JP2007190551A - 廃棄プリント基板の回収方法 - Google Patents
廃棄プリント基板の回収方法 Download PDFInfo
- Publication number
- JP2007190551A JP2007190551A JP2007009172A JP2007009172A JP2007190551A JP 2007190551 A JP2007190551 A JP 2007190551A JP 2007009172 A JP2007009172 A JP 2007009172A JP 2007009172 A JP2007009172 A JP 2007009172A JP 2007190551 A JP2007190551 A JP 2007190551A
- Authority
- JP
- Japan
- Prior art keywords
- glass fiber
- recovering
- copper foil
- waste printed
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 43
- 238000004064 recycling Methods 0.000 title abstract 3
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims abstract description 60
- 239000003365 glass fiber Substances 0.000 claims abstract description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 50
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 claims abstract description 38
- 235000010344 sodium nitrate Nutrition 0.000 claims abstract description 30
- 239000004317 sodium nitrate Substances 0.000 claims abstract description 30
- 239000002253 acid Substances 0.000 claims abstract description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000002699 waste material Substances 0.000 claims description 52
- 239000011889 copper foil Substances 0.000 claims description 35
- MWUXSHHQAYIFBG-UHFFFAOYSA-N Nitric oxide Chemical compound O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims description 33
- 239000000243 solution Substances 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 29
- 238000011084 recovery Methods 0.000 claims description 19
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 18
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 15
- 229910017604 nitric acid Inorganic materials 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 15
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 12
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 239000000203 mixture Substances 0.000 claims description 10
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 9
- 230000005484 gravity Effects 0.000 claims description 8
- 239000000126 substance Substances 0.000 claims description 8
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 4
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical group [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims description 4
- 229910001415 sodium ion Inorganic materials 0.000 claims description 4
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical group [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 3
- 239000003929 acidic solution Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- -1 carbide Substances 0.000 claims description 3
- 229910001431 copper ion Inorganic materials 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 235000010333 potassium nitrate Nutrition 0.000 claims description 2
