KR20070077114A - 소모된 인쇄회로기판 재활용 방법 - Google Patents
소모된 인쇄회로기판 재활용 방법 Download PDFInfo
- Publication number
- KR20070077114A KR20070077114A KR1020070006022A KR20070006022A KR20070077114A KR 20070077114 A KR20070077114 A KR 20070077114A KR 1020070006022 A KR1020070006022 A KR 1020070006022A KR 20070006022 A KR20070006022 A KR 20070006022A KR 20070077114 A KR20070077114 A KR 20070077114A
- Authority
- KR
- South Korea
- Prior art keywords
- pcb
- wasted
- recycling
- tin
- copper
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 47
- 238000004064 recycling Methods 0.000 title claims abstract description 46
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims abstract description 44
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 41
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 claims abstract description 33
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 claims abstract description 31
- 239000007789 gas Substances 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 28
- 229910052802 copper Inorganic materials 0.000 claims abstract description 26
- 235000010344 sodium nitrate Nutrition 0.000 claims abstract description 22
- 239000004317 sodium nitrate Substances 0.000 claims abstract description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 21
- 150000003071 polychlorinated biphenyls Chemical class 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 13
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 13
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000000197 pyrolysis Methods 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 238000010438 heat treatment Methods 0.000 claims abstract description 8
- 239000002253 acid Substances 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000002844 melting Methods 0.000 claims abstract description 4
- 230000008018 melting Effects 0.000 claims abstract description 4
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims abstract description 3
- 238000002791 soaking Methods 0.000 claims abstract 3
- 239000003365 glass fiber Substances 0.000 claims description 45
- 239000000243 solution Substances 0.000 claims description 15
- 230000005484 gravity Effects 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- 239000003929 acidic solution Substances 0.000 claims description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 229910000679 solder Inorganic materials 0.000 claims description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 239000007864 aqueous solution Substances 0.000 claims description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 4
- -1 bromine ions Chemical class 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 239000011734 sodium Substances 0.000 claims description 4
- 229910001415 sodium ion Inorganic materials 0.000 claims description 4
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims description 2
- 229910001431 copper ion Inorganic materials 0.000 claims description 2
- JOQGJRQKCIJIDB-UHFFFAOYSA-N tin;hydrochloride Chemical group Cl.[Sn] JOQGJRQKCIJIDB-UHFFFAOYSA-N 0.000 claims description 2
- YQMWDQQWGKVOSQ-UHFFFAOYSA-N trinitrooxystannyl nitrate Chemical compound [Sn+4].[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O.[O-][N+]([O-])=O YQMWDQQWGKVOSQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002699 waste material Substances 0.000 claims description 2
- FGIUAXJPYTZDNR-UHFFFAOYSA-N potassium nitrate Chemical group [K+].[O-][N+]([O-])=O FGIUAXJPYTZDNR-UHFFFAOYSA-N 0.000 claims 2
- LPXPTNMVRIOKMN-UHFFFAOYSA-M sodium nitrite Chemical group [Na+].[O-]N=O LPXPTNMVRIOKMN-UHFFFAOYSA-M 0.000 claims 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 235000010333 potassium nitrate Nutrition 0.000 claims 1
- 239000004323 potassium nitrate Substances 0.000 claims 1
- 235000010288 sodium nitrite Nutrition 0.000 claims 1
- 239000011889 copper foil Substances 0.000 abstract description 14
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 239000002184 metal Substances 0.000 abstract description 11
- 239000011152 fibreglass Substances 0.000 abstract description 6
- 150000002739 metals Chemical class 0.000 abstract description 4
- 150000001875 compounds Chemical class 0.000 abstract 5
- 239000010410 layer Substances 0.000 abstract 1
- 239000002344 surface layer Substances 0.000 abstract 1
- 238000002485 combustion reaction Methods 0.000 description 14
