TWI465315B - 可導電之拋光墊及其製造方法 - Google Patents

可導電之拋光墊及其製造方法 Download PDF

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TWI465315B
TWI465315B TW97143727A TW97143727A TWI465315B TW I465315 B TWI465315 B TW I465315B TW 97143727 A TW97143727 A TW 97143727A TW 97143727 A TW97143727 A TW 97143727A TW I465315 B TWI465315 B TW I465315B
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Taiwan
Prior art keywords
polymer
polymer solution
bottom layer
polishing
polishing pad
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TW97143727A
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TW201018545A (en
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Chung Chih Feng
I Peng Yao
Yung Chang Hung
Chun Ta Wang
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Bestac Advanced Material Co Ltd
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Priority to TW97143727A priority Critical patent/TWI465315B/zh
Priority to US12/427,259 priority patent/US8343586B2/en
Publication of TW201018545A publication Critical patent/TW201018545A/zh
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Publication of TWI465315B publication Critical patent/TWI465315B/zh

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
    • B23H5/00—Combined machining
    • B23H5/06—Electrochemical machining combined with mechanical working, e.g. grinding or honing
    • B23H5/08—Electrolytic grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
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    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
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    • D06P1/00—General processes of dyeing or printing textiles, or general processes of dyeing leather, furs, or solid macromolecular substances in any form, classified according to the dyes, pigments, or auxiliary substances employed
    • D06P1/44—General processes of dyeing or printing textiles, or general processes of dyeing leather, furs, or solid macromolecular substances in any form, classified according to the dyes, pigments, or auxiliary substances employed using insoluble pigments or auxiliary substances, e.g. binders
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    • D06P1/44—General processes of dyeing or printing textiles, or general processes of dyeing leather, furs, or solid macromolecular substances in any form, classified according to the dyes, pigments, or auxiliary substances employed using insoluble pigments or auxiliary substances, e.g. binders
