * | 2008-11-13 | 2010-10-26 | Applied Materials, Inc. | Method of forming front contacts to a silicon solar cell without patterning |
KR100993511B1 (ko) | 2008-11-19 | 2010-11-12 | 엘지전자 주식회사 | 태양 전지 및 그 제조 방법 |
KR101539047B1 (ko) * | 2008-12-24 | 2015-07-23 | 인텔렉츄얼 키스톤 테크놀로지 엘엘씨 | 광기전력 변환 소자 및 그의 제조방법 |
JP2010258043A (ja) * | 2009-04-21 | 2010-11-11 | Sanyo Electric Co Ltd | 太陽電池 |
JP2010283339A (ja) * | 2009-05-02 | 2010-12-16 | Semiconductor Energy Lab Co Ltd | 光電変換装置及びその作製方法 |
CN102044579B (zh) * | 2009-09-07 | 2013-12-18 | Lg电子株式会社 | 太阳能电池 |
EP2293350A3 (en) * | 2009-09-07 | 2013-06-12 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
US9911781B2 (en) | 2009-09-17 | 2018-03-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
US9673243B2 (en) | 2009-09-17 | 2017-06-06 | Sionyx, Llc | Photosensitive imaging devices and associated methods |
EP2494611A2 (en) * | 2009-10-26 | 2012-09-05 | 3M Innovative Properties Company | Structured film and articles made therefrom |
US9012766B2 (en) | 2009-11-12 | 2015-04-21 | Silevo, Inc. | Aluminum grid as backside conductor on epitaxial silicon thin film solar cells |
CN102074616B (zh) * | 2009-11-19 | 2013-03-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种选择性发射极太阳能电池的制备方法 |
KR101145357B1 (ko) * | 2009-12-16 | 2012-05-14 | (주)에스엔텍 | 텍스처링 모듈 및 이를 구비한 태양전지 제조장치 및 이를 이용한 태양전지 제조방법 |
KR20110071375A (ko) * | 2009-12-21 | 2011-06-29 | 현대중공업 주식회사 | 후면전계형 이종접합 태양전지 및 그 제조방법 |
NL2004066C2 (en) * | 2010-01-06 | 2011-07-07 | Stichting Energie | Solar cell and method for manufacturing of such a solar cell. |
DE102010007695A1 (de) | 2010-02-09 | 2011-08-11 | Helmholtz-Zentrum Berlin für Materialien und Energie GmbH, 14109 | Rückseitenkontaktierte Solarzelle mit unstrukturierter Absorberschicht |
US8692198B2 (en) | 2010-04-21 | 2014-04-08 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
CN101866969B (zh) * | 2010-05-27 | 2012-09-19 | 友达光电股份有限公司 | 太阳电池 |
US9214576B2 (en) | 2010-06-09 | 2015-12-15 | Solarcity Corporation | Transparent conducting oxide for photovoltaic devices |
US20120146172A1 (en) | 2010-06-18 | 2012-06-14 | Sionyx, Inc. | High Speed Photosensitive Devices and Associated Methods |
US8633379B2 (en) | 2010-08-17 | 2014-01-21 | Lg Electronics Inc. | Solar cell |
DE102010044348A1 (de) * | 2010-09-03 | 2012-03-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Photovoltaische Solarzelle und Verfahren zu deren Herstellung |
US9773928B2 (en) | 2010-09-10 | 2017-09-26 | Tesla, Inc. | Solar cell with electroplated metal grid |
US9800053B2 (en) | 2010-10-08 | 2017-10-24 | Tesla, Inc. | Solar panels with integrated cell-level MPPT devices |
WO2012105154A1 (ja) * | 2011-01-31 | 2012-08-09 | 三洋電機株式会社 | 光電変換素子の製造方法 |
WO2012105153A1 (ja) * | 2011-01-31 | 2012-08-09 | 三洋電機株式会社 | 光電変換素子 |
US8816190B2 (en) * | 2011-04-18 | 2014-08-26 | First Solar, Inc. | Photovoltaic devices and method of making |
US8802486B2 (en) * | 2011-04-25 | 2014-08-12 | Sunpower Corporation | Method of forming emitters for a back-contact solar cell |
US9054256B2 (en) | 2011-06-02 | 2015-06-09 | Solarcity Corporation | Tunneling-junction solar cell with copper grid for concentrated photovoltaic application |
