JP5090732B2 - Cmp用多層研磨パッド材料 - Google Patents
Cmp用多層研磨パッド材料 Download PDFInfo
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- JP5090732B2 JP5090732B2 JP2006517174A JP2006517174A JP5090732B2 JP 5090732 B2 JP5090732 B2 JP 5090732B2 JP 2006517174 A JP2006517174 A JP 2006517174A JP 2006517174 A JP2006517174 A JP 2006517174A JP 5090732 B2 JP5090732 B2 JP 5090732B2
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/008—Abrasive bodies without external bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Description
Claims (37)
- 研磨層と底部層を備える化学-機械研磨用の多層研磨パッドであって、研磨層のショアA硬度が30〜50であり、底部層が研磨層と実質的に同じ範囲に広がっており、研磨層と底部層が接着剤の使用なしで互いに接合されており、研磨層と底部層が、選択的な発泡によって単一のポリマー樹脂から形成されたものであり、かつ(i)研磨層が多孔性であり、底部層が非多孔性であるか、もしくは(ii)研磨層が非多孔性であり、底部層が多孔性である、多層研磨パッド。
- 研磨層が第1のポリマー樹脂を含んでおり、底部層が第2のポリマー樹脂を含んでいる、請求項1に記載の研磨パッド。
- 研磨層が熱可塑性ポリウレタンを含んでおり、底部層が、ポリカーボネート、ナイロン、ポリオレフィン、ポリビニルアルコール、ポリアクリレート、ポリテトラフルオロエチレン、ポリエチレンテレフタレート、ポリイミド、ポリアラミド、ポリアリーレン、ポリアクリレート、ポリスチレン、ポリメタクリル酸メチル、そのコポリマーおよびその混合物からなる群から選らばれるポリマー樹脂を含んでいる、請求項2に記載の研磨パッド。
- 研磨層が透明である、請求項1に記載の研磨パッド。
- 研磨層が開口部を有する、請求項4に記載の研磨パッド。
- 底部層が透明である、請求項1に記載の研磨パッド。
- 研磨層が開口部を有する、請求項6に記載の研磨パッド。
- ポリマー樹脂が、熱可塑性エラストマー、熱硬化性ポリマー、ポリウレタン、ポリオレフィン、ポリカーボネート、ポリビニルアルコール、ナイロン、弾性ゴム、弾性ポリエチレン、ポリテトラフルオロエチレン、ポリエチレンテレフタレート、ポリイミド、ポリアラミド、ポリアリーレン、ポリアクリレート、ポリスチレン、ポリメタクリル酸メチル、そのコポリマーおよびその混合物からなる群から選らばれる、請求項1に記載の研磨パッド。
- ポリマー樹脂が熱可塑性ポリウレタンである、請求項8に記載の研磨パッド。
- 研磨層と底部層の間に配置された1つ以上の中間層をさらに含んでおり、その中間層が、研磨層および底部層と実質的に同じ範囲に広がっており、研磨層、1つまたは複数の中間層、底部層が接着剤を使用せずに互いに接合されている、請求項1に記載の研磨パッド。
- 研磨層と底部層の間に配置された中間層を含んでいない、請求項1に記載の研磨パッド。
- 研磨層と底部層のうちの少なくとも一方が光透過性である、請求項10に記載の研磨パッド。
- 中間層が光透過性であり、研磨層と底部層が不透明である、請求項10に記載の研磨パッド。
- 研磨層が第1の開口部を備え、底部層が第2の開口部を備え、そして第1の開口部が第2の開口部と位置合わせされている、請求項13に記載の研磨パッド。
- 1つまたは複数の中間層がポリマー樹脂を含んでいる、請求項10に記載の研磨パッド。
- ポリマー樹脂が、熱可塑性エラストマー、熱硬化性ポリマー、ポリウレタン、ポリオレフィン、ポリカーボネート、ポリビニルアルコール、ナイロン、弾性ゴム、弾性ポリエチレン、ポリテトラフルオロエチレン、ポリエチレンテレフタレート、ポリイミド、ポリアラミド、ポリアリーレン、ポリアクリレート、ポリスチレン、ポリメタクリル酸メチル、そのコポリマーおよびその混合物からなる群から選らばれる、請求項15に記載の研磨パッド。
- ポリマー樹脂が熱可塑性ポリウレタンである、請求項16に記載の研磨パッド。
- (a)回転するプラテンと、
(b)回転するこのプラテンに固定された請求項10に記載の研磨パッドと、
(c)回転する研磨パッドに接触させて研磨する被加工物を保持する取り付け台と
を備える化学-機械研磨装置。 - 現場で終点を検出するシステムをさらに備える、請求項18に記載の化学-機械研磨装置。
- 被加工物を研磨する方法であって、
(i)請求項10に記載の研磨パッドを用意し、
(ii)その研磨パッドに被加工物を接触させ、そして
(iii)その研磨パッドを被加工物に対して移動させることによって被加工物を摩耗させ、被加工物を研磨すること
を含む方法。 - (a)回転するプラテンと、
(b)回転するこのプラテンに固定された請求項1に記載の研磨パッドと、
(c)回転する研磨パッドに接触させて研磨する被加工物を保持する取り付け台と
を備える化学-機械研磨装置。 - 現場で終点を検出するシステムをさらに備える、請求項21に記載の化学-機械研磨装置。
- 被加工物を研磨する方法であって、
(i)請求項1に記載の研磨パッドを用意し、
(ii)その研磨パッドに被加工物を接触させ、そして
