94.12.14 591065 11217twf2.doc/006 然後，將第二導電物質與第二高分子發泡體同時注入 模腔中（步驟3〇6)，以使第二導電物質分散於第二高分子發 泡體中，其中第二發泡體之硬度係大於第一高分子發泡體 之硬度，此相對較硬之第二高分子發泡體係作爲硏磨之 用’而相對較軟之第一高分子發泡體係作爲緩衝之用。在 此’第二導電物質係選自導電高分子聚合物、抗靜電劑、 碳黑或金屬粉末，而第二高分子發泡體例如是聚脲酯 (PU)、環氧樹脂、美耐明樹脂及相關之熱固性樹脂發泡體。 接著，使第一高分子發泡體與第二高分子發泡體硬化 鲁 成型(步驟308)。然後，進行脫模步驟，以取得具有兩層結 構的硏磨墊(步驟310)。後續於硏磨墊背面貼覆背膠時，將 選用具有導電性之感壓膠。 由上可知利用本發明所製得之硏磨墊不但具有雙層結 構，而且相對較硬之第二發泡體由於其所摻入的導電物質 不包含導電性塡充物或導電性纖維，因此可以避免當硏磨 墊逐漸耗損而使得韌性較強之導電性塡充物或導電性纖維 裸露出來時，會損傷被硏磨物的表面。 同樣的，利用本發明所製得之具有雙層結構之硏磨墊 _ 中，更包括於硏磨之表面上形成溝渠，此溝渠是在注入第 一局分子發泡體的步驟之前，先在模具內預埋入至少一條 狀物，然後才繼續進行本發明之製程步驟，最後在進行脫 模之後，即可得到具有溝渠的雙層結構之硏磨墊（如第5圖 所示）。另外，溝渠的形成亦可選擇使用機械或化學方式在 硏磨墊表面上形成。 因此，利用上述之方法所製得之具有雙層結構之導電 1194.12.14 591065 11217twf2.doc / 006 Then, inject the second conductive material and the second polymer foam into the mold cavity at the same time (step 30), so that the second conductive material is dispersed in the second polymer foam In the body, the hardness of the second foam is greater than the hardness of the first polymer foam. This relatively hard second polymer foam system is used for honing and the first polymer is relatively soft. The foam system is used as a buffer. Here, the second conductive substance is selected from conductive polymer, antistatic agent, carbon black, or metal powder, and the second polymer foam is, for example, polyurea (PU), epoxy resin, memanim Resin and related thermosetting resin foams. Next, the first polymer foam and the second polymer foam are hardened and formed (step 308). Then, a demolding step is performed to obtain a honing pad having a two-layer structure (step 310). In the subsequent application of adhesive on the back of the honing pad, a conductive pressure sensitive adhesive will be used. It can be seen from the above that the honing pad prepared by using the present invention not only has a double-layer structure, but also a relatively hard second foam, since the conductive substance incorporated therein does not contain a conductive filler or conductive fiber, It can avoid that when the honing pad is gradually worn out and the conductive conductive filler or conductive fiber with strong toughness is exposed, the surface of the object to be honed will be damaged. Similarly, the honing pad _ with a double-layer structure prepared by using the present invention further includes forming a trench on the surface of the honing. This trench is before the step of injecting the molecular foam in the first round. At least one object is pre-embedded in the mold, and then the process steps of the present invention are continued. Finally, after the demolding is performed, a double-layered honing pad having a trench can be obtained (as shown in FIG. 5). In addition, the trench can be formed mechanically or chemically on the surface of the honing pad. Therefore, the double-layered conductivity obtained by the above method 11
94.12.14 591065 11217twf2.doc/006 拾、申請專利範圍 1·一種導電性硏磨墊的製造方法，包括： 提供一模具，該模具具有一模腔； 於該模腔中注入一高分子發泡體，並且使一導電物質 分散於該高分子發泡體中； 使該高分子發泡體硬化成型；以及 進行一脫模步驟，以取得一硏磨墊。94.12.14 591065 11217twf2.doc / 006 Patent application scope 1. A method for manufacturing a conductive honing pad, comprising: providing a mold having a cavity; and injecting a polymer foam into the cavity And a conductive substance is dispersed in the polymer foam; the polymer foam is hardened and formed; and a demolding step is performed to obtain a honing pad.