US9496308B2 (en) | 2011-06-09 | 2016-11-15 | Sionyx, Llc | Process module for increasing the response of backside illuminated photosensitive imagers and associated methods |
CN102214720B (zh) * | 2011-06-10 | 2013-07-24 | 山东力诺太阳能电力股份有限公司 | 基于p型硅片的背接触异质结太阳电池 |
JP2014525091A (ja) | 2011-07-13 | 2014-09-25 | サイオニクス、インク. | 生体撮像装置および関連方法 |
TWI427808B (zh) * | 2011-08-11 | 2014-02-21 | Univ Nat Yunlin Sci & Tech | Production method of back electrode solar cell |
US8889981B2 (en) * | 2011-10-18 | 2014-11-18 | Samsung Sdi Co., Ltd. | Photoelectric device |
KR20130050721A (ko) | 2011-11-08 | 2013-05-16 | 삼성에스디아이 주식회사 | 태양 전지 |
CN102446992A (zh) * | 2011-12-14 | 2012-05-09 | 杭州赛昂电力有限公司 | 薄膜太阳能电池及其制作方法 |
US9064764B2 (en) | 2012-03-22 | 2015-06-23 | Sionyx, Inc. | Pixel isolation elements, devices, and associated methods |
KR20140019099A (ko) * | 2012-08-02 | 2014-02-14 | 삼성에스디아이 주식회사 | 광전소자 |
JP6103867B2 (ja) * | 2012-09-12 | 2017-03-29 | シャープ株式会社 | 光電変換素子および光電変換素子の製造方法 |
TWI483410B (zh) * | 2012-09-27 | 2015-05-01 | Motech Ind Inc | 太陽能電池、其製造方法及其模組 |
MX351564B (es) | 2012-10-04 | 2017-10-18 | Solarcity Corp | Dispositivos fotovoltaicos con rejillas metálicas galvanizadas. |
US9865754B2 (en) | 2012-10-10 | 2018-01-09 | Tesla, Inc. | Hole collectors for silicon photovoltaic cells |
US10074755B2 (en) | 2013-01-11 | 2018-09-11 | Tesla, Inc. | High efficiency solar panel |
WO2014110520A1 (en) | 2013-01-11 | 2014-07-17 | Silevo, Inc. | Module fabrication of solar cells with low resistivity electrodes |
JP6466346B2 (ja) | 2013-02-15 | 2019-02-06 | サイオニクス、エルエルシー | アンチブルーミング特性を有するハイダイナミックレンジcmos画像センサおよび関連づけられた方法 |
NL2010382C2 (en) * | 2013-03-01 | 2014-09-03 | Energieonderzoek Ct Nederland | Photo-voltaic cell and method of manufacturing such a cell. |
US9939251B2 (en) | 2013-03-15 | 2018-04-10 | Sionyx, Llc | Three dimensional imaging utilizing stacked imager devices and associated methods |
US9624595B2 (en) | 2013-05-24 | 2017-04-18 | Solarcity Corporation | Electroplating apparatus with improved throughput |
US9209345B2 (en) | 2013-06-29 | 2015-12-08 | Sionyx, Inc. | Shallow trench textured regions and associated methods |
CN103646983B (zh) * | 2013-11-29 | 2016-09-07 | 常州天合光能有限公司 | 背发射极对称异质结太阳电池及其制备方法 |
US9577134B2 (en) * | 2013-12-09 | 2017-02-21 | Sunpower Corporation | Solar cell emitter region fabrication using self-aligned implant and cap |
TW201526252A (zh) * | 2013-12-25 | 2015-07-01 | Neo Solar Power Corp | 太陽能電池及其製造方法 |
US10309012B2 (en) | 2014-07-03 | 2019-06-04 | Tesla, Inc. | Wafer carrier for reducing contamination from carbon particles and outgassing |
US20160020342A1 (en) * | 2014-07-17 | 2016-01-21 | Solarcity Corporation | Solar cell with interdigitated back contact |
CN105470322A (zh) * | 2014-09-12 | 2016-04-06 | 英属开曼群岛商精曜有限公司 | 太阳能电池、太阳能电池模块及太阳能电池的制作方法 |
JP2017530557A (ja) | 2014-09-26 | 2017-10-12 | パワーバイプロキシ リミテッド | 誘導性電力伝送システム用送信機 |
US9899546B2 (en) | 2014-12-05 | 2018-02-20 | Tesla, Inc. | Photovoltaic cells with electrodes adapted to house conductive paste |
US9947822B2 (en) | 2015-02-02 | 2018-04-17 | Tesla, Inc. | Bifacial photovoltaic module using heterojunction solar cells |
US20160284913A1 (en) * | 2015-03-27 | 2016-09-29 | Staffan WESTERBERG | Solar cell emitter region fabrication using substrate-level ion implantation |
