CH558084A - Halter mit mindestens einem scheibenfoermigen halbleiterelement. - Google Patents

Halter mit mindestens einem scheibenfoermigen halbleiterelement.

Info

Publication number
CH558084A
CH558084A CH1071371A CH1071371A CH558084A CH 558084 A CH558084 A CH 558084A CH 1071371 A CH1071371 A CH 1071371A CH 1071371 A CH1071371 A CH 1071371A CH 558084 A CH558084 A CH 558084A
Authority
CH
Switzerland
Prior art keywords
holder
disc
semiconductor element
shaped semiconductor
shaped
Prior art date
Application number
CH1071371A
Other languages
English (en)
Original Assignee
Bbc Brown Boveri & Cie
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bbc Brown Boveri & Cie filed Critical Bbc Brown Boveri & Cie
Priority to CH1071371A priority Critical patent/CH558084A/de
Priority to DE2139745A priority patent/DE2139745A1/de
Priority to DE19717130426U priority patent/DE7130426U/de
Priority to NL7203094A priority patent/NL7203094A/xx
Priority to BE780425A priority patent/BE780425A/xx
Priority to GB1114872A priority patent/GB1384951A/en
Priority to IT2160672A priority patent/IT950015B/it
Priority to FR7208389A priority patent/FR2128812B1/fr
Priority to US00272729A priority patent/US3789248A/en
Priority to SE302072A priority patent/SE377863B/xx
Publication of CH558084A publication Critical patent/CH558084A/de
Priority to JP17226080U priority patent/JPS56110654U/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)
CH1071371A 1971-03-11 1971-07-20 Halter mit mindestens einem scheibenfoermigen halbleiterelement. CH558084A (de)

Priority Applications (11)

Application Number Priority Date Filing Date Title
CH1071371A CH558084A (de) 1971-07-20 1971-07-20 Halter mit mindestens einem scheibenfoermigen halbleiterelement.
DE2139745A DE2139745A1 (de) 1971-07-20 1971-08-07 Halter fuer mindestens ein scheibenfoermiges halbleiterelement
DE19717130426U DE7130426U (de) 1971-07-20 1971-08-07 Halter fuer mindestens ein scheibenfoermiges halbleiterelement
NL7203094A NL7203094A (de) 1971-03-11 1972-03-08
GB1114872A GB1384951A (en) 1971-03-11 1972-03-09 Semi conductor device mounting
BE780425A BE780425A (fr) 1971-03-11 1972-03-09 Monture pour au moins un element semiconducteur en forme de plaquette
IT2160672A IT950015B (it) 1971-03-11 1972-03-09 Sostegno di almeno un elemento semiconduttore a disco
FR7208389A FR2128812B1 (de) 1971-03-11 1972-03-10
US00272729A US3789248A (en) 1971-07-20 1972-07-18 Holder member for a semiconductor element
SE302072A SE377863B (de) 1971-03-11 1972-09-12
JP17226080U JPS56110654U (de) 1971-03-11 1980-12-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH1071371A CH558084A (de) 1971-07-20 1971-07-20 Halter mit mindestens einem scheibenfoermigen halbleiterelement.

Publications (1)

Publication Number Publication Date
CH558084A true CH558084A (de) 1975-01-15

Family

ID=4366030

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1071371A CH558084A (de) 1971-03-11 1971-07-20 Halter mit mindestens einem scheibenfoermigen halbleiterelement.

Country Status (3)

Country Link
US (1) US3789248A (de)
CH (1) CH558084A (de)
DE (2) DE7130426U (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3955122A (en) * 1974-02-26 1976-05-04 Armor Elevator Company, Inc. Heat sink mounting for controlled rectifiers
US3982308A (en) * 1975-08-27 1976-09-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device clamping apparatus
US4093958A (en) * 1976-12-09 1978-06-06 Motorola, Inc. Semiconductor device assembly with improved fatigue resistance
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
US4885126A (en) * 1986-10-17 1989-12-05 Polonio John D Interconnection mechanisms for electronic components
US5040051A (en) * 1988-12-05 1991-08-13 Sundstrand Corporation Hydrostatic clamp and method for compression type power semiconductors
US6111338A (en) * 1993-05-28 2000-08-29 Matsushita Electric Industrial Co., Ltd. Acceleration sensor and method for producing the same
DE59407080D1 (de) * 1993-08-09 1998-11-19 Siemens Ag Leistungs-Halbleiterbauelement mit Druckkontakt
US6407924B1 (en) * 2001-01-09 2002-06-18 International Business Machines Corporation Enhanced thermal path mechanical tolerance system
US7824498B2 (en) * 2004-02-24 2010-11-02 Applied Materials, Inc. Coating for reducing contamination of substrates during processing
EP2109885B1 (de) * 2007-01-26 2016-05-04 Inductotherm Corp. Kompressionsklemmung von halbleiterbauelementen
DE102008043173A1 (de) * 2008-07-04 2010-01-07 Robert Bosch Gmbh Getriebe-Antriebseinheit mit einer Selbsthemmvorrichtung
US20120155029A1 (en) * 2010-12-20 2012-06-21 Raytheon Company Adaptive thermal gap pad
US20150327395A1 (en) * 2014-05-09 2015-11-12 General Electric Company Apparatus for securing an electronic component
US11107962B2 (en) * 2018-12-18 2021-08-31 Soulnano Limited UV LED array with power interconnect and heat sink

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2078284A (en) * 1935-06-14 1937-04-27 Rca Corp Self-leveling mounting for piezoelectric elements
US2124596A (en) * 1936-02-19 1938-07-26 Bell Telephone Labor Inc Piezoelectric crystal apparatus
US2278966A (en) * 1938-11-14 1942-04-07 Brush Dev Co Piezoelectric apparatus
US3185870A (en) * 1961-10-26 1965-05-25 Dynamics Corp America Crystal cage assembly
FR1600561A (de) * 1968-01-26 1970-07-27

Also Published As

Publication number Publication date
US3789248A (en) 1974-01-29
DE2139745A1 (de) 1973-02-01
DE7130426U (de) 1973-06-14

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Legal Events

Date Code Title Description
PL Patent ceased