JP2006527923A5 - - Google Patents

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Publication number
JP2006527923A5
JP2006527923A5 JP2006517174A JP2006517174A JP2006527923A5 JP 2006527923 A5 JP2006527923 A5 JP 2006527923A5 JP 2006517174 A JP2006517174 A JP 2006517174A JP 2006517174 A JP2006517174 A JP 2006517174A JP 2006527923 A5 JP2006527923 A5 JP 2006527923A5
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JP
Japan
Prior art keywords
layer
polishing
polishing pad
workpiece
polymer resin
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JP2006517174A
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English (en)
Japanese (ja)
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JP2006527923A (ja
JP5090732B2 (ja
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Priority claimed from US10/463,680 external-priority patent/US6884156B2/en
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Publication of JP2006527923A publication Critical patent/JP2006527923A/ja
Publication of JP2006527923A5 publication Critical patent/JP2006527923A5/ja
Application granted granted Critical
Publication of JP5090732B2 publication Critical patent/JP5090732B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2006517174A 2003-06-17 2004-06-03 Ｃｍｐ用多層研磨パッド材料 Expired - Fee Related JP5090732B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/463,680 2003-06-17
US10/463,680 US6884156B2 (en) 2003-06-17 2003-06-17 Multi-layer polishing pad material for CMP
PCT/US2004/017564 WO2005000527A2 (en) 2003-06-17 2004-06-03 Multi-layer polishing pad material for cmp

Publications (3)

Publication Number Publication Date
JP2006527923A JP2006527923A (ja) 2006-12-07
JP2006527923A5 true JP2006527923A5 (enExample) 2007-07-05
JP5090732B2 JP5090732B2 (ja) 2012-12-05

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Family Applications (1)

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JP2006517174A Expired - Fee Related JP5090732B2 (ja) 2003-06-17 2004-06-03 Ｃｍｐ用多層研磨パッド材料

Country Status (11)

Country Link
US (1) US6884156B2 (enExample)
EP (2) EP2025469B1 (enExample)
JP (1) JP5090732B2 (enExample)
KR (1) KR101109367B1 (enExample)
CN (1) CN100591483C (enExample)
AT (1) ATE416881T1 (enExample)
DE (1) DE602004018321D1 (enExample)
MY (1) MY134466A (enExample)
SG (1) SG149719A1 (enExample)
TW (1) TWI295949B (enExample)
WO (1) WO2005000527A2 (enExample)

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