201221032 六、發明說明： 【發明所屬之技術領域】 、本發明係有關一種陶瓷金屬化散熱板之製造方 法特別疋扣可製得具有良好散熱效率之陶瓷金屬化 散熱板的製造方法。 '【先前技術】 - 由於電子產業的快速發達，電路板上的電路密度 ^越來越高，造成在使用時電路板所積聚的廢熱越來越 不易散除。 咼功率LED需求逐漸增加，造成散熱基板所要 承載之熱量大幅提升，使得散熱基板從舊有pcB提 升為MCPCB基板，然而，在更高功率LED的大量 使用下，因為MCPCB基板的介電層與基板熱膨脹係 數不匹配而導致板爆及斷路，而且其存在不抗高AC • 電壓的問題，近期乃逐漸改採用陶瓷做為散熱材料。201221032 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a method for manufacturing a ceramic metallized heat dissipation plate, which is particularly capable of producing a ceramic metallized heat dissipation plate having good heat dissipation efficiency. '[Prior Art] - Due to the rapid development of the electronics industry, the circuit density on the board is getting higher and higher, which makes the waste heat accumulated by the board more and more difficult to dissipate. The demand for power LEDs is gradually increasing, which causes the heat to be carried by the heat-dissipating substrate to be greatly increased, so that the heat-dissipating substrate is upgraded from the old pcB to the MCPCB substrate. However, in the large-scale use of higher-power LEDs, the dielectric layer and the substrate of the MCPCB substrate The thermal expansion coefficient does not match and causes plate explosion and open circuit, and its existence is not resistant to high AC • voltage. Recently, ceramics have been gradually used as heat dissipation materials.
陶瓷材料 DBC(Direct Bonded Copper)及 DPC (Direct Plated Copper)加工方式起源於193〇年，此 技術因現今LED產業的蓬勃發展而大放異彩，dbc 技術雖具有高導熱與易加工等特性，但厚銅伴著的強 大熱應力在高溫下也會導致產品的穩定度不降。 有鑑於此，發明人乃著手進行研究改良，經長期 研究、測試，終於開發完成本發明。 201221032 【發明内容】 因此’本發明旨在提供一種陶瓷金屬化散熱板之 製造方法，係經由上色、雷射鑽孔、褪色及磨除等步 驟，於陶瓷基板表面形成預定的連接孔洞，藉此，孔 洞的孔徑可以控制在經電鑄填孔製程時，能一次填 實，不需二次填料者。 依本發明之陶瓷金屬化散熱板之製造方法，其雷 射鑽孔係從基板的背面進行，如此能使基板表面形成 的孔洞為較小孔徑，以利一次填實的電鑄填孔製程， 為本發明之次一目的。 依本發明之陶瓷金屬化散熱板之製造方法，進一 步使用垂直連續式較法於基板上沉積導電層銅 (fu),於進行濺鍍時可避免落塵掉落在基板上，以提 幵整體產出效率，為本發明之次一目的。 至於本發明之S羊細構造、應用原理、作用與功 ί解則請參照下列依附圖所作之說明即可得到完i的 【實施方式】 本發明之陶究金屬化散熱板之製造方法，包含有 以下步驟： 左匕3有 第一步驟為上色步驟102 ••使 丁 W丄 1之用自動上色機，以 不織布均勻地在陶究基板之欲切 ^ ^± 刀。面上色，再以熱風 村上色的基板表面塗料烘乾； 201221032 射，為鑽孔步驟102:使用聚焦的高溫雷 :對上色後的陶究基板以氣化方式鑽孔加工。為了 克服鑽孔為上大下小的圓椎 圓椎狀，鑽孔加工的位置係在 基板的^ 1便線路正面得以形成較小孔徑； 第三步驟為清潔步驟103:當色料完全清除乾淨 ί’利用磨刷機先將基板上的雷射融渣去除且將基板 表面磨平’再利用氣化鐵或有機溶劑將基板表面可能 殘留的金屬與有機物咬除，最後利用超音波水洗將基 板上導通孔内的融料潔乾淨，以確保基板上沒有其 他會影響後續製程的物質存在； —第四步驟為導電銅層沉積步驟104 :當陶瓷基板 完成鑽孔且清潔乾淨後，為使陶瓷基板的表面得以進 行電鑄，本發明利用垂直連續式濺鍍法，在基板上沉 積導電層銅（Cu)，並且加上一層中介層（Ti/(：u、丁卜 TiW或NiCr)於銅與基板之間以增加線路附著性； • 使用垂直連續式濺鍍法時，垂直式靶材係位於腔 體的左右側，於進行濺鍍時，可同時雙面沉積，落塵 不會直接掉落於基板上，以提昇整體產出效率，而利 用滾輪式（roll to roll)，更有較小體積的預抽腔體， 能大幅降低抽真空與破真空的時間。其中，所述滾輪 式（roll to roll)係輸送帶的意思。降低破真空及抽真 空的原因是，在反應腔體前後有加入小腔體，在小腔 體把真空抽到與主腔體一樣低時再打開閘門送入主 腔體’等錢度完畢後’打開腔體送入破真空小腔體進 201221032 行出料，所以可以大幅降低抽真空與破真空的時間。 並且，在腔體的最前段加裝了離子鎗進行清潔的 動作，確保基板在進入濺鍍腔體内時其表面是完全潔 淨的狀態，進而確保濺鍍完成後金屬層於基板的附著 性是可靠的。 第五步驟為黃光微影成像步驟105 :係在第一層 金屬上覆蓋不同層數的負型乾膜光阻，再依照不同需 2的第-層金屬厚度’選擇適合乾膜光阻的厚度，配 :適當的加熱滾輪溫度、壓力、貼合速度及乾膜張 將光阻貼合於第一層金屬上做為電鑛模具，在適 二溫度及濕度下，配合適當的曝光能量，在第一層 硬化Ϊ亡由底片將第二層金屬線路部份遮蔽，曝光， 一層金屬線路之外的乾膜， 經由顯影去險笛只 从罝数刀紐後，再 膜，以二屬線路，保留線路以外的乾 乂便填入第二層金屬線路。 第六步驟為電鑄填孔步驟1〇6 利用電鍍方田上70先阻後， 積，以阻覆蓋的種子層上方進行沉 導電線路，X心 料孔填滿導it，達到提供 確保電㈣1料熱。實糾，先進行打底電鍍， 酸等酸=:行硫酸銅及硫 鹽產生盘二2陽極腐姓’防业鹽基性鋼鹽或亞銅 ' 所造成粗糙銅鍍層的問題。 201221032 第七步驟為韌骐步驟107 :剝膜製裎的柞 用來將曝光顯影後所留…二“的作用主要 鹼型溶液藥劑，#水 之先阻去除’使用強 去膜。