NL7203094A - - Google Patents

Info

Publication number
NL7203094A
NL7203094A NL7203094A NL7203094A NL7203094A NL 7203094 A NL7203094 A NL 7203094A NL 7203094 A NL7203094 A NL 7203094A NL 7203094 A NL7203094 A NL 7203094A NL 7203094 A NL7203094 A NL 7203094A
Authority
NL
Netherlands
Application number
NL7203094A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CH369171A external-priority patent/CH528817A/de
Priority claimed from CH1071371A external-priority patent/CH558084A/de
Application filed filed Critical
Publication of NL7203094A publication Critical patent/NL7203094A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Braking Arrangements (AREA)
  • Die Bonding (AREA)
NL7203094A 1971-03-11 1972-03-08 NL7203094A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH369171A CH528817A (de) 1971-03-11 1971-03-11 Halter für mindestens ein scheibenförmiges Halbleiterelement
CH1071371A CH558084A (de) 1971-07-20 1971-07-20 Halter mit mindestens einem scheibenfoermigen halbleiterelement.

Publications (1)

Publication Number Publication Date
NL7203094A true NL7203094A (de) 1972-09-13

Family

ID=25693632

Family Applications (1)

Application Number Title Priority Date Filing Date
NL7203094A NL7203094A (de) 1971-03-11 1972-03-08

Country Status (7)

Country Link
JP (1) JPS56110654U (de)
BE (1) BE780425A (de)
FR (1) FR2128812B1 (de)
GB (1) GB1384951A (de)
IT (1) IT950015B (de)
NL (1) NL7203094A (de)
SE (1) SE377863B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
AT506778B1 (de) * 2008-04-29 2012-04-15 Siemens Ag Kühlanordnung mit zwei nebeneinander angeordneten halbleiterbauelementen

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE564064A (de) * 1957-03-01 1900-01-01
DE1514483B2 (de) * 1965-06-22 1971-05-06 Siemens AG, 1000 Berlin u 8000 München Druckkontakt halbleiter gleichrichter
JPS4414338Y1 (de) * 1966-05-14 1969-06-18
DE1299076B (de) * 1966-06-10 1969-07-10 Siemens Ag Halbleiter-Scheibenzellen-Anordnung mit mindestens einem Paar zwischen Druckstuecken eingespannten Zellen
JPS4411714Y1 (de) * 1966-06-17 1969-05-15
US3401315A (en) * 1966-10-31 1968-09-10 Int Rectifier Corp Compression assembled semiconductor device using spherical force transmitting member

Also Published As

Publication number Publication date
FR2128812A1 (de) 1972-10-20
SE377863B (de) 1975-07-28
FR2128812B1 (de) 1977-09-02
JPS56110654U (de) 1981-08-27
IT950015B (it) 1973-06-20
GB1384951A (en) 1975-02-26
BE780425A (fr) 1972-07-03

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Legal Events

Date Code Title Description
BV The patent application has lapsed