- 239000004323 potassium nitrate Substances 0.000 claims description 2
- 235000010288 sodium nitrite Nutrition 0.000 claims description 2
- 239000002344 surface layer Substances 0.000 claims description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims 2
- 238000001556 precipitation Methods 0.000 claims 1
- 239000011780 sodium chloride Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 6
- 229910045601 alloy Inorganic materials 0.000 abstract description 3
- 239000000956 alloy Substances 0.000 abstract description 3
- 150000002739 metals Chemical class 0.000 abstract description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 abstract description 2
- 239000011734 sodium Substances 0.000 abstract description 2
- 229910052708 sodium Inorganic materials 0.000 abstract description 2
- 239000005539 carbonized material Substances 0.000 abstract 3
- 238000010306 acid treatment Methods 0.000 abstract 1
- 239000012770 industrial material Substances 0.000 abstract 1
- 239000007788 liquid Substances 0.000 abstract 1
- 238000002485 combustion reaction Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 11
- 229910017053 inorganic salt Inorganic materials 0.000 description 7
- 238000001816 cooling Methods 0.000 description 6
- 238000005979 thermal decomposition reaction Methods 0.000 description 6
- 238000011109 contamination Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 239000011535 reaction buffer Substances 0.000 description 4
- 238000007790 scraping Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 229910002651 NO3 Inorganic materials 0.000 description 2
- 230000033228 biological regulation Effects 0.000 description 2
- 230000036760 body temperature Effects 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000011978 dissolution method Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 231100000252 nontoxic Toxicity 0.000 description 2
- 230000003000 nontoxic effect Effects 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000035484 reaction time Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 239000003738 black carbon Substances 0.000 description 1
- 150000003842 bromide salts Chemical class 0.000 description 1
- 150000001649 bromium compounds Chemical class 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 239000002440 industrial waste Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/20—Agglomeration, binding or encapsulation of solid waste
- B09B3/25—Agglomeration, binding or encapsulation of solid waste using mineral binders or matrix