實施時，^線或浸泡式去膜槽進行 先限膨濁，再藉或其他去媒液將 和循严θ 、主 、，麗3又備或循環設備以適當的壓力 猶環：I收：除、:由藥劑膨濁過後的光阻，然後藉由 〈、立”，清理被去除的光阻，後段再以加壓水 洗、超音波震盈等、、主、赵 ^ ' π 4方式，配合吸水棉及吹乾烘烤 工，如此完成去除光阻的整個製程。 第八步驟為蝕刻步驟1〇8:蝕刻製程是將一個材 4使用化學反應或物理撞擊作用去移除的技術，本發 明使用濕姓刻，經由化學反應來達到钱刻目的，將所 要蚀刻的材料經由浸泡，或將化學溶液喷灑至被钮刻 物’經由溶液與被㈣物間的化學 表面的原？，以達到㈣的目的。 于厚膜 鬌 製程中先藉由強酸型藥劑來移除欽銅合金層，該 層是使用物理氣象沉積之濺鍍方式形成，該導電層主 要作為後段電鍍金屬材料所需之電流傳導路徑，可由 金屬、合金或沉積數層金屬層構成的，如銅、錫、鎳、 鈦軋等&至其中之一所組成。在經由喷灑裝置噴麗 強酸藥劑並與鈦銅合金表面產生化學反應移除該導 電層，後段再經由加壓水洗、超音波震盪等清潔方 式，配合吸水棉及吹乾烘烤方式完成蝕刻的整個製 程。 201221032 第九步驟為磨刷步驟l〇9 :磨刷步驟主要用以處 理前製程所產生的融渣、厚度不均、鋼凸、溢鍍、防 銲後粗糙而使基板表面平整。製程前段使用砂帶研磨 整平線路表面’後段再以不織布拋光拋細線路表面。 然後進入水洗段，清洗基板研磨後殘留在銅表面的銅 粉，清洗成品板上的孔洞或切割後的殘屑及粉末，清 洗殘留在板面或孔徑内之藥液，清洗前製程之污染 物除了使用近接水洗與加壓水洗以得到良好的洗淨 效果，提高產品的良率外，還可使用超音波震盪清洗 去除產品表面的雜污，清洗不易清洗的細縫，使導通 ^達到知达、置產化的目的。最後再用吸水滾輪吸乾基 反表面強風吹乾孔洞内部，熱風循環風機蒸發孔 内吸附之水氣。 ’、 第十步驟為絕緣層防護印刷步驟11〇 :在第二層 =上、、=防正焊錫及導體間的短路或外來的：： 以伴持^ =危害’需要在線路上覆蓋-絕緣層， 焊===通、絕緣性，因此使用熱固型防 三層於苐二層金屬㈣上使::由印製第 ，有機物完全揮發，再經第：^二==將 層線路。當所需精度、準確度 、 匕第二 擇感光型油墨，先全而⑽ f求“時，則需選 :絕緣層線路成形，最後經熱::::墨 知徹底硬化。此外，防焊漆亦-可作為識:標 201221032 之途，當作為識別標誌時，與前述方式相同；當作為 填孔用途時，則需要藉由重覆印刷，達到填孔之實。 第十一步驟為表面改質步驟lu :表面改質（銀、 鎳金、鎳鈀金）為表面最終處理之製程，不管是電鍍 或化子鍍，目的都是要將金屬鍍在銅線路上，形成的 表面金屬層不但可提高表面焊錫強度、打線強度，如 .果鍍在銅線路上的金屬為銀層還可提光反射率，但易 氧化；如果鍍在銅線路上的金屬^金層則因金為惰性 零金屬，可提高產品的穩定度。 本發明之陶瓷金屬化散熱板之製造方法，經由以 上之製程步驟，不僅能使陶瓷基板金屬化，且透過多 重的清潔輔助製程，基板可以在完全無雜質的情形下 形成線路，進而提供產品的穩定度。 而本發明之陶瓷金屬化散熱板之製造方法，更可 以應用於以下之樣品需求，包括： • 實施例一：[擋牆製程] 擔牆，係為了在LED晶粒上方以點膠方式塗佈 螢先粉時，藉擋牆使溶膠侷限在一定範圍内而不流 本發明提供三種解決方案，包括有網印製程、點 私製程和貼環製程。其中， 網印製程，是利用防銲油墨作為基材，印製於基 該製程又細分兩小製程；#中之一為顯影裂， 式為先全面印刷’印刷完成後，曝光顯影，最後 201221032 線路形成。另一種為熱固型卜 後直接成形。 此方法為印刷完、烘烤 勝H"%’、本發明是透過精密的點膠機進行點 疋’捕確的線馬平台及點膠控制器的搭 配，點製出不同形狀的檔牆，並穩定的 的準確性。 η*細徂置 貼” ’係依不同需求製作不同材質的環圈 (FR4、紹圈、陶堯圈蓉、姊 ^ ’然後經定位後貼置於基板 上0 貫施例二：[亮銀表面製程】 r :應ί品有更高的反光表面，需使用亮銀製 Μ乍寺，疋在剝膜步驟（第八步驟）之前，即在電 =用來保護金屬表面不被料，後續剝削虫刻完成 後再進订化學鍍銀’使保持電鑛出來的亮面。 =表面的製作’係以.直流電源供應器在線路的 ^表面電錄緻密而光亮的銅’以化學鍍的方式在銅的 ::沉積-層很薄的金屬保護層(鎳或銀)，此保護層 :::重子層触刻製程中，保護線路電鍍出的亮面銅， == 吏表面產生霧化現象降低反射，當種子層 疋畢後再以不姓刻銅的溶劑去除金屬保護層，使 式=保持原有電鑛出的亮度，最後再以浸鑛銀的方 板的目：上沉積一層銀，以達到高反射表面之散熱基 板的目標。 實施例三：[電鍍銀製程] 201221032 為了使線路表面有更厚且緻密的銀層，而電鍍銀 因為圖面過為複雜，不能拉導線時，則需使用此電鍍 銀製程，首先在銅線路電鍍完成後，直接進行電鍍銀 層以完成所需電路，緊接著移除電鍍框架的乾膜光 阻，讓應移除的種子層裸露出來，再以保護層覆蓋於 電鍍線路上方，然後以蝕刻液移除種子層，即可將完 整的圖樣顯現出來，最後再將保護層剝離即完成製 程。 因此’可有以下三種方式實施： 方式·直接在光罩上拉導線，在姓刻步驟（第 九步驟）之後施作電鍍銀。 方式二：在電鑄填孔（第七步驟）之後，經剝膜、 臈刷拋平表面，再曝上一層光阻以保護露出來的種子 層不會被電鍍上銀，然後再經剝膜、蝕刻種子層， 成此製程。Ceramic materials DBC (Direct Bonded Copper) and DPC (Direct Plated Copper) processing methods originated in 193 years, this technology shines due to the booming LED industry today, dbc technology has high thermal conductivity and easy processing, but The strong thermal stress associated with thick copper also causes the stability of the product to not decrease at high temperatures. In view of this, the inventors have started research and improvement, and have finally developed the present invention through long-term research and testing. 