- 239000000463 material Substances 0.000 description 14
- 238000011282 treatment Methods 0.000 description 12
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000004090 dissolution Methods 0.000 description 5
- 229910017053 inorganic salt Inorganic materials 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000003763 carbonization Methods 0.000 description 3
- 239000012770 industrial material Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 2
- YPJKMVATUPSWOH-UHFFFAOYSA-N nitrooxidanyl Chemical compound [O][N+]([O-])=O YPJKMVATUPSWOH-UHFFFAOYSA-N 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005979 thermal decomposition reaction Methods 0.000 description 2
- 231100000331 toxic Toxicity 0.000 description 2
- 230000002588 toxic effect Effects 0.000 description 2
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052728 basic metal Inorganic materials 0.000 description 1
- 150000003818 basic metals Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical class C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010309 melting process Methods 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000002341 toxic gas Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 239000010891 toxic waste Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
- B09B3/20—Agglomeration, binding or encapsulation of solid waste
- B09B3/25—Agglomeration, binding or encapsulation of solid waste using mineral binders or matrix
- B09B3/29—Agglomeration, binding or encapsulation of solid waste using mineral binders or matrix involving a melting or softening step
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/001—Dry processes
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/005—Separation by a physical processing technique only, e.g. by mechanical breaking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0255—Specific separating techniques using different melting or softening temperatures of the materials to be separated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/02—Separating plastics from other materials
- B29B2017/0213—Specific separating techniques
- B29B2017/0293—Dissolving the materials in gases or liquids
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B17/00—Recovery of plastics or other constituents of waste material containing plastics
- B29B17/04—Disintegrating plastics, e.g. by milling
- B29B2017/0424—Specific disintegrating techniques; devices therefor
- B29B2017/0496—Pyrolysing the materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/06—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts
- B29K2105/065—Condition, form or state of moulded material or of the material to be shaped containing reinforcements, fillers or inserts containing impurities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
- B29K2705/10—Copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3425—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49751—Scrap recovering or utilizing
- Y10T29/49755—Separating one material from another
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Processing Of Solid Wastes (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
Abstract
Description
Claims (7)
- 소모된 인쇄회로기판을 처리 단계에 의해 재활용하는 방법에 있어서,(a)소모된 PCB에 전자부품이 없도록 납땜지점에 있는 모든 전자부품을 가열하여, 소모된 모든 PCB상의 전자부품을 모두 제거한 후 재활용을 위해 상기 전자부품을 수집 및 제거하는 단계와,(b)소모된 PCB에 전자부품이 없도록 소모된 모든 PCB를 200℃ 이상으로 가열하여, 표층에 있는 납땜 주석을 용융시키므로써, 주석함유 부품을 제거 및 수집하는 단계와,(c)내층에 있는 주석함유 부품을 용해하여 이러한 부품과 구리를 분리시키기 위해, 상기 단계(b)의 소모된 PCB를 주석제거 용액에 담그고, 재활용을 위해 상기 주석제거 용액에 의해 모든 주석함유 부품을 직접 수집하는 단계와,(d)관통구멍으로부터 점용접용 구리 및 전기도금용 구리를 용해하여, 소모된 PCB에 구리박편이 없어지도록, 단계(c)의 상기 소모된 PCB에 강한 산성 용액을 가하는 단계와,(e)브롬화 에폭시 수지를 유리섬유로부터 분리시키는 열분해 화학반응을 실행하여, 브롬화나트륨과 탄화된 유리섬유와 구리박편과 유기 가스와 질소 산화물이 생성되도록, 단계(d)의 상기 소모된 PCB를 용융된 질산나트륨에 담그는 단계와,(f)상부에 형성된 그 혼합물에 물세척법을 적용하여 탄화된 유리섬유 및 구리박편을 분리시킨 후, 재활용을 위해 상기 탄화된 유리섬유 및 구리박편을 직접 수집하는 단계를 포함하는 것을 특징으로 하는 인쇄회로기판 재활용 방법.
- 제1항에 있어서, 사용된 강한 산성 용액은 에칭 용액으로 작용할 수 있는 구리 이온[Cu++]을 함유한 산성 용액이 되는 것을 특징으로 하는 인쇄회로기판 재활용 방법.
- 제1항에 있어서, 상기 단계(d)에 사용된 강한 산성 용액은 산소환경하에서 상기 소모된 PCB에 살포되기 위해, 희석된 질산일 수도 있으며 또한 약간의 질산과 혼합된 염산 또는 황산인 것을 특징으로 하는 인쇄회로기판 재활용 방법.
- 제1항에 있어서, 상기 단계(e)의 브롬화 에폭시 수지는 질산나트륨과 직접 반응하여 유기 가스 및 질소 산화물로 되도록 열에너지에 의해 분해되며, 나트륨 이온[Na+]과 브롬 이온[Br-]은 즉시 조합되어 용융된 질산나트륨에서 유지되며, 상기 에폭시 수지내의 대부분의 탄소는 유리섬유(12)에 고착되어 유리섬유(12)를 탄화시키는 것을 특징으로 하는 인쇄회로기판 재활용 방법.