2·如申請專利範圍第1項所述之導電性硏磨墊的製造 方法，其中於該模腔中注入該高分子發泡體，且使該導電 物質分散於該高分子發泡體中之步驟係將該導電物質與該 高分子發泡體同時注入該模腔中。 3·如申請專利範圍第2項所述之導電性硏磨墊的製造 方法，其中該導電物質係選自一導電高分子聚合物、一抗 靜電劑、碳黑以及金屬粉末其中之一。 4·如申請專利範圍第1項所述之導電性硏磨墊的製造 方法，其中於該模腔中注入該高分子發泡體，且使該導電 物質分散於該高分子發泡體中之步驟包括：2. The manufacturing method of the conductive honing pad according to item 1 of the scope of patent application, wherein the polymer foam is injected into the cavity, and the conductive substance is dispersed in the polymer foam. The step is to simultaneously inject the conductive substance and the polymer foam into the mold cavity. 3. The manufacturing method of the conductive honing pad according to item 2 of the scope of the patent application, wherein the conductive substance is selected from one of a conductive polymer, an antistatic agent, carbon black, and metal powder. 4. The manufacturing method of the conductive honing pad according to item 1 of the scope of the patent application, wherein the polymer foam is injected into the cavity, and the conductive substance is dispersed in the polymer foam. The steps include:
先將該導電物質預置入該模腔內；以及 將該高分子發泡體注入該模腔中。 5·如申請專利範圍第4項所述之導電性硏磨墊的 方法，其中該導電物質係選自一導電性塡充物以及一導電 性纖維其中之一。 6·如申請專利範圍第1項所述之導電性硏磨墊的_胃 方法，其中該高分子發泡體包括聚脲酯(PU)、環氧樹月旨、 美耐明樹脂及相關之熱固性樹脂。 16 591065 11217twf2.doc/006 94 12 14 7. —種導電性硏磨墊的製造方法，包括： 提供一模具，該模具具有一模腔； 於該模腔中注入一第一高分子發泡體，並且使一第一 導電物質分散於該第一高分子發泡體中； 於該模腔中注入一第二高分子發泡體，並且使一第二 導電物質分散於該第二高分子發泡體中，其中該第二發泡 體之硬度係大於該第一高分子發泡體之硬度； 使該第一高分子發泡體以及該第二高分子發泡體硬化 成型；以及 進行一脫模步驟’以取得具有兩層結構之一硏磨墊。 8·如申請專利範圍第7項所述之導電性硏磨墊的製造 方法，其中於該模腔中注入該第一高分子發泡體以及該第 一咼分子發泡體，且使該第一導電物質分散於該第一高分 子發泡體中，使該第二導電物質分散於該第二高分子發泡 體中之步驟包括： 先將該第一導電物質與該第一高分子發泡體同時注入 該模腔中；以及 再將該第二導電物質與該第二高分子發泡體同時注入 該模腔中。 9·如申請專利範圍第8項所述之導電性硏磨墊的製造 方法，其中該第一導電物莺以及該第二導電物質係選自一 導電性塡充物、一導電性_維、一導電高分子聚合物、一 抗靜電劑、碳黑以及金屬粉末其中之一。 10·如申請專利範圍第7項所述之導電性硏磨墊的製造 方法，其中於該模腔中注入該第一高分子發泡體以及該第 17 591065 11217twf2 .doc/006 94.12.14 二高分子發泡體，且使該第一導電物質分散於該第一高分 子發泡體中，使該第二導電物質分散於該第二高分子發泡 體中之步驟包括： 先將該第一導電物質預置入於該模腔中； 再將該第一高分子發泡體注入該模腔中；以及 將該第二導電物質與該第二高分子發泡體同時注入該 模腔中。 11. 如申請專利範圍第10項所述之導電性硏磨墊的製 造方法，其中該第一導電物質係係選自一導電性塡充物以 及一導電性纖維其中之一，該第二導電物質係選自一導電 高分子聚合物、一抗靜電劑、碳黑以及金屬粉末其中之一。 12. 如申請專利範圍第7項所述之導電性硏磨墊的製造 方法，其中該第一高分子發泡體以及該第二高分子發泡體 包括聚脲酯（PU)、環氧樹脂、美耐明樹脂及相關之熱固性 樹脂。 13. —種導電性硏磨墊，包括： 一高分子發泡體； 一導電物質，分散於該高分子發泡體中。 14 ·如申請專利範圍第13項所述之導電性硏磨塾，其中 該導電物質係選自一導電高分子聚合物、一抗靜電劑、碳 黑、一金屬粉末、一導電性塡充物以及一導電性纖維其中 之一。 15·如申請專利範圍第I3項所述之導電性硏磨墊，其中 該高分子發泡體包括聚脲酯（PU)、環氧樹脂、美耐明樹脂 及相關之熱固性樹脂發泡體。 18 591065 94.12.14 11217twG.doc/006 16. —種導電性硏磨墊，包括： 一第一高分子發泡體； 一第一導電物質，分散於該第一高分子發泡體中； 一第二高分子發泡體，配置在該第一高分子發泡體 上，其中該第二高分子發泡體之硬度較該第一高分子發泡 體之硬度高；以及 一第二導電物質，分散於該第二高分子發泡體中。 17. 如申請專利範圍第16項所述之導電性硏磨墊，其中 該第一導電物質以及該第二導電物質係選自一導電性塡充 物、一導電性纖維、一導電高分子聚合物、一抗靜電劑、 碳黑以及一金屬粉末其中之一。 IS·如申請專利範圍第16項所述之導電性硏磨墊，其中 該第一導電物質係係選自一導電性塡充物以及一導電性纖 維其中之一，該第二導電物質係選自一導電高分子聚合 物、一抗靜電劑、碳黑以及金屬粉末其中之一。 19·如申請專利範圍第16項所述之導電性硏磨墊，其中 在該第二發泡體中具有複數個溝渠，且該些溝渠之底部係 暴露出該第一發泡體中之該第一導電物質。 2〇·如申請專利範圍第I6項所述之導電性硏磨墊，其中 該高分子發泡體包括聚脲酯(PU)、環氧樹脂、美耐明樹脂 及相關之熱固性樹脂發泡體。 19The conductive material is first preset into the cavity; and the polymer foam is injected into the cavity. 5. The method of a conductive honing pad as described in item 4 of the scope of patent application, wherein the conductive substance is selected from one of a conductive filler and a conductive fiber. 6. The stomach method of the conductive honing pad as described in the first item of the scope of patent application, wherein the polymer foam includes polyurea ester (PU), epoxy resin, melamine resin and related Thermosetting resin. 16 591065 11217twf2.doc / 006 94 12 14 7. A method for manufacturing a conductive honing pad, comprising: providing a mold having a cavity; and injecting a first polymer foam into the cavity And dispersing a first conductive substance in the first polymer foam; injecting a second polymer foam into the cavity; and dispersing a second conductive substance in the second polymer foam In the foam, the hardness of the second foam is greater than the hardness of the first polymer foam; the first polymer foam and the second polymer foam are hardened and molded; and Demolding step 'to obtain a honing pad having one of the two-layer structure. 