DE102015112046A1 (de) * | 2015-07-23 | 2017-01-26 | Helmholtz-Zentrum Berlin Für Materialien Und Energie Gmbh | Verfahren zur Herstellung einseitig angeordneter strukturierter Kontakte in einer Schichtanordnung für ein photovoltaisches Bauelement |
US9761744B2 (en) | 2015-10-22 | 2017-09-12 | Tesla, Inc. | System and method for manufacturing photovoltaic structures with a metal seed layer |
US9842956B2 (en) | 2015-12-21 | 2017-12-12 | Tesla, Inc. | System and method for mass-production of high-efficiency photovoltaic structures |
US9496429B1 (en) | 2015-12-30 | 2016-11-15 | Solarcity Corporation | System and method for tin plating metal electrodes |
US10115838B2 (en) | 2016-04-19 | 2018-10-30 | Tesla, Inc. | Photovoltaic structures with interlocking busbars |
CN106653928A (zh) * | 2016-11-30 | 2017-05-10 | 上海电机学院 | 一种新型异质结太阳能电池结构及其制作方法 |
US20180295560A1 (en) | 2017-04-11 | 2018-10-11 | Global Tel*Link Corporation | System and method for detecting and controlling contraband devices |
US10672919B2 (en) | 2017-09-19 | 2020-06-02 | Tesla, Inc. | Moisture-resistant solar cells for solar roof tiles |
US11190128B2 (en) | 2018-02-27 | 2021-11-30 | Tesla, Inc. | Parallel-connected solar roof tile modules |
CN116741849A (zh) * | 2022-06-08 | 2023-09-12 | 浙江晶科能源有限公司 | 一种太阳能电池及光伏组件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003282458A (ja) * | 2002-03-26 | 2003-10-03 | Sanyo Electric Co Ltd | 半導体素子及びその製造方法 |
JP2004296776A (ja) * | 2003-03-27 | 2004-10-21 | Sanyo Electric Co Ltd | 光起電力素子およびその製造方法 |
JP2005101240A (ja) * | 2003-09-24 | 2005-04-14 | Sanyo Electric Co Ltd | 光起電力素子およびその製造方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4434318A (en) * | 1981-03-25 | 1984-02-28 | Sera Solar Corporation | Solar cells and method |
JPH0831413B2 (ja) * | 1986-11-26 | 1996-03-27 | キヤノン株式会社 | Pin型光電変換素子の製造方法 |
US5213628A (en) * | 1990-09-20 | 1993-05-25 | Sanyo Electric Co., Ltd. | Photovoltaic device |
JP2719230B2 (ja) * | 1990-11-22 | 1998-02-25 | キヤノン株式会社 | 光起電力素子 |
US5256887A (en) * | 1991-07-19 | 1993-10-26 | Solarex Corporation | Photovoltaic device including a boron doping profile in an i-type layer |
ES2169078T3 (es) * | 1993-07-29 | 2002-07-01 | Gerhard Willeke | Procedimiento para fabricacion de una celula solar, asi como la celula solar fabricada segun este procedimiento. |
JPH0878659A (ja) * | 1994-09-02 | 1996-03-22 | Sanyo Electric Co Ltd | 半導体デバイス及びその製造方法 |
JP3468670B2 (ja) * | 1997-04-28 | 2003-11-17 | シャープ株式会社 | 太陽電池セルおよびその製造方法 |
JP2001189478A (ja) * | 1999-12-28 | 2001-07-10 | Sanyo Electric Co Ltd | 半導体素子及びその製造方法 |
JP2001291881A (ja) * | 2000-01-31 | 2001-10-19 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP3490964B2 (ja) * | 2000-09-05 | 2004-01-26 | 三洋電機株式会社 | 光起電力装置 |
JP4070483B2 (ja) * | 2002-03-05 | 2008-04-02 | 三洋電機株式会社 | 光起電力装置並びにその製造方法 |
JP2003298078A (ja) * | 2002-03-29 | 2003-10-17 | Ebara Corp | 光起電力素子 |
US20050151131A1 (en) * | 2002-06-11 | 2005-07-14 | Wager John F.Iii | Polycrystalline thin-film solar cells |
US7015640B2 (en) * | 2002-09-11 | 2006-03-21 | General Electric Company | Diffusion barrier coatings having graded compositions and devices incorporating the same |