201221032 [Description of the Invention] Therefore, the present invention is directed to a method for manufacturing a ceramic metallized heat dissipation plate by forming steps of a predetermined connection hole on a surface of a ceramic substrate through steps of coloring, laser drilling, fading, and grinding. Therefore, the pore diameter of the hole can be controlled once in the electroforming hole filling process, and the secondary filler is not required. According to the manufacturing method of the ceramic metallized heat dissipation plate of the present invention, the laser drilling is performed from the back surface of the substrate, so that the hole formed on the surface of the substrate can be made into a small aperture, so as to facilitate the once-filled electroforming filling process. For the second purpose of the present invention. According to the manufacturing method of the ceramic metallized heat dissipation plate of the present invention, the conductive layer copper (fu) is further deposited on the substrate by using the vertical continuous method, and the dust can be prevented from falling on the substrate during the sputtering to improve the overall production. Efficiency is the second purpose of the present invention. As for the S-thin structure, application principle, function and function of the present invention, please refer to the following description according to the drawings to obtain the finished method. [Embodiment] The method for manufacturing the metallized heat-dissipating plate of the present invention includes There are the following steps: Left 匕 3 has the first step of coloring step 102 • • Use Ding W丄1 with an automatic coloring machine to uniformly cut the ^^± knife on the ceramic substrate without weaving. The surface is colored, and then the substrate surface paint colored by the hot wind village is dried; 201221032 shot, for drilling step 102: using the focused high temperature thunder: the colored ceramic substrate is drilled by gasification. In order to overcome the rounded vertebrae of the upper and lower boreholes, the position of the drilling process is formed on the front side of the substrate to form a smaller aperture; the third step is the cleaning step 103: when the color material is completely removed ί'Using the brush to remove the laser slag on the substrate and smooth the surface of the substrate. Then use gasification iron or organic solvent to remove the metal and organic matter that may remain on the substrate surface. Finally, use ultrasonic cleaning to wash the substrate. The melt in the via hole is cleaned to ensure that there are no other substances on the substrate that will affect the subsequent process; - the fourth step is a conductive copper layer deposition step 104: after the ceramic substrate is drilled and cleaned, the ceramic substrate is made The surface is electroformed. The present invention utilizes a vertical continuous sputtering method to deposit a conductive layer of copper (Cu) on a substrate, and an interposer (Ti/(:u, butyl, TiW or NiCr) is applied to the copper and Between the substrates to increase the line adhesion; • When using the vertical continuous sputtering method, the vertical targets are located on the left and right sides of the cavity, and when sputtering is performed, both sides can be deposited at the same time, and the falling dust is not straight. Dropped on the substrate to improve overall output efficiency, and roll to roll, with a smaller volume of pre-draining chamber, can greatly reduce the time of vacuuming and vacuuming. Roll to roll is the meaning of the conveyor belt. The reason for reducing the vacuum and