- 제1항에 있어서, 상기 단계(f)의 탄화된 유리섬유 및 구리박편의 혼합물에서, 상기 탄화된 유리섬유는 수용액 위로 부유되며; 상기 구리박편은 수용액의 비중과 비교하였을 때 상이한 비중으로 인해 아래쪽으로 가라앉으며, 이에 따라 상기 탄화된 유리섬유 및 구리박편의 수집 및 재활용 처리과정이 용이해지는 것을 특징으로 하는 인쇄회로기판 재활용 방법.
- 제1항에 있어서, 상기 질산나트륨은 질산칼륨이나 아질산나트륨으로 대체될 수 있는 것을 특징으로 하는 인쇄회로기판 재활용 방법.
- 제1항에 있어서, 상기 질산 주석제거 용액은 염산 주석제거 용액으로 대체될 수 있는 것을 특징으로 하는 인쇄회로기판 재활용 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095102342 | 2006-01-20 | ||
TW095102342A TWI268184B (en) | 2006-01-20 | 2006-01-20 | Recycling method for waste printed circuit board brominated epoxy resin and glass fiber in the resin are recycled and converted into raw material for industry |
CN200610002019A CN100592939C (zh) | 2006-01-20 | 2006-01-23 | 回收废弃印刷电路板的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070077114A true KR20070077114A (ko) | 2007-07-25 |
KR100821792B1 KR100821792B1 (ko) | 2008-04-14 |
Family
ID=42562866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070006022A KR100821792B1 (ko) | 2006-01-20 | 2007-01-19 | 폐 인쇄회로기판 재활용 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070169330A1 (ko) |
EP (1) | EP1811821B1 (ko) |
JP (1) | JP4791978B2 (ko) |
KR (1) | KR100821792B1 (ko) |
CN (1) | CN100592939C (ko) |
SG (1) | SG134269A1 (ko) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101829666A (zh) * | 2010-05-06 | 2010-09-15 | 陕西师范大学 | 废印刷线路板热解脱溴方法 |
US7867317B2 (en) | 2007-11-16 | 2011-01-11 | Korea Institute of Geoscience and Minderal Resources | Pre-treatment process for liberation of metals from waste printed circuit boards using organic solution |
US20150322545A1 (en) * | 2011-12-15 | 2015-11-12 | Advanced Technology Materials, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
US9850433B2 (en) | 2015-12-31 | 2017-12-26 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of E-waste materials |
US10640711B2 (en) | 2018-06-05 | 2020-05-05 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of treated wood waste sources |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101358285B (zh) * | 2007-08-03 | 2010-11-03 | 中国科学院过程工程研究所 | 一种废弃环氧电路板上金属铜箔的剥离方法 |
CN101250315B (zh) * | 2008-03-18 | 2010-06-23 | 上海大学 | 废旧印刷电路板的基板材料的利用及处理方法 |
CN101407596B (zh) * | 2008-09-25 | 2011-08-17 | 上海第二工业大学 | 从废弃印刷线路板的非金属粉末中回收环氧树脂和玻璃纤维的方法 |
TW201041668A (en) * | 2009-05-27 | 2010-12-01 | xie-sen Wu | Pyrolysis method of recycled substrate of printed circuit board and device thereof |
CN101921915B (zh) * | 2009-06-12 | 2012-05-23 | 巫协森 | 热裂解废印刷电路板回收基材方法及其装置 |
KR101108208B1 (ko) | 2009-08-20 | 2012-01-31 | 주식회사 리더스큐엠 | 폐frp의 재활용 과정에서 기계적 조작을 용이하게 하기 위한 폐frp의 전처리방법 |
CN101787547B (zh) * | 2010-02-09 | 2011-06-15 | 中南大学 | 一种从废印刷电路板中回收有价金属的方法 |
AP2016009105A0 (en) * | 2010-04-15 | 2016-03-31 | Entegris Inc | Method for recycling of obsolete printed circuit boards |
CN101905234B (zh) * | 2010-07-23 | 2012-07-04 | 中国科学院广州能源研究所 | 一种废印刷线路板综合回收利用的方法及装置 |
CN101937742B (zh) * | 2010-09-10 | 2012-05-09 | 北京科技大学 | 一种镀锡铜米分离回收金属铜锡的方法和装置 |