EP1519422B1 (en) * | 2003-09-24 | 2018-05-16 | Panasonic Intellectual Property Management Co., Ltd. | Photovoltaic cell and its fabrication method |
US6998288B1 (en) * | 2003-10-03 | 2006-02-14 | Sunpower Corporation | Use of doped silicon dioxide in the fabrication of solar cells |
US20060130891A1 (en) * | 2004-10-29 | 2006-06-22 | Carlson David E | Back-contact photovoltaic cells |
FR2880989B1 (fr) * | 2005-01-20 | 2007-03-09 | Commissariat Energie Atomique | Dispositif semi-conducteur a heterojonctions et a structure inter-digitee |
US20070169808A1 (en) * | 2006-01-26 | 2007-07-26 | Kherani Nazir P | Solar cell |
-
2006
- 2006-06-30 US US11/480,161 patent/US20080000522A1/en not_active Abandoned
-
2007
- 2007-06-19 AU AU2007202844A patent/AU2007202844A1/en not_active Abandoned
- 2007-06-20 EP EP07110609A patent/EP1873840A1/en not_active Withdrawn
- 2007-06-28 KR KR1020070064792A patent/KR20080002657A/ko not_active Application Discontinuation
- 2007-06-29 JP JP2007171329A patent/JP2008021993A/ja active Pending
- 2007-06-29 CN CNA2007101263199A patent/CN101097969A/zh active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003282458A (ja) * | 2002-03-26 | 2003-10-03 | Sanyo Electric Co Ltd | 半導体素子及びその製造方法 |
JP2004296776A (ja) * | 2003-03-27 | 2004-10-21 | Sanyo Electric Co Ltd | 光起電力素子およびその製造方法 |
JP2005101240A (ja) * | 2003-09-24 | 2005-04-14 | Sanyo Electric Co Ltd | 光起電力素子およびその製造方法 |
Cited By (53)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009524916A (ja) * | 2006-01-26 | 2009-07-02 | アライズ テクノロジーズ コーポレーション | 太陽電池 |
JP2009200267A (ja) * | 2008-02-21 | 2009-09-03 | Sanyo Electric Co Ltd | 太陽電池 |
JP2011523230A (ja) * | 2008-06-12 | 2011-08-04 | サンパワー コーポレイション | ポリシリコンドープ領域を有するバックコンタクト型太陽電池のトレンチプロセス及び構造 |
JP2014212339A (ja) * | 2008-06-12 | 2014-11-13 | サンパワー コーポレイション | ポリシリコンドープ領域を有するバックコンタクト型太陽電池のトレンチプロセス及び構造 |
US8975717B2 (en) | 2008-06-12 | 2015-03-10 | Sunpower Corporation | Trench process and structure for backside contact solar cells with polysilicon doped regions |
JP2016036056A (ja) * | 2008-06-12 | 2016-03-17 | サンパワー コーポレイション | ポリシリコンドープ領域を有するバックコンタクト型太陽電池のトレンチプロセス及び構造 |
JP2010087520A (ja) * | 2008-10-02 | 2010-04-15 | Commiss Energ Atom | デュアルドーピングを備えたヘテロ接合光電池及びその製造方法 |
JP2010147324A (ja) * | 2008-12-19 | 2010-07-01 | Kyocera Corp | 太陽電池素子および太陽電池素子の製造方法 |
JP2010183080A (ja) * | 2009-02-04 | 2010-08-19 | Lg Electronics Inc | 太陽電池及びその製造方法 |
JP2015029126A (ja) * | 2009-02-04 | 2015-02-12 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
CN102334192A (zh) * | 2009-02-26 | 2012-01-25 | 三洋电机株式会社 | 太阳能电池的制造方法 |
WO2010098446A1 (ja) * | 2009-02-26 | 2010-09-02 | 三洋電機株式会社 | 太陽電池の製造方法 |
US8664034B2 (en) | 2009-02-26 | 2014-03-04 | Sanyo Electric Co., Ltd. | Method of manufacturing solar cell |
JP2010199416A (ja) * | 2009-02-26 | 2010-09-09 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
JP2011009615A (ja) * | 2009-06-28 | 2011-01-13 | Sino-American Silicon Products Inc | 太陽電池の製造方法 |
JP2011061197A (ja) * | 2009-09-04 | 2011-03-24 | Lg Electronics Inc | 太陽電池およびその製造方法 |
JP2013513964A (ja) * | 2009-12-14 | 2013-04-22 | トタル ソシエテ アノニム | 裏面接点・ヘテロ接合太陽電池 |
JP2013513965A (ja) * | 2009-12-21 | 2013-04-22 | ヒュンダイ ヘビー インダストリーズ カンパニー リミテッド | 裏面電界型のヘテロ接合太陽電池及びその製造方法 |