vacuum is to add a small cavity before and after the reaction chamber, and then open the vacuum when the small cavity is as low as the main cavity. The gate is sent to the main cavity. After the completion of the money, the chamber is opened and sent into the vacuum chamber to enter the 201221032 line, so the vacuuming and vacuuming time can be greatly reduced. Moreover, the front part of the cavity is added. The ion gun is installed to ensure the surface of the substrate is completely clean when it enters the sputtering chamber, thereby ensuring the adhesion of the metal layer to the substrate after the sputtering is completed. The fifth step is yellow lithography. The imaging step 105: covering the first layer of metal with different layers of negative dry film photoresist, and then selecting the thickness suitable for the dry film photoresist according to the thickness of the first layer of metal required to be 2, with: suitable heating roller temperature The pressure, the laminating speed and the dry film sheet are adhered to the first layer of metal as an electric ore mold. Under the appropriate temperature and humidity, with appropriate exposure energy, the first layer is hardened by the negative film. The second layer of metal wire is partially shielded, exposed, and a dry film other than a metal line. After development, the squid is only removed from the number of knives, and then the film is replaced by two lines, and the remaining lines are reserved. The second step is to enter the second layer of metal circuit. The sixth step is electroforming hole filling step 1〇6. After electroplating on the square field, the first resistance is 70, and the product is covered with a conductive layer above the seed layer covered by the resistance. The X core hole fills the lead. To achieve the provision of electricity (four) 1 material heat. Really correct, first do the plating, acid and other acid =: copper sulfate and sulfur salt to produce the disk 2 2 anode rot surname 'anti-salt-based steel salt or cuprous copper' caused by The problem of rough copper plating. 201221032 The seventh step is the toughening step 107: the 剥 剥 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 柞 二 二 二 二 二^Line or immersion type degassing tank to carry out the first limit expansion, and then borrow or other de-mediation will be followed by strict θ, main, Li 3 or circulating equipment with appropriate pressure to the ring: I receive: except, by: After the swelling of the drug, the photoresist is removed by 〈,立, and the removed photoresist is then washed with pressurized water, ultrasonic shock, etc., main, Zhao ^ ' π 4 way, with absorbent cotton and Dry the baker, thus completing the entire process of removing the photoresist. The eighth step is an etching step 1〇8: the etching process is a technique of removing a material 4 using a chemical reaction or a physical impact, and the present invention uses a wetness and a chemical reaction to achieve the purpose of etching. The material is soaked, or the chemical solution is sprayed onto the original surface of the chemical surface between the solution and the (four) object. To achieve the purpose of (4). In the thick film