(iii)その研磨パッドを被加工物に対して移動させることによって被加工物を摩耗させ、被加工物を研磨すること
を含む方法。 - 化学-機械研磨用の多層研磨パッドであって、研磨層、底部層及び研磨層と底部層の間に配置された1つ以上の中間層を備えており、
研磨層のショアA硬度が30〜50であるとともに、
(i)研磨層、底部層、1つまたは複数の中間層が実質的に同じ範囲に広がっており、
(ii)研磨層、1つまたは複数の中間層、底部層が接着剤を使用せずに互いに接合されており、そして
(iii)研磨層及び底部層が多孔性であり、1つまたは複数の中間層が非多孔性である、多層研磨パッド。 - 光透過性多層研磨パッド材料を含む化学-機械研磨用の研磨パッドであって、
(i)光透過性多層研磨パッド材料が、接着剤の使用なしで互いに接合された第1の透過層と第2の透過層を含んでおり、そして
(ii)第1の透過層が多孔性であり、第2の透過層が非多孔性であり、かつ
前記第1の透過層のショアA硬度が30〜50である、研磨パッド。 - 光透過性多層研磨パッド材料が同時押し出しによって形成される、請求項25に記載の研磨パッド。
- 第1の透過層と第2の透過層がポリマー樹脂を含んでいる、請求項25に記載の研磨パッド。
- ポリマー樹脂が、熱可塑性エラストマー、熱硬化性ポリマー、ポリウレタン、ポリオレフィン、ポリカーボネート、ポリビニルアルコール、ナイロン、弾性ゴム、弾性ポリエチレン、ポリテトラフルオロエチレン、ポリエチレンテレフタレート、ポリイミド、ポリアラミド、ポリアリーレン、ポリアクリレート、ポリスチレン、ポリメタクリル酸メチル、そのコポリマーおよびその混合物からなる群から選らばれる、請求項27に記載の研磨パッド。
- ポリマー樹脂が熱可塑性ポリウレタンである、請求項28に記載の研磨パッド。
- 第1の透過層が第1のポリマー樹脂を含んでおり、第2の透過層が第2のポリマー樹脂を含んでおり、第1のポリマー樹脂と第2のポリマー樹脂が異なっている、請求項25に記載の研磨パッド。
- 第1の透過層が熱可塑性ポリウレタンを含んでおり、第2の透過層が、ポリカーボネート、ナイロン、ポリオレフィン、ポリビニルアルコール、ポリアクリレート、ポリテトラフルオロエチレン、ポリエチレンテレフタレート、ポリイミド、ポリアラミド、ポリアリーレン、ポリアクリレート、ポリスチレン、ポリメタクリル酸メチル、そのコポリマーおよびその混合物からなる群から選らばれるポリマー樹脂を含んでいる、請求項30に記載の研磨パッド。
- 光透過性多層研磨パッド材料が、第1の透過層と第2の透過層の間に配置された第3の透過層をさらに備えている、請求項25に記載の研磨パッド。
- 光透過性多層研磨パッド材料が、第1の透過層と第2の透過層の間に配置された層を含んでいない、請求項25に記載の研磨パッド。
- 光透過性多層研磨パッド材料が、200nm〜10,000nmの範囲の少なくとも1つの波長において10%以上の透過率を有している、請求項25に記載の研磨パッド。
- (a)回転するプラテンと、
(b)請求項25に記載の研磨パッドと、
(c)回転する研磨パッドに接触させて研磨する被加工物を保持する取り付け台と
を備える化学-機械研磨装置。 - 現場で終点を検出するシステムをさらに備える、請求項35に記載の化学-機械研磨装置。
- 被加工物を研磨する方法であって、
(i)請求項25に記載の研磨パッドを用意し、
(ii)その研磨パッドに被加工物を接触させ、そして
(iii)その研磨パッドを被加工物に対して移動させることによって被加工物を摩耗させ、被加工物を研磨すること
を含む方法。
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US10/463,680 | 2003-06-17 | ||
US10/463,680 US6884156B2 (en) | 2003-06-17 | 2003-06-17 | Multi-layer polishing pad material for CMP |
PCT/US2004/017564 WO2005000527A2 (en) | 2003-06-17 | 2004-06-03 | Multi-layer polishing pad material for cmp |
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JP2006527923A JP2006527923A (ja) | 2006-12-07 |
JP2006527923A5 JP2006527923A5 (ja) | 2007-07-05 |
JP5090732B2 true JP5090732B2 (ja) | 2012-12-05 |
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US (1) | US6884156B2 (ja) |
EP (2) | EP1651388B1 (ja) |
JP (1) | JP5090732B2 (ja) |
KR (1) | KR101109367B1 (ja) |
CN (1) | CN100591483C (ja) |
AT (1) | ATE416881T1 (ja) |
DE (1) | DE602004018321D1 (ja) |
MY (1) | MY134466A (ja) |
SG (1) | SG149719A1 (ja) |
TW (1) | TWI295949B (ja) |
WO (1) | WO2005000527A2 (ja) |