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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Textile Engineering (AREA)
  • Mechanical Engineering (AREA)
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Description

可導電之拋光墊及其製造方法
本發明係關於一種拋光墊及其製造方法，詳言之，係關於一種可導電之拋光墊及其製造方法。
參考圖1，顯示中華民國專利公開第200505632號所揭示之習知可導電之拋光墊之應用示意圖。該可導電之拋光墊1包括一底層11及一拋光層12。該底層11具有一佈線網路111。該拋光層12具有一拋光面121，該拋光面121具有至少一陽極122及至少一陰極123，該陽極122及該陰極123係利用該佈線網路111及一電連接器21分別連接至一電源22之正極端子221及負極端子222。
進行拋光時，將該可導電之拋光墊1固定於一拋光盤23，並將一基板24固定於一基板載體25，該基板24具有一金屬層241，且位於該拋光面121之上方，另有一拋光液26位於該基板24及該拋光面121之間。當該電源22提供電流，且該拋光液26、該陽極122、該陰極123及該基板24之金屬層241接觸時，就形成一電路。首先，該金屬層241之金屬原子進行電荷轉移，而形成金屬離子(M→M＋ ＋e－ )，且在該基板24之表面上聚積。接著，一受體(該拋光液26中的錯合劑)擴散至該金屬層241之表面，且在該受體及該金屬離子間形成一錯合物。最後，該錯合物自該金屬層241之表面擴散入該拋光液26中。該錯合物之擴散速率在該基板24之表面的凸出區域與凹下區域之間具有差別。在凸出 區域，該錯合物比在凹下區域擴散得更快，最終形成一光滑之基板24表面。
該習知可導電之拋光墊1之缺點如下。由於該陽極122及該陰極123係為金屬，其硬度高，故拋光時該基板24之表面易產生刮傷。此外，該陽極122及該陰極123經電化學機械拋光後會有所損耗，致使該拋光面121凹凸不平，而影響良率。
因此，有必要提供一種創新且具進步性的可導電之拋光墊及其製造方法，以解決上述問題。
本發明提供一種可導電之拋光墊，其包括一底層、一導電薄膜及一拋光層。該底層包括一第一高分子體及一纖維基材。該第一高分子體係包覆該纖維基材，且具有複數個第一孔洞。該導電薄膜位於該底層上，其中該導電薄膜覆蓋該底層之一表面。該拋光層位於該導電薄膜上，包括一第二高分子體。該第二高分子體具有複數個第二孔洞。
本發明另提供一種可導電之拋光墊之製造方法，包括以下步驟：(a)提供一纖維基材；(b)將該纖維基材浸置(Dipping)於一第一高分子溶液中，使該第一高分子溶液包覆該纖維基材，該第一高分子溶液包括一第一高分子體及一第一溶劑；(c)固化該第一高分子溶液，以形成一底層，該底層具有複數個第一孔洞；(d)形成一導電薄膜於該底層上，其中該導電薄膜覆蓋該底層之一表面；(e)形成一第二高分子溶液於該導電薄膜上，其中該第二高分子溶液包括 一第二高分子體及一第二溶劑；及(f)固化該第二高分子溶液，以形成一拋光層，該拋光層具有複數個第二孔洞。
本發明另提供一種可導電之拋光墊，其包括一導電薄膜、一底層及一拋光層。該底層位於該導電薄膜上，包括一第一高分子體及一纖維基材，其中該導電薄膜覆蓋該底層之一表面。該第一高分子體係包覆該纖維基材，且具有複數個第一孔洞。該拋光層位於該底層上，包括一第二高分子體。該第二高分子體具有複數個第二孔洞。
本發明另提供一種可導電之拋光墊之製造方法，包括以下步驟：(a)提供一纖維基材；(b)將該纖維基材浸置(Dipping)於一第一高分子溶液中，使該第一高分子溶液包覆該纖維基材，該第一高分子溶液包括一第一高分子體及一第一溶劑；(c)形成一第二高分子溶液於該第一高分子溶液上，其中該第二高分子溶液包括一第二高分子體及一第二溶劑；(d)同時固化該第一高分子溶液及該第二高分子溶液，以分別形成一底層及一拋光層，該底層具有複數個第一孔洞，該拋光層具有複數個第二孔洞；及(e)形成一導電薄膜於該底層上，其中該導電薄膜覆蓋該底層之一表面。
藉此，即便該底層及該拋光層係為不良導體，該導電薄膜亦可提升其導電性，使該拋光墊具有良好導電性。其次，該拋光墊具有一彈性表面，在進行拋光時不易使一待拋光工件之表面產生刮傷。此外，該拋光墊不具有電極，且該拋光墊之拋光面係為一均勻材質，可避免不同硬度之材質在拋光後損耗率不同，致使該拋光面凹凸不平之情 況，進而提升良率。
參考圖2，顯示本發明可導電之拋光墊之第一實施例之示意圖。該拋光墊3包括一底層31、一導電薄膜32及一拋光層33。
該底層31包括一第一高分子體311及一纖維基材312。該第一高分子體311係包覆該纖維基材312，且具有複數個第一孔洞313。在本實施例中，該第一高分子體311之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂，且該纖維基材312係為一不織布。
該導電薄膜32(由寬憶電子公司(QUAN YI ELECTRONICS CORP.)生產，其型號為QF400)位於該底層31上，且覆蓋該底層31之一表面。該拋光層33位於該導電薄膜32上，且其具有一拋光面331。該拋光層33包括一第二高分子體332。該第二高分子體332具有複數個第二孔洞333。在本實施例中，該第二高分子體332之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。