crucible process, the copper alloy layer is first removed by a strong acid type agent, and the layer is formed by a physical meteorological deposition sputtering method, which is mainly used as a current conduction path required for the subsequent metal plating material. A metal, an alloy, or a plurality of layers of metal, such as copper, tin, nickel, titanium, etc., are combined to one of them. The conductive layer is removed by spraying a strong acid agent through a spraying device and chemically reacting with the surface of the titanium-copper alloy, and the etching is performed by a washing method such as pressurized water washing or ultrasonic vibration in the latter stage, and the etching is performed by the absorbent cotton and the drying and baking method. The entire process. 201221032 The ninth step is the rubbing step l〇9: the rubbing step is mainly used to treat the slag generated by the pre-process, uneven thickness, steel convexity, overflow plating, rough after welding, and the surface of the substrate is flat. In the front part of the process, sanding is used to level the surface of the line. The rear section is then polished with a non-woven fabric to polish the surface of the line. Then enter the water washing section, clean the copper powder remaining on the copper surface after the substrate is polished, clean the holes on the finished board or the chips and powder after cutting, clean the liquid remaining in the surface of the board or the pores, and clean the pollutants in the process before cleaning. In addition to the use of near-washing and pressurized water washing to obtain a good cleaning effect, improve the yield of the product, you can also use ultrasonic shock cleaning to remove the impurities on the surface of the product, cleaning the slits that are difficult to clean, so that the conduction can reach The purpose of production. Finally, the water-absorbing roller is used to suck the dry base. The anti-surface strong wind blows the inside of the hole, and the hot air circulating fan evaporates the water and gas adsorbed in the hole. ', the tenth step is the insulation layer protection printing step 11〇: in the second layer = upper, = anti-positive solder and short circuit between the conductors or foreign:: with the support ^ = hazard 'requires on-line coverage - insulation , welding === pass, insulation, so use the thermosetting anti-three layer on the second layer of metal (four) to make:: by printing the first, the organic matter is completely volatilized, and then through the first: ^ two = = layer line. When the required precision, accuracy, and second choice of photosensitive ink, first all (10) f ", then you need to choose: insulation layer forming, and finally heat:::: ink knows that it is completely hardened. In addition, anti-welding Paint also - can be used as the identification: the road of 201221032, when used as the identification mark, the same as the above; when used as a hole filling, it is necessary to repeat the printing to achieve the hole filling. The eleventh step is the surface Modification step lu: Surface modification (silver, nickel gold, nickel palladium gold) is the final surface treatment