- B09B3/29—Agglomeration, binding or encapsulation of solid waste using mineral binders or matrix involving a melting or softening step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/005—Separation by a physical processing technique only, e.g. by mechanical breaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0255—Specific separating techniques using different melting or softening temperatures of the materials to be separated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0293—Dissolving the materials in gases or liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B2017/0424—Specific disintegrating techniques; devices therefor
- B29B2017/0496—Pyrolysing the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/065—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts containing impurities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49751—Scrap recovering or utilizing
- Y10T29/49755—Separating one material from another
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
【解決手段】廃棄プリント基板の回収方法において、
加熱処理によってはんだ合金を溶解して搭載されたデバイス類を分離回収し、
さらに加熱して真空吸引によりはんだ合金を回収し、
基板を硝酸ナトリウム融液に浸漬して基板層内の錫はんだ合金を分離回収し、
さらに強酸溶液により、銅を回収し、
液酸処理によって基板上の配線金属、銅などを溶解、回収し、
溶融硝酸ナトリウム中で熱分解により臭化ナトリウム、炭化物とガラス繊維などを生成、分離し、
水洗浄により炭化物,ガラス繊維を分離回収する。
【選択図】図1
Description
1.処理温度が400℃以上のとき、基板中の錫、鉛および銅は容易に混合されて合金状となり、回収後低価格の混合金属となってしまい、精製する場合、時間および手間が掛かり、コストが増加する。
2.溶融無機塩の比重はプリント基板よりも大きく、基板を溶融無機塩に投入したとき、基板が浮いてしまい、撹拌分離作業の過程において大きな困難を有する。
3.無機塩によって破壊された後、基板は軟化して、撹拌破砕ができなくなる。
4.プリント基板上の各半田箇所は、貫通孔よりも大きく、全ての製作が完了されたプリント基板は半田によって接続され、連結した構造が形成されるが、それによって基板のガラス繊維を緊密に固定するので分離作業が非常に困難であり、分離効果は相対的に極めて劣る。
5.廃棄プリント基板を長時間溶融無機塩内に放置した場合、ガラス繊維が破壊され、混合撹拌および再抽出過程における反応時間の制御を一致させることができないのでガラス繊維の回収が困難となり、同時に破砕後のガラス繊維の再利用性が低下する。
b:デバイス類が除去された廃棄プリント基板を200℃以上に加熱し、表層の半田を溶融状態にして真空吸引装置で直接外層上の錫合金(錫化物)を回収する。基板の最外層は錫化合物であり、デバイス類は錫によって半田接合され、錫は200℃以上で溶融し始めるので、基板の温度が200℃以上において、錫合金は溶融状態となり、真空吸引装置で直接大部分の錫合金を回収できる。
c:一般の硝酸液にステップbの処理後のデバイス類が除去された廃棄プリント基板を浸漬し、その内層内の錫合金を溶解して、銅金属と分離させ、硝酸液によって内層内の全ての錫合金を直接回収する。
d:強酸溶液でステップc処理後のデバイス類が除去された廃棄プリント基板を溶解し、すべての半田点上の銅箔および基板の貫通孔上の銅鍍金を強酸溶液中に溶解し、銅箔のない半田点および貫通孔の廃棄プリント基板とする。銅箔を溶解した後の強酸溶液は銅イオンを含む酸性溶液を形成し、直接エッチング液として利用することができ、本来基板内層に存在して回路を形成していた銅片または銅箔は未だ強酸溶液に接触して溶解していないので、ガラス繊維内に存在する。
e:ステップd処理後の廃棄プリント基板を溶融状態の硝酸ナトリウム20溶液に投入して化学反応を行い、溶融硝酸ナトリウム20に内部の臭化エポキシ樹脂を熱分解させた後、ガラス繊維と分離し、臭化ナトリウム11、炭化物、ガラス繊維12および銅箔13混合物、有機気体14および窒素酸化物15がそれぞれ形成される。臭化ナトリウム11は臭化塩類に属し、環境に対して無害であるので、直接廃棄または再利用することができ、有機気体14および窒素酸化物15は完全燃焼後、安定した無毒の気体となり、大気中に放出することができる。
f:炭化物、ガラス繊維12および銅箔13の混合物を取り出し、水洗浄によって炭化物、ガラス繊維12と純粋な銅箔13とに分離することができ、直接回収して材料として再利用することができる。
2.本発明の各処理工程は、それぞれ材料別の回収効果を備えるので、回収を容易に行うことができ、回収処理設備に掛かる投資を大幅に低下させることができ、操作方法も極めて容易である。
3.本発明の処理回収過程全体において、二次汚染を防止することができる。その理由を下記に示す。
(1)錫の溶解作業は、市販の硝酸液または塩酸液を使用するので、処理工程のレベルを高める効果を有する。
(2)銅の溶解作業は、強酸液によって行われ、その液体は従来技術におけるプリント基板の製造工程で使用されるエッチング液と同一であり、直接エッチング液として使用できる。
(3)強酸化剤によって臭化エポキシ樹脂を破壊し、ナトリウムイオンと臭化物イオンとを迅速に結合させて安定した臭化塩類を形成するので二次汚染を有効的に防止できる。
(4)回収された炭化物、ガラス繊維は完全であり、且つ面積が大きいので再利用性が高く、容易に加工することができ、また、内部に付着した炭素がガラス繊維を直接強化する機能を有し、繊維に炭素を加える熱を節約できるだけでなく、再利用材料を直接投入できる。
