JP2007527625A5 - - Google Patents
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- JP2007527625A5 JP2007527625A5 JP2006554308A JP2006554308A JP2007527625A5 JP 2007527625 A5 JP2007527625 A5 JP 2007527625A5 JP 2006554308 A JP2006554308 A JP 2006554308A JP 2006554308 A JP2006554308 A JP 2006554308A JP 2007527625 A5 JP2007527625 A5 JP 2007527625A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support structure
- chamber
- atom
- diamond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 125000004429 atom Chemical group 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229910052799 carbon Inorganic materials 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 33
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims 8
- 238000000151 deposition Methods 0.000 claims 5
- 238000001816 cooling Methods 0.000 claims 4
- 230000008021 deposition Effects 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000000654 additive Substances 0.000 claims 3
- 230000000996 additive effect Effects 0.000 claims 3
- 239000012790 adhesive layer Substances 0.000 claims 2
- 238000004140 cleaning Methods 0.000 claims 2
- 239000000356 contaminant Substances 0.000 claims 2
- 238000007872 degassing Methods 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
- 239000007789 gas Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 239000002114 nanocomposite Substances 0.000 description 10
- 229910003460 diamond Inorganic materials 0.000 description 3
- 239000010432 diamond Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 125000004430 oxygen atom Chemical group O* 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/786,876 | 2004-02-24 | ||
| US10/786,876 US7824498B2 (en) | 2004-02-24 | 2004-02-24 | Coating for reducing contamination of substrates during processing |
| PCT/US2005/005672 WO2005083752A2 (en) | 2004-02-24 | 2005-02-23 | Contaminant reducing support system |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007527625A JP2007527625A (ja) | 2007-09-27 |
| JP2007527625A5 true JP2007527625A5 (enExample) | 2013-01-24 |
| JP5270095B2 JP5270095B2 (ja) | 2013-08-21 |
Family
ID=34861866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006554308A Expired - Lifetime JP5270095B2 (ja) | 2004-02-24 | 2005-02-23 | 基板の微粒子汚染物質を削減可能な基板サポート構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (4) | US7824498B2 (enExample) |
| JP (1) | JP5270095B2 (enExample) |
| KR (3) | KR101400256B1 (enExample) |
| CN (3) | CN100543959C (enExample) |
| TW (1) | TWI327744B (enExample) |
| WO (1) | WO2005083752A2 (enExample) |
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-
2004
- 2004-02-24 US US10/786,876 patent/US7824498B2/en not_active Expired - Lifetime
-
2005
- 2005-02-23 CN CNB2005800057738A patent/CN100543959C/zh not_active Expired - Lifetime
- 2005-02-23 KR KR1020067019440A patent/KR101400256B1/ko not_active Expired - Lifetime
- 2005-02-23 US US11/065,702 patent/US20050252454A1/en not_active Abandoned
- 2005-02-23 JP JP2006554308A patent/JP5270095B2/ja not_active Expired - Lifetime
- 2005-02-23 WO PCT/US2005/005672 patent/WO2005083752A2/en not_active Ceased
- 2005-02-23 CN CN2008101269132A patent/CN101393883B/zh not_active Expired - Lifetime
- 2005-02-23 CN CN2008101269147A patent/CN101383317B/zh not_active Expired - Lifetime
- 2005-02-23 TW TW094105456A patent/TWI327744B/zh not_active IP Right Cessation
- 2005-02-23 KR KR1020137015494A patent/KR101357097B1/ko not_active Expired - Fee Related
- 2005-02-23 KR KR1020127004813A patent/KR20120045029A/ko not_active Ceased
-
2010
- 2010-10-01 US US12/896,272 patent/US8852348B2/en not_active Expired - Lifetime
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2014
- 2014-07-21 US US14/337,131 patent/US10053778B2/en active Active
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