process, whether it is electroplating or proton plating, the purpose is to plate the metal on the copper line to form the surface metal layer. Not only can the surface solder strength and wire strength be improved, for example, the metal plated on the copper wire is a silver layer which can also enhance the light reflectivity, but is easy to oxidize; if the metal layer coated on the copper wire is inert to gold Zero metal can improve the stability of the product. The manufacturing method of the ceramic metallized heat dissipation plate of the invention can not only metallize the ceramic substrate through the above process steps, but also pass through multiple cleaning auxiliary processes, and the substrate can be completely free of impurities. of Forming the line under the shape to provide product stability. The method for manufacturing the ceramic metallized heat sink of the present invention can be applied to the following sample requirements, including: • Embodiment 1: [Retaining wall process] In order to apply the fluorescing powder on the LED dies in a dispensing manner, the sol is limited to a certain range by the retaining wall without flowing through the present invention. The invention provides three solutions, including a screen printing process, a dot process, and a ring process. Among them, the screen printing process uses the solder-proof ink as the substrate, and is printed on the basis of the process and subdivided into two small processes; one of the # is the development crack, and the type is the full-scale printing after the printing is completed, the exposure is developed, and finally 201221032 The circuit is formed. The other is the direct forming of the thermosetting type. This method is printed and baked. H"%', the invention is a precise line of the horse-drawn platform and points through a precise dispenser. The glue controller is used to make different shape wall and stable accuracy. η* fine 徂 贴 ” ” ” 依 依 依 依 依 依 依 依 依 依 依 依 依 FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR FR , ^ 'Then is placed on the substrate after positioning. Example 2: [Bright silver surface process] r : The product has a higher reflective surface, you need to use the bright silver Μ乍 temple, 疋 in the stripping step (the first Before the eight steps), that is, the electricity = used to protect the metal surface from being materialized, and the subsequent stripping of the insects is completed after the chemical silver plating is made to keep the bright surface of the electric mine. The surface is made. The supplier is on the surface of the line. The dense and bright copper is electrolessly plated in copper:: deposited - a very thin metal protective layer (nickel or silver), this protective layer::: heavy layer In the process, the bright copper plated by the protection circuit, == the atomization phenomenon on the surface of the crucible reduces the reflection. When the seed layer is finished, the metal protective layer is removed by the solvent of the non-existing copper, so that the original electric mine is maintained. The brightness is finally, and finally a layer of silver is deposited on the surface of the immersion silver plate to achieve the