(5)ガラス繊維の回収は、簡単な水洗浄で完了される。
(6)銅箔の回収も水洗浄によって完了する。
(7)臭化ナトリウムおよび硝酸ナトリウムの性質は大きく異なり、硝酸ナトリウムの融点は300℃であるが、臭化ナトリウムの融点の757.7℃よりも低く、硝酸ナトリウムの比重は2.261であり、臭化ナトリウムの比重3.203よりも小さいので容易に分離を行うことができる。
(8)多種の回収物はすべて良好な回収価値を有し、回収工程におけるロスはない。
11 臭化ナトリウム
12 炭化物+ガラス繊維
13 銅箔
14 有機気体
15 窒素酸化物
20 硝酸ナトリウム
30 炉体
31 入口
32 臭化ナトリウム取り出しバルブ
33 掻き出し装置
34 出口
40 加熱装置
50 気体完全燃焼装置
51 循環反応装置
52 加酸素助燃反応装置
53 空気反応緩衝停留装置
54 二次加熱燃焼装置
55 ブロワ
56 空気熱交換装置
57 炉体冷却装置
58 空気洗浄冷却装置
59 圧力平衡装置
141安定気体
Claims (7)
- 廃棄プリント基板上の全ての半田点を加熱して全ての搭載されたデバイス類を除去して、デバイス類が除去された廃棄プリント基板とし、分離したデバイス類を分別するステップaと、
前記デバイス類が除去された廃棄プリント基板を200℃以上に加熱し、表層の半田を溶融状態として真空吸引装置で直接外層上の錫合金を回収するステップbと、
硝酸液にステップb処理後の前記デバイス類が除去された廃棄プリント基板を浸漬し、その内層内の錫合金を溶解して、銅金属と分離させ、硝酸液によって内層内の全ての錫合金を直接回収するステップcと、
強酸溶液にステップc処理後の前記デバイス類が除去された廃棄プリント基板を浸漬し、すべての半田点上の銅箔および基板の貫通孔上の銅鍍金を前記強酸溶液中に溶解し、銅箔のない半田点および貫通孔の廃棄プリント基板を形成するステップdと、
ステップd処理後の前記廃棄プリント基板を溶融状態の硝酸ナトリウム融液に投入して化学反応を行い、溶融硝酸ナトリウムに内部の臭化エポキシ樹脂を熱分解させた後、ガラス繊維と分離させ、臭化ナトリウム、炭化物、ガラス繊維および銅箔混合物、有機気体および窒素酸化物をそれぞれ形成するステップeと、
前記炭化物、ガラス繊維および銅箔の混合物を取り出し、水洗浄によって炭化物、ガラス繊維と純粋な銅箔とに分離し、回収するステップfと、
を含むことを特徴とする廃棄プリント基板の回収方法。 - 前記ステップdにおける銅箔が溶解した後の強酸溶液は、銅イオンを含む酸性溶液を形成し、直接エッチング液として利用されることを特徴とする請求項1記載の廃棄プリント基板の回収方法。
- 前記ステップdにおける強酸溶液は稀硝酸であるか、或いは塩酸または硫酸を酸素を含む雰囲気中でスプレーすると同時に前記塩酸または硫酸中に少量の硝酸が選択的に加えられることを特徴とする請求項1記載の廃棄プリント基板の回収方法。
- 前記ステップeは、熱エネルギーによって臭化エポキシ樹脂を熱分解し、同時に硝酸ナトリウムと直接化学変化を発生させて有機気体および窒素酸化物を形成し、臭化物イオンとナトリウムイオンとが直接臭化ナトリウムを形成して溶融硝酸ナトリウム内に残留し、エポキシ樹脂中の炭素はその大部分がガラス繊維上に直接付着し、ガラス繊維と炭化物に転換する処理を行うことを特徴とする請求項1記載の廃棄プリント基板の回収方法。
- 前記ステップfの炭化物とガラス繊維および銅箔の混合物中において、炭化物、ガラス繊維の比重は銅箔よりも軽いので、水洗浄後、炭化物、ガラス繊維は水溶液の上方に浮き、銅箔は下方に沈殿し、炭化物、ガラス繊維および銅箔の回収作業を容易にしたことを特徴とする請求項1記載の廃棄プリント基板の回収方法。
- 前記硝酸ナトリウムは、硝酸カリウムまたは亜硝酸ナトリウムに代替することを特徴とする請求項1記載の廃棄プリント基板の回収方法。
- 前記硝酸液は、塩酸液に代替することを特徴とする請求項1記載の廃棄プリント基板の回収方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095102342 | 2006-01-20 | ||
TW095102342A TWI268184B (en) | 2006-01-20 | 2006-01-20 | Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry |
CN200610002019A CN100592939C (zh) | 2006-01-20 | 2006-01-23 | 回收废弃印刷电路板的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007190551A true JP2007190551A (ja) | 2007-08-02 |
JP4791978B2 JP4791978B2 (ja) | 2011-10-12 |
Family
ID=42562866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007009172A Expired - Fee Related JP4791978B2 (ja) | 2006-01-20 | 2007-01-18 | 廃棄プリント基板の回収方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070169330A1 (ja) |
EP (1) | EP1811821B1 (ja) |
JP (1) | JP4791978B2 (ja) |
KR (1) | KR100821792B1 (ja) |
CN (1) | CN100592939C (ja) |
SG (1) | SG134269A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101905234A (zh) * | 2010-07-23 | 2010-12-08 | 中国科学院广州能源研究所 | 一种废印刷线路板综合回收利用的方法及装置 |
KR101108208B1 (ko) | 2009-08-20 | 2012-01-31 | 주식회사 리더스큐엠 | 폐frp의 재활용 과정에서 기계적 조작을 용이하게 하기 위한 폐frp의 전처리방법 |