CN102009058B (zh) * | 2010-09-27 | 2014-11-05 | 北京航空航天大学 | 一种从废印刷电路板中提取玻璃纤维和能量利用的装置 |
CN101954678B (zh) * | 2010-10-28 | 2012-07-25 | 中南大学 | 一种废弃印刷电路板分选前的预处理工艺 |
CN102676822B (zh) * | 2011-03-11 | 2014-01-01 | 深圳市格林美高新技术股份有限公司 | 一种免焚烧无氰化处理废旧印刷电路板的方法 |
CN102127643B (zh) * | 2011-04-07 | 2012-11-21 | 北京科技大学 | 一种镀锡铜块料铜锡分离的喷淋方法和装置 |
CN102240663A (zh) * | 2011-04-13 | 2011-11-16 | 深圳市格林美高新技术股份有限公司 | 一种废旧电路板中稀贵金属与废塑料的分离回收方法 |
CN102389888B (zh) * | 2011-05-12 | 2014-05-28 | 上海理工大学 | 一种处置废弃印刷电路板的熔盐气化方法及其所用的装置 |
CN103100771A (zh) * | 2011-11-15 | 2013-05-15 | 梁刚 | 环保型全自动旧电路板焊锡快速回收机 |
CN102433441B (zh) * | 2011-12-26 | 2013-10-16 | 上海大学 | 利用离子液体处理废旧线路板的方法 |
CN102560118B (zh) * | 2012-01-09 | 2013-07-24 | 刘景洋 | 一种废电路板浸提液中锡铅回收方法 |
WO2013151437A1 (en) | 2012-04-05 | 2013-10-10 | Nederlandse Organisatie Voor Toegepast-Natuurwetenschappelijk Onderzoek Tno | An e-waste demounting device and method |
JP5843289B2 (ja) * | 2012-04-27 | 2016-01-13 | 株式会社アステック入江 | プリント基板の処理方法 |
CN103495783B (zh) * | 2013-09-18 | 2015-08-19 | 清华大学 | 一种面向重用的废弃电路板贴装式元器件拆解设备 |
WO2016022755A2 (en) | 2014-08-06 | 2016-02-11 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
CN105967221B (zh) * | 2016-05-09 | 2017-08-29 | 江苏夏博士节能工程股份有限公司 | 废旧覆铜板反应回收系统 |
CN105921496A (zh) * | 2016-06-13 | 2016-09-07 | 王枝宝 | 一种废电路板残渣处理方法 |
CN108456783B (zh) * | 2017-11-28 | 2020-11-27 | 苏州美源达环保科技股份有限公司 | 一种线路板废金、废锡边框提金、提锡的复合设备及工艺 |
CN108048663A (zh) * | 2017-12-13 | 2018-05-18 | 长沙汇聚环境技术有限公司 | 一种从废镀锡铜米中分离锡的方法 |
CN108439408A (zh) * | 2018-02-12 | 2018-08-24 | 中山大学 | 一种利用废弃线路基板制备碳化硅粉体材料的方法 |
CN108500032B (zh) * | 2018-03-22 | 2021-09-28 | 安徽浩悦环境科技有限责任公司 | 含溴废物的处理方法 |
CN109365487B (zh) * | 2018-11-30 | 2020-07-07 | 清远市进田企业有限公司 | 一种废旧电路板中环氧涂层的高效节能清洗工艺 |
CN110421743A (zh) * | 2019-09-12 | 2019-11-08 | 南安市商宏机械科技有限公司 | 一种杂糅自剔除的塑料粉碎混炼造粒一体机 |
CN111420794A (zh) * | 2020-03-31 | 2020-07-17 | 陕西科技大学 | 一种土壤中微塑料的分离提取装置及方法 |
KR102182334B1 (ko) * | 2020-05-22 | 2020-11-24 | 주식회사 에스알아이 | 폐기판으로부터 실리콘 카바이드를 회수하는 방법 |
CN112153818A (zh) * | 2020-10-14 | 2020-12-29 | 杭州建德睿夕电子科技有限公司 | 一种可自动回收废弃电路板上电器元件的装置 |
CN113471885B (zh) * | 2021-05-19 | 2022-08-19 | 国网湖北省电力有限公司襄阳供电公司 | 一种多方位固定且两侧自走式切割的粗长电缆拆分装置 |
CN113436807B (zh) * | 2021-05-25 | 2023-10-10 | 福建明锐新材料科技有限公司 | 一种铜线生产制造工艺 |
CN113522885B (zh) * | 2021-07-09 | 2023-05-09 | 东莞理工学院 | 一种近临界流体处理废弃印刷线路板的方法 |
CN114029320A (zh) * | 2021-11-09 | 2022-02-11 | 广州爱锋派环保科技有限公司 | 一种废旧手机线路板裂解方法及其装置 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4164542A (en) * | 1973-05-08 | 1979-08-14 | Pincus Deren | Detinning process |
GB2109820B (en) * | 1981-11-24 | 1986-04-09 | Occidental Chem Co | Metal stripping composition |
JP2665192B2 (ja) * | 1995-04-28 | 1997-10-22 | 日本電気株式会社 | 難燃性プラスチックスの分解ガスの処理方法 |
JPH08311444A (ja) * | 1995-05-22 | 1996-11-26 | Toshiba Corp | ハンダの除去方法 |
US5755950A (en) * | 1995-06-07 | 1998-05-26 | Dulin Metals Company | Process for removing plating materials from copper-based substrates |