goal of the heat-dissipating substrate of the highly reflective surface. Embodiment 3: [Electroplating Silver Process] 201221032 In order to make the surface of the circuit have a thicker and dense silver layer, and the electroplating silver is too complicated to pull the wire, the electroplating process is required, first in the copper line. After the plating is completed, the silver plating layer is directly performed to complete the required circuit, and then the dry film photoresist of the plating frame is removed, the seed layer to be removed is exposed, and the protective layer is overlaid on the plating line, and then etched. The liquid layer is removed to reveal the complete pattern, and finally the protective layer is peeled off to complete the process. Therefore, it can be implemented in the following three ways: Method: Pull the wire directly on the mask, and apply silver plating after the last step (the ninth step). Method 2: After electroforming (the seventh step), the film is peeled off, the surface is polished, and a layer of photoresist is exposed to protect the exposed seed layer from being plated with silver, and then stripped. Etching the seed layer into this process.
一 在電輪填孔（第七步驟）之後，直接M 二：剝膜過後’再上一反向光阻覆蓋銅線路並裸遷 製程 種t層，再_刻去除種子層，最後去除綠完成出 程。 此方式可直接使用種子層當導線電鍍，不會有』 =線路的問題，此外，製程中電鍵出的銀層，> ==中都有保護層的保護，所以產品完成後都， 保有元整的表面及特性。 綜上所述，本發明之陁达 月炙闹是金屬化散熱板之製造: 201221032 未Γ:::使用’合〜…請 需陳明者， 施例，若依本發 以上所述：^ 7¾ θ> 乃疋本發明較佳具體的實 明之構想所作之改變，其產生之功能 作用’仍未超出說明書與圖示所涵蓋之精神時，均應 在本發明之範圍内，合予陳明。 201221032 【圖式簡單說明】 第1圖係本發明之製作步驟流程圖。 【主要元件符號說明】 101 ： 上色步驟 102 ： 鑽孔步驟 103 ： 清潔步驟 104 ： 導電銅層沉積步驟 105 ： 黃光微影成像步驟 106 : 電鑄填孔步驟 107 ： 剝膜步驟 108 ： 蝕刻步驟 109 : 磨刷步驟 110 ： 絕緣層防護印刷步驟 111 ： 表.__面改質步驟After the electric wheel is filled (the seventh step), the direct M 2: after the film is peeled off, the upper reverse photoresist is used to cover the copper line and the t-layer is left in the process of relocation, and the seed layer is removed, and finally the green is removed. Departure. This method can directly use the seed layer when the wire is electroplated, there will be no problem of 』= line, in addition, the silver layer of the electric key in the process, > == has protection of the protective layer, so after the product is completed, the retaining element The entire surface and characteristics. In summary, the invention of the present invention is the manufacture of metallized heat sink: 201221032 未Γ::: Use '合〜... Please ask Chen Ming, the case, according to the above: ^ 73⁄4 θ> is a change in the preferred embodiment of the present invention, and the functional function produced by the present invention is not within the scope of the present invention, and is intended to be combined with Chen Ming. . 201221032 [Simplified description of the drawings] Fig. 1 is a flow chart showing the steps of the production of the present invention. [Main Component Symbol Description] 101 : Coloring Step 102 : Drilling Step 103 : Cleaning Step 104 : Conductive Copper Layer Deposition Step 105 : Yellow Photolithography Imaging Step 106 : Electroforming Filling Step 107 : Stripping Step 108 : Etching Step 109 : Brushing Step 110: Insulation Protection Printing Step 111: Table.__ Surface Modification Step