在其他應用中，該拋光墊3更可包括一強化材料(圖中未示)，位於該第一高分子體311之該等第一孔洞313內及該底層31之表面，該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，其中該水性PU及水性壓克力樹脂係用以增加該底層31之強度，該潑水處理劑係用以 增加防水性，該手感處理劑係用以增加軟柔度。較佳地，該拋光墊3之表面電阻係低於1×105 Ω，體積電阻係低於1×106 Ω‧cm。
參考圖3，顯示本發明可導電之拋光墊之第一實施例之製造方法之流程圖。配合參考圖2，首先，參考步驟S31，提供一纖維基材312。在本實施例中，該纖維基材312係為一不織布。接著，參考步驟S32，將該纖維基材312浸置(Dipping)於一第一高分子溶液(圖中未示)中，使該第一高分子溶液包覆該纖維基材312。該第一高分子溶液包括一第一高分子體311及一第一溶劑。在本實施例中，該第一高分子體311之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。較佳地，該第一高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)。
接著，參考步驟S33，固化該第一高分子溶液，以形成一底層31，該底層31具有複數個第一孔洞313。在其他應用中，該步驟S33之後更包括一形成一強化材料(圖中未示)於該底層31之該等第一孔洞313內及該底層31之表面之步驟，該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，且該強化材料係以浸置(Dipping)方式形成。
接著，參考步驟S34，形成一導電薄膜32(由寬憶電子公司(QUAN YI ELECTRONICS CORP.)生產，其型號為 QF400)於該底層31上，其中該導電薄膜32覆蓋該底層31之一表面。接著，參考步驟S35，形成一第二高分子溶液(圖中未示)於該導電薄膜32上，其中該第二高分子溶液包括一第二高分子體332及一第二溶劑。在本實施例中，該第二高分子體332之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。較佳地，該第二高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)。最後，參考步驟S36，固化該第二高分子溶液，以形成一拋光層33，該拋光層33具有複數個第二孔洞333及一拋光面331。
參考圖4，顯示本發明可導電之拋光墊之第一實施例之應用示意圖。進行拋光時，首先，將該拋光墊3固定於一拋光盤41，並將一待拋光工件(基板42)固定於一基板載體43，該基板42位於該拋光墊3之上方，另有一拋光液44位於該基板42及該拋光墊3之間。接著，將該基板42連接至一電源之正極，且將該拋光墊3連接至該電源之負極。當該基板42、該拋光液44及該拋光墊3接觸時，就形成一電路，而得以進行電化學機械拋光。
參考圖5，顯示本發明可導電之拋光墊之第二實施例之示意圖。該拋光墊5包括一導電薄膜52(由寬憶電子公司(QUAN YI ELECTRONICS CORP.)生產，其型號為QF400)、一底層51及一拋光層53。該底層51位於該導電薄膜52上，其中該導電薄膜52覆蓋該底層51之一表面，包括 一第一高分子體511及一纖維基材512。該第一高分子體511係包覆該纖維基材512，且具有複數個第一孔洞513。在本實施例中，該第一高分子體511之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂，且該纖維基材512係為一不織布。
該拋光層53位於該底層51上，且其具有一拋光面531。該拋光層53包括一第二高分子體532。在本實施例中，該拋光層53係塗佈於該底層51上，因此該底層51及該拋光層53不使用黏合劑而結合在一起。該第二高分子體532具有複數個第二孔洞533。在本實施例中，該第二高分子體532之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。
在其他應用中，該拋光墊5更可包括一強化材料(圖中未示)，位於該第一高分子體511之該等第一孔洞513內及該底層51之表面，該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，其中該水性PU及水性壓克力樹脂係用以增加該底層51之強度，該潑水處理劑係用以增加防水性，該手感處理劑係用以增加軟柔度。較佳地，該拋光墊5之表面電阻係低於1×105 Ω，體積電阻係低於1×106 Ω‧cm。
參考圖6，顯示本發明可導電之拋光墊之第二實施例之製造方法之流程圖。配合參考圖5，首先，參考步驟S61， 提供一纖維基材512。在本實施例中，該纖維基材512係為一不織布。接著，參考步驟S62，將該纖維基材512浸置(Dipping)於一第一高分子溶液(圖中未示)中，使該第一高分子溶液包覆該纖維基材512，該第一高分子溶液包括一第一高分子體511及一第一溶劑。在本實施例中，該第一高分子體511之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。較佳地，該第一高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)。