CN102389888A (zh) * | 2011-05-12 | 2012-03-28 | 上海理工大学 | 一种处置废弃印刷电路板的熔盐气化方法及其所用的装置 |
JP2013230437A (ja) * | 2012-04-27 | 2013-11-14 | Astec Irie Co Ltd | プリント基板の処理方法 |
JP2014529500A (ja) * | 2011-12-15 | 2014-11-13 | アドバンスドテクノロジーマテリアルズ,インコーポレイテッド | 廃電気電子機器のリサイクル中にはんだ金属を剥離するための装置及び方法 |
CN105921496A (zh) * | 2016-06-13 | 2016-09-07 | 王枝宝 | 一种废电路板残渣处理方法 |
KR102182334B1 (ko) * | 2020-05-22 | 2020-11-24 | 주식회사 에스알아이 | 폐기판으로부터 실리콘 카바이드를 회수하는 방법 |
CN114029320A (zh) * | 2021-11-09 | 2022-02-11 | 广州爱锋派环保科技有限公司 | 一种废旧手机线路板裂解方法及其装置 |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101358285B (zh) * | 2007-08-03 | 2010-11-03 | 中国科学院过程工程研究所 | 一种废弃环氧电路板上金属铜箔的剥离方法 |
KR100889315B1 (ko) | 2007-11-16 | 2009-03-18 | 한국지질자원연구원 | 유기용액을 이용한 폐인쇄회로기판으로부터 금속을회수하는 방법 |
CN101250315B (zh) * | 2008-03-18 | 2010-06-23 | 上海大学 | 废旧印刷电路板的基板材料的利用及处理方法 |
CN101407596B (zh) * | 2008-09-25 | 2011-08-17 | 上海第二工业大学 | 从废弃印刷线路板的非金属粉末中回收环氧树脂和玻璃纤维的方法 |
TW201041668A (en) * | 2009-05-27 | 2010-12-01 | xie-sen Wu | Pyrolysis method of recycled substrate of printed circuit board and device thereof |
CN101921915B (zh) * | 2009-06-12 | 2012-05-23 | 巫协森 | 热裂解废印刷电路板回收基材方法及其装置 |
CN101787547B (zh) * | 2010-02-09 | 2011-06-15 | 中南大学 | 一种从废印刷电路板中回收有价金属的方法 |
SG184881A1 (en) | 2010-04-15 | 2012-11-29 | Advanced Tech Materials | Method for recycling of obsolete printed circuit boards |
CN101829666B (zh) * | 2010-05-06 | 2012-03-14 | 陕西师范大学 | 废印刷线路板热解脱溴方法 |
CN101937742B (zh) * | 2010-09-10 | 2012-05-09 | 北京科技大学 | 一种镀锡铜米分离回收金属铜锡的方法和装置 |
CN102009058B (zh) * | 2010-09-27 | 2014-11-05 | 北京航空航天大学 | 一种从废印刷电路板中提取玻璃纤维和能量利用的装置 |
CN101954678B (zh) * | 2010-10-28 | 2012-07-25 | 中南大学 | 一种废弃印刷电路板分选前的预处理工艺 |
CN102676822B (zh) * | 2011-03-11 | 2014-01-01 | 深圳市格林美高新技术股份有限公司 | 一种免焚烧无氰化处理废旧印刷电路板的方法 |
CN102127643B (zh) * | 2011-04-07 | 2012-11-21 | 北京科技大学 | 一种镀锡铜块料铜锡分离的喷淋方法和装置 |
CN102240663A (zh) * | 2011-04-13 | 2011-11-16 | 深圳市格林美高新技术股份有限公司 | 一种废旧电路板中稀贵金属与废塑料的分离回收方法 |
CN103100771A (zh) * | 2011-11-15 | 2013-05-15 | 梁刚 | 环保型全自动旧电路板焊锡快速回收机 |
CN102433441B (zh) * | 2011-12-26 | 2013-10-16 | 上海大学 | 利用离子液体处理废旧线路板的方法 |
CN102560118B (zh) * | 2012-01-09 | 2013-07-24 | 刘景洋 | 一种废电路板浸提液中锡铅回收方法 |
WO2013151437A1 (en) | 2012-04-05 | 2013-10-10 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | An e-waste demounting device and method |
CN103495783B (zh) * | 2013-09-18 | 2015-08-19 | 清华大学 | 一种面向重用的废弃电路板贴装式元器件拆解设备 |
WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
US9850433B2 (en) | 2015-12-31 | 2017-12-26 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of E-waste materials |
CN105967221B (zh) * | 2016-05-09 | 2017-08-29 | 江苏夏博士节能工程股份有限公司 | 废旧覆铜板反应回收系统 |
CN108456783B (zh) * | 2017-11-28 | 2020-11-27 | 苏州美源达环保科技股份有限公司 | 一种线路板废金、废锡边框提金、提锡的复合设备及工艺 |