JP2015062232A (ja) * | 2010-03-04 | 2015-04-02 | サンパワー コーポレイション | バックコンタクトソーラーセルおよびソーラーセルの製造方法 |
JP2010283408A (ja) * | 2010-09-30 | 2010-12-16 | Sanyo Electric Co Ltd | 太陽電池 |
JP2011044749A (ja) * | 2010-11-30 | 2011-03-03 | Sanyo Electric Co Ltd | 太陽電池 |
JP2012164961A (ja) * | 2011-02-08 | 2012-08-30 | Samsung Sdi Co Ltd | 太陽電池およびその製造方法 |
JP5879538B2 (ja) * | 2011-03-25 | 2016-03-08 | パナソニックIpマネジメント株式会社 | 光電変換装置及びその製造方法 |
WO2012132615A1 (ja) * | 2011-03-25 | 2012-10-04 | 三洋電機株式会社 | 光電変換装置及びその製造方法 |
JPWO2012132758A1 (ja) * | 2011-03-28 | 2014-07-28 | 三洋電機株式会社 | 光電変換装置及び光電変換装置の製造方法 |
JPWO2012132766A1 (ja) * | 2011-03-28 | 2014-07-28 | 三洋電機株式会社 | 光電変換装置及び光電変換装置の製造方法 |
US9653626B2 (en) | 2011-03-28 | 2017-05-16 | Panasonic intellectual property Management co., Ltd | Photoelectric conversion device and method for producing photoelectric conversion device |
WO2012132758A1 (ja) * | 2011-03-28 | 2012-10-04 | 三洋電機株式会社 | 光電変換装置及び光電変換装置の製造方法 |
JP2013115262A (ja) * | 2011-11-29 | 2013-06-10 | Sharp Corp | 光電変換素子 |
JP2013125890A (ja) * | 2011-12-15 | 2013-06-24 | Sharp Corp | 光電変換素子およびその製造方法 |
JP2015507848A (ja) * | 2011-12-30 | 2015-03-12 | ソレクセル、インコーポレイテッド | マルチレベルソーラーセルメタライゼーション |
JP2013187287A (ja) * | 2012-03-07 | 2013-09-19 | Sharp Corp | 光電変換素子 |
JP2013239694A (ja) * | 2012-05-14 | 2013-11-28 | Sereebo Inc | トンネル酸化物を有する後面接合太陽電池 |
JP2014067888A (ja) * | 2012-09-26 | 2014-04-17 | Sharp Corp | 光電変換素子および光電変換素子の製造方法 |
JP2016509376A (ja) * | 2013-03-08 | 2016-03-24 | ソイテックSoitec | 効率を改善するように構成された低バンドギャップ活性層を有する光活性デバイス及び関連する方法 |
JP2015050411A (ja) * | 2013-09-04 | 2015-03-16 | 三洋電機株式会社 | 太陽電池 |
JP2014112735A (ja) * | 2014-03-19 | 2014-06-19 | Sanyo Electric Co Ltd | 太陽電池の製造方法 |
JP2016012624A (ja) * | 2014-06-27 | 2016-01-21 | シャープ株式会社 | 光電変換装置およびその製造方法 |
WO2015198978A1 (ja) * | 2014-06-27 | 2015-12-30 | シャープ株式会社 | 光電変換装置およびその製造方法 |
JP2016012623A (ja) * | 2014-06-27 | 2016-01-21 | シャープ株式会社 | 光電変換装置およびその製造方法 |
US10224453B2 (en) | 2014-11-04 | 2019-03-05 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
JP2016092425A (ja) * | 2014-11-04 | 2016-05-23 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
US10714654B2 (en) | 2014-11-04 | 2020-07-14 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
US10749069B2 (en) | 2014-11-04 | 2020-08-18 | Lg Electronics Inc. | Solar cell and method for manufacturing the same |
JPWO2016114271A1 (ja) * | 2015-01-14 | 2017-10-19 | シャープ株式会社 | 光電変換素子、それを備えた太陽電池モジュールおよび太陽光発電システム |
WO2016114371A1 (ja) * | 2015-01-16 | 2016-07-21 | シャープ株式会社 | 光電変換素子、それを備えた太陽電池モジュールおよび太陽光発電システム |
JP2016143868A (ja) * | 2015-02-05 | 2016-08-08 | 信越化学工業株式会社 | 裏面接合型太陽電池 |
WO2016140309A1 (ja) * | 2015-03-04 | 2016-09-09 | シャープ株式会社 | 光電変換素子およびその製造方法 |
JP2015188120A (ja) * | 2015-07-31 | 2015-10-29 | シャープ株式会社 | 光電変換素子 |
JP2017118112A (ja) * | 2015-12-21 | 2017-06-29 | エルジー エレクトロニクス インコーポレイティド | 太陽電池及びその製造方法 |
US10868210B2 (en) | 2015-12-21 | 2020-12-15 | Lg Electronics Inc. | Solar cell and method of manufacturing the same |
JP2019169599A (ja) * | 2018-03-23 | 2019-10-03 | 株式会社カネカ | 太陽電池の製造方法、および、太陽電池 |
JP7043308B2 (ja) | 2018-03-23 | 2022-03-29 | 株式会社カネカ | 太陽電池の製造方法、および、太陽電池 |
Also Published As