8. The manufacturing method of the conductive honing pad according to item 7 in the scope of the patent application, wherein the first polymer foam and the first rubidium molecular foam are injected into the cavity, and the first A conductive substance is dispersed in the first polymer foam, and the step of dispersing the second conductive substance in the second polymer foam includes: firstly, the first conductive substance and the first polymer foam are dispersed. The foam is simultaneously injected into the cavity; and the second conductive substance and the second polymer foam are simultaneously injected into the cavity. 9. The method of manufacturing a conductive honing pad as described in item 8 of the scope of application for a patent, wherein the first conductive material and the second conductive material are selected from a conductive filler, a conductive material, One of a conductive polymer, an antistatic agent, carbon black, and metal powder. 10. The method for manufacturing a conductive honing pad as described in item 7 of the scope of patent application, wherein the first polymer foam and the 17th 591065 11217twf2.doc / 006 94.12.14 are injected into the cavity. The step of dispersing the first conductive material in the first polymer foam and dispersing the second conductive material in the second polymer foam includes: A conductive material is preset in the mold cavity; the first polymer foam is injected into the mold cavity; and the second conductive material and the second polymer foam are simultaneously injected into the mold cavity . 11. The method for manufacturing a conductive honing pad as described in item 10 of the scope of patent application, wherein the first conductive substance is selected from one of a conductive filler and a conductive fiber, and the second conductive The substance is selected from one of a conductive polymer, an antistatic agent, carbon black, and metal powder. 12. The method for manufacturing a conductive honing pad as described in item 7 of the scope of patent application, wherein the first polymer foam and the second polymer foam include polyurea ester (PU), epoxy resin 2. Minamine resin and related thermosetting resins. 13. A conductive honing pad, comprising: a polymer foam; a conductive substance dispersed in the polymer foam. 14. The conductive honing hob according to item 13 of the scope of the patent application, wherein the conductive substance is selected from a conductive polymer, an antistatic agent, carbon black, a metal powder, and a conductive filler. And one of the conductive fibers. 15. The conductive honing pad as described in item I3 of the scope of patent application, wherein the polymer foam includes polyurea ester (PU), epoxy resin, Minamine resin and related thermosetting resin foam. 18 591065 94.12.14 11217twG.doc / 006 16. A conductive honing pad, comprising: a first polymer foam; a first conductive substance dispersed in the first polymer foam; a A second polymer foam is disposed on the first polymer foam, wherein the hardness of the second polymer foam is higher than the hardness of the first polymer foam; and a second conductive substance , Dispersed in the second polymer foam. 17. The conductive honing pad according to item 16 of the scope of patent application, wherein the first conductive material and the second conductive material are selected from a conductive filler, a conductive fiber, and a conductive polymer. Materials, an antistatic agent, carbon black, and a metal powder. IS. The conductive honing pad as described in item 16 of the scope of patent application, wherein the first conductive substance is selected from one of a conductive filler and a conductive fiber, and the second conductive substance is selected One of a conductive polymer, an antistatic agent, carbon black, and metal powder. 19. The conductive honing pad according to item 16 of the scope of application for a patent, wherein there are a plurality of trenches in the second foam, and the bottom of the trenches is exposed from the first foam. First conductive substance. 20. The conductive honing pad as described in item I6 of the patent application scope, wherein the polymer foam includes polyurea ester (PU), epoxy resin, Minamine resin and related thermosetting resin foam . 19