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JP2002124496A (ja) * | 2000-10-18 | 2002-04-26 | Hitachi Ltd | 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置 |
JP2002170799A (ja) * | 2000-11-30 | 2002-06-14 | Nikon Corp | 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス |
JP2002178257A (ja) * | 2000-12-12 | 2002-06-25 | Nikon Corp | 研磨面観測装置及び研磨装置 |
US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
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JP2003133270A (ja) * | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
US6722249B2 (en) * | 2001-11-06 | 2004-04-20 | Rodel Holdings, Inc | Method of fabricating a polishing pad having an optical window |
JP2003220550A (ja) * | 2002-01-24 | 2003-08-05 | Sumitomo Bakelite Co Ltd | 研磨用パッドおよびその製造方法 |
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JP2005001083A (ja) * | 2003-06-13 | 2005-01-06 | Sumitomo Bakelite Co Ltd | 研磨用積層体および研磨方法 |
-
2003
- 2003-06-17 US US10/463,680 patent/US6884156B2/en not_active Expired - Lifetime
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2004
- 2004-06-03 SG SG200705357-2A patent/SG149719A1/en unknown
- 2004-06-03 DE DE602004018321T patent/DE602004018321D1/de not_active Expired - Lifetime
- 2004-06-03 EP EP04776265A patent/EP1651388B1/en not_active Expired - Lifetime
- 2004-06-03 EP EP08017326.3A patent/EP2025469B1/en not_active Expired - Lifetime
- 2004-06-03 AT AT04776265T patent/ATE416881T1/de active
- 2004-06-03 CN CN200480016709A patent/CN100591483C/zh not_active Expired - Lifetime
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- 2004-06-03 KR KR1020057024127A patent/KR101109367B1/ko active IP Right Grant
- 2004-06-03 WO PCT/US2004/017564 patent/WO2005000527A2/en active Application Filing
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Also Published As
Publication number | Publication date |
---|---|
DE602004018321D1 (de) | 2009-01-22 |
KR20060023562A (ko) | 2006-03-14 |
EP2025469B1 (en) | 2013-05-01 |
KR101109367B1 (ko) | 2012-01-31 |
TWI295949B (en) | 2008-04-21 |
CN1805826A (zh) | 2006-07-19 |
MY134466A (en) | 2007-12-31 |
SG149719A1 (en) | 2009-02-27 |
WO2005000527A2 (en) | 2005-01-06 |
US6884156B2 (en) | 2005-04-26 |
JP2006527923A (ja) | 2006-12-07 |
EP1651388B1 (en) | 2008-12-10 |
EP2025469A1 (en) | 2009-02-18 |
CN100591483C (zh) | 2010-02-24 |
ATE416881T1 (de) | 2008-12-15 |
EP1651388A2 (en) | 2006-05-03 |
US20040259484A1 (en) | 2004-12-23 |
TW200513348A (en) | 2005-04-16 |
WO2005000527A3 (en) | 2005-06-02 |
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