Publication number | Publication date |
---|---|
CN101097969A (zh) | 2008-01-02 |
US20080000522A1 (en) | 2008-01-03 |
AU2007202844A1 (en) | 2008-01-17 |
EP1873840A1 (en) | 2008-01-02 |
KR20080002657A (ko) | 2008-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2008021993A (ja) | 全背面接点構成を含む光起電力デバイス及び関連する方法 | |
US9887306B2 (en) | Tunneling-junction solar cell with copper grid for concentrated photovoltaic application | |
US20080173347A1 (en) | Method And Apparatus For A Semiconductor Structure | |
Gordon et al. | 8% Efficient thin‐film polycrystalline‐silicon solar cells based on aluminum‐induced crystallization and thermal CVD | |
US8872020B2 (en) | Heterojunction solar cell based on epitaxial crystalline-silicon thin film on metallurgical silicon substrate design | |
KR101000064B1 (ko) | 이종접합 태양전지 및 그 제조방법 | |
EP2110859B1 (en) | Laminate type photoelectric converter and method for fabricating the same | |
US20070023081A1 (en) | Compositionally-graded photovoltaic device and fabrication method, and related articles | |
US20070023082A1 (en) | Compositionally-graded back contact photovoltaic devices and methods of fabricating such devices | |
US20100243042A1 (en) | High-efficiency photovoltaic cells | |
US20080174028A1 (en) | Method and Apparatus For A Semiconductor Structure Forming At Least One Via | |
US20090255574A1 (en) | Solar cell fabricated by silicon liquid-phase deposition | |
US9231146B2 (en) | Silicon photovoltaic element and fabrication method | |
US10084099B2 (en) | Aluminum grid as backside conductor on epitaxial silicon thin film solar cells | |
US20120312361A1 (en) | Emitter structure and fabrication method for silicon heterojunction solar cell | |
JP5645734B2 (ja) | 太陽電池素子 | |
KR101079027B1 (ko) | 광기전력 장치의 제조 방법 | |
US20110120549A1 (en) | Thin film solar cell and manufacturing method threof, method for increasing carrier mobility in semiconductor device, and semiconductor device | |
AU2022429985A1 (en) | Solar cell and method for forming the same | |
WO2023126146A1 (en) | Solar cell and method for forming the same | |
Goldbach et al. | Bifacial silicon heterojunction solar cell with deposited back surface field | |
Gordon et al. | Processing and characterization of efficient thin-film polycrystalline silicon solar cells | |
WO2011032879A2 (en) | Method for manufacturing a thin-film, silicon-based solar cell |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100614 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100614 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20100614 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20100614 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110607 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20110607 |
|
RD04 | Notification of resignation of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7424 Effective date: 20110614 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111130 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120306 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120309 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120405 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120413 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120717 |