接著，參考步驟S63，形成一第二高分子溶液(圖中未示)於該第一高分子溶液上，其中該第二高分子溶液包括一第二高分子體532及一第二溶劑。在本實施例中，該第二高分子溶液係以塗佈(Coating)方式形成於該第一高分子溶液上，該第二高分子體532之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。較佳地，該第二高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)。
接著，參考步驟S64，同時固化該第一高分子溶液及該第二高分子溶液，以分別形成一底層51及一拋光層53，該底層51具有複數個第一孔洞513，該拋光層53具有複數個第二孔洞533及一拋光面531。在本實施例中，該底層51及該拋光層53不使用黏合劑而結合在一起。在其他應用中， 該步驟S64之後更包括一形成一強化材料(圖中未示)於該底層51之該等第一孔洞513內及該底層51之表面之步驟，該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，且該強化材料係以浸置(Dipping)方式形成。最後，參考步驟S65，形成一導電薄膜52(由寬憶電子公司(QUAN YI ELECTRONICS CORP.)生產，其型號為QF400)於該底層51上，其中該導電薄膜52覆蓋該底層51之一表面。
藉此，即便該底層31,51及該拋光層33,53係為不良導體，該導電薄膜32,52亦可提升其導電性，使該拋光墊3,5具有良好導電性。其次，該拋光墊3,5具有一彈性表面，在進行拋光時不易使一待拋光工件(基板42)之表面產生刮傷。此外，該拋光墊3,5不具有電極，且該拋光墊3,5之拋光面331,531係為一均勻材質，可避免不同硬度之材質在拋光後損耗率不同，移致使該拋光面331,531凹凸不平之情況，進而提升良率。
茲以下列實例予以詳細說明本發明，唯並不意味本發明僅侷限於此等實例所揭示之內容。
實例：
本實例之製造方法係對應上述第一實施例。參考圖2，首先，提供一纖維基材312，該纖維基材312係為一不織布。接著，將該纖維基材312浸置於一第一高分子溶液中，使該第一高分子溶液包覆該纖維基材312，該第一高分子溶液包括重量百分比27.8%之第一高分子體311、重量 百分比10%之色料、重量百分比0.9%之界面劑及重量百分比61.3%之二甲基甲醯胺(DMF)溶劑，其中該第一高分子體311之材質係為聚胺酯(Polyurethanes,PU)。接著，固化該第一高分子溶液，以形成一底層31，該底層31具有複數個第一孔洞313。接著，製備一強化材料，該強化材料包括重量百分比8%之水性PU及重量百分比92%之水。將該底層31浸置於該強化材料，使該強化材料形成於該底層31之該等第一孔洞313內。
接著，形成一導電薄膜32(由寬憶電子公司(QUAN YI ELECTRONICS CORP.)生產，其型號為QF400)於該底層31上，其中該導電薄膜32覆蓋該底層31之一表面。接著，形成一第二高分子溶液於該導電薄膜32上，其中該第二高分子溶液包括重量百分比59.4%之第二高分子體332、重量百分比21.6%之色料、重量百分比2.8%之界面劑及重量百分比16.2%之二甲基甲醯胺(DMF)溶劑，其中該第二高分子體332之材質係為聚胺酯(Polyurethanes,PU)。最後，固化該第二高分子溶液，以形成一拋光層33，該拋光層33具有複數個第二孔洞333及一拋光面331。該固化之方式係使該二甲基甲醯胺於一凝固槽內進行交換凝固，再以70℃之水溫進行水洗，並在110℃下烘乾以形成該拋光墊3。
惟上述實施例僅為說明本發明之原理及其功效，而非用以限制本發明。因此，習於此技術之人士對上述實施例進行修改及變化仍不脫本發明之精神。本發明之權利範圍應如後述之申請專利範圍所列。
1‧‧‧習知可導電之拋光墊
3‧‧‧本發明可導電之拋光墊之第一實施例
5‧‧‧本發明可導電之拋光墊之第二實施例
11‧‧‧底層
12‧‧‧拋光層
21‧‧‧電連接器
22‧‧‧電源
23‧‧‧拋光盤
24‧‧‧基材
25‧‧‧基材載體
26‧‧‧拋光液
31‧‧‧底層
32‧‧‧導電薄膜
33‧‧‧拋光層
41‧‧‧拋光盤
42‧‧‧基板
43‧‧‧基板載體
44‧‧‧拋光液
51‧‧‧底層
52‧‧‧導電薄膜
53‧‧‧拋光層
111‧‧‧佈線網路
121‧‧‧拋光面
122‧‧‧陽極
123‧‧‧陰極
221‧‧‧正極端子
222‧‧‧負極端子
241‧‧‧金屬層
311‧‧‧第一高分子體
312‧‧‧纖維基材
313‧‧‧第一孔洞
331‧‧‧拋光面
332‧‧‧第二高分子體
333‧‧‧第二孔洞
511‧‧‧第一高分子體
512‧‧‧纖維基材
513‧‧‧第一孔洞
531‧‧‧拋光面
532‧‧‧第二高分子體
533‧‧‧第二孔洞
圖1顯示習知可導電之拋光墊之應用示意圖；圖2顯示本發明可導電之拋光墊之第一實施例之示意圖；圖3顯示本發明可導電之拋光墊之第一實施例之製造方法之流程圖；圖4顯示本發明可導電之拋光墊之第一實施例之應用示意圖；圖5顯示本發明可導電之拋光墊之第二實施例之示意圖；及圖6顯示本發明可導電之拋光墊之第二實施例之製造方法之流程圖。
3‧‧‧本發明可導電之拋光墊之第一實施例
31‧‧‧底層
32‧‧‧導電薄膜
33‧‧‧拋光層
311‧‧‧第一高分子體
312‧‧‧纖維基材
313‧‧‧第一孔洞
331‧‧‧拋光面
332‧‧‧第二高分子體
333‧‧‧第二孔洞

Claims (21)

  1. 一種可導電之拋光墊，包括：一底層，包括一第一高分子體及一纖維基材，該第一高分子體係包覆該纖維基材，且具有複數個第一孔洞；一導電薄膜，位於該底層上，其中該導電薄膜覆蓋該底層之一表面；及一拋光層，位於該導電薄膜上，該拋光層包括一第二高分子體，該第二高分子體具有複數個第二孔洞。