CN108048663A (zh) * | 2017-12-13 | 2018-05-18 | 长沙汇聚环境技术有限公司 | 一种从废镀锡铜米中分离锡的方法 |
CN108439408A (zh) * | 2018-02-12 | 2018-08-24 | 中山大学 | 一种利用废弃线路基板制备碳化硅粉体材料的方法 |
CN108500032B (zh) * | 2018-03-22 | 2021-09-28 | 安徽浩悦环境科技有限责任公司 | 含溴废物的处理方法 |
US10640711B2 (en) | 2018-06-05 | 2020-05-05 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of treated wood waste sources |
CN109365487B (zh) * | 2018-11-30 | 2020-07-07 | 清远市进田企业有限公司 | 一种废旧电路板中环氧涂层的高效节能清洗工艺 |
CN110421743A (zh) * | 2019-09-12 | 2019-11-08 | 南安市商宏机械科技有限公司 | 一种杂糅自剔除的塑料粉碎混炼造粒一体机 |
CN111420794A (zh) * | 2020-03-31 | 2020-07-17 | 陕西科技大学 | 一种土壤中微塑料的分离提取装置及方法 |
CN112153818A (zh) * | 2020-10-14 | 2020-12-29 | 杭州建德睿夕电子科技有限公司 | 一种可自动回收废弃电路板上电器元件的装置 |
CN113471885B (zh) * | 2021-05-19 | 2022-08-19 | 国网湖北省电力有限公司襄阳供电公司 | 一种多方位固定且两侧自走式切割的粗长电缆拆分装置 |
CN113436807B (zh) * | 2021-05-25 | 2023-10-10 | 福建明锐新材料科技有限公司 | 一种铜线生产制造工艺 |
CN113522885B (zh) * | 2021-07-09 | 2023-05-09 | 东莞理工学院 | 一种近临界流体处理废弃印刷线路板的方法 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08299759A (ja) * | 1995-04-28 | 1996-11-19 | Nec Corp | 難燃性プラスチックスの分解ガスの処理方法 |
JPH08311444A (ja) * | 1995-05-22 | 1996-11-26 | Toshiba Corp | ハンダの除去方法 |
JPH0952750A (ja) * | 1995-08-11 | 1997-02-25 | Sumitomo Bakelite Co Ltd | 人工石材 |
JPH09225445A (ja) * | 1996-02-28 | 1997-09-02 | Hitachi Ltd | 電子部品搭載プリント配線基板の廃棄品の処理方法 |
JPH09272989A (ja) * | 1996-04-08 | 1997-10-21 | Sumitomo Metal Mining Co Ltd | はんだ溶解液 |
JPH1134058A (ja) * | 1997-07-24 | 1999-02-09 | Mitsubishi Electric Corp | 廃棄物処理装置 |
JPH1136020A (ja) * | 1997-07-15 | 1999-02-09 | Justy:Kk | 廃プリント基板等の処理方法 |
JPH11216455A (ja) * | 1998-02-04 | 1999-08-10 | Hitachi Ltd | 廃プリント基板処理装置及びその処理方法 |
JP2000290424A (ja) * | 1999-04-07 | 2000-10-17 | Matsushita Electric Ind Co Ltd | 臭素系難燃剤を含有する熱可塑性樹脂組成物の再生処理方法 |
JP2001107152A (ja) * | 1999-10-06 | 2001-04-17 | Seikyo Kotei Komon Kofun Yugenkoshi | 廃棄プリント配線板の処理方法 |
JP2001177234A (ja) * | 1999-12-16 | 2001-06-29 | Sony Corp | 表面実装部品の除去方法及び除去装置 |
JP2002177921A (ja) * | 2000-12-11 | 2002-06-25 | Ibiden Co Ltd | 廃棄されたプリント基板からの有価物の回収法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4164542A (en) * | 1973-05-08 | 1979-08-14 | Pincus Deren | Detinning process |
GB2109820B (en) * | 1981-11-24 | 1986-04-09 | Occidental Chem Co | Metal stripping composition |
US5755950A (en) * | 1995-06-07 | 1998-05-26 | Dulin Metals Company | Process for removing plating materials from copper-based substrates |
US5911907A (en) * | 1995-08-30 | 1999-06-15 | Surface Tek Specialty Products, Inc. | Composition and method for stripping tin and tin-lead from copper surfaces |
US5994611A (en) * | 1995-09-18 | 1999-11-30 | Toda Kogyo Corporation | Method of incinerating plastic products containing ferric oxide hydroxide particles |
JP3365364B2 (ja) * | 1999-08-31 | 2003-01-08 | 千住金属工業株式会社 | プリント基板 |