JPH0952750A (ja) * | 1995-08-11 | 1997-02-25 | Sumitomo Bakelite Co Ltd | 人工石材 |
US5911907A (en) * | 1995-08-30 | 1999-06-15 | Surface Tek Specialty Products, Inc. | Composition and method for stripping tin and tin-lead from copper surfaces |
US5994611A (en) * | 1995-09-18 | 1999-11-30 | Toda Kogyo Corporation | Method of incinerating plastic products containing ferric oxide hydroxide particles |
JPH09225445A (ja) * | 1996-02-28 | 1997-09-02 | Hitachi Ltd | 電子部品搭載プリント配線基板の廃棄品の処理方法 |
JPH09272989A (ja) * | 1996-04-08 | 1997-10-21 | Sumitomo Metal Mining Co Ltd | はんだ溶解液 |
JPH1136020A (ja) * | 1997-07-15 | 1999-02-09 | Justy:Kk | 廃プリント基板等の処理方法 |
JPH1134058A (ja) * | 1997-07-24 | 1999-02-09 | Mitsubishi Electric Corp | 廃棄物処理装置 |
JPH11216455A (ja) * | 1998-02-04 | 1999-08-10 | Hitachi Ltd | 廃プリント基板処理装置及びその処理方法 |
JP2000290424A (ja) * | 1999-04-07 | 2000-10-17 | Matsushita Electric Ind Co Ltd | 臭素系難燃剤を含有する熱可塑性樹脂組成物の再生処理方法 |
JP3365364B2 (ja) * | 1999-08-31 | 2003-01-08 | 千住金属工業株式会社 | プリント基板 |
US6089479A (en) * | 1999-09-28 | 2000-07-18 | Cleanenv' Engineeering Consultant Co., Ltd. | Method for treating waste printed circuit boards with molten mixture of inorganic salts |
JP2001107152A (ja) * | 1999-10-06 | 2001-04-17 | Seikyo Kotei Komon Kofun Yugenkoshi | 廃棄プリント配線板の処理方法 |
JP2001177234A (ja) * | 1999-12-16 | 2001-06-29 | Sony Corp | 表面実装部品の除去方法及び除去装置 |
JP2002177921A (ja) * | 2000-12-11 | 2002-06-25 | Ibiden Co Ltd | 廃棄されたプリント基板からの有価物の回収法 |
JP4123769B2 (ja) | 2001-12-18 | 2008-07-23 | 株式会社デンソー | プリント基板のリサイクル方法 |
MXPA03007267A (es) * | 2001-12-18 | 2004-06-30 | Denso Corp | Metodo de reciclado de tablero de circuitos impresos y aparato para el mismo. |
GB2416166A (en) * | 2003-03-27 | 2006-01-18 | Hsieh Sen Wu | Methods and devices for recycling copper from a discarded circuit board and a discarded fluid containing copper |
-
2006
- 2006-01-23 CN CN200610002019A patent/CN100592939C/zh not_active Expired - Fee Related
- 2006-11-06 US US11/592,974 patent/US20070169330A1/en not_active Abandoned
- 2006-12-05 EP EP20060125409 patent/EP1811821B1/en not_active Not-in-force
-
2007
- 2007-01-17 SG SG200700330-4A patent/SG134269A1/en unknown
- 2007-01-18 JP JP2007009172A patent/JP4791978B2/ja not_active Expired - Fee Related
- 2007-01-19 KR KR1020070006022A patent/KR100821792B1/ko active IP Right Grant
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7867317B2 (en) | 2007-11-16 | 2011-01-11 | Korea Institute of Geoscience and Minderal Resources | Pre-treatment process for liberation of metals from waste printed circuit boards using organic solution |
CN101829666A (zh) * | 2010-05-06 | 2010-09-15 | 陕西师范大学 | 废印刷线路板热解脱溴方法 |
US20150322545A1 (en) * | 2011-12-15 | 2015-11-12 | Advanced Technology Materials, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
US9649712B2 (en) * | 2011-12-15 | 2017-05-16 | Entegris, Inc. | Apparatus and method for stripping solder metals during the recycling of waste electrical and electronic equipment |