  2. 如請求項1之拋光墊，其中該第一高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂，且該第二高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。
  3. 如請求項1之拋光墊，其中該纖維基材係為一不織布。
  4. 如請求項1之拋光墊，其中更包括一強化材料，位於該第一高分子體之該等第一孔洞內，該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑。
  5. 一種可導電之拋光墊之製造方法，包括：(a)提供一纖維基材；(b)將該纖維基材浸置(Dipping)於一第一高分子溶液中，使該第一高分子溶液包覆該纖維基材，該第一高分子溶液包括一第一高分子體及一第一溶劑； (c)固化該第一高分子溶液，以形成一底層，該底層具有複數個第一孔洞；(d)形成一導電薄膜於該底層上，其中該導電薄膜覆蓋該底層之一表面；(e)形成一第二高分子溶液於該導電薄膜上，其中該第二高分子溶液包括一第二高分子體及一第二溶劑；及(f)固化該第二高分子溶液，以形成一拋光層，該拋光層具有複數個第二孔洞。
  6. 如請求項5之方法，其中該步驟(a)中，該纖維基材係為一不織布。
  7. 如請求項5之方法，其中該步驟(b)中，該第一高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)，且該步驟(e)中，該第二高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)。
  8. 如請求項5之方法，其中該步驟(b)中，該第一高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂，且該步驟(e)中，該第二高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。
  9. 如請求項5之方法，其中該步驟(c)之後更包括一形成一強化材料於該底層之該等第一孔洞內之步驟，該強化材 料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，其中該強化材料係以浸置(Dipping)方式形成。
  10. 如請求項5之方法，其中該步驟(e)中，該第二高分子溶液係以塗佈(Coating)方式形成於該底層上。
  11. 一種可導電之拋光墊，包括：一導電薄膜；一底層，位於該導電薄膜上，包括一第一高分子體及一纖維基材，該第一高分子體係包覆該纖維基材，且具有複數個第一孔洞，其中該導電薄膜覆蓋該底層之一表面；及一拋光層，位於該底層上，該拋光層包括一第二高分子體，該第二高分子體具有複數個第二孔洞。
  12. 如請求項11之拋光墊，其中該第一高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂，且該第二高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。
  13. 如請求項11之拋光墊，其中該纖維基材係為一不織布。
  14. 如請求項11之拋光墊，其中更包括一強化材料，位於該第一高分子體之該等第一孔洞內，該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，且該拋光層係塗佈於該底層上。
  15. 一種可導電之拋光墊之製造方法，包括：(a)提供一纖維基材；(b)將該纖維基材浸置(Dipping)於一第一高分子溶液中，使該第一高分子溶液包覆該纖維基材，該第一高分子溶液包括一第一高分子體及一第一溶劑；(c)形成一第二高分子溶液於該第一高分子溶液上，其中該第二高分子溶液包括一第二高分子體及一第二溶劑；(d)同時固化該第一高分子溶液及該第二高分子溶液，以分別形成一底層及一拋光層，該底層具有複數個第一孔洞，該拋光層具有複數個第二孔洞；及(e)形成一導電薄膜於該底層上，其中該導電薄膜覆蓋該底層之一表面。
  16. 如請求項15之方法，其中該步驟(a)中，該纖維基材係為一不織布。
  17. 如請求項15之方法，其中該步驟(b)中，該第一高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)，且該步驟(c)中，該第二高分子溶液更包括色料、界面劑及二甲基甲醯胺(Dimethylformamide,DMF)。
  18. 如請求項15之方法，其中該步驟(b)中，該第一高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂，且該步驟(c)中，該 第二高分子體之材質係為聚丙烯(Polyproylene,PP)、聚乙烯對苯二甲酸酯(Polyethylene Terephthalate,PET)、聚胺酯(Polyurethanes,PU)或高分子樹脂。
  19. 如請求項15之方法，其中該步驟(c)中，該第二高分子溶液係以塗佈(Coating)方式形成於該第一高分子溶液上。
  20. 如請求項15之方法，其中該步驟(d)中，該底層及該拋光層不使用黏合劑而結合在一起。
  21. 如請求項15之方法，其中該步驟(d)之後更包括一形成一強化材料於該底層之該等第一孔洞內之步驟，其中該強化材料係為水性PU、水性壓克力樹脂、潑水處理劑或手感處理劑，且該強化材料係以浸置(Dipping)方式形成。
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