US6089479A (en) * | 1999-09-28 | 2000-07-18 | Cleanenv' Engineeering Consultant Co., Ltd. | Method for treating waste printed circuit boards with molten mixture of inorganic salts |
CN1214872C (zh) * | 2001-12-18 | 2005-08-17 | 株式会社电装 | 印刷电路板的再生方法和装置 |
JP4123769B2 (ja) | 2001-12-18 | 2008-07-23 | 株式会社デンソー | プリント基板のリサイクル方法 |
WO2004096711A1 (en) * | 2003-03-27 | 2004-11-11 | Hsieh Sen Wu | Methods and devices for recycling copper from a discarded circuit board and a discarded fluid containing copper |
-
2006
- 2006-01-23 CN CN200610002019A patent/CN100592939C/zh not_active Expired - Fee Related
- 2006-11-06 US US11/592,974 patent/US20070169330A1/en not_active Abandoned
- 2006-12-05 EP EP20060125409 patent/EP1811821B1/en not_active Not-in-force
-
2007
- 2007-01-17 SG SG200700330-4A patent/SG134269A1/en unknown
- 2007-01-18 JP JP2007009172A patent/JP4791978B2/ja not_active Expired - Fee Related
- 2007-01-19 KR KR1020070006022A patent/KR100821792B1/ko active IP Right Grant
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08299759A (ja) * | 1995-04-28 | 1996-11-19 | Nec Corp | 難燃性プラスチックスの分解ガスの処理方法 |
JPH08311444A (ja) * | 1995-05-22 | 1996-11-26 | Toshiba Corp | ハンダの除去方法 |
JPH0952750A (ja) * | 1995-08-11 | 1997-02-25 | Sumitomo Bakelite Co Ltd | 人工石材 |
JPH09225445A (ja) * | 1996-02-28 | 1997-09-02 | Hitachi Ltd | 電子部品搭載プリント配線基板の廃棄品の処理方法 |
JPH09272989A (ja) * | 1996-04-08 | 1997-10-21 | Sumitomo Metal Mining Co Ltd | はんだ溶解液 |
JPH1136020A (ja) * | 1997-07-15 | 1999-02-09 | Justy:Kk | 廃プリント基板等の処理方法 |
JPH1134058A (ja) * | 1997-07-24 | 1999-02-09 | Mitsubishi Electric Corp | 廃棄物処理装置 |
JPH11216455A (ja) * | 1998-02-04 | 1999-08-10 | Hitachi Ltd | 廃プリント基板処理装置及びその処理方法 |
JP2000290424A (ja) * | 1999-04-07 | 2000-10-17 | Matsushita Electric Ind Co Ltd | 臭素系難燃剤を含有する熱可塑性樹脂組成物の再生処理方法 |
JP2001107152A (ja) * | 1999-10-06 | 2001-04-17 | Seikyo Kotei Komon Kofun Yugenkoshi | 廃棄プリント配線板の処理方法 |
JP2001177234A (ja) * | 1999-12-16 | 2001-06-29 | Sony Corp | 表面実装部品の除去方法及び除去装置 |
JP2002177921A (ja) * | 2000-12-11 | 2002-06-25 | Ibiden Co Ltd | 廃棄されたプリント基板からの有価物の回収法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101108208B1 (ko) | 2009-08-20 | 2012-01-31 | 주식회사 리더스큐엠 | 폐frp의 재활용 과정에서 기계적 조작을 용이하게 하기 위한 폐frp의 전처리방법 |
CN101905234A (zh) * | 2010-07-23 | 2010-12-08 | 中国科学院广州能源研究所 | 一种废印刷线路板综合回收利用的方法及装置 |
CN102389888A (zh) * | 2011-05-12 | 2012-03-28 | 上海理工大学 | 一种处置废弃印刷电路板的熔盐气化方法及其所用的装置 |
CN102389888B (zh) * | 2011-05-12 | 2014-05-28 | 上海理工大学 | 一种处置废弃印刷电路板的熔盐气化方法及其所用的装置 |
JP2014529500A (ja) * | 2011-12-15 | 2014-11-13 | アドバンスドテクノロジーマテリアルズ,インコーポレイテッド | 廃電気電子機器のリサイクル中にはんだ金属を剥離するための装置及び方法 |
US20150322540A1 (en) * | 2011-12-15 | 2015-11-12 | Advanced Technology Materials, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