US9850433B2 (en) | 2015-12-31 | 2017-12-26 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of E-waste materials |
US10961461B2 (en) | 2015-12-31 | 2021-03-30 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of e-waste materials |
US11306255B2 (en) | 2015-12-31 | 2022-04-19 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of e-waste materials |
US11814585B2 (en) | 2015-12-31 | 2023-11-14 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of e-waste materials |
US10640711B2 (en) | 2018-06-05 | 2020-05-05 | Chz Technologies, Llc | Multistage thermolysis method for safe and efficient conversion of treated wood waste sources |
Also Published As
Publication number | Publication date |
---|---|
CN101007313A (zh) | 2007-08-01 |
KR100821792B1 (ko) | 2008-04-14 |
EP1811821A1 (en) | 2007-07-25 |
JP2007190551A (ja) | 2007-08-02 |
CN100592939C (zh) | 2010-03-03 |
US20070169330A1 (en) | 2007-07-26 |
SG134269A1 (en) | 2007-08-29 |
EP1811821B1 (en) | 2011-02-23 |
JP4791978B2 (ja) | 2011-10-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100821792B1 (ko) | 폐 인쇄회로기판 재활용 방법 | |
Li et al. | Overview of the recycling technology for copper-containing cables | |
CN103943911B (zh) | 废旧锂离子电池综合回收利用的方法 | |
CN103443996B (zh) | 用于电池组的回收方法和处理装置 | |
US6523764B2 (en) | Method for separating metallic from waste printed circuit boards, and dry distillation apparatus used for waste treatment | |
Jiang et al. | Improving the end-of-life for electronic materials via sustainable recycling methods | |
JP6589966B2 (ja) | リチウムイオン電池廃材の処理方法 | |
JP5664043B2 (ja) | 廃リチウムイオン電池電解液の再利用方法 | |
CN102218439A (zh) | 一种废弃印刷线路板基板热解分离有价组分的方法 | |
CN102500858A (zh) | 高频感应加热分离废旧电路板中电子元器件的系统及方法 | |
CN108413412A (zh) | 一种线路板的处理系统 | |
CA2056902A1 (en) | Process and apparatus for the treatment of metal-laminated plastics scrap | |
KR101569710B1 (ko) | 혼합형 플라즈마 토치 시스템, 및 이를 이용한 산업 및 가전 폐기물의 유가금속 회수 방법 | |
CN110387472A (zh) | 超声作用下低温熔融混碱处理回收废旧电路板的方法 | |
KR102658327B1 (ko) | 복합 폐기물 소스를 처리하기 위한 방법, 장치 및 시스템 | |
CN102371412A (zh) | 废电路板电子元器件及焊锡的脱除装置和方法 | |
CN112570839A (zh) | 一种电路板元器件错时定点加热解焊装置和方法 | |
JP2003334529A (ja) | 基板類処理方法 | |
CN111644443A (zh) | 一种废旧电路板综合回收的方法 | |
JPH11188335A (ja) | 廃銅線の処理方法 | |
JP4733525B2 (ja) | Pcb廃棄物の処理方法 | |
CN109701998A (zh) | 一种焚烧飞灰的处置方法 | |
CN113500051A (zh) | 一种电路板焊锡去除装置及方法 | |
JPH1176980A (ja) | プリント基板の処理方法 | |
TWI688731B (zh) | 廢棄電子產品處理方法及其處理裝置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130329 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140324 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150306 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160307 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20170324 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180129 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20190311 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20200218 Year of fee payment: 13 |