JP2017095810A (ja) * | 2011-12-15 | 2017-06-01 | インテグリス・インコーポレーテッド | 廃電気電子機器のリサイクル中にはんだ金属を剥離するための装置及び方法 |
US9731368B2 (en) * | 2011-12-15 | 2017-08-15 | Entegris, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
JP2013230437A (ja) * | 2012-04-27 | 2013-11-14 | Astec Irie Co Ltd | プリント基板の処理方法 |
CN105921496A (zh) * | 2016-06-13 | 2016-09-07 | 王枝宝 | 一种废电路板残渣处理方法 |
KR102182334B1 (ko) * | 2020-05-22 | 2020-11-24 | 주식회사 에스알아이 | 폐기판으로부터 실리콘 카바이드를 회수하는 방법 |
CN114029320A (zh) * | 2021-11-09 | 2022-02-11 | 广州爱锋派环保科技有限公司 | 一种废旧手机线路板裂解方法及其装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101007313A (zh) | 2007-08-01 |
KR20070077114A (ko) | 2007-07-25 |
CN100592939C (zh) | 2010-03-03 |
KR100821792B1 (ko) | 2008-04-14 |
EP1811821B1 (en) | 2011-02-23 |
US20070169330A1 (en) | 2007-07-26 |
SG134269A1 (en) | 2007-08-29 |
EP1811821A1 (en) | 2007-07-25 |
JP4791978B2 (ja) | 2011-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4791978B2 (ja) | 廃棄プリント基板の回収方法 | |
CN105779770B (zh) | 一种回收废电路板中有价金属的方法 | |
CN105755289A (zh) | 一种废弃线路板有价金属综合回收的方法 | |
JP5664043B2 (ja) | 廃リチウムイオン電池電解液の再利用方法 | |
CN103949461B (zh) | 一种使用近临界水分离和回收废旧电路板各组分材料的方法 | |
US20230037130A1 (en) | Method For Cooperative Disposal Of Waste Printed Circuit Board Thermal Cracking Slag And Smelting Ash | |
CN105543486A (zh) | 一种回收废弃电路板中有价金属的方法 | |
CN111468504A (zh) | 固体废物处理装置与固体废物处理方法 | |
CN103934536B (zh) | 一种对废弃印刷电路板焊接元器件进行拆解的方法 | |
CN105274358B (zh) | 一种多元混合熔盐碱性熔炼回收废弃电路板粉末中锡的方法 | |
CN102583501A (zh) | 覆铜板回收过程产生的含铜废渣的回收方法 | |
CN113714246B (zh) | 一种垃圾焚烧飞灰处理系统及方法 | |
CN117550594A (zh) | 一种高纯石墨的提纯方法 | |
CN112139201A (zh) | 一种废弃电路板的资源回收处理方法 | |
KR20210132049A (ko) | 폐전자기판의 처리 방법 | |
CN215745469U (zh) | 一种垃圾焚烧飞灰处理系统 | |
CN109701998A (zh) | 一种焚烧飞灰的处置方法 | |
CN111777054B (zh) | 铝电解废旧阴极炭块微波-超声波-碱浸协同除氟的方法 | |
JP2008248304A (ja) | Sb,Biの回収方法 | |
JP2000210650A (ja) | 電子機器廃棄物の処理方法 | |
CN106517116A (zh) | 一种工业废硝酸的综合利用工艺 | |
CN113667827A (zh) | 一种垃圾焚烧飞灰和含铜污泥的协同处理方法 | |
JP3304734B2 (ja) | シュレッダーダストの処理方法 | |
KR102617450B1 (ko) | 폐자재의 재활용 방법 | |
JP5470727B2 (ja) | 樹脂製品の廃棄処理方法及び樹脂製品の廃棄処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081016 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20081028 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090122 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: A7422 Effective date: 20090123 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20090123 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100427 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100726 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110705 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110722 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140729 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4791978 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |