TW201146113A - Circuit board and manufacturing method thereof - Google Patents

Abstract

This invention aims to provide a circuit board wherein highly precise electrical circuit is formed on an insulating base material. First, a resin covering D2 is formed on the surface of an insulating base material D1. Then, by forming recesses with a depth exceeding the thickness of the resin covering D2 taking the outer surface of the resin covering D2 as a basis so as to form circuit grooves D3 having a prescribed shape and depth. Next, plating catalyst or its precursor D5 is covered on the surface of the circuit grooves D3 and the surface of the resin covering D2. Further, the resin covering D2 is peeled off to obtain an insulating base material D1. The circuit board of this invention includes the thus obtained insulating base material D1 and an electroless plating film D6 formed on the circuit grooves by conducting an electroless plating to the insulating base material D1. The ratio of the thickness of the electroless plating film D6 relative to the depth of the circuit grooves D3 is less than 0.5.

Description

201146113 VI. Description of the Invention: [Technical Field] The present invention relates to a circuit board and a method of manufacturing the same. [Prior Art] Electrical devices such as portable information terminal devices such as mobile phones, computers and peripheral devices thereof, various information, and electrical products are rapidly becoming highly functionalized. Along with this, the circuit board mounted on these electric devices is required to further increase the density of the electric circuit. In order to meet the demand for higher density of such electric circuits, it has been desired to provide a method for accurately forming an electric circuit wiring having a narrower line width and a line interval (the width of a portion between adjacent electric circuits and electric circuits). In the high-density circuit wiring, problems such as short-circuiting or migration between wirings are likely to occur. Further, when the number of stacks is increased, the unevenness generated on the circuit forming surface becomes large, and it becomes difficult to form a fine circuit. As a method of manufacturing a circuit board, for example, a method of subtracting a method or an additive method for forming an electric circuit in an insulating base has been known. The subtraction method is a method in which a metal other than the material (f road material) of the county electric circuit (salt H) is to be an electric circuit on the surface of the metal box. On the other hand, the additive method is to implement electroless Wei in the part of the insulating base-to-slave circuit, and (10) the metal film with a thick film thickness of the square circuit, in the part where the electric circuit is to be formed, ^^ Residual gold shot 1, silk '^ other parts of the method. If you use this part of the metal, you will increase the manufacturing cost. On the other hand, wiring. Therefore, the 'metal* will be wasted. In comparison, the addition method is a better circuit formation. From this point, each step of forming a metal wiring by a conventionally known "full-addition method" will be described with reference to Fig. 5. First, with 201146113, first, as shown by ffl 5 (A), a through-hole m is formed. 1) The surface of the D100 is covered with an electric recording medium D102. In addition, the surface of the insulating substrate is roughened in advance, and then, as shown in Fig. 5 (8), the edge of the dielectric layer 2 is covered. A photoresist layer D103 is formed on the substrate D100. Then, the photomask D110 which forms a predetermined circuit pattern as shown in FIG. 5(c) is applied to the photoresist layer D1〇3. Next, as shown in FIG. 5(D). 'Yes, the exposed photoresist layer D1〇3 Γ4. Then, as shown in FIG. 5(E), an electroless ore-free electroless ore is applied to the surface of the circuit pattern D104 formed by the development. The metal wiring D1G5 is formed on the inner wall surface. By performing the above steps, a circuit composed of the metal wiring D1〇5 is formed on the insulating base material D100. In the above conventional additive method, the insulating substrate (4) is covered. The electro-mineral catalyst is called 2. Therefore, the following problem occurs: when the photoresist layer is developed, it can be only protected by the photoresist.幵U ^ When the photoresist layer m〇3 is not made with high precision, as shown in the figure, it is not necessary to form part of the electroplated part of the residual electro-mineral part, and the edge-faced surface is covered with electroplating catalyst. The electric power part D106 of the ίί will cause a short circuit or an erection between adjacent circuits, which is easy to occur in the formation of a line width and a narrow line spacing. In addition, Fig. 6 is a schematic sectional view. 'The outline shape of the circuit formed by the conventional method of the method of the method of manufacturing the circuit board, for example, the manufacturing method described in the document 1 and the patent document 2, etc. Lili Literature 1 discloses the following additional addition method: The first layer of the lunar layer provided with the auxiliary miscellaneous and the second layer of the photosensitive resin layer having the alkali solubility It has a predetermined electric quantity __'= ί Ξ 接着 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Coating a resin protective film (step )).. a groove and a through hole corresponding to the wiring pattern are formed on the insulating substrate coated with the protective film by mechanical processing or laser beam irradiation, either separately or simultaneously (second step). Next, the insulating substrate is formed on the insulating substrate. Then, the entire surface is lifted up. Then, the protective film is peeled off and the active layer on the insulating substrate is removed (the active layer is left on the inner wall surface of the trench and the through via (step 4). Then, the insulating layer On the substrate, Wei is used to form a conductive layer on the inner wall surface of the activated groove and the through hole (5) [Patent Document] [Patent Document 1] [Patent Document 2] JP-A-58-186994 [Patent Document 2] [Problem to be Solved by the Invention] However, it is formed according to Japanese Laid-Open Patent Publication No. SHO 57-134996 Solvent solubility is not 2 kinds of photosensitive resin layer, and °, | display and time = ===== must be: dissolution 2: = f case on the protective film and insulating substrate cutting, solvent demonstration Male = hardened = = membrane Ϊ good solvent resistance, it is difficult to remove the solvent alone. The second JJi inert resin has a high adhesion to the resin substrate, so that the tree can be removed from the two hardening trees _ debris residue, and the protective film can be removed correctly. Package:: The surface of the skin of the skin 5 is scattered to the side: ϋ The crack of the electro-mineral catalyst in the protective film will be divided again, and it is the electroplating catalyst that is dispersed again in the solvent. If it is again high-precision == Electricity: Subgrade _ manufacturing method, its threatening county shame [technical means to solve the problem] film, package ^ formed on the surface of the resin coating ^ ^ ^ ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί The depth is below G.5. The coating film t, the insulating substrate treated as follows: a circuit groove having a predetermined pattern is formed in the resin resin film-preserving layer, and the surface of the circuit trench is formed by the tree and the resin. Wei: 7 borrowed from the insulating substrate to decompose the ore film in the part of the mineral catalyst or its precursor that is intended to form an electric ore film, thereby forming an electrical depression on the trench of the circuit. No electricity board. The circuit base of the high-precision red Wei circuit on the m-wire wire, that is, the contour of the circuit of the German domain is turned to a high-precision (four) circuit substrate. As a result, in the case where the opening interval is formed in the 201146113, it is also possible to prevent the breakage of the electric contact surface in the electric power, and to prevent the short-circuit money from being transferred. In addition, a circuit having a desired depth can also be formed. The thickness of the electroless electrolysis, as described above, is relatively small with respect to the electric two, 'wood and s', so that the electroless plating film is formed from the circuit forming surface, and the convex wire is formed even if stacked As the number increases, the bumps generated by the circuit formation are also relatively small, and it is easier to form a fine circuit. According to the structure, the lion can also be made to form a high-precision electrical circuit on the insulating substrate. The thickness of the plating film is preferably 〇25 with respect to the groove of the circuit. A circuit substrate that prevents defects from being formed on an insulating substrate and forms an electrical circuit of a more southern precision. Further, the thickness of the electrode film is preferably 〇. According to this configuration, it is possible to provide a circuit board in which a higher-precision electrical circuit is formed on the substrate. In addition, the depth of the f-channel is preferably thin. According to this configuration, a circuit board in which an electric circuit of higher precision is formed on the insulating base material can be obtained. Further, a method of manufacturing a circuit board according to one aspect of the present invention includes: a step of forming a film on a surface of a color edge substrate; a film forming step of forming a resin film; and an outer surface of the resin film a base groove forming step having a depth of the thickness of the overbearing lining, thereby forming a circuit trench forming step having a desired shape and depth of the circuit trench on the insulating substrate; the surface of the circuit trench And a catalyst coating step of coating the surface of the resin coating with a plating catalyst or a precursor thereof; a step of removing the coating from the insulating substrate; and removing the resin coating from the insulating substrate A plating treatment step of performing electroless plating/formation of an electroless plating film is performed; in the plating treatment step, an electroless plating film is formed in such a manner that the thickness of the electroless plating film is 0.5 or less with respect to the depth of the circuit trench. According to the manufacturing method, after the resin film is formed on the insulating base material, a circuit groove having a predetermined pattern is formed by laser processing or the like, and in a state where the portion where the plating film is not desired to be formed is protected by the resin film, The surface of the circuit trench and the surface of the resin film are covered with an electric money catalyst or a precursor thereof. Thereafter, the resin coating film 8 201146113 from the insulating substrate can be relatively easily removed from the portion where the electrodeposited film is to be formed, and the other portion of the plating catalyst or its precursor is removed. It is also easy to form a high-precision electrical circuit on an insulating substrate. That is, the fixed contour is maintained at a high precision. As a result, it is possible to prevent the thickness of the electroless circuit trench electroless ore film from remaining between the circuits, for example, as described above, which is 'relative to the electric power as described above; From the circuit forming surface, the protrusion is small, and the 凹凸 彡 辑 于 于 于 于 该 : 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟 沟The wire f 1 卜 1 1 覆 _ 退 step ' is preferably a step of dissolving a part of the resin film which swells the resin film with a predetermined liquid, and then squeezing from the insulating substrate. According to these manufacturing methods, it is easier to separate from the insulation. Therefore, it is easier to form a high-precision electric circuit on the insulating substrate. - In addition, the fineness of the thief should be above. By using a wide resin film, the resin film can be easily peeled off from the insulating substrate.匕I' makes it easier to form high-precision electrical circuits on insulating substrates. In addition, regarding the tree, the ruthenium film is also produced with a large degree of practice and the body is dissolved. In addition, the catalyst contacting step should preferably have the step of f in the acidic catalyst metal mixed solution, and the predetermined liquid in the money film removing step is preferably an experimental solution, and the tree 曰 曰 镰 镰 镰 镰 卿 卿 金属 金属The scale of the sputum is S, and the swelling degree of the test 201146113 solution is preferably 50% or more. According to the manufacturing method, the resin coating film is not easily peeled off in the catalyst-f which is treated under acidic conditions, and is carried out with an alkaline solution after the catalyst coating step. It is easier to peel off. Therefore, the resin film can be selectively irradiated by the lion at the = film removal step. Therefore, it is possible to easily protect the portion of the film from the electroless island film after the coating of the electroless plating film and the coating removal step after the plating catalyst or its precursor is coated. Therefore, the circuit can be formed more correctly. The film removal step is preferably such that the resin film is dissolved and removed by a predetermined liquid. According to these manufacturing methods, the resin can be easily coated with the resin from the insulating substrate, and therefore, it is easy to form a high-precision electrical circuit on the insulating substrate. Further, it is preferable that the resin coating film is coated with an elastic material on the surface of the insulating base material ==== to form a resin coating film. Therefore, it is easier to transfer the film to the LY ί ί 在 在 在 在 在 在 在 在 在 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Further, a resin film of the resin == used for the transfer. If these resin coatings are used, it is a better choice to prepare the coatings for the sake of mass production. . . Further, the elastomer is preferably selected from the group consisting of a diene elastomer having a carboxyl group, a propionate body, a polyacetate system, and an elastomer. In addition, it is more suitable to be a styrene-butadiene copolymer. According to the body ^ can be * larger, more difficult to be dissolved by the resin _. In addition, it is preferable to use a film containing a resin composed of an acid resin equivalent to an acrylic resin as a main component. In addition, it is preferable that the resin film is a monomer which is at least one kind of a slow acid or an acid anhydride which satisfies (4) a saturated group in a molecule, and (a compound polymerization of one or more types is reduced by = 201146113 - ΐΐ) A (tetra) compound resin or a composition comprising the poly] resin composition is obtained. If the resin is coated with the resin, the resin can be easily formed on the edge of the base material. Thereby, it is easier to additionally on the insulating substrate. The resin coating film can be mostly dissolved by the film removal step S = liquid, and can be effectively used for being dissolved = = 2 'in the lyophile _ towel' #量宜为(10)~议. The thickness of the resin film should be less than 10哗, which is beneficial to form a part with a width of 2 or less with high precision. The step is preferably to use laser processing to form the circuit trench: ==, so it is a better choice. In addition, laser processing 3 open = connection 'through hole' and buried capacitor in the edge of the substrate. 2, the circuit trench forming step is preferably to use a press step, which is relatively easy to shape by imprinting The circuit trench is a step of forming a trench, and the trench forming step is preferably formed on the substrate when the trench is formed. If the method is used according to the method, The time layer (10) is a ship. The team hole knows the electroless ore to form the interlayer hole or the inner layer hole. In addition, the insulating substrate has a high height difference; preferably, the insulating layer 2 = the catalyst overcoating step, the film removing step, and the mode of the electric money ί _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the case of the photoreceptor, the luminescence of the fluorescent material is checked to check for the removal of the film. 11 201146113 The lipid film is not completely removed, and there is little residue. When the groove is removed, the read weave is removed; the path of the ^b is not charged when the circuit is grooved; the residue of the resin film is also = gas power, after the right cover step Remove the surface illumination of the given illuminate ί_ _ 咖钱纽 (4) Saki, you can check Ϊ ... 臈 臈 臈 瑕疵 覆 覆The position of the 瑕疵 。 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一 另一The high-precision electric lightning thunder and thunder two-band b' provides a manufacturing method that is easy to form a high-precision lightning (4) on an insulating substrate. That is, it can be separated from the electroless ore film. The high-precision is maintained at a high level of accuracy, thereby preventing the occurrence of short-circuiting of the electroless ore film remaining in the circuit forming portion or the migration, thereby preventing the short-circuit [embodiment], but the present invention It is not limited to this. The circuit board of the tree ' ΐ ' 触 触 : : : : : 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路The main mold forms a circuit trench having a desired shape and depth, and is formed on the surface of the electric material, the surface of the film, and the surface of the 5 resin film by a plating catalyst or a precursor thereof. Insulating substrate; and the insulating substrate No application --201,146,113 electroless mineral film on the circuit trench; with respect to the best of mines electroless film in groove depth of the circuit 05 or less. A method of manufacturing a circuit board according to a 1-1st aspect of the invention. The method includes forming a concave portion having a resin coating over the outer surface of the coating film on the surface of the insulating substrate, thereby forming a desired shape on the insulating substrate. And the circuit trench forming step of the circuit trench of the ice; the surface of the trench of the circuit and the shattering of the thief (4) _ _ _ _ _ _ 、 、 、 、 、 、 、 、 、 The film removal step of the resin film; the electroless plating of the ruthenium has been removed to form an electroless plating film: in the step, the thickness of the electroless galvanic sheet is relative to the width of the circuit trench. The method of .5 or less forms an electroless money film. Fig. J shows a method of manufacturing a circuit board according to a first embodiment of the invention. Fig. 1 is a view showing the manufacture of the circuit board of the first embodiment. First, as shown in Fig. 1(A), a film D2 is formed on the surface of the insulating base material D1. ― In addition, this step corresponds to a film forming step. Next, as shown in Fig. 1(B), the outer surface of the resin film is a circuit trench D3 having a depth equal to or greater than the thickness of the resin film D2. Further, the insulating substrate D1 is perforated to form a through hole D4 as a portion of the dielectric groove D3. Further, this step corresponds to the circuit trench forming step by the circuit trench D3 = electric = electroless ore portion, i.e., the gas circuit. In addition, the 1 (Q shown in the 'Dream D3 into the circuit groove D3 of the resin cream film dipped in this product 士士费 + 乂 and Hexin drive body. In addition, away from the electricity or its former" Y is further, and the surface of the circuit board D1 is formed with the electric circuit or the front of the material D5. The other side is the surface contact of the grease film m or its precursor. (4) The film is removed together with the resin film D2 in a state above the load m 201146113. The step of recognizing corresponds to the film removing step. The opening is removed, and the subsequent 'removal of the resin is removed. The insulating enamel of the film D2 is deposited on the portion of the plating catalyst or its precursor ^, and the mi / ' as shown in the figure _ is formed in the circuit trench m 邱The money film acts as an electrical circuit full of electricity, to increase the film thickness further. With film 06 can be. That is, the electroless plating film 〇6 is formed in such a manner that the electroless electricity is equal to or less than 5 3 US is less than or equal to 5; The thickness of the Ο ί / Λ 矿 D D6 is formed to be an electroless ray D6 with respect to the depth of the circuit trench D3 being 0.25 or more. That is, the thickness of the thick β-channel groove D3 is above the G.25, the electrolysis, and the ship D6. In addition, this step is equivalent to the electric ore processing step.珉 6 Each step' forms a (four) way substrate (10) as shown in Fig. 1 (Ε). In the above-described circuit board manufacturing method, the shape and size of the circuit trench (4) (electrical circuit) D6 are as follows, in the case where the circuit board (10) is formed with high precision. Fig. 2 After the trench forming step and after the Wei plating treatment step: the moon pattern: another ▲' turn) indicates the circuit trench forming step: 2 (B) indicates the state after the electric ore processing step. First, the shape of the circuit trench D3 is not a two-dimensional ship, specifically, the vertical section of the long-side direction of the road, which may be a rectangle, or a sectional area, and a longer length. It is a better choice for the loss of propagation of the rate signal. In addition, the thickness of the electroless electric axis D6 is τ D3, ίΐ 14 201146113, as long as the thickness g/D is 0.5 or less, the thickness of the electroless D6 is different. There is no special limit. on. Further, s' has a T/D of 0.25. When the thickness τ of the electroless bond film D6 is too large, the oxidizing resistance is increased. Correction, when the advantage of the transmission loss of the non-bribe surface number will have a tendency to decrease _ 疋 this enough to reduce the two frequency letter 1XT / when the thickness of the T surface is too small in the deep d(t / d) of the circuit groove (10) 3 ^ 'The electrical resistance of the electrical circuit (wiring) will increase, and the risk of the open circuit problem will be high. In addition, the advantages described above can reduce the propagation loss, especially the advantage of "the transmission loss of the two ^ will have a reduced touch. I w frequency sheep L in addition, the specific thickness of the electroless plating film D6 τ, there will be a difference due to the depth D of D3, but it is preferably, for example, 〇1~1〇μιη: because of the °H circuit trench, the depth D of the circuit depends on the above, but the other is not limited, specifically Preferably, for example, a relationship of ^5 μ/, that is, another 'the circuit trench D3 and the size of the electroless ore film (f gas circuit) D6, specifically, for example, when the specific thickness τ of the electroless plated film D6 When it is 5, the pitch D of the trench D3 of the circuit is 20 μm or 1 〇 μιη. At this time, t/d is 〇25 or 0.5. In addition, the 5 kel circuit trench D3 and the electroless ion film (electrical The size of the circuit is measured by, for example, a vertical cross section in the longitudinal direction of the circuit trench D3 by an SEM (scanning electron microscope), and the respective components of the present embodiment will be described. <Laminating film forming step> Film forming step, such as The above-described step of forming the resin film D2 on the surface of the insulating substrate D1. (Insulating substrate) The insulating substrate D1 used in the film forming step is as long as it can be used to manufacture a circuit substrate. Specifically, for example, a resin substrate including a tree 201146113 grease, etc. The circuit substrate may be a circuit board, and for example, the road base j is not particularly limited. Regarding a specific example of the organic substrate, The circuit substrate is composed of epoxy resin, acrylic resin, polycarbonate T 匕 T T, 聚 硫 验 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂 树脂Substrate.

The wire is used for electricity (4) organic substrate I system is limited. Specifically, for example, the above-mentioned epoxy resin, nitrogen-containing resin, __, etc. of A iiSL type epoxy resin, double s type epoxy resin, and aramid epoxy f " Further, it is possible to use the above respective epoxy resins and iiit of the above-mentioned epoxy resin, spinel pentadiene type epoxy resin, benzene_ and ε, alicyclic epoxy resin, and the like. In addition, in order to make it ii, it will shoot ίί ‘When the base material is made of the above-mentioned respective resins, in general, in order to harden, it is particularly limited. Specifically, for example, dicyandiamide, rsv = bismuth, for example, secret type, aryl type, _ type and other hardeners = Fu: flame retardancy can be used, for example, after phenolic resin or after Although it is not particularly limited', it is because of the use of laser processing of the shape of the moon: 'The use of laser light in the wavelength range of _ ~ 4GGnm range of good absorption rate of Xie Yuezhen. Specifically, for example, a polyimide resin or the like. The tree also has a filler on the substrate (insulation layer). The filler may be a helmet 饩 particle or an organic fine particle, and is not particularly limited. If it is included, the filler in the machined processing section will be exposed, and the unevenness of the filler can improve the i-integration laser between the electric hard resin. 201146113 will be ^ηΐ machine, the material of the sub-frequency is, for example, 4 butterfly A1A), Huaqing High dielectric constant filling materials such as N), nitrogen (AlN), dioxo-), titanic acid (^2), etc.; hard ferrite magnets. , bucket: gas oxidation town (Mg (Yangyang, Nitrogen Oxide (A1 (0H) 2), triple emulsified bismuth (Sb203), bismuth pentoxide (Sb2 〇), 胍 salt 匕 ° _ the inorganic microparticles can be separate In the case of using the above-mentioned no in, it is also possible to use two or more types in combination. In the case of the inorganic micro-rape, the degree of freedom of the flame retardancy, the particle size distribution, and the hue of the g is high. Appropriate blending and particle size should be used for the purpose of filling with a single ^ / 1 degree. In addition, the shaft is not limited, but the filler with a uniform particle size below the thickness of the insulating layer should be used. The filler of ΙΟμπι is more preferably used as a filler having an average particle diameter of μ5μηι 〜5_. The inorganic fine particles are used in the stone, and in order to improve the dispersibility in the insulating substrate, the fine particles may be further in the 'insulating substrate' In order to improve the inorganic agent; the dispersibility of ί, Ϊΐ may also contain a Wei coupling agent. The Wei wei 2 is not limited. Specifically, for example, Epoxy Wei, County Wei, ", Vinyl Wei System, styryl-Wei-based, methacryloxy-oxyxanthene, 3^丨ί-based, titanate, etc. The above-mentioned decane coupling agent may be used alone or in combination of two or more kinds. The insulating substrate is entangled in order to increase the enthalpy of the inorganic fine particles in the insulating substrate. The dispersing enthalpy may be limited. Specific examples include a sorbus noodle, a calcined ray-based system, a polymer-based dispersant, and the like. The above-mentioned side or side may be used alone (resin coating) The film m may be removed as long as it can be removed in the subsequent removal step. Specifically, for example, the organic solvent or the test solution can be easily dissolved, and the leopard can be used as the latter (swelling liquid). A film made of a swelled resin, etc., in which 'from the viewpoint of easy removal of the viewpoint, especially the use of % saplings. In addition, the expansion of the resin _ liquid ^ 17 201146113 liquid) ^ swelling degree In addition, the swellable resin film Γτίΐ (swelling liquid) does not dissolve substantially, but is easily detached from the surface of the insulating a and m due to swelling. Hunger film, or dissolve relative to the body The method of forming the resin which is easily peeled off from the surface of the insulating base material D1 is not particularly limited. Specifically, for example, "welding coating can form a liquid material of a resin film and then turn the film. The method printed on the table * of the insulating button D1; 忒Ϊ =ίϊ=ΐ is not particularly limited. Specifically, for example, a conventional spin coating of the resin coating film D2 is preferably 1 Å or less, and the thickness of the resin coating D2 is preferably. · 1 μηη is in the appropriate = two. In addition, if the thickness is too thick, the groove formation in the circuit = the precision of the circuit groove or the through hole of the upper mine machine plus Wang Qingcheng; the degree = the thickness of the grease film 太 too When it is thin, there will be a tree ίί, 'Ρ^ 秘 佳 佳 之 离 离 离 离 为 为 为 为 为 佳 佳 佳 佳 佳 佳 佳 佳. The gamma ^f _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the fine removal step, it may be difficult to swell the W 曰 film. The method for forming the film m resin gamma is not particularly a mosquito, and the same method as the above-mentioned resin substrate work /==. Specifically, for example, after the liquid material which can form a bulky resin film is coated on the insulating dry m surface, the liquid material which is formed on the support substrate is coated, and then the liquid material is dried. The method on the surface of the ship's material D1, etc. (4) Liquid materials of Zenghai swellable resin film, for example, suspension of elastomer - sub-donation. Specific examples of the elastomer include, for example, styrene-butadiene H·J8 201146113-based elastomer, acrylic-based elastomer such as acrylonitrile-based copolymer, and ～21 elastomer. If the scale-elastic elastomer is used, it is possible to form a swellable resin film having a desired degree of swelling by adjusting the (four) degree or the gelatinized material (4) of the detachment of the suspended liquid or the planting liquid. The swellable resin film is particularly preferably a film having a degree of swelling depending on the pH of the swelling liquid with f. If such a film is used, the swellable resin can be made under the 披 Γ value in the catalyst coating step by making the liquid conditions in the liquid-to-worker-removing step in the catalyst-independent step different. The film maintains a high adhesion force to the insulating substrate, and the swellable resin film is easily peeled off under the ρ Η value in the film removing step, more specifically, for example, when the catalyst coating step is provided For example, a step of treating in a pH value of 3 _ _ _ _ _ hetero (hybrid metal mixed solution), and the film removal step is provided in the range of pH, 1 ± / valley liquid towel to make u In the step of reversing the temperament of the lining, the swellability of the swellable fine-grained glutinous 5 hai acidic plating catalyst colloidal solution should be less than 5〇%, more preferably less than 4〇%, ^ The degree of swelling and swelling should be above 5G%, and more should

It is over 500%. Taking T/the swellable resin film, for example, a sheet material made of an elastomer having a predetermined amount of carboxyl groups, and a dry film resist for patterning a printed wiring board (hereinafter also referred to as two DFR) The photocurable alkali-developing type resist of the photocurable alkaline development type is subjected to overall hardening, or a thermosetting or alkaline developing type sheet. (10) Specific examples of the elastomer having a carboxyl group include, for example, a diene-based elastomer having a styrene-butadiene-based copolymer fluorene having a carboxyl group in the J-position of a monomer having a carboxyl group, and an acrylic acid It is intended to be an acrylic elastomer such as a copolymer and a poly-elastic. If the body is turned, the elastomer is equivalent to the amount of cross-linking of the float or emulsion, and the degree of cross-linking is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The sputum base of the miscellaneous towel will be coated with an alkaline aqueous solution to make the swellable lion cover the thorn, and the effect of peeling off the surface of the insulating substrate by the swelled resin. In addition, the acid equivalent weight of the polymer of the thiol group per i. Specific examples of the monomer unit having a few groups are, for example, (meth)acrylic acid, fumaric acid, 19 201146113 #土皮酉夂, crotonic acid', itaconic acid, and maleic acid. ,, and more (8) ~ 80 〇. When the acid equivalent is too small, the disk, the 'paste-type and the singer's resistance to the electricity will have a downward trend. Lisi Temple will have a reduced inclination to the alkaline water/gluteal liquid. In addition, the molecular weight of the elastomer should be! When the amount of t is too large, the amount of t is too large, and the tendency to decrease is too small. It is too small to touch the production - 'the slave maintains a uniform thickness of the swellable resin film. 1 ς The resistance also tends to deteriorate. _ Qiu plating other treatment liquids get the inclusion of this. ^剌 Polymer Fine === It is the main purpose of the necessary age, or S f the molecular weight, 'the weight average molecular weight is _~ 戋 to the electric & :!*= G~5 surface. When the amount of the neurite is too small, the resistance of the thin curved accompaniment (acid resistance) may reduce the dissociation or the adhesion when it becomes a dry film may be deteriorated = direction = ί Pharma, inhibition of laser processing The thermal deformation or the flow number of the time is disclosed in Japanese Laid-Open Patent Publication No. 2GG1-2G1851. ^ f11^0 t T-acid, bar _, itaconic acid, maleic anhydride, Malay 酉 酉 + 酉, acryl acid age, can be used, or a combination of 2 _. (b) 20 201146113 = In general, 'for example, it is non-acidic and has (_ is not limited to this in the molecule. It can be selected in such a manner as to maintain the visibility of electroplating properties, etc.) Words, there is rain: ethyl decanoate, isopropyl acrylate, n-butyl methacrylate: diyl == dibutyl ester, methacrylic acid third butyl vinegar, methacryl: 酉曰, A, It is an acid of 2-acid C, etc. In addition, an ester of ethyl acetate (i-hoi), a methacrylonitrile fine ethylene derivative, and the like. In addition, it is used in the molecule; Υ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The amount of the slow base is preferably 100~2 0, (8). In the test, the amount refers to the polymerization (8) which has an i equivalent of a carboxyl group: compatibility with a solvent or other composition or pretreatment of an electric ore. In addition, when the acid equivalent is too high, the lion's character tends to decrease. Further, the composition ratio of the (a) early body is 5 to 7 % by mass. _, 地田ΪΪΪ*polymer can be used as long as it has resistance to adhesion to the nucleus. In addition, in order to improve the fit of the dry film (1 dish), the test agent is used. Specifically, there are methyl propylene '3 kinds of resistance to be added cross-linked isopropyl vinegar, methyl propyl ketone, methyl propyl benzoic acid: dibutyl sulfonium methyl acrylate second vinegar, methacrylic acid rLi X Base acid, 2 sides of ethyl vinegar, methyl acrylate acid 2_ by the aid of the auxiliary. Further, it is also possible to use benzylic ether, methicone, styrene or a polymerizable externally available polymerizable unsaturated group in the molecule. Further, the ke includes a polyunsaturated compound which can be described as an oligo of the early or monomeric reaction. In addition to the last two years, m ίτ, contains two or more other photopolymerizable monomers. About monomer's example or polypropylene: ί: mercapto acrylate, 1,4-cyclohexanediol dimethacrylate, poly-_, polyethylene glycol dimethyl acrylate, polyoxyethylene a polyacrylic acid diol dimercapto acrylate vinegar, 2 - 21 201146113 bis-p-hydroxyphenyl) propane dimethacrylate, glyceryl tridecyl acrylate Dipentaerythritol penta(meth)acrylate, tri-propyl thiophene propylene glycol dimethacrylate, bisphenol A propylene oxide trisyl acrylate vinegar (bisphenol A diglycidyl ether (meth)acrylate), 2,2-bis(4-methacryloxypentaethoxyphenyl)propane A polyfunctional methacrylic ketone containing a certain class of amines. It may also be any of the above monomers or the monomer 2 = polymer. Furthermore, a filler may also be included. The filler is not particularly limited, for example: sulphur dioxide, oxidized, magnesium hydroxide, carbonic acid, clay, kaolin, titanium oxide, sulfuric acid lock, zhiming, zinc oxide, talc, mica, glass, titanic acid Potassium, limestone, sulfuric acid town, cut Lu, organic fillers, etc. In addition, the thickness of the photoresist is as usual! ~ Teacher (7) is very thin, so the size of the filler should be small. The average particle size can be used, and the coarse particles are passed through the cutter, but they can also be broken when dispersed, and the coarse particles can be removed by filtration. ^Additives, for example, photopolymerizable resin (photopolymerization initiator), polymerization preventing dyeing t pigment, chromonic pigment), thermal polymerization initiator, cyclic i-substrate negative or urethane cross-linking agent, etc. . In the printing plate processing program of the present invention, laser processing is sometimes used, and when it is used, it is necessary to use a laser to impart releasability to the photoresist. The laser processing machine can be molecular #射或(10)―YAG余#. These lasers are loaded with various alpha-wavelengths and use materials with a high absorption rate for this wavelength to achieve efficiency. Among them, the UV_YAG laser is suitable for fine processing ί/ί ^f wave 355 belly, 4 times higher order wave 266 nm, so the choice of the wavelength is the same. On the other hand, 'the absorption rate is sometimes lower than that of a certain process because of the body'. For example, when using a photoresist with a lower absorption rate of w, it is too silky, so it can be used when the female money is layered and added. In the case of the use of the laser light, the specific example of the DFR of the photocurable resin composition containing the photopolymerization initiator can be used, for example, the Japanese Patent Application No. 2-23119 No. Bulletin: The sheet obtained by fully drying the dry film of the resin composition of the 00 wrist number, the ○ wrist type, and the ^ σ shadow type, for example, manufactured by Asahi Kasei Co., Ltd. In addition, the swellable resin film of Yuhe, for example, a resin containing a slow-base group and a main resin (for example, Yoshikawa Chemical Co., Ltd. NAZDAR229) or a resin containing phenol as a main component:: LEKTRACHEM Company system "i〇4F"). , a dampness resin ship, which is dried on the surface of an insulating substrate by a spin coating method or a stick coating method, or a DFR bonded to a support substrate by a vacuum laminator or the like. After the surface of the material is fully hardened, it can be easily formed. Further, the resin film may be a film of a grease in addition to the resin film described above. For example, the photoresist material constituting the resin coating film has the following materials. The necessary characteristics of the photoresist material constituting the resin film, for example, (1) the resistant drape of the medium covered in the above-mentioned medium, the immersed lining of the lining of the lining, and the cutting of the liquid; (2) The fine material step J ^ the step of forming the insulating substrate of the resin film impregnated into the test liquid, can be cured; ίί = recognition (resistance); (3) high film forming property; (4) dry film It is easier to refine the factory (5). Regarding the electroplating core-attached liquid, although there will be a detailed-Sn gel-like catalyst system, the whole is acidic _2); In the case of the g ^ sub-contact system, the _shu catalyst is a weak test, and H y indicates that it is acidic. From the above, it can be seen that the value of the electro-nuclear nucleus-attaching liquid is 1 to 11 ′, which is more resistant to a pH of 1 to 12. In addition, when the photoresist film-forming sample is immersed in the * liquid, the photoresist is swollen or (9). r wave resistance function. In addition, in general, the impregnation temperature is room temperature ~ not between 1 and 1 minute, the thickness of the photoresist film is about 1 to 1 〇, but 23 201146113 The test stripping agent used in the film removal step Liquid, although one, the system makes _ such as Na0H aqueous solution or carbon_water soluble 匕14, preferably 1^ value 12 to 14, so, PH value is 11 wio〇 / 〇 ^, 10 ^,, Dipping or spraying, but not limited to this. ",", in order to form a photoresist on the insulating material, the film forming property also changes, and the defects such as the eye hole are uniform. In addition, _ in order to be formed. In addition, the film is dried by a laminator (roller, vacuum). The temperature of the bonding is from room temperature to 丨6 (rc, when pressure, if it is, it needs adhesion when it is attached. Therefore, it is not made by This is limited to. The three-layer structure of the Fuying waist is 保存ί, and it is of course the best to store at room temperature, but it must be recorded in a low-grade yarn. It should not be separated. The resin should be thermoplastic. Linear polymer. For the characteristics of ^':1#, it can also be grafted and branched. Regarding its molecular weight, the number of two knives is about 1000~500_, preferably ~5〇〇〇〇. If the molecular homogenization or electroplating nuclear adhesion liquid resistance (acid resistance) will have a reduced tilting t', it will be too large, and the stripping or dry film adhesion will have a tendency to deteriorate. Then ==== medicine Liquid resistance, prevention of thermal deformation during laser processing or abortion of the main resin composition, the following (8) and (b) substances can be obtained: (a): to ^, with A monomer of a polymerizable unsaturated group of a few acids or anhydrides. 〇, : g4^ ^ — pp., JP-A-2002-231190, and JP-A-2001-851. For example, (meth)acrylic acid, fumaric acid, laurel. 24 201146113 皮 t, crotonic acid, itaconic acid, maleic anhydride, maleic acid half vinegar, acrylic acid butyl vinegar, etc., can be used alone, Two or more types may be used in combination. Regarding the substance (b), in general, the compound is non-acidic and has (a) polymerizable unsaturated group in the molecule, but is not limited thereto. The tolerance in the step, the hardness of the cured film, and the flexibility of the ^ can be selected. Specifically, '^, there is methyl methacrylate, methacrylate, isopropyl methacrylate, decyl propylene Acid n-butyl vinegar, methyl propyl benzoic acid second butyl vinegar, = acrylic acid third butyl vinegar, thioglycolic acid secret B, methacrylic acid 2 · propyl vinegar f. Lai guess ϊ ϋ Γ Γ Γ 衍生物 衍生物 衍生物 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The three-dimensional cross-linking of the monomer having the plural money and the base, and the reactive functional groups such as the latex, the soil, the amine group, the guanamine group, and the vinyl group can be introduced into the group. j. When the resin contains silk, the amount of silk contained in the resin is preferably 触~2_'. In this case, the acid equivalent means that it has an amount of y, y, y, and weight. #酸# When the amount is too low, 'the solvent or other composition' will have a tendency to decrease. The _ _ body group ί ί 聚物 ' as long as it has the resistance to the plating core or can be imparted In addition, in order to improve various resistances, for example, methyl methacrylate, methacrylic acid (10), methyl = ^: n-butyl vinegar, methacrylic acid second butyl vinegar, methacrylic methacrylate ί An ester of vinyl alcohol, methacrylonitrile, styrene or a vinyl derivative which can be used. Further, polymerization using _ or an acid anhydride having an upper group in the molecule can also be obtained. Further, any one of the oligo- & monomer or the oligomer which reacts the monomer may be included, and any one of mono- and mono-methyl propyl acetonate 4-cyclohexanediol dimethyl two 25 201146113 = Ethylene dimethacrylate, polyethylene glycol dimercapto acrylate, phenyl) propylene dimethyl propylene surface, glycerol hydrazine Τ Τ propyl propylene 、, tri (tetra) propyl propylene trie epoxide Two pairs of dipropylene oxide shunts trisyl acrylic acid S, 2,2 bis (4 methoxy alkenyl, containing secret f _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ , ' Contains fill 5. Filler is not particularly limited ^, specifically, for example: : 虱, alumina, magnesium hydroxide, calcium carbonate, clay, kaolin, titanium oxide = lock, steal, chest, material, _, _^Titanium, ° The thickness of the other photoresist, 1' can also be broken during dispersion, and the coarse particles can be removed by sputum. Reagents, = Photopolymerizable resin (photopolymerization initiator), polymerization prevention Or in the printing process of the amine-based, thermal-polymerization, and epoxy-based products, the laser processing may be used, and the use of carbon dioxide gas = profit === material to impart peelability. The processing machine can produce UV-YAG laser suitable for people to use 知 - -3 times higher harmonics 355nm, 4 large for use, completion, laser wavelength is higher, is the better choice. ^= =====The long absorption rate material is better. Specifically, for example, f is a certain degree of assembly. That is, when the root layer is processed by the insulating layer, the energy is adjusted using the light having the laser light absorption rate adjusted and The advantages are different, so it is appropriate to respond to the condition, <circuit trench forming step> the circuit trench forming step is to form the circuit trench D3 on the insulating substrate D1; 26 201146113 step., form: line trench D3 The method is not particularly limited. Specifically, for example, > laser film D2 is formed on the outer edge substrate D1, and laser processing and die cutting processing are performed from the outer surface side of the resin coating film 2 Mechanical knives such as _machining or profile processing are used to form a circuit groove having a desired shape and depth. When a fine circuit with high precision is desired, it is preferable to use a laser to enhance it. Shooting, you can change the laser output to adjust the depth of cut freely. For the press type, for example, a fine tree press type process used in the technical field of nano-printing is used, and in addition, a beacon which uses a wire-forming via hole may be provided on the groove of the circuit.孑匕D4 〇 骤 骤 限定 限定 限定 限定 限定 限定 限定 限定 限定 限定 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路The thickness of the film D2 can also be excavated beyond the thickness of the resin film D2. The width of the circuit trench D3 formed by the dry path forming step is not particularly limited to the right laser processing, even if the line width is less than 2 Gpm. Fine circuit, two L formation 1 In addition, the depth of the circuit trench is set to be the same as the height difference of the electric power to fill the electric S circuit = material; In the case of the medium=step, in the case where the surface of the circuit trench D3 and the surface of the resin coating spoon are covered with the step 7 of the electric medium or its precursor, the inner wall surface of the through hole D4 is also subjected to the heart == The enemy media or its precursor D5, is used in the electric step An electroless electricity is formed on the part of the electricity and electricity. 3 shots "ί., electric sensitizer" can be used as long as the conventional electroless mineral catalyst is used, and other coatings are removed. The catalyst of the catalyst is generated by the catalyst after the resin film is removed. Specific examples of electric vehicles, such as: gold 27 201146113, age, or metal precursors. The method of coating the catalyst or its precursor D5, for example, a method of treating the acidic pd_Sn colloidal solution which can be treated under the condition of 丄:^, and then treating the mixed solution. Specifically, for example, the following method. It is the time of the surfactant (cleaner, blending agent) in the surfactant solution (the detergent, the blending agent), etc., which is the oil component attached to the D1 ship base D1 and the D4 ship base material D1 ^. Then, as needed, it was treated with a sodium persulfate-sulfuric acid soft soft button. Then, pickling is carried out in a sulfuric acid aqueous solution having a pH of 1 to 2 or a salt water: liquid phase solution. Next, the liquid film of the main component of the aqueous solution of the stannous solution (iv) is impregnated at a concentration of about 4 times to perform prepreg treatment on the surface of the vaporized ion edge substrate m. Thereafter, it is immersed in an acidic plating such as an acidic Pd-Sn gel containing gas f-tin and palladium-vaporized palladium and having a pH of 1 to 3, such as colloidal Pd and Sn. A redox reaction (SnCl2 + PdCl2 - SnCl4 + PcU) is generated between the palladium and the palladium. In this case, the plating catalyst, that is, metal palladium, is deposited. For the acid plating catalyst solution, a conventional acidic Pd- = a large catalyst solution or the like may be used, and a commercially available mineralizing procedure using an acidic plating catalyst colloidal solution may also be employed. For such procedures, for example, systemized vendors of Rohm and Haas Electronic Materials LLC. By the treatment of the catalysts, the precursor D5 can be plated on the surface of the circuit trench D3, the surface of the inner wall and the surface of the resin film D2. <Laminating film removal step> The film removing step ′ is a step of removing the resin coating film D2 from the insulating base material D1 subjected to the catalyst coating step. The method of removing the resin film D2 is not particularly limited. Specifically, for example, a method in which the resin coating film D2 is swollen by a solution (swelling liquid), and then the j-sealing film D2 is peeled off from the insulating base material D1; a predetermined solution (swelling liquid) is used. After the resin coating film D2 is wetted and partially dissolved, the resin coating film D2 is peeled off from the insulating substrate m; and the resin coating film D2 is dissolved by a predetermined solution (swelling liquid) 28 201146113 Ίί: IT Hai swelling liquid 'As long as it is capable of swelling the resin film D2, the color edge substrate D1 is immersed in the swelling liquid for a predetermined period of time, hi = after' Ultrasonic irradiation may also be applied during the impregnation to improve the removal efficiency. When it is peeled off, it can be peeled off with light force. Line description. When the swellable resin coating film is used as the resin coating film D2, the liquid crystal D2 is supplied as a liquid, and the insulating substrate D1 and the electric mineral or its precursor are used as long as the quality is used. Decomposition of the substance D5 = solution, and only the swellable resin film D2_ or the dissolved liquid can be used, and it is particularly limited. Further, it is preferable to use a liquid which swells the swellable resin coating film D2 to such an extent. These swelling liquids can be selected according to the swelling property = thickness. Specifically, for example, the swellable resin is coated with an elastomer such as a diene-based elastomer, an acrylic elastomer, or a polyester-based elastomer, and (a) has at least one polymerizable unsaturated group in the knives. Polymerization of at least one monomer of a few acids or anhydrides and (b) polymerization of at least one or more monomers polymerizable with the monomer (a) - a polymer lion or an age-containing composition containing the polymer When an acrylic resin containing a rebel group is formed, an alkaline aqueous solution such as a sodium chloride aqueous solution having a concentration of about 1 to 1% by weight is preferably used. Further, when an electroplating process which is treated under the above-described acidic conditions is used in the catalyst coating step, the swellable resin film D2 should preferably have a swelling degree of less than 50% under acidic conditions, preferably below 40%. In the case of a swellability of 5% by weight or more, an elastomer such as a diene elastomer, an acrylic elastomer, or a polyester elastomer, (a) having at least one polymerizable unsaturated group in the molecule a polymer resin obtained by polymerizing at least one monomer of citric acid or an acid anhydride, and (b) a polymer resin obtained by polymerizing at least one monomer polymerizable with the monomer (a) or a resin containing the polymer resin It is formed of an acrylic resin containing a carboxyl group. These swellable resin coatings can be easily swollen and peeled off by using an alkaline aqueous solution having a pH of 12:14, for example, an aqueous sodium hydroxide solution having a concentration of about 1 to 10%. Further, in order to improve the peeling property, it is also possible to irradiate with ultrasonic waves during the impregnation. In addition, it can be peeled off with light force as needed. 29 201146113 A method of swelling the film-coated fat-film 02, for example, removing the swellable resin. Insulation substrate 1) 1 is impregnated in the swelling solution for a predetermined period of time, and 2'+ is used to improve the peelability. It is preferable to irradiate with ultrasonic waves during the impregnation. In addition, when the heart is not peeled off, it can be peeled off with light force as needed. <Electroplating treatment step> f For the method of treating the ruthenium-based D2 of the ruthenium-based base material di-dielectric ore, it is possible to use, for example, an insulating layer partially covered with an electric ore contact =; month_hur 1> The material D1 is immersed in the electroless electro- ore solution, and only the part of the two-way f-catalyst or its precursor D5 is precipitated without the electric solution (electrical ore layer). Huadian = Jinyu: copper (Cu), _, The selection of the outline. The electroplating (four) consumption (four) of the age of two towels is a better choice. When the § 5 has Nl, the impurity or the cake is excellent in adhesion, and it is a precursor step. In the scale substrate D1, the wire touches the medium or its groove is formed = electric r side: it is only in the desire to form electricity. =冓=Working out no electricity—membrane•即=ΐ二= The electric film 10, because of the narrowness of the second circuit from the circuit 'will not leave excess money film between the scale circuit. This is enough to prevent short circuits or migration. <Inspection Step> In the method of manufacturing the circuit board, the method of manufacturing the circuit board may further include an inspection step, and the itii contains the money (4), and after the step of removing the slanting step, the spurt is in the first place. Or near-ultraviolet light, using the luminescence of fluorescent substances, you can check the useful d-cover = ΐ瑕 recording. Therefore, in this actual job, "manufacturing τ can form an electrical circuit with a very narrow line spacing. When forming an electrical circuit with extremely narrow line width and line spacing, as shown in Fig. 3, 201146113, the resin coating may be It cannot be completely removed and remains on the surface of the insulating substrate D1 and is formed between adjacent electrical circuits D8. At this time, an electroless plating film is formed on the portion, which causes problems such as migration or short circuit. In this case, if the inspection step is provided, the presence or absence of the coating or the removal of the coating film can be checked. FIG. 3 is an explanatory view for explaining that the resin coating contains a fluorescent substance. The inspection step of detecting whether or not the coating film is completely removed by the luminescence of the fluorescent substance. The fluorescent substance contained in the resin film D2 in the inspection step can be illuminated by a predetermined light source. Others are not particularly limited. For example, Fluoresceine, Eosine, Pyronine G, etc. ^ Use this inspection procedure to check the luminescent portion of the fluorescent substance, which is the resin film D. (2) Residual part of the residue D2a. Therefore, by removing the portion where the light is detected, the electroless plating film can be prevented from being formed on the portion. This prevents problems such as migration or short-circuiting from occurring. Slag processing step> In the method of manufacturing a circuit board of the presently known aspect, after the money processing = after application, specifically, before or after the implementation of filling the Wei, it may be further implemented. The de-doping step of the treatment process is carried out, and the excess resin is removed by the de-doping treatment. In addition, in the case of a circuit board substrate which is prepared to have the '^ soil plate', the un-formed t-mine of the insulation can be formed. ^ Part of the surface of the secret '峨 ^ its upper layer of the secret ^ β ' can also be carried out to check the bottom of the layer of the treatment. This can be removed; ^. In addition, the test without mosquitoes (4) 2 and 2. In particular, S 'for example: immersed in a treatment with a too strong acid solution., r = the above step, the circuit substrate mo shown in Fig. )) is formed. [1st - 2th embodiment 〕 Yan Lei implementation shows that the formation of electricity on a flat insulating substrate The present invention is not limited to this. Specifically, it can be a method for manufacturing a three-dimensional circuit substrate in which the electric circuit of the electric circuit is configured. 31 201146113 Explanation of the manufacture of the three-dimensional circuit of the i--2 embodiment of the Kina D5i, the surface of the three-dimensional insulating substrate Z with high and low difference parts shouted resin fine D2. Correction, the age axis as a thief Forming the three-dimensional insulating substrate D51 can be used to manufacture a three-dimensional circuit. Specific examples of the resin material used to prepare the resin molded body include styrene, poly-resin, _resin, poly-resin, The method of forming the grease film D2 is not particularly limited, and specifically, the same formation method as that of the first to the first embodiment.

Also, as shown in Fig. 4 (9), the outer surface of the resin film D2 is a circuit groove D3 having a depth equal to or greater than the thickness of the reference D D2. The circuit I m is not limited. Specifically (4), for example: _ 1st to 1st ^ method. The circuit trench D3 can define a portion that utilizes an electroless shovel = electroless galvanic, that is, a portion that can form an electrical circuit. This step corresponds to a circuit trench forming step. Next, as shown in Fig. 4(C), an electric ore catalyst or a driver D5 is coated on the surface of the circuit trench and the surface of the resin film m of the in-groove m. The method of covering the electrocaloric catalyst or its precursor D5 is not particularly limited. For example, the same method as the third embodiment is used. = Catalyst override step. The catalyst is coated on the side, as shown in Fig. 4 (〇; the surface of the wire is D2 _ upper _ plated catalyst sorrow as shown in Fig. 4 (D), from the three-dimensional insulating substrate D51 The resin coating = 2 is removed. Thus, the electrocaloric catalyst or its precursor D5 can be left only on the surface of the portion of the three-dimensional insulating substrate where the groove D3 has been formed. The electric side carrier or the precursor D on the surface of D2 is removed together with the resin coating film D2 in a state of being over the resin coating film D2. 32 201146113 2 Detachment method for the f film D2 Specifically, for example, the same method as the above-described method is used. This step corresponds to the film removal step. (IV) The pair of the resin film D2 shown in Hi Figure 4 (Ε) The three-dimensional insulation of the two, the application of electroless ore. By this, Qian Cun the electric ore catalyst or its precursor m rises out of the electroless recording m D6. That is, the circuit has been formed An electroless electric surface D6 is formed on the portion of the hole D4 as an electrical circuit. Second, the electron microscope, the formation method of the D6 is not particularly limited. Specifically, 'for example; The method of turning the shaft, etc., correcting, the step is to form the circuit substrate according to the above steps 'as shown in Fig. 4(Ε), and the electric circuit D6 is formed on the bulk insulating substrate D51. Even if the line width and the line of the electric circuit formed on the insulating substrate are sufficient to form a high-precision electrical circuit, the present embodiment can accurately and easily display the surface of the three-dimensional circuit substrate having the step portion. [Second Embodiment] The invention further relates to a method for manufacturing an f-channel substrate and a Weilu substrate. The portable information terminal device, the computer, and the surrounding area, various electric appliances With the rapid development of the device, the electric circuit of the circuit board mounted on the electric device is required to be further densified in two steps. In order to satisfy the high density of these electric circuits. In the case of the electric circuit wiring which is narrower, it is required to form a narrower electrical circuit wiring in the form of a line width and a width of a portion between the electric circuit circuits. In the household circuit, the green line wiring _ short circuit or relocation problem. The mountain is also on the ί ϊ ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί ί The subtraction method is a method of subtracting the metal shame which is to be formed on the stacking plate and the surface of the Wei circuit to form an electrical circuit. The other aspect 'addition method is a method in which a portion of the four-way portion of the Qianyuan substrate is subjected to electroless plating to form a predetermined circuit. / 33 201146113 The subtraction method is a method of engraving a metal foil on the surface of a metal foil sheet stacking sheet, leaving a metal foil in a portion where an electrical circuit is to be formed, and removing other portions. If this method is used, the removed metal will be wasted, increasing the manufacturing cost. On the other hand, the addition rule is to perform electroless plating on a portion where an electric circuit is to be formed to form a metal wiring. Therefore, the metal will not be wasted, and the resources that are consumed without any reason are less. From this point of view, the additive method is a preferred method of circuit formation. Referring to the @ π system _ the conventional additive addition method, the full addition method forms a method of forming an electric path composed of gold wires. In addition, Fig. u is a schematic cross-sectional view for the steps of forming a metal compound by a conventional full addition method. The electric contact catalyst A102 is coated on the surface of the insulating substrate 〇 formed with the through hole A101 as shown in Fig. 11 (A). Further, the surface of the insulating substrate Al is formed as shown in Fig. Β(Β), and a hetero layer 趟3 is formed on the color material A1GG coated with the electrocaloric catalyst A102. Next, as shown in FIG. 11 (Q), the mask A11 that forms a predetermined circuit pattern is exposed to the photoresist layer A1〇3. As shown in FIG. 11(D), the exposed light is collimated. Then, as shown in Fig. 11(E), the metal wiring A105 is formed on the surface of the circuit pattern 鸠4 formed by the development and the surface of the circuit pattern 形成4 formed by the development. By performing the above steps, a circuit composed of the metal wiring A105 is formed on the material 00. On the entire surface of the power-on (10), the photoresist layer A103 is pushed for four days to cause a problem of underarming. That is, 'when plated with high precision. However, when the portion of the spurs is not formed, it may be that the layer 3 is developed as shown in Fig. 12 as αι〇6. This is due to the fact that 9 is the excess plating portion of the residue. On the surface of the excess Α11, it is covered by the electro-catalyst Al02. These short-circuit ^ migration problems; short circuit between circuits or when the circuit is moved more f. In addition, the cross-sectional view of the stomata line width and the well-added full-addition method which is narrower is used to explain the manufacturing method different from the above-mentioned circuit board manufacturing method, for example: 34 201146113 The bulletin and the 曰本细号 bulletin ΐΠϋ7:134996 reveal 7^ another kind of addition method. Practicing Soluble (4) 2 Photosensitivity _=S= Exposure is performed on a predetermined light-shielding mask. The developer is exposed to a photosensitive resin layer for development. Next, the catalyst is adsorbed on the entire surface of the ii 2/3⁄4, and then dissolved by the test solution to form a circuit, and the circuit is correctly formed on the portion where the catalyst exists. In the following, the following method was disclosed in the Japanese version of the Japanese version of the Japanese Patent No. 58-Lion No. 94. A resin protective film is coated on the color and edge substrate (insulating substrate) (first step). On the ship's edge wire, the riL of the residual beam or the residual beam is removed, and the activation layer of the activation layer on the surface of the core is removed from the groove on the groove and the _ surface of the through hole (the second layer) The conductive layer is formed on the wall of the through hole _ the selected layer (the fifth step). ???,,,,,,,, according to Japanese Patent Laid-Open No. 57-134996, it is necessary to form a solvent having different solubility. In the case of the sensation of the sensation of the sensation, it is necessary to use the alkaline solution to solve the second photosensitive resin after the adsorption of the catalyst. Therefore, the manufacturing process is very complicated. Bulletin No. 58_186994: In the heat-curing resin, the heat-clearing resin is used in the heat-removing resin. The heat-reducing curry of the miscellaneous film is not specifically described. 35 201146113 With good solvent resistance, it is difficult to adhere the resin to the resin substrate by the solvent alone. Therefore, in the tree, the fragments of the thermosetting tree film remain, and it can be correctly Guarantee == No damage on the surface of Table 9 If strong solvent or long time is used for sufficient peeling = It is very difficult to go. In addition, the guide is formed. In addition, when the fine part is dispersed into the solvent last time, if it is dispersed again, the medium will be on the surface of the resin substrate, and the part may be combined with the electric ore. The catalyst will be attached again with the Japanese special opening 52-186994. The film is therefore the right way to lie down the circuit. The method of the lion is to form a metal that has the above-mentioned knowledge of various circuit-based electrical circuits. The wiring is prone to a narrow edge, and there is a problem that the circuitable trench that constitutes the stripping system is peeled off. The circuit gas is ======_The electric board on which the battery is mounted is 'installable larger^'〇# The metal wiring in the bottom plate portion may be peeled off from the insulating substrate. === When the external force is applied, the metal wiring forming the bottom plate portion may have a narrow line width and a narrow line spacing. The above circuit damage: 36 201146113 iI i consider the use of expanded circuit wiring line width, reinforcement and insulation base gamma contact, feeding metal wiring = insulation base _9 (4) method. _, _ green can not make the circuit high density 0 target, The object of the present invention is to provide a view Board, even if the disk is wide and the wiring is very narrow, the insulation substrate = gas circuit is very close, the electrical circuit is not easily damaged. In addition, the circuit is provided for k. The purpose of the method for manufacturing a substrate is to reduce the adhesion between the insulating substrate and the electrical circuit, and to focus on: color rim = composition. When using an insulating substrate that does not contain a filler, due to the use of a laser channel groove The surface does not contain fillers, so it is easier to make it ί雷ϊ r, i Γ Γ , ,, smooth surface circuit trenches, it is easier to form electric fii•疋不έ·Laser processing or mechanical addition forming circuit The filler with reduced smoothness of the surface of the groove. (4) When it is found that the material of the ship's edge is not included in the circuit groove, it is not formed on the circuit trench as the electrical circuit. The phenomenon of peeling off the plating layer. After that, the inventors infer that the phenomenon is caused by the following reasons. The surface of the surface groove is smooth, so even if the catalyst metal is provided on the surface of the Wei groove, it cannot be fully covered and will fall off. In addition, since the insulating substrate does not contain a filler, the coefficient of thermal linear expansion is large. Specifically, the &' insulating substrate is susceptible to deformation due to temperature changes that exceed the stress applied to the electrical circuit by the electrical circuit and the insulating substrate. When the circuit trench is formed by laser processing or machining, since the insulating soil material has no filler, the heat resistance of the insulating substrate is low, and melting occurs due to heat. The shape of the circuit trench Will be deformed. That is, the shape of the electric circuit is unevenly formed because the electrical circuit is subjected to the adhesion of the pen to the insulating substrate. In the present invention, in order to allow the insulating substrate to contain a circuit for the use of laser processing or mechanical processing, the circuit board of the present invention includes: on the surface Forming a resin coating, a large and deep circuit trench, on the surface of the circuit trench = and: = an insulating substrate, and the insulating substrate is a ===== way, the insulating substrate contains a filler. The electric milk formed by the electric forging can obtain the electric wire formed on the insulating base material and the narrowness of the line spacing, and the adhesion between the insulating base material and the electric circuit can be obtained by the above structure." The electric circuit is not easily damaged. Circuit board. In addition, the electrical ° is two or two, but by the thief electroless electric 戦 in the wire of the wire and the tongue 'being the edge of the substrate and the electrical circuit. It is concluded that the first is in the formation When the circuit is grooved, the surface of the ship's substrate groove will be electrically charged due to the filler, preventing the use of no electricity in the circuit groove ===== high cis ^ : r. It is 'can prevent this deformation from making electricity again' in the use of laser processing or machining of the substrate containing, (10) losing Yang Ming _ high, ^ = insulation, that is, because the shape of the circuit trench can be prevented from opening) Can make electricity. The stress is also averaged to prevent the electrical circuit from being peeled off. ', the circuit to the 38 201146113 ΛΛ 上 上 ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ ΛΛ The circuit board that is also reported to the south and the electrical circuit is not easily damaged. In addition, the content of the filler is preferably from 10 to 90% by mass based on the insulating substrate. With such a structure, it is possible to obtain a circuit board in which the adhesion between the insulating base material and the electric circuit is high even if the line width slit of the Wei f road is narrow. Further, the average particle diameter of the filler is preferably 〇·〇5 to 1〇μιη. With these structures, it is possible to obtain a circuit board having high adhesion between the insulating substrate and the circuit even if the line width and the gap of the circuit are narrow. In addition, the average particle diameter of the filler is relative to the width of the circuit trench, the depth of the trench of the circuit, and the width of the portion between the circuit trench and the circuit impurity that are in contact with each other, and the minimum resident G .25~50%. With these configurations, it is possible to obtain a circuit board in which the insulating substrate and the electrical circuit are very south, even if the line width of the electric circuit and the line spacing are narrow. ^ In addition, the far filler is preferably inorganic fine particles. With these configurations, it is possible to obtain a f-wire plate having a high adhesion between the insulating substrate and the electric circuit even if the winding of the circuit and the line spacing are narrow. The lack of influence is caused by the smaller the coefficient of the second base of the ship, such as the ship's edge substrate. That is, the insulating substrate is less likely to be less stressed by the electric circuit of the shaft which is deformed by the change in temperature. Therefore, it is possible to prevent the deformation from stressing the electric circuit and peeling off the electric circuit. In addition, the δHai electrical circuit should preferably include at least a portion having a line width of 5 to 3 pm. When the electrical circuit includes a portion having a narrow line width, a circuit substrate having a sufficiently high density of electricity can be obtained. In addition, when the electrical circuit includes the narrow portion of the line width, the contact area between the electrical circuit and the insulating substrate is narrow, the adhesion between the electrical circuit and the insulating substrate is lowered, and the electrical circuit becomes easy. Peel off from the insulating substrate. By the above configuration, it is possible to obtain a circuit board which can prevent the electrical circuit from being separated from the insulating substrate even if the electric circuit includes the electric power of the portion 7 having a narrow line width. . Further, a method of manufacturing a circuit board according to another aspect of the present invention includes: a film forming step of forming a resin film on the surface of the insulating substrate; and an outer surface of the resin film & 39 201146113 2: Mechanical Processing - a step of performing a key switch having a desired shape and a surface of the tree; the step of forming the film c is narrow and the line spacing is not uniform with respect to the electrical circuit. The embodiment of the second embodiment includes the following technique content. From the i two coffee ^: kind of circuit substrate 'package*: a resin film is formed on the surface, and the formed % of the genus is a kind of smear-like blush film peeling gas 笏: ί. ΐ two = edge ____ The electrical enthalpy of the formation of the circuit board

Handle, item 2-4. Circuit A as recited in item 1 of claims 1 to 2 - 3 (4) The average particle diameter of the filler relative to the width of the circuit trench, the circuit J i$trm is 5= . The groove-circuit-divided width request item 2-7. A method of manufacturing a circuit board, comprising: a step of forming a resin film on the surface of the insulating material; and an outer surface of the resin film ^ 201146113 Insulation Substrate It is a circuit groove forming step of a deep circuit trench; in the electric 2 film peeling step; and the electroless 2 in the insulating substrate has been electrolyzed The insulating substrate used in the electro-optical step contains the persuasion 4. * The money is used in the steps of the 缞-cake to make the wire on the Qingdian electrical circuit circuit board. Further, a method of manufacturing the circuit board is further provided. (10) Hereinafter, the embodiment of the present invention will be described, but the present invention is a method in which the catalyst metal is coated on the insulating substrate from the [2-1th embodiment]. 3 Sun 1 ^ The manufacturing method of the circuit board of the second embodiment of the present invention; = a picture 'for explaining the manufacturing aspect of the wth embodiment> First, as shown in Fig. 7(A), Insulation substrate A1 = A2. In addition, this step is equivalent to covering 2/2, containing ^. Specifically, for example, the resin and the edge-filling substrate A1 A1 are complemented by (9). When the resin film is formed, the insulating material is formed into a product: ": = and = surface electric = plus = machine: the two-shaped surface is The alignment, the cutting or machining process is performed by the outer surface of the resin coating Α2, and the through hole a4 is formed by punching. The step is equivalent to the electric 41 201146113. Next, as shown in Fig. 7(C) In the circuit trench A3 is formed on the surface of the resin film A2 of the circuit trench A3, and the surface of the resin film A2 is covered with a 'media 1 and a dielectric> A5. At this time, since the insulating substrate A1 is formed. The through hole μ, (smart $ through hole A4 _ silk also dumps the catalyst A = when the catalyst is covered by the step. The "steps are connected f" as shown in Fig. 7 (D), from the insulating base Material A1 to coat the resin

The insulating substrate A1 is formed by the circuit trench A3 or the surface of the insulating surface A5 which is coated on the surface, and is removed by the resin coating on the film peeling and the film coating. Correction, this step is equivalent to the A1 shown in the 'frequency of the film Α 2 has been followed by the insulating substrate shovel d electricity? . In this case, the portion in which the catalyst metal crucible 5 remains is electrically formed. The portion of the circuit trench A3 or the through-hole A4 is formed with a key layer A6 of the disorder circuit. Then the electric circuit can be made of the electric ore layer A6. The enamel layer is again electrolessly electrolyzed (filled with electric forging), so that the electrical circuit composed of the electric ore layer Α6 can be formed by filling the entire =J method as shown in Figure 7 (Ε), so that: The height difference of the earth U electrical circuit is eliminated. In addition, this step is equivalent to the electron microscope processing step. From the above steps, the circuit substrate 10 shown in the figure can be formed. For example, the 3-way substrate A1G' is even in the insulating substrate. The line of the electrical circuit formed on the above is narrowed, the adhesion between the insulating substrate and the Wei circuit is high, and the electrical circuit is not easily damaged. The monthly b is enough to mention the adhesion of the above insulating substrate to Wei, which is inferred to be Because of the relationship between the following mechanisms. In the second embodiment, FIG. 8 is a state explanatory diagram of the insulating substrate A1 in the step of forming the trench of the circuit. FIG. 8(4) shows the post-processing The state of the insulating substrate A1 'W' shows the plating process step In the state of the insulating base material A1. 42 201146113 The insulating base material A1 after the step of forming the groove of the circuit is subjected to laser processing or machining as shown in Fig. 8(A) to perform laser processing or machining. Forming the circuit trenches as shown in the figure, the ;3 3 dielectric coating step on the surface of the trench Α3 of the circuit is covered by the catalyst, which is not easy to fall off due to the small bumps of 3 hai. ΐ ΐ _ _ after 'in the political description ..., electrolytic plating, hunting this, as shown in Figure 8 (Β), in the circuit ^ A3 into the electrical circuit layer Α 7. Because it can prevent the electric The catalyst metal covered by the bell i is detached, so that the circuit, the 凹凸 52 凹凸 _ 定 定 , , , „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ „ The adhesion. The insulating substrate contains a filler, so the coefficient of thermal expansion is small. Therefore, if the degree is changed and deformed, the formed electric circuit is subjected to the detachment of the circuit. °疋 This deformation causes the electric (4) road to be subjected to the thorn stress, which causes the electrical substrate to be lifted or mechanically added to form the Wei groove, due to the phenomenon of insulation. Since the heat resistance of the base material is high, it is less likely to cause deformation due to heat, and the shape of the groove of the reservoir is deformed. Therefore, it is possible to prevent the electrical circuit from being peeled off. The person of the road can make a circuit board that even hides the electrical damage of Qingcheng. That is, the electrical circuit made of the electric ore layer A is not easily peeled off from the insulating substrate. When it was found that '# uses an insulating substrate a21 which does not contain a filler, the same method is used to form an electric circuit, and a portion where an electric ore layer which is an electric circuit is not formed on the circuit gully is generated, or a shape 43 is formed. The phenomenon of peeling off the electric ore layer. The reasoning is because of the embarrassing reason. In addition, Fig. 9 is a state in which the insulating substrate A21, which is not filled with a filler, is used as the insulating substrate Α2ι. ® 9 (A) and ® 9 (B) are the drawings of A (10) and Figure 8 (b). First, laser processing or machining makes the circuit trench A23 formed on the insulating substrate A21. The surface is smooth, and the surface of the circuit groove A23 is sloped, and the surface of the circuit A23 is not fully covered and may fall off. After that, the electroless plating is performed after the tree A22 is peeled off, such as =, On the surface of the circuit trench A23, there is an electric power which is not coated on the catalyst groove A23, and the electric wire is not formed. Further, since the insulating base material A21 does not contain a filler, the coefficient of thermal linear expansion becomes large. The insulating substrate A21 is easily deformed by temperature change, and the stress applied by the plating layer A25 exceeds the adhesion between the electrodeposited layer A25 and the insulating substrate a/, thereby forming the peeled portion A25a of the plating layer A25. In the case of the circuit trench A23, since the germanium substrate A21 does not have a filler, the insulating substrate A21 (four) is melted by heat, and the shape of the circuit trench A23 is changed: = The stress applied to the plating layer A25 may become ^, due to the deformed shape, When the stress applied to A25 exceeds the portion of the plating layer A2S and the insulating substrate A2, the peeled portion A25a of the plating layer A25 is formed. The spoon is at σ-two, and the electric ore layer 25 of the gas circuit is not formed in the insulating layer. The material 21 is peeled off on the circuit trench 23, that is, when the plating is filled, the obtained electric circuit is easily removed from the insulating substrate. Hereinafter, each structure of the present embodiment will be described. The base material A1 contains a filler. Specifically, for example, the resin and the filler are not particularly limited as long as they constitute a resin which can be used to manufacture a circuit board. Specifically, for example, Wei 201146113 Acrylic resin, polycarbonate _, poly fluorene epoxy resin, double-presence f-type epoxy resin, double-hop s: Yuan gas yr, benzene __ epoxy resin, silk benzene ride. J=r

The epoxy resin is an organic circuit of an epoxy circuit grade of the sulphur secret tree as long as it is available. Specifically, for example, the bismuth oxide of Abisbiphenol: the flame retardancy of the above-mentioned epoxy tree material which is brominated or dish denatured by trimeric isocyanic acid tricondensation, can also be used to make it hard 4: == When the substrate is used - Generally speaking, there is no special limit for the hardening. If y is to use a hardener, it can be used as a phenol disc type Qin secret hardener. The benzene age hardener is, for example, a hardener such as a wipe. Further, the curing agent may be used alone or in combination of two or more. The flat microparticles 'may also be organic microparticles' are not particularly limited. The material of the oxidation Hi machine is 'specifically' such as: oxygen residue, 钡 〇 、, oxygen 等, etc. magnetic i filling material ϋ 2 (4) 1 electric constant filling material; hard ferrite magnet yttrium oxide (Sb cn ^ : feng gasification town ( Mg(〇H)2), aluminum hydroxide (Α1(0Η)2), triacid sputum/upper gasification record (Sb2〇5), strontium salt, zinc sulphate, pin compound, stearic acid ~f'〇 )(〇H)2) '~〇4)' Machine microparticles, as well as particles, can be used alone or above. These inorganic fine particles, because of the heat transfer in the desired work distribution, color touch, and high degree of miscellaneous, can be used to calculate the irritability and particle size. 矽ί:合:ϊ::::理为: The dispersibility in the insulating substrate can be surface treated. In addition, the insulating substrate, in order to improve the inorganic 45 201146113

Sit's dispersibility in the coffin can also contain Wei coupling agents. Regarding the stone f 偶 1 1 'specifically, for example, epoxy decane, decyl decane, amino decane i aldehyde, styryl wei series, methacryl _ kewei series, propylene material: two == In addition, as for the organic fine particles, for example, it is easy to turn off, and in the above-mentioned respective fillers, the selection of the inorganic particles is high, and the filling ratio 浐====== It is close to, for example, the c content is on the top, and low distortion and low stress can be achieved. Another line expands the tendency to peel off. I think this is because it is not easy to be in the =2d2, the electricity is covered by the grease =:: the insulation step _ the depth D of the tree and the circuit adjacent to each other, the visibility of the emperor a, the ditch of the circuit The minimum 値, should = 2 = the part of the slot ίί - ruler and the bureau U.5~40%. In addition, in this 46 201146113 1 average particle diameter ' can be used - general particle size meter, for example: ^ = = = the electric another: the groove prevents the electric wire from becoming part of the electric lining, or there may be insufficient to be used It seems that the time is not good.) In 10^3=Material, I average particle diameter 'When the width of the groove of the circuit (the groove width is 2〇_ or less, it should be ~3^' when the groove width exceeds 1_ while below , it should be 〇 still 7~μΐη, the groove width is more than 20μιη and in 30 beer 10^ is 〇.05~7_, when the groove width exceeds 3〇μιη, it should be 〇.05~ 辞H the mutual _ The width of the portion between the circuit trench and the circuit trench and the depth of the Weilai (gap) satisfy the minimum of the groove depth and the groove depth. On the other hand, the touch is two When the depth of the groove is 20 μm, but the groove depth is 1 μm, the filler of the average particle is less than 3 μm. *υ;> ^External' The aspect of the insulating substrate is not particularly limited. Specifically, for example, : sheet f, a film, a prepreg, a three-dimensional shaped molded body, etc. The insulating substrate Α 1 is not particularly limited. Specifically, it is a sheet or a film. When the prepreg is used, it is preferably = 10 to 200, 'more preferably about 20 to 1 。. '',,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Other sub-areas are not particularly limited. Specifically, for example: from available organic; or an agent or an experimental solution ^ 易 47 201146113 or can be used to describe the following liquid (swelling _ _ _ _ _ _ Ξ ί ΐ f f f 。 。 。 。 。 。 It is not limited to the method of the film A2. After the green material, the method of applying the liquid material can be applied to the main surface of the soil material i, such as a resin film formed in advance, and a special film. S 'for example: f knows shouting coating method fine coating method, etc. - the thickness of square ΐΓ ΐΓ ΐΓ 宜 is preferably 10 or less, more preferably 5 or less. The thickness of the other film Α 2 should be above α (four), more preferably _ When the machine is too thick, 'the tilting of the lightning is used in the step of forming the groove of the circuit: t, the accuracy of the hole material (four) will be When the film is difficult to form a uniform thickness, the thickness of the film is too thin, and the film is covered with a resin coating. _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ A tree membrane having a degree of swelling of 50% or more is preferably used in a coating of a resin having a swelling degree of more than 1% by weight on the swelling liquid, and is used in the film. If there is too much problem, there will be a tendency to make the peeling difficult. The lion and the lion are special, especially limited. In particular, after the example, the liquid is coated on the support substrate. A method or the like on the main surface of the material: a liquid material, an emulsion, or the like which can form the swellable resin film by transferring the resin film to the insulating substrate Α1. Specific examples of the elastomer are as described in Example 48 201146113, an olefinic elastomer of the water 4, an acrylic elastomer such as an acrylate copolymer, or the like. When these elastomers are used, it is possible to easily form a swellable resin covering having a desired degree of swelling by adjusting characteristics such as the degree of crosslinking or the degree of gelation of the elastomer resin particles dispersed in the suspension liquid or the ritual liquid. . Further, the swellable resin film is particularly preferably a ship whose swelling degree depends on the ρΗ of the swelling liquid. If the special film is formed, by making the liquid material in the repulsion step different from the liquid condition in the _ removal step, the swelled resin film can be coated under the pH value in the catalyst overlying step. Maintaining a high adhesion to the insulating substrate, ^the swellable resin film is easily peeled off under the pH value in the film removing step. More specifically, for example, when the catalyst coating step is provided, for example a step of treating in a positive value Η hetero-acid catalyst metal colloidal solution, and swelling the swellable resin in the test solution in the range of 12 to 14 of the film peeling value: the swelling property Preferably, the resin coating is relative to the acidic catalyst metal: Γ is 25% or less, more preferably below the secret, and is relative to the testability/distress, more preferably at least 5%, and most preferably at 500. More than % of the trees are covered with mulch.体 ΐϊ ΐϊ 树脂 树脂 树脂 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The type of photoresist that has been subjected to full hardening, or a thermosetting or alkaline developing sheet. _, for example, an acrylic elastomer containing a styrene-butadiene-based copolymer olefinic acid copolymer having a filament, such as a monomer having a filament, and the like; The °=_transferable body' can be formed into a swelling resin coating having a desired liquid: a degree of the desired liquid by adjusting the dispersion or the amount of the suspension, the degree of crosslinking, or the degree of gelation. The filaments in the elastomer will be water-soluble due to the test of water solubility =====; the film from the insulating substrate table H. 卜 酉夂 里 才 才 日 日 畲 畲 畲 的 的 的 的 的 的 的 的 的 的 的 的 的 的 的Specific examples of the eight-filament monomer unit are, for example, (meth)acrylic acid, fumaric acid, 49 201146113 cinnamic acid, crotonic acid, itaconic acid, and maleic anhydride. ^ In the transfer of money-based miscellaneous silk for the discussion ~ 2_, more suitable for 1 〇〇 ~ face. #酸当量太丄溶, the compatibility of the product will be reduced, resulting in resistance to the electric lining treatment solution. In addition, when the kinetic equivalent is too large, there will be a decrease in the solubility of the water-soluble Lanna, and the molecular weight of the elastomer It should be i0000~1 million. It is more suitable. When the molecular weight of iff is too large, the _ sex will have a tendency to decrease. If it is too small, the degree will be reduced. _, the second of the electricity processing liquid A photocurable resin group using 3 photopolymerization initiators is disclosed in Japanese Patent Publication No. 231, Japanese Patent Application Publication No. Hei. No. Hei. No. Hei. For the sheet produced by the hardening, or the FR of the city, for example, a series made by Asahi Kasei Co., Ltd., etc. In addition, 'for other swelling resin coatings, for example, a resin containing a carboxyl group and a rosin: a main component (for example, Yoshikawa Chemical Co., Ltd. AZDAR229) or a resin containing a phenol as a main component (Example 2 LEKTRACHEM) Company system ri〇4F") and so on. The swellable resin film is coated on the surface of the insulating substrate by a coating method such as a spin coating method or a stick coating method, and then dried or vacuum laminated. The machine or the like can be formed by bonding the vein formed on the support substrate to the surface of the insulating substrate and then fully curing it. - In addition, the width of the circuit trench formed by the one-channel trench forming step is not particularly f ^ ° ^ body] ' For example, the circuit trench should preferably contain at least a line width of 5 to 30 μm (knife|| The trench As defines a portion of the portion of the trench that is formed by electroless forging to form an electric ore layer. Specifically, for example, the visibility of the trench formed in this embodiment is formed in the present embodiment. The line width of the electrical circuit, that is, when the shape of 50 201146113 into the narrow circuit of the electrical circuit, the circuit board of the circuit. In addition, the report accounted for the two two brothers = brother, knife, work back In terms of masculinity, 'electrical circuit and insulation'; ==, and: ===; circuit? easy to use from the insulating substrate 2 from the substrate of the road, can also make electrical circuit and insulation J material Yamaguchi _Qi, picking up the depth of the circuit base of the circuit that prevents the electrical circuit from being peeled off from the insulating substrate, is completely filled with electricity _ flat electrical circuit and absolutely ; ί ί; W-ray processing 'even if the line width is below 2 ί) μη1 below the fine-grained circuit, into the thunder tree Wei treatment step Cai Xiang no read in desire The electric flip can be used, and there is no special ship. In addition, ί 。 。 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( , or a precursor for the formation of such metals. A method for coating the plating catalyst A5, for example: a Pd-Sn colloidal solution which can be treated under the acidic ii· of pH value 3 After the disambiguation, the solution is further processed, for example, the following method: First, the surface of the insulating substrate A1 on which the circuit trench A3 and the through hole A4 are formed is adhered to In the case of the bribe and the drenching, the time is washed. Then, in response to the need, 'sodium sulphate-sulfuric acid soft secret treatment is used. Then, in the pH value of 2 aqueous sulfuric acid solution or hydrochloric acid, the special acidic solution Then, it is immersed in a concentration of about 1% of a prepreg containing a stannous fluoride aqueous solution or the like as a main component, and the chloride ions are adsorbed on the surface of the insulating base material A1. , and then impregnated with acidic Pd-Sn glue containing gasification tin and vaporized palladium and pH 1~3 An acidic catalyst metal f-like solution such as agglomerates to adsorb and adsorb Pd and Sn. Then, a redox reaction is generated between the adsorbed stannous vapor and the chlorinated I bar (SnC12+PdC^SnC^ + pd丄(51 201146113 Thus, the plating catalyst is metal palladium. In addition, 'the acid catalyst metal% gel-like catalyst solution, etc., also> Tian Erye' can use the conventional acidic Pd-plating procedure. Systematic sales of the company using the catalyst metal colloidal solution 1 such as RohmandHaas Electronic Materials Co., Ltd. There is an insulating substrate A1 of 5 hai resin film A2!v immersed in alkali, y Lf For example, the resin coating A2 coating A2 is applied to the dissolved body for a predetermined period of time, so that the resin can be detached at a concentration of about 1 to about 5%. In addition, it is also possible to make the swellable resin coating film as the resin woven fabric 2 because it swells and swells. The liquid can be broken, and the other is not limited. The type or thickness of the lion-free resin coating A2 is selected as appropriate ===thin-thorax such as ~exposure machine_water-soluble^ In addition, when using the above acidic conditions in the catalyst coating step, the resin is covered. The film A2 s is formed by an elastomer which is swollen under acidic conditions, such as a di-elastomer, an anthraquinone elastomer, and a polyester elastomer, which are swollen under the test conditions. These swellable substances can be easily swelled and peeled off by using an aqueous test solution having a pH of 12 to 14, for example, a concentration of Bu·Left $ (, a sodium solution, etc.) In addition, it is also possible to peel off the swellable resin film A2 by a light _ force. For example, a method of swelling the swellable resin film A2, for example, is immersed in a swellable 52 201146113 Μ ubiquinone insulating substrate A1 In order to improve the peeling property, it is better to use the ultrasonic wave during the impregnation to swell and not peel off, or gently press it as needed. For the method of zen treatment, for example, a color edge substrate A1 partially covered with electric money may be immersed in an electroless alkaline liquid, and an electroless electricity is deposited on a portion covered with electricity A5. The method of coating (electric money layer), etc. 'Another kind of electrolysis, 1 metal' such as: copper (Cu), recorded (four), Ming (C〇), ^ CU is the domain of the plating due to excellent impurity, It is better to choose = ί. When the stomach contains Nl, the adhesion of Nike or (4) is excellent, and it is no electricity = 电镀 of plating film A5 There is no _ limit. Specifically, ~ΙΟμηι, more preferably 丨~5哗. Especially 』 = Ϊ Ϊ 厚 can be thick 1 thick 'can be (4) to form a large cross-sectional area "wiring = when the metal wiring can be made The strength is improved, which is the preferred method. The surface/1 surface residual 働 働5 on the correct f film in the part of the circuit to be formed into the circuit trench μ8μ conductive ^ aspect can also prevent the formation of circuit trenches Electrolytic forging film. Therefore, even if a complex t-microcircuit is formed at a narrow pitch interval, no excess plating film remains between the circuits, so that it is possible to prevent problems such as knowing or migration. - 2 implementation aspects] gas thunder, -1 real, in the sample 'describes the formation of electric circuit board on the planar insulating substrate, but the invention is not limited to this. Specifically, npj use has A three-dimensional three-turn insulating substrate, which is also a circuit board (stereo circuit board) of an electrical circuit that is correctly wired, and the second embodiment will be described below. Method for manufacturing a three-dimensional circuit substrate. Description of the steps to manufacture the second to second embodiments Each step of the three-dimensional circuit substrate = "the resin film A2 is formed on the surface of the three-dimensional insulating substrate having a high and low difference portion as shown in Fig. 10 (4). Further, this step corresponds to the film forming step 53 201146113. The material A51 can be used to produce a vertical resin molded body, and is not particularly limited. The molded body is preferably formed by injection molding, and the production efficiency is good. The composition of the resin material used to obtain the resin molded body is obtained. For example, a polycarbonate resin, a polyamide resin, various polyester resins, polyphenylene sulfide, etc. 曰' The method for forming the resin coating A2 is not particularly limited. Specifically, it is the same as the first embodiment. Forming method, etc. '5', for example, J is 'as shown in Fig. 10 (9)', in the insulating layer formed with the resin film A2, and the outer surface of the film A2 is lasered or mechanically machined. It is a T-Royal A3 with the depth of the shape. The laser processing or machining of A3 is such that the resin film A2 is the thickness of the film A2. Further, this step is equivalent to the portion in which the electroless ore is formed into an electric ore layer by the circuit trench A3, that is, the electric circuit forming portion. Then, as shown in FIG. 10(C), the surface of the resin film A2 on the surface of the circuit trench A3 and the surface of the resin film A2 is covered with a catalyst metal (electrical ^10) The catalyst is covered by the catalyst. The catalyst is coated with ^1G(C) to cover the metal ruthenium 5 on the surface of the circuit trench 3 and on the surface of the resin film 2. As shown by 1G(D), Wei Liguan silk material A51 can cover the resin with A3 WL, and the catalyst metal A5 can be formed on the surface of the three-dimensional insulating substrate A51 on which the circuit groove|film is formed. On the other hand, the catalyst metal A5 coated on the resin and the surface is removed from the resin film A2 and placed on the resin film A2. In addition, this step corresponds to the film edge 1G ( In the case of E), the electroless electricity is applied to the three-dimensionally intact resin film A2. Thereby, the reading layer A6 is opened/formed on the portion of the residual metal A5. The Weiza A3 or the through-hole VIII 4 54 201146113 part is formed on the electroplated layer A6 as an electrical circuit. In addition, the step is ♦ in the electroplating process step. As shown in FIG. 1A, the circuit substrate A6 can be formed, which forms an electrical circuit A6 on the three-dimensionally shaped three-dimensional insulating substrate A51. If the circuit substrate A60 is formed, even the insulating substrate The line width and the line spacing of the electrical circuit formed thereon are narrow, the adhesion between the insulating substrate and the electrical circuit is also high, and the electrical circuit is not easily damaged. Further, the circuit substrate of the present embodiment is even on the three-dimensional circuit substrate. [Embodiment of the present invention] The present invention relates to a method of manufacturing a multilayer circuit substrate using an additive method and a method of the present invention. Multilayer circuit board manufactured by the manufacturing method. θ In recent years, portable information terminal devices, computers, 1 peripheral devices, and various information home appliances, such as mobile phones, have been rapidly becoming more highly functional. In the circuit boards mounted on these electrical devices, the electrical circuits are also required to have higher densities. In order to realize these circuits. In order to increase the density of the substrate, it is desirable to form a method in which a wire having a narrower line width and a line spacing can be accurately formed. In a high-density wiring, problems such as short-circuiting or migration between wirings are likely to occur. In the wiring of the thinner width, the mechanical strength of the wiring is lowered, and the electric power is easily cut off due to the charging factor. Furthermore, the number of stacks is increased = the number of the bumps generated on the surface is increased, and the surface is formed to be formed. The fine circuit becomes difficult. ^The method of forming the circuit of the circuit board is known as the subtraction method or the addition method. The ft method is a gold that is to be formed outside the part of the metal frame. The method of going to (subtracting), (10) into a circuit. On the other hand, the additive method is a method of performing electroless plating, (10) silk path on the base 2 electric part. In the same way, the subtraction method is a method in which the thick metal of the side film is entangled in the gold to form a circuit. If this method is used, the metal portion of the removed portion is removed, and the additive method can form the electric film only on the portion of the metal wiring to be grounded, so that the metal is not wasted. From this point of view, the additive method is preferable. The full additive method of the representative domain method of the present invention is such that, in the form of τ, the surface of the insulating substrate is coated with the electric money catalyst. Then, in the electricity money J; into a photoresist layer. Then, through the reticle forming the predetermined electrical connection, the noise is matched. Then, the circuit is developed. For the development, the table of Fig. J is subjected to electroless electricity to form a line on a portion of the circuit pattern. By these steps, an electrical circuit can be formed on the insulating substrate. > - ^ In the above conventional additive method, when a lightning supply is applied over the entire surface of the insulating substrate, a plating film can be formed in the photoresist. Fine, when you do not enter the scene, you may not be able to form part of the circuit. This is because the plating catalyst is coated on the entire surface of the insulating substrate or the paste is applied, and the line width and the test are narrow. In order to solve these problems, we have considered the application of, for example, Japanese Patent Laid-Open No. 58-186994. Money, the protective film on the wire and the wire. The groove of the circuit pattern and the through hole. Next, at the insulating base i ==:, 匕 layer. Then, the resin protective film was peeled off, and the activation layer was left only on the groove S^ and the inner wall surface of the through hole. Then, the insulation $electricity=selectively selects the technique of the activated groove and the through hole. The applicant has already left the electric bond catalyst for electroless plating at a high f. For example, a part of a circuit pattern or an inner wall surface of a through-hole, etc., is required to be patented for the purpose of the invention. (曰本特愿2008-118818 ====狮_1嶋, etc.). Reference b will be explained with reference to FIG. And f is applied to the surface of the insulating substrate & the resin film is applied, and the groove "go through hole d 56" having the desired circuit pattern is formed on the insulating substrate a to which the resin film b has been applied. 201146113 The bottom surface of the trench e in the crucible is the same as the surface of the insulating substrate a. However, it does not matter whether the trench c is excavated deeper than the surface of the insulating substrate a. Next, as shown in Fig. 17 (: No, in The surface of the trench c and the through via d and the surface of the resin film b are coated with an electrocaloric catalyst e. Here, the neocatalyst contains its precursor in the reddish color. Next, as shown in Fig. 17D, the resin is used. The film b is peeled off to leave a plating catalyst e on the surface of the trench c and the through hole d. Then, as shown in Fig. 17E, an electroless ore film f is formed on the remaining portion of the plating catalyst e to obtain A circuit board 形成 of a conductive layer having a high precision is formed on the surface of the trench c and the through-hole d. Further, in recent years, a method for manufacturing a multilayer printed circuit board having a high density is described as follows: The mesoporous layer method of interlayer and pores is well known, and such The layering method, if the application diagram is as ruthless, firstly, as shown in Fig. 18A, the circuit i ί which has formed the ith electrical circuit h is not the surface method of the circuit substrate g. In addition, the formation path of the first circuit h, as shown in Fig. 18B, forms an insulating layer i on the surface of the electric, base, g on which the first circuit h has been formed. As shown in (10), a resin film is formed on the surface of the diarrhea.] Next, as shown in FIG. 18D, a film of a resin film is formed from the second layer of the second layer. (4) The pattern k and the interlayer connection hole m. The circuit diagram 荦 to the H-connection hole m: to the ith circuit h of the circuit board g, and the surface of the second circuit is connected, on the surface of the resin skin j, The circuit pattern (4) is overlaid on the surface of the first circuit h and the surface S of the exposed first circuit h can be simplified for the purpose of the operation. Next, as shown in Fig. 18G, For the (3), the electroless plating is performed, and the electroless plating is formed on the portion of the circuit pattern k of the residual electric ore catalyst n. In the plating film, the second electrical circuit p is formed on the insulating layer i. Further, the electroless plating film is grown from the second circuit h located at the bottom of the interlayer connection hole „1, thereby filling the interlayer connection with the electric metal The hole m is formed by the second circuit P and the circuit board g which form the metal! The circuit h is connected to the q column and connected between the layers. π However, if the part of the circuit pattern k and the layer are connected to the hole m at the same time as the electroless electric wire, the line width of the crotch portion is very iced. The depth is also very shallow, so the circuit part is deeper when the shaft conductor is formed, so the electric age is required to fill for a long time: == The conductor of the final part is formed at the end of the electroless plating, as shown in the figure l8G, = even, with The metal filling of the hole is slightly sufficient, and it becomes a hole for connection with the system. On the other hand, if the electroless plating is used for the inter-layer connection charge, the circuit portion will form a too-bound body and become prone to a short one. In addition, the volume of the hole for narrowing the interlayer connection is proposed in the literature, so that the metal in the short-term hole is used. Since the filling is performed, the depth of the interlayer connection hole is made smaller to reduce the diameter of the interlayer connection hole. However, as far as the former is concerned, there is a good implementation in the design of the circuit substrate. In addition, in the latter case, the contact area between the connection hole and the circuit becomes small, and the reliability of the connection between the layers is lowered: the diameter of the connection hole is reduced to the width of the wiring groove for the circuit pattern or ^ In this case, the metal filling can be completed in a short time, but at this time, the inner wall surface and the bottom portion of the interconnecting hole are grown, and the inner surface of the interconnecting hole is also grown, and it is easy to generate voids in the inside of the metal post. 〇ΐΐϋΐ目ΐ* provides a method for manufacturing a multilayer circuit substrate, which can be solved in the case of a super-addition method when a magnetic circuit board is used. It is also possible to U = fill the hole sufficiently and well to fill the metal, and prevent the formation of the circuit portion. The manufacturing method of the multilayer substrate of the present invention is connected to the electric plate of the electric shaft lining machine (four) Build 58 201146113' 1 circuit# The first insulating layer of the first insulating layer is formed on the circuit forming surface of the circuit board: a step is formed; an opening is formed on the first insulating layer from the outer surface, so that the opening step is formed; the first electric is exposed a step of forming a metal post on the circuit to form a metal post; forming a second insulating layer on the top of the first insulating layer and the top of the metal post; forming a second insulating layer a circuit _ forming step of forming a groove having a thickness of at least the resin film and a predetermined depth of the second 乂 以及 and a predetermined rotation groove and a circuit pattern; The resin film a catalyst overcoating step of coating an electric forging catalyst on the surface of the pattern of the hί road; a step of removing the film from the resin film by the , , , , and a*; The edge layer is implemented with electroless ore, and the second electrical circuit is formed on the first insulating layer and the second insulating layer on the first and second insulating layers of the electrical and electronic devices. At the same time make the = circuit board (four) 丨 Wei circuit through the metal column in the connection = step. According to the above method, since the second insulating layer forming step, the opening forming step, and the metal post forming step are used to fill the interlayer connection hole with the Wei metal in advance, the unintended circuit portion forms a multi-conductor, It is possible to spend time fully connecting the layers with (4) filler metal. Further, since the circuit does not form as described above, the plating film does not grow from the side of the circuit pattern, and the generation of voids can be prevented, so that the metal filling condition is good. New, after the completion of the metal filling of the inter-layer pores, the second insulating layer forming step, the film forming step, the circuit pattern forming step, the catalyst-separating step, the film removing step, and the electric money step are performed, as shown in FIG. 17A to FIG. The addition method described in 17E forms the conductor of the circuit portion, so that a fine conductor having good precision can be formed in a short time, and an unnecessary conductor can be prevented from being formed in the circuit portion. According to the above, even if the fine circuit pattern and the interlayer connection hole are mixed, the additive method can be suitably applied to smoothly manufacture the multilayer circuit substrate by the build-up method. ~ The "metal pillar" formed by the metal pillar forming step may have a thickness that is thicker than the conductor layer constituting the electric circuit, and may have a conductive 59 201146113 convex portion that protrudes in an approximately vertical direction on the electric circuit, and the shape thereof is not Specially limited. For example, in addition to a columnar shape having a fixed cross-sectional shape such as a column or a corner post, the cross-sectional shape may be changed in the longitudinal direction or in a truncated cone shape. The "groove" of the circuit pattern formed in the circuit pattern forming step is mainly a groove, and the "opening" is, for example, an opening for the electrode pad portion. However, the corresponding condition is the hole for interlayer connection (different from the hole for interlayer connection completed by the previous metal filling). In addition, according to the above configuration, since the resin film is formed on the outer surface of the second insulating layer/on the outer surface of the second insulating layer, the total thickness of the second flag and the thickness of the second insulation and thickness are determined. The resin film is removed, so the second (4) processing is performed in the portion of the circuit pattern. Therefore, the bottom surface of the circuit bribe is located at a position "below the outer surface of the second insulating layer" to form a part or all of the outer surface of the second insulating layer of the buried cake constituting the electric circuit. Gentleman's fruit, add the thickness of the conductor layer 'and ensure that the electric 'ϋ ί the thickness of the body layer protruding from the second insulating layer, protect the ^ = , , , color edge, Yue Xiong Luo 'eliminate or reduce on the circuit forming surface The bumps produced. The bottom surface is decorated with steps (4) The top of the gold flank from the Kushiro pattern: the top two pad conductor layer from the outer surface of the insulation layer 丄 = the position of the surface, it is a two-plated metal filled to the bottom of the circuit pattern, making the metal face - the bottom surface of the pattern is excavated to the outer surface g surface of the first insulating layer: =- 201146113 The edge of the column is opposite to the surface of the filament, but the top of the golden age is stopped at the top of the growth phase before the growth stops. After the metal surface forming step of the pattern is formed, the top of the metal pillar is removed to the electric pole. In the circuit pattern forming step, the top of the metal pillar or the large exit pupil can be surely achieved by modifying the top of the metal pillar. The position is such that the top of the metal post does not protrude from the bottom surface of the circuit pattern. In the step of opening ί, the electroless magnetic film is used to make the electric ore film from the dew = that is, the electric deduction path is regarded as the electroless Wei, so that the gold can be formed reasonably. In addition, the present invention can also be formed in the metal column. In the step, after the η surface, the _ surface of the opening, and the surface of the exposed electrical circuit are coated with the electroless electroless plating, the surface of the first insulating layer is removed by performing electricity: electricity 1 ΐί Electroplating metal deposited on the outer surface side of the color edge layer. In the case where it contains: dissolve ======== On the insulating layer, if the resin film is removed from the surface of the insulating layer, the circuit can be prevented, and the multilayer circuit substrate can be prevented. The multi-residue circuit board manufactured by the above manufacturing method. Therefore, even if the fine circuit pattern is connected to the ground, the metal is sufficiently filled in the interlayer connection hole, thereby producing a multilayer circuit substrate which causes a problem such as a short circuit. The scoop conductor is not easy 61 201146113 = 艮p, and the third embodiment of the present invention includes the following technical contents. May 3rd Item 1. A method of manufacturing a multilayer circuit board having interconnected electrical circuits and interlayer connection holes, comprising: in the circuit board on which the first electrical circuit is formed, the shaft surface is insulated The first step of the layer formation step; forming an opening from the outer surface on the first insulating layer of 5 hai, so that the first! The exposed opening of the electrical circuit forms an if姊 yarn step of filling the opening with the metal clock metal on the first electrical circuit to form a metal f; on the outer surface of the first insulating layer and the top of the metal pillar a second insulating layer forming step of the layer; a skin forming step of the outer film of the second insulating layer; and a total of a thickness of the fd day skin and a thickness of the second insulating layer formed on the outer surface of the resin film The above ί slots and/or openings are used to form a circuit pattern of the circuit pattern, and the portion of the first gradation pattern and the metal _: J circuit, and the first circuit of the insulating layer is transmitted through the metal column Electroplating step of connecting between layers. The first electrical method of the circuit board: == step; the portion of the electric circuit in which the bottom surface of the board is exposed and protruded to form the circuit pattern circuit pattern is regarded as the electric thin portion: , the first request of the top of the ih metal (four) Item 3-3. If the request item 3-1 is a method of the present invention, in the circuit pattern forming step, the bottom surface of the manufacturing side of the substrate is exposed or protruded (four) manner to form the Wei _ jin zhi's not from the circuit pattern method' The manufacturing method of the circuit board of the ί 在 在 = = = = = = = = = = = 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 After that, the position of the bottom surface of the top of the metal post will be exposed, and the circuit diagram will be exposed or protruded in the circuit. The method of manufacturing the Rulu substrate of any one of the items of the column of the I column is not to be found in the top of the column of the I column. = layer electric power = the electroless plating is used to grow the electroplated film, whereby (4) metal plating is filled with electricity to find the item 3-7. As described in any one of claims 3-1 to 3-5, the manufacture of the substrate The method 'where' in the metal column forming step, the electric surface, the inner wall surface of the hole and the exposed first! The surface of the electrical circuit is covered with minerals, and then the plating metal deposited on the outer surface side containing the first insulating layer is removed. The method of manufacturing a road board according to any one of the preceding claims, wherein the resin fine layer can be dissolved or removed from the insulating layer by a predetermined liquid enthalpy or The multilayered circuit board manufactured by the method of the invention described in any one of the claims 3-1 to 3-8. According to the present invention, even if the fine circuit pattern and the interlayer connection hole are mixed, the additive method can be suitably applied, and the multilayer circuit board can be smoothly manufactured by the build-up method. However, since the electric circuit is buried in the insulating layer, it is possible to ensure the mechanical strength of the circuit to protect the circuit, prevent the edge of the circuit from falling off, and prevent the occurrence of bumps on the circuit forming surface. [Embodiment 3] FIG. 13 is a partial plan view showing the structure of the electric circuit F27 of the multilayer circuit board π of the present embodiment, and the arrangement of the interlayer connection holes F21 (with the metal post F22). As shown in the figure, in the present embodiment, the multilayer circuit substrate F of the electrical circuit F27 and the interlayer connection hole F21, that is, the via holes are connected to each other, can be manufactured. The circuit F& includes a wiring F27a having a fine line width and a pad portion F27b for electrodes. The electrode pad portion F27b is provided to overlap the interlayer connection hole F21. The I-I line in Fig. 13 indicates the cutting position of the end view of Figs. 14 to 16. In Fig. 14, reference numeral F10 is a circuit board, symbol Fli is an i-th electric circuit, symbol 63 201146113 嘌 symbol F21 is a hole for interlayer connection, symbol F22 is a metal pillar, and symbol 2 is a resin film, symbol F24 is a resin film, symbol F25 is a circuit diagram, two F26 is an electroplating catalyst, symbol F27 is a second electric circuit, and symbol F3 shows the entire insulating layer in which the insulating layer F20 and the second insulating layer F23 are combined. As shown in FIG. 141, in the multilayer circuit board π, the second electric circuit Fn is provided on the road substrate F10, and the second electric circuit F27 is provided on the insulating layer F3 (the first insulating reed F20 and the second insulating layer F23). The upper insulating layer F30 is stacked on the circuit board π. The first electric circuit F11 and the second electric circuit F27 are connected to each other through the interlayer connection holes F21 (and the metal posts F22) provided on the i-th insulating layer F2. <Circuit Substrate Preparation Step> In the manufacturing method of the present embodiment, first, as shown in FIG. 14A, the circuit board fi (the circuit board preparation step) in which the first electric circuit F11 is placed is prepared. In the case of 14A, the first circuit F11 is placed on the surface of the circuit board, but may be buried on the surface of the circuit board F1. Further, the method of forming the first circuit Fn is not closed. The profitable method is formed by subtracting the method or the addition method to know the circuit formation method. Furthermore, the 'secret substrate' can form a circuit in a single φ or a circuit on both sides. Further, it may be a multilayer circuit substrate. The circuit board F10 can be any organic substrate which is conventionally used in the manufacture of a multilayer circuit board, and is not particularly limited. Specific examples of the organic substrate include, for example, an epoxy resin, an acrylic resin, a polycarbonate transesterification, a polyimide resin, a polyphenylene sulfide resin, a polyphenylene ester, and a cyanate resin. A substrate composed of a resin such as a double-stranded amine resin. The pattern of the circuit board no may be a sheet, a film, a prepreg, or a molded body having a two-dimensional shape, and is not particularly limited. The thickness of the circuit board is not particularly limited. For example, when g is a sheet, a film, or a prepreg, the thickness may be set to about 1 to 500 μm, and more preferably about 20 to 200 μm. The detailed description of the circuit board F1A is the same as that of the first insulating layer F20 described below. <Insulation Layer Forming Step> Next, as shown in Fig. 14B, the surface of the circuit board F10 on which the jth circuit Fu is provided (circuit opening & surface formation) is opened as the first insulating layer ρ2〇 ( The first insulating layer forming step). The aspect of the first insulating layer F20 is not particularly limited. Specifically, for example: 64 201146113 A sheet, a film, a prepreg, and a three-dimensional shaped body, or formed of a resin solution. The thickness of the first insulating layer F20 is not particularly limited. Specifically, when the film is a film or a prepreg, it is preferably set to, for example, 10 to 2 Å μm, and more preferably 2 to 100 Å. Further, the first insulating layer F2 may contain particles such as cerium oxide particles. For example, pre-pressurization may be performed on the surface of the circuit board F10 to be expanded and bonded, and then hardened to form an i-th = hot press to be hardened. Alternatively, the i-th insulating layer F20 may be formed by coating the machine solution ' on the surface of the circuit board F1 (four) and then hardening it. In addition, 2 tools such as a mold and a frame tool are used to place the insulating layer material, and the pressurization is performed to harden one, and the fine molded body ' can also be stacked on the sheet, the film or the prepreg; the material obtained by J 2 ^ is stacked on the circuit. On the surface of the substrate, it is hardened by adding = ^ sheet =, or it is hardened by heating and pressing, and the three-dimensional shape is formed. "It is possible to use each of the conventional polyacrylic acid used in the manufacture of a multilayer circuit board. Resin, polycarbon m Asia!! t 1 shouts secret lipids, polyphenylene resin, cyanate ester tree 曰 魏 魏 脂 魏 魏 魏 魏 魏 魏 魏. ^Manufacture of Chinese coffee organic base

Agent Lu #this" will be limited. Specifically, for example, bisphenol A 13⁄4 milk tree, bisphenol F type epoxy resin, double s-recorded chest condensate, and resin may be used in combination of two or more kinds. (10) When the base material is composed of each of the above-mentioned respective materials, and the above-mentioned resins are generally used, it is generally not particularly limited as long as it is hardened. Specifically, for example, dicyandiamide, a phenolic curing agent, a sulfonium hardener, an aminotriazine acid curing agent, a cyanic acid resin, or the like. The present hardeners are, for example, hardeners such as plucking type, argon burning type, and terpene type. For further imparting flame retardancy, for example, a phosphorus-denatured phenol resin or a dish-denatured cyanate resin or the like can be used. Further, the curing agent may be used singly or in combination of two or more kinds of curing agents. Further, although it is not particularly limited, since a circuit pattern is formed by laser processing, it is preferable to use a resin having a good absorption rate of laser light in a wavelength range of 100 nm to 4 Å. Specifically, for example, a polyimide resin or the like. Further, the insulating base material (insulating layer) may contain a filler. The filler may be inorganic microparticles or organic microparticles, and is not particularly limited. When the filler is contained, the filler in the laser processing portion is exposed, and the unevenness of the filler improves the adhesion between the plating and the resin. _ The material constituting the inorganic fine particles, specifically, for example, alumina (Al 2 〇 3), oxidized town (MgO): nitriding (BN), nitriding (A1N), and sulphur dioxide (Si 〇 2 High dielectric constant filling material such as titanic acid, (BaTi〇3), titanium oxide (Tl〇2), etc.; magnetic filling material of hard ferrite magnet f: magnesium hydroxide (Mg (ΟΗ) 2), hydrogen and oxygen (A1 (QH) 2), samarium oxide (Sb203), pentoxide recording 2 〇 5), strontium salt, zinc silicate, compound, hard fat, etc. ^ inorganic flame retardant; talc (Mg3 ( Si4〇iG)(〇H)2), barium sulfate (BaS〇4), stone anti-text, 'bow (aCCb), mica, etc. Two or more kinds of these inorganic fine particles can be used in combination. These inorganic fine particles have high heat transfer number, flame retardancy, particle size distribution, and freedom of color tone. Therefore, when the type of the fine particles can be selected, the appropriate recording and the particle size are set to a high degree of filling. purpose. Further, although the mystery is not particularly limited, it is preferable to use a filler having an average particle diameter of _μΠ1 and a filler having an average particle diameter of 0.05 μm to 5 μm by using a filler having a flat particle size below the thickness of the insulating layer. Further, the inorganic fine particles are treated to improve the surface of the insulating substrate. In addition, the insulating substrate is specifically for the purpose of extracting the amine-free oxime, for example, an epoxy Wei system, a sulfhydryl group, a ruthenium group, a vinyl group, a styrene group, and a Alkyl propylene oxide Oxygen eve 66 201146113 Di-methoxy-Weiss, a titanate (tetra) Wei coupler and the like. The above-mentioned Wei coupling agent may be used singly or in combination of two or more kinds. In addition to the eight-hearted 'Wei margin, in order to improve the secondary release of the inorganic fine particles in the Wei edge substrate, a dispersing agent may also be contained. The dispersant is not particularly limited. Specifically, ΙλΪ, mountain, age, polyetheramine-based, polymer-based dispersant, and the like. The "Knife" can be used alone or in combination of two or more. Further, specific examples of the organic fine particles include rubber fine particles and the like. For example, when the circuit substrate F1G and the second insulating layer F2G are laminated on the surface (circuit forming surface) of the prepreg H/circuit substrate F10, the insulating layer F20' is heated and pressurized to be hardened. The material type _ and the reclining of the constitutive path substrate F1G may be different from the material type of the first and second color fringe layers F20 and the resin type. However, from the viewpoint that the circuit F10 and the first insulating layer F2 are well-closed and stacked, it is preferable that they are different types which are good in phase with each other, and are preferably the same kind as each other. <Opening Hole Forming Step> ' Next, as shown in Fig. 14C, the surface of the first insulating layer F2 is (external laser processing to form an interlayer connection on the surface (outer surface) of the first insulating layer TM) Hole F21 (opening forming step). At this time, the first circuit F11' of the substrate F10 of the interlayer connection hole F2 exposes the ith circuit Fn. Further, the details of the technique and its peripheral technology are described in other steps. The detailed description of the laser processing & basin technology is as follows. 8. In addition, the resin residue of the residual insulating layer F20 on the first circuit FU exposed by the laser processing is the slag ( It is not shown in the figure. The slag may become the original cause of the bad condition, so it should be removed by the desmear treatment. For the desmear treatment, a conventional method such as immersing the permanganic acid solution to dissolve and remove the slag is used. However, it is also possible to omit the desmear treatment in response to the situation. Meaning <Metal Column Formation Step> Next, as shown in Fig. 14D, on the exposed first circuit Fu, electrolytic plating or electrolysis, Filling the splicing hole with a plating metal, and connecting the symmetry F21 forms a metal crucible F22 (metal pillar forming step). In addition, when 67 201146113, the first circuit FU can be regarded as an electric money core, starting from the first circuit FU, and then on the other hand. In the case of the inner wall surface of the first insulating layer F20 and the surface of the exposed first circuit F11, electroless plating is performed after the electroless electric clock is applied to the surface of the first circuit F11, and electroplating is performed. After the opening F21 is filled, the key metal deposited on the outer surface side of the insulating layer immediately including the surface of the 2 F20 is removed. The shape, size, and interval of the gold foil are not particularly limited.歹1·和: The approximate cylindrical height is about 5~200μηη, and the diameter of the bottom surface is 10: Taiwan. In addition, it can be a columnar, truncated or angular insulation side (4) and grows to the first (four)=Γί In the second insulating layer forming step, a second permanent insulating layer will be described later, and before the resin film F24 is formed in the film forming step, the interlayer connecting holes for connecting the right and second circuits (10) to each other may be filled. ^ Fill and form a good enough to prevent pores Metal post F22. <Second insulating layer forming step> Next, as shown in Fig. 14E, a second insulating layer is formed on the top of the outer surface pillar F22 of the first insulating layer (2^ = positive and The same applies to the insulating layer F2. Specifically, the layer color can be, for example, a sheet, a film, a prepreg, and a three-dimensional shaped body. The thickness of the second insulating layer F23 is not produced by the coating. In particular, when the sheet is a sheet, a fine or a prepreg, it is preferably, for example, 3 to more preferably 5 to 40 μm. Further, the second insulating layer F2 has inorganic fine particles such as ruthenium particles. Regarding the second insulating layer F23, for example, it can be in the first! The outer & sheet ^ film of the insulating layer F2〇 and the viewing material field make the Wei-he, the ship hardened, and can also be coated on the outer surface of the first lining F2G. Further, a material such as a mold or a frame may be used, and a material forming 68 201146113 F23 may be placed and pressed to be hardened to form a molded body having a three-dimensional shape. The second insulating layer F23 is not particularly limited as long as it can be used in various conventional organic substrates used in the production of a multilayer circuit board. Specific examples of the organic substrate include, for example, an epoxy resin, an acrylic resin, a polycarbonate resin, a polyimide resin, a polystyrene ether resin, a polyphenylene ether resin, and a cyanide used in the production of a multilayer circuit board. A substrate composed of a resin such as an acid ester resin, a benzoxazine resin or a bismaleimide resin. The detailed description of the second insulating layer F23 is the same as the detailed description of the first insulating layer F2 先前 described above. Further, the type of material and the type of resin constituting the first insulating layer F20 may be different from the type of material and the type of resin constituting the second insulating layer F23. However, from the viewpoint of the good adhesion and stacking of the i-th layer F20 and the second insulating layer F23, it is preferable that they are different types which are good in phase, and are preferably the same kind as each other. <Thin film forming step> ' Next, as shown in Fig. 14E, a resin skin 24 (ship forming surface) is formed on the outer surface of the second insulating layer F23. The target ship (photoresist) F24 should be removed in the film removal step described below. The others are not particularly limited. The resin film may suitably dissolve the film from the surface of the second insulating layer F23 by dissolving or swelling the predetermined liquid. Specifically, for example, a leather composed of a swellable resin composed of a soluble surface which can be read with an organic solvent or a base, or a swellable resin of a pharmaceutically acceptable liquid of $. In addition, the swellable resin skin flute 9 does not have a liquid solution, but it is also finer than the resin which is easily peeled off from the surface of F23 by the scent of the scent, and also contains a predetermined liquid and may be affected by The resin film which is dissolved by the second insulating layer is dissolved or dissolved by a predetermined liquid, and the resin film which is peeled off by the surface of the second insulating layer F23 is dissolved. When the resin skin is used, the resin layer is removed. _The film is removed and scattered. "The electricity on the resin film will scatter. When the film is lightly removed, the surface of the film can be removed smoothly. It can be prevented. 69 201146113 The second method is not limited. For example, a method of applying a liquid film which can form a resin film leg on i) or a resin film formed by coating a liquid material on a support substrate is transferred to the first The other method on the surface of the insulating layer F23 is, for example, a method of forming a resin film composed of the resin film F24 formed by ice on the outer surface (surface) of the second insulating layer f23. The method is not particularly limited. For example, the material of the m Ξ film F24 is a resin which can be dissolved by a predetermined liquid or dissolved or removed by the surface of the insulating layer F23, that is, L which is known as a spin coating method or a stick coating method. '/, ί is not particularly limited. It is preferable to use a resin having a swelling degree of 5 〇〇 / 对 or more for a given liquid of 1 〇〇 % or more, preferably using a degree of swelling in addition to swelling. When the degree is too low, the resin film may be difficult to peel off. (4) ίί ' f The degree of swelling of the fat film (sw) can be based on the weight before swelling -) and swelling ^ 弋 ^ (8) with "swelling degree SW = ([m (8) - m (b)] / m (b)} χ 1 〇〇 (%)" The method of drying the pre-liquid or the ritual liquid of the elastomer on the surface of the second insulating layer F23 and drying it, or coating the elastic substrate on the support substrate. After the liquid or the emulsion, the film formed by drying the film formed on the surface of the second insulating layer F23 can be easily obtained. - Specific examples of the living body, for example, styrene-butadiene An acryl-based elastomer such as a fluorene-body acrylate or a copolymer such as a diene-based copolymer, and an elastic one or the like. If these elastomers are used, they can be dispersed into a suspension or a milk by adjustment. 2 The resin film having a desired degree of swelling is easily formed by the characteristics of the degree of crosslinking or the degree of gelation of the lipid particles. Further, the resin film is particularly preferably a film whose swelling degree changes depending on the pH of the swelling liquid. If the scale is different, the liquid material in the coating of the Lai is different from the liquid condition in the step of removing the film described later. The resin film F24 maintains a high adhesion to the second insulating layer F23 under the pH of the catalyst coating step. 201146113 ίIn addition to the pH in the film removal step, the resin film F24 is easily Peeling the bovine head i12~14 in the alkaline solution to make the resin film swell 6〇=^, '=^=_catalyst gold scaly solution _ moistness should be in Bu, #~,, under 4〇, Further, the degree of swelling of the test solution is preferably 50% or more, more preferably 100% or more, and more preferably 5% or more. The film of the sea surface is, for example, an elastomer having a predetermined amount of silk. Dry film photoresist for forming a pattern of a stone wiring board (hereinafter also referred to as dfr)

The sheet obtained by the It i development type resist is cured after being fully cured, or a thermosetting or inspecting developing sheet. s of the unit _ ', for example, a styrene-butadiene-based copolymer having a carboxyl group and a styrene-butadiene-based copolymer having a carboxyl group in the sub-group; The acidity equivalent of the elastomer, the degree of crosslinking, or the degree of gelation, etc. In addition, it is also easy to form a carboxyl group in the resin skin which is dissolved by the liquid in the film removal step, and the carboxyl group in the aqueous solution is swollen in the aqueous solution, and has a tree. The skin, from the side of the 2nd absolute ride F23 surface lion. Further, the molecular weight of the polymer of the acid #1 carboxyl group. Specific examples of the monomer unit having a silk, such as (meth)acrylic acid, cinnamic acid, crotonic acid, itaconic acid, and maleic anhydride. The content of the Wei group in the filamentized elastomer is from 1 〇〇 to 2 _, more preferably from 100 〜. When the acid equivalent is too small ("too many"), the compatibility with the solvent or other composition is lowered, and the resistance of the conductively plated ruthenium treatment liquid tends to decrease. In addition, when the acid is used as the amount of the base When there is little time, 'the hybrid water-soluble lion will have ^. In addition, the molecular weight of the elastomer should be 10,000 ~ qing Wan, more preferably 20,000 ^ 50 to 10,000, 71 201146113 ^ child is 20,000 ~ 60,000. When the molecular weight of the body is too large, the peeling property will be too small, and the viscosity will decrease when it is too small. To maintain the uniform thickness of the resin film, the resistance of the pretreatment liquid for electroplating will also deteriorate. In the process, ', in addition, DFR Acrylic resin containing a predetermined amount of carboxyl groups, hydrazine, ΐΐΪ ί, phenolic resin, ethyl phthalate ate, etc. as a 'resin to OT2R 〇 5 as ff _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The sheet obtained by the surface hardening disclosed in the Japanese Patent Publication No. JP-A-212262, or the DFR of the commercially available test, for example, a series manufactured by Asahi Kasei Co., Ltd., etc. , for example: containing a carboxyl group and using rosin 1 Resin (for example, Nazd, manufactured by Yoshikawa Chemical Co., Ltd., a resin containing phenol as a main component (for example, "104F" manufactured by LEKTRACHEM Co., Ltd.)) Resin film F24, which is coated by a conventional spin coating method or a stick Cloth method = fat = float or emulsion applied to the surface of the second insulating layer F23. A tool such as a vacuum laminator will be formed on the surface of the & layer F23 on the support substrate. Fully hardened, it can be easily shaped, and the thickness of the other '] should be, for example, below 10, more preferably at 5μΓη = corpse pattern F25 in laser processing or machining to form the right ί ΪΓ Ϊ grease film F24 should be used, for example, in the case of an equivalent amount of acid in the 100~_ left-turned C-side egg. In addition to the above, the resin film F23 should also have the following characteristics, and also the surface. 72 201146113 Outline; (3) High; 'There will be a detailed description, but in the case of the attached drug solution', although the text is acidic (pH 1~3) water, the liquid is in the case of ice 11/catalytic system, 'all ΐϋΐ pH^f PH ^ ^ When immersed in the liquid, the photoresist does not live. It means that when the photoresist is formed into a film, in general, Ι ί , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Second, the treatment by the film removal step is 'not limited to this. In order to melt or spray the manufacturing steps or reduce the material loss, etc., for the sake of simplicity, the bending property of the film is still necessary. ^^ And in order to ensure easy handling or time is random. If it is, it will be a ^~boot in the fit of 4, and it will be a three-layer structure that works repeatedly, but it is not the same. Membrane clips are the best, but they must also be stored at room temperature. The composition of the dry film will not separate, f_ will not drop & = deposit. From the above point of view, the resin has at least one type of monomer polymerized with at least one of the polymerized monuments and the fine surface H. The soap body on the seed and the (9) can be opened in the 7-28U37 bulletin, 曰本^ know the technology 'for example: 曰本特本特开2_—such as carrying, Japanese special toilet 73 201146113 201851荨. Regarding (a) monomer 'for example: (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, maleic anhydride, maleic acid half ester, butyl acrylate, etc., can be used alone' Two or more types are used in combination. Regarding the (b) monomer, for example, it is not acidic and has (a) polymerizable unsaturated group in the molecule, but is not limited thereto. It is possible to maintain various resistances in the plating step, flexibility of the cured film, and the like. Specifically, 'methyl acetoacetate vinegar, methacrylic acid vinegar:: acrylic acid ugly, methyl (10) acid positive ester, methacrylic acid second butyl vinegar, methyl vinegar, methacrylic acid 2 Methyl acrylate 2 side: erythritol, methacrylonitrile, styrene styrene derivative, etc., such as erythritol and vinyl acetate vinegar. Further, it can be obtained by using one of the above polymerization or acid polymerization in the molecule. Further, a monomer having a plurality of unsaturated groups is selected from a single f which is aggregated by 1 in a three-dimensional crosslink. In addition, when the reactive functional group guide towel such as S amine group, amine group or ethyl group contains the county, the acid equivalent of the amount of sulfhydryl group contained in the resin is more suitable for the lion. When the acid equivalent is too low When the main resin is suitable to have the 孰 plasticity temporary station ancient μ; picking this & species = characteristics can also be grafted to make it =, _: 5 〇 _, about _ ~ ί, if ^ 曲Or electric_adhesive liquid resistance (acid resistance) will be reduced by two large liquids r: ^^ system, can also be introduced into the cross-linking point. Prevent thermal deformation during laser processing or flow control plasticizer as a brewing (4); 74 201146113 言=如: methyl methacrylate, ethyl methacrylate, methyl propyl hydrazine :: butyl vinegar, methacrylic acid second vinegar, methyl propylene and ethyl acetate Vinyl alcohol _ class mu and base thief or acid _ polymerization can also be obtained. Then 'multiple official mouth = two = single, can also contain other two or more single ^ ^ monobasic acid ester, or polypropylene glycol Methyl acrylate, polyethylene glycol propane = arr-poly 3: ^ / propylene s_ poly succinyl methyl di, di neopentaerythritol penta methacrylate, tris (tetra) ene 5 甲其 trace ί The basic base of the Wuyi Warfare) is a kind of polyacrylic acid which contains an amino phthalic acid vinegar. The filler of the above monomer or the monomer which reacts the monomer is not particularly limited. Specifically, the example _ = equal = = thick cracked, and the shaft 'coarse grain is cut, but it can also be used as a dispersing agent, a photopolymerizable resin (photopolymerization initiator), a polymerization preventive substance or In the circuit pattern forming step of the pigment), the thermal polymerization initiator, and the epoxy group, the resin rib 3 is required to utilize the laser force of the photoresist because of the lightning relationship.

Second-class: 5S, with various intrinsic wavelengths, using materials with high absorption rate for this wavelength, 75 201146113 where (10)-YAG laser is suitable for fine processing, laser-like material) for these wavelengths Leather, can be "two when the lack of ΐ η limit" also has a relatively low absorption rate of the photoresist material will be lower than the ϋ ϊ ϋ ϋ absorption rate is lower, the W light can pass through the photoresist F24, can be 隼 ===== When the first insulating layer is processed, it is possible to obtain particularly good results. For example, = and the ease of laser processing for the laser processing of the photoresist F24 is easy and the scale is set. In the surface of the resin film F24 (outer surface), the thickness of the surface of the resin film F24 is 値Into the circuit _5 (circuit pattern forming step). The circuit diagram is formed by F25 1, Fan Cheng 1 cutting or profiling, etc. In addition, the ptf ^ of the circuit pattern F25 is used as the wiring (4) (refer to ® 13). Trench, circuit diagram slaughter ^ is the example of the padding section (four) (see the _ off hole. In addition, milk can also contain interlayers With the hole (in the case of the circuit pattern F25 which has been measured in the thickness of the metal column, as shown in FIG. _, if to the red insulating layer F20 but on the outer surface of the first insulating layer F20 (the circuit of the table is drunk) The state of F25. On the other hand, in the case where the formation exceeds the total thickness, the first insulation layer is formed as shown in Fig. 15F of the third embodiment or Fig. 16F of the third embodiment. F2. The state in which the circuit pattern F25 is buried on the outer surface (surface) of the first and the edge a-20. The width of the groove for the wiring F27a in the circuit pattern F25 is not particularly limited. In the case of the processing, the method of forming the circuit pattern F25 even in the fine groove having a line width of 2 〇μΠ1 并无 is not particularly limited. Specifically, it is possible to use a cutting process such as a shot machining or a cutting process by Ray 76 201146113. In order to form a high-precision fine circuit pattern F25, it is preferable to use a laser processing. The laser processing is used to control the output (energy or power) of the lightning element, and the depth of the first insulating layer F20 is compared. Adjustment. In addition, regarding the press type processing, it is preferable to use, for example, a nanoprint. In the brush field, a molding process using a fine resin is used. / After forming the predetermined circuit pattern F25', the electroless plating film is provided to define a portion where the second electric circuit F27 is formed. Further, the pattern shown in the third embodiment is shown. 15F indicates a case where the circuit pattern forming step forms the circuit pattern F25 in such a manner that the bottom surface of the pattern F25 is exposed and protruded at the top of the metal pillar F22 previously formed in the metal pillar forming step. When the first insulating layer F2 is excavated by laser processing, the resin or the like constituting the first insulating layer F20 is easily removed, but the plating metal constituting the metal post F22 is difficult to remove. <catalyst coating step> Next, as shown in Fig. 14G, the plating catalyst F26 is plated on the surface of the resin film F24 and on the surface of the circuit pattern F25 (catalyst coating step). That is, on the surface of the circuit pattern t F25 resin film F24 u and the insulating layer F3G, and on the surface of the circuit pattern t F25 smear film F24 a and the insulating layer, all of the electric ore catalyst F26 is coated. In addition, from the viewpoint of electroless electricity, which will be described later, it is not necessary to cover the surface of the metal main F22, but the entire surface of the resin film F24 and the insulating layer F3. Catalyst F26 simplifies the job. This 'electro-mineral catalyst F26 conceptually contains its precursors. Eight (four) ί shop media - for the money to say Wei step shot _ into the electroless electric shovel film. The catalyst is pre-applied to the §Hai electric film on the knives. Electro-mineral catalyst can be used Xi = electroless plating, other than _ limited. Further, the precursor of the j F26 may be preliminarily coated and the electric metal catalyst ρ26 = may be removed after the removal of the resin film F24. Specific examples of the electric charge medium F26 include, for example, a metal which can form a scale metal in addition to metals such as metal (4) and platinum '^(Ag). The method of coating the electric ore mine, for example, using the method of treating the Sn miscellaneous at a pH of 1 to 3, and then using the method of 77 201146113 Shibuya. More specifically, for example, the following method. The resin skin 臈F24 and the insulating layer F30 of the surface pattern F25 are subjected to a predetermined time 的 液 (cleaning agent, blending agent), itri ° ° · 10 ^ sub-adsorption; ^ etc. as the main component of the pre-dip liquid towel A prepreg treatment is performed on the surface of the vaporization of the i iitn F24 and the insulating layer F3. The mixture is vaporized with stannous and an acidic Pd-Sn acidic catalyst metal colloidal solution having a pH of 1 to 3 to agglomerate and adsorb Pd and Sn. Iron ίη ΓΐΓ gasification of stannous and chlorine to produce a redox reaction between her (Saki 2 - nCLj + Pd!;). Thereby, the electric shovel catalyst Fa, that is, metal palladium, is precipitated.

Sn wins / touches ^ ^ Catalyst metal colloidal solution, can use the traditional acidic Pd - Lei Keshi material to make the thief Lai Ling is a gelatinous solution limited 41 series = = order 'for example: ^ Yi S Electronics The material stock F24 treatment "can be covered with the electric shovel F26 on the surface of the resin film, and the circuit pattern F25 as shown in Fig. 14G. <Thick film removing step> (4) The resin film pa (the skin removing step) is removed from the insulating layer F30 (more specifically, the second insulating layer F). That is, when the resin film is a soluble resin, the resin film F24 is dissolved using an organic solvent or an alkaline solution, and the surface of the insulating layer F3G is removed. Further, when the resin film is a swellable resin, the resin film F24 is swollen by the dissimilar body, and then peeled off from the surface of the insulating layer. By the film removing step, the electric ore F26 can be left on the surface of the insulating layer (4). On the other hand, the electric money catalyst F26' on the surface of the resin film is newly removed from the insulating layer together with the resin film F24. Here, from the viewpoint of preventing the electric ore catalyst F26 removed from the insulating layer F3 from scattering and re-coating on the surface of the insulating layer F3, the resin film Fa is removed from the insulating layer 78 201146113 F30 without being torn apart. It is better to keep the whole and remove continuously. The liquid which dissolves or swells the resin film F24 does not substantially dissolve or dissolve the circuit board F10, the insulating layer F30, and the electric contact catalyst F26, and the resin film F24 can be dissolved or swollen to be easily dissolved from the insulating layer F3. The degree of removal or stripping of the liquid can be removed, and the others are not limited. The liquid is used as the liquid, and it is possible to select a suitable one according to the type or thickness of the resin film F24. Specifically, for example, when a photocurable epoxy resin is used as the photoresist resin, a photoresist removing agent having a solvent-based alkaline aqueous solution or the like can be used. Further, for example, when the resin film F24 is formed of a diene-transformed body, a propylene I(tetra)-form, and a poly-transformed body, or when the resin film F24 has (8) at least i polymerizable in the molecule, a saturated carboxylic acid or an acid _ at least one of the above monomers and (9) a platable (8) monomer, at least one of which is obtained by a lysine polymerization, or a resin composition containing the hydrazine, or In the case of the above-mentioned acidic conditions, it is preferable to use an aqueous solution such as a concentration of the aqueous solution of the aqueous solution of the aqueous solution of the sodium hydroxide. When the procedure is used, the resin film F24 should have a swelling degree under acidic conditions of 6 (%) or less and 40% or less. Under the test conditions, the degree of swelling is above 鄕. For example, the two-faced, acrylic-based and poly-I a compound of a cast body or the like, or a monomer having at least 1 ^ or more of an acid or an acid anhydride having at least one polymerizable unsaturated group in the blade, and (b) polymerizable with the monomer (9) At least the above-mentioned single-components or the inclusion of the compound The shape is formed by the art 3 = a slow-base acrylic resin. The resin film, 1 irfo 4 4 is preferably an aqueous solution having a pH of 12 to 14, such as a concentrated solution~=^1 The aqueous solution of cerium oxide is used to dissolve or swell, and it is irradiated with ultrasonic waves when it is used. In addition, it can be peeled off by the method of _5 film F24, for example, : It will be covered by the resin film F24 ίH f. In addition, in order to improve peeling removal or dissolution removal, it is especially suitable when it is impregnated. ^ 79 201146113 In addition, when When it is difficult to remove or dissolve and remove, it may be lighter than necessary. [Electroplating step] Next, as shown in FIG. 141, the insulating layer F3 is not provided, and the portion of the plating catalyst F2 (10) circuit pattern F2 5 and gold, An electroless surface is formed on the exposed portion t of the main F22 to form a second electric circuit F27 on the insulating layer F3G (that is, the first insulating layer F20 and the color layer F23). Further, the insulating layer F30 is formed. The first circuit F27 and the first circuit m of the circuit substrate F10 are connected to each other through the metal pillar ρ22 (electrical ore) By using the electroless electrowinning treatment, an electroless electro-money film with good precision can be deposited on the portion of the road pattern F25. The processing method can be used to make a part of the coating material H insulating layer F30 & a method of depositing an electroless plating film on a portion of the electroless electrolytic ore that is coated with the plating catalyst ρ26. 'Metal for electroless ore, such as copper (Cu), nickel (four), (c.) and aluminum (A1) 荨. Among them, electroplating with Cu as a main component is preferable because it has excellent conductivity, and 'resistance to insects or adhesion to solder when Ni is contained. Excellent and preferable selection The film thickness of the non-electrolytic plating film of the Yankai 并无 is not particularly limited. Specifically, for example, 〇 1 to ΙΟμηι ’ is preferably about 1 to 5 pm. Using the electric clock step, an electroless plating film is deposited on the surface of the insulating layer F3G with a neocatalyst F26. If so, a highly precise conductive layer can be formed only on the second circuit F27 to be formed. On the other hand, it is also possible to prevent the electroless electric ship from being deposited on the portion where the circuit pattern F25 is not formed. Therefore, even if the fine wiring F27a having a narrow line width is formed at a narrow pitch interval, the excess plating film is not left in the adjacent wiring. Therefore, it is possible to prevent problems such as short circuit or migration. With these plating steps, the laser processed surface on the surface of the insulating layer F3G can be used. Thereby, a new second circuit F27 is formed on the surface of the insulating layer F30, and the second circuit F27 of the insulating layer and the first circuit F11 of the circuit = 透过 are transmitted through the interlayer connection hole F21 or the metal pillar, and the layer 201146113 By repeating or repeating these steps, as shown in Fig. 13, a multilayer circuit substrate π having the second circuit F27 on the surface of the insulating layer F30 can be manufactured. Then, in the layer circuit board FI t, the electric circuits F1 and F27 and the interlayer connection hole F21 are connected to each other in each layer, and the electric circuits FU and F27 of the respective layers are connected to each other through the interlayer distance holes F21. According to the manufacturing method described in the embodiment, the film thickness of the second circuit F27 can be freely adjusted by adjusting the depth of the circuit pattern F25 with respect to the insulating layer F30. = Second, the second circuit F27 can be formed in a deeper portion of the insulating layer, or the plurality of circuits 2, F27 can be formed at positions different in depth from each other. Further, by forming the second circuit F27 in a deep portion of the insulating layer F30, a thick circuit F27 can be formed. The thick film has a large cross-sectional area, so it has a high strength and a capacitance of 4 °. In the manufacturing method of the present embodiment, the first insulating layer forming step and the opening are formed by the formation of the circuit pattern F25. In the step of forming the metal column, the interlayer connection hole F21 is filled with the plating metal in advance, so that it is not necessary to care whether or not the second circuit F27 forms the outer conductor, and it is possible to take time to sufficiently fill the metal for the interlayer connection hole F21. Further, when the metal for the interlayer connection hole F21 is filled, since the circuit pattern F25 is not formed, the plating film does not grow from the circuit pattern side, and the occurrence of voids can be prevented, and the metal filling can be improved. Then, after the metal filling of the interlayer connection holes is completed, the second insulating layer forming step, the film forming step, the circuit pattern forming step, the touch coating step, the film removing step, and the Laying step are formed by an additive method. Since the conductor of the second circuit F27 can form a fine conductor with high precision in a short time, it is possible to prevent an unnecessary conductor from being formed on the second circuit F27. According to the inner valley, even if the fine circuit pattern F25 is mixed with the interlayer connection hole F21, the multilayer circuit substrate F1 can be smoothly manufactured by the additive method by the additive method. In the manufacturing method of the present aspect, the second insulating layer F23 is formed on the outer surface of the second insulating layer F2, and the resin film F24 is formed on the outer surface of the second insulating layer F23, and at least resin is formed in the formation. After the circuit pattern F25 having a depth equal to or greater than the thickness of the second insulating layer and the thickness of the second insulating layer is removed, the resin film F24 is removed. Therefore, the second insulating layer F23 is necessarily processed and removed at the portion of the circuit pattern F25. 201146113 Therefore, the bottom surface of the circuit pattern F25 is located below the outer surface of the second insulating layer F23, and the conductor layer constituting the second circuit F27 is partially or entirely embedded in the outer surface of the second insulating layer F23. . As a result, the thickness of the conductor layer can be increased, and the mechanical strength of the second circuit F27 can be ensured. Further, the amount of the conductor layer protruding from the second insulating layer F23 can be eliminated or reduced, the second circuit F27 can be protected, and the second circuit F27 can be prevented from falling off from the insulating layer F30, and the unevenness generated on the circuit forming surface can be eliminated or reduced. In the manufacturing method of the present embodiment, in the step of forming the metal post, the electric power is increased by the helmet electrolysis money on the exposed first electric circuit F11, and the plating metal is filled in the interlayer; Since the conductor, that is, the electroplating core of the electric circuit π-de-plating, can reasonably form the metal post F2h to be non-electric. In addition, in the manufacturing method of the present embodiment, the step of forming the metal pillar is performed on the surface of the s 1 ^ edge layer F20. The inner wall surface of the interlayer connection hole F21 and the surface of the exposed first circuit F11 are coated with a catalyst F25, and after the electric contact catalyst is applied to the surface, the electrolytic surface is further applied, thereby filling the layer with a new metal. After the hole F2 Bu, remove the inclusion in the first! The surface of the insulating layer F2 is deposited on the outer surface side of the iff/20-. Since the power supply layer is included in the first insulation, the gold shoulder can be formed reasonably. In the manufacturing method of the present embodiment, the resin film F24 is preferably soluble or swellable from the second insulation layer F23 ( The resin film of the Wei edge layer is widened. The resin film F24 can be used to dissolve or remove the resin film on the surface of the layer F23, and the core of the tree 3 is collapsed in the resin film sand. _Fei Zheng's scattered electric key contact media is once again insulated to form an extra money film. Since it can be easily and smoothly removed, the grease film F24 can be removed, so it can prevent these problems. *F2; 'F27 ^ From good' and this is enough Preventing the circuit F27 from forming a redundant guide 82 201146113 A multilayer circuit substrate n which is less prone to short-circuit problems, etc. Therefore, it is possible to use the additive method to smoothly manufacture a multilayer circuit substrate F by the build-up method. The multilayer circuit board F1 having an electric circuit having a high degree of shape accuracy is used. With the manufacturing method of the shirt layer circuit board F1, the IC substrate which can be used for the width of the f F27a and the wiring F27a_the narrow gap can be touched. Action electric live with P brush A multilayer circuit board π for use in a board or a three-dimensional circuit board. Further, in the method of manufacturing a multilayer circuit board, the resin film may be subjected to ultraviolet light after the fine removal step. It is checked whether or not the film is completely removed by the luminescence of the fluorescent substance. In the method of manufacturing the L-like multi-path substrate, the line width of the wiring F27a and the metal wiring (4) having a very small interval between the wirings F27a can be formed. Next, there may be a problem that the fat film F24 is benefited, for example, between the metal wirings F27a of the mutual connection. When the metal wiring ties are left with a resin film, a plating film is formed on the tp knife, resulting in migration or Short-circuit problem, etc. This month, F24 contains a fluorescent substance, which can be removed after the film removal step, and the film is removed to illuminate the predetermined light source, so that the residual portion of the film F24 is illuminated by the fluorescent substance. It is the fluorescent material contained in the resin film F24 used in this inspection step. The mouth must be fixed to the light source. "绯_可, it is not made ^ ^ For example: Fluoresceine, Eosine, Pyronine G, etc. 8. The portion of the lipid film F24 which emits light of the fluorescent substance is detected by this inspection step. Therefore, the portion where the light emission is detected can be formed on the portion. Therefore, it is possible to prevent the occurrence of migration or short-circuit corrections. [Third Embodiment 2-2] The third embodiment of the present invention will be described with reference to Fig. 15. The description of the third to second aspect is added, and the description of the characteristic portion of the third to second aspect is added. The third embodiment of the third embodiment, as shown by 0 15F, begins to form a resin film beyond the outer surface of the circuit pattern forming step 83 201146113. The thickness of the F24 is the second, the sum of the end of the color edge layer F23, and the circuit pattern is prevented. In the second portion F25, the second insulating layer of the resin film F24 is removed, and the first insulating layer F20' is dug out so that the bottom surface of the circuit pattern F25 is at the fjrr plane position. 'Then, the 3:2 real: S 1SF does not' in the circuit pattern forming step, from the circuit pattern prevention map, the metal pillar F22 formed by the metal pillar forming step of the second and second sides of the metal layer F ^ ^ ^ Form the circuit job F25. This is because the resin or the like constituting the first insulating layer F20 is easily removed, but the plating metal of the column F22 is hard to be removed. In the manufacturing method of the present embodiment, in the circuit_forming step, the circuit diagram ί F25 is formed so as to protrude from the bottom surface of the F25 road pattern, and the second electric_F27 portion of the top of the metal column F22 is covered. Refer to Figure 13 for the top of the electrode for the electrode. The top of the metal post F22 will be 4 into the conductor layer of the crucible 4 7b. The paste misalignment effect effectively prevents the strip from being formed (4) the mat layer that sufficiently withstands the filament zero weight f [the third embodiment] - see Fig. 16 The third to third embodiments of the present invention will be described. In addition, the = 目 constituting the element makes the __ number, and (4) omits the description of the characteristic part of the 3%. Now, as shown in Fig. 160, in the metal pillar forming step, ΪΪ does not grow to the height of the outer surface of the first insulating layer. On the contrary, the plating film of the metal post F22 is grown to a circuit pattern of 84 1 曰 6F = two gold, and 22 does not grow to the surface of the first insulating layer: the temperature stops. Therefore, it is relatively easy to achieve the purpose of not protruding the top of the metal post F22 at the stage of the circuit diagram forming step. Then, as shown in Figure i6F, in the electricity

The top portion is not cut from the bottom surface of the circuit diagram _ to prevent the conductor layer formed on the top of the metal pillar F22 from being etched from the surface of the H 201146113. Does not increase, the circuit is formed by the formation of the surface; using, for example, the soft side rides the F2G's watch to turn off the bottom of the bottom of the ίΐ ίίί metal column _F22 coffee until the circuit pattern F25 [fourth implementation] 07 The multi-second power of the method, the technical field of the ancient substrate, the portable information terminal device, the computer and its periphery, which are mainly used in the multilayer circuit H manufactured by the additive method and the manufacturing method, are in the & The electrical devices such as the type of planting are rapidly developing toward a high degree of functionality. The scales are higher than those of the electric plates (4), and the electrical power is more (four). In order to achieve high density of these circuit boards, we have correctly In the wiring which forms a circuit having a narrower line width and a spacer, it is easy to cause short-circuit or migration between wirings, and the wiring is thinner in the width of the wiring. Strength will decrease, circuit capacity :,, 'After the impact and other factors, it was broken by seven. In addition, the stacking 娄 owes the booster port, and in the circuit formation, the unevenness of the life becomes larger, and it becomes difficult to form a fine circuit. It is known that there is a subtraction method or an addition method for the method of the slab of the wire plate. The smashing method is to remove (subtract) the metal from the portion other than the portion where the circuit is to be formed on the surface of the metal iridium stacking plate. The method of forming a circuit. On the other hand, the domain method is a method of forming an electric circuit by electroless plating to form a circuit portion of the substrate. Λ In general, the subtraction method is to thicken the etching film. The metal foil is a method of residual metal f| on the = part of the circuit to be formed. If this method is used, the metal part of the cis-removal portion is wasted. On the other hand, the additive method can only be used in the portion where the metal wiring is to be formed. The upper shape 85 201146113 becomes an electroless power, so no metal is wasted. From this point of view, the additive method is a circuit formation method. w The conventional additive method of the additive method is as follows. Carry out, 'coating the surface of the insulating substrate. _. Next, The light-forming layer of the dielectric material is then developed. Then, the light pattern of the photoresist layer is developed through the photomask that has formed the predetermined electrical pattern, and then the circuit pattern is developed. Then, the surface formed by the development is subjected to electroless plating. To form an electric circuit on the portion of the electrical circuit. By these steps, an electrical circuit can be formed on the insulating substrate. - In the above conventional additive method, the entire surface of the insulating substrate is formed. There are three kinds of problems on the top of the film. That is, when the photoresist layer ίί ^ is high-precision, it can be formed in the non-tilted part of the photoresist when it is not formed. When developing, 'there may be some defects in the part that would not be formed in the circuit. Because the plating film on the insulating substrate _ the recording surface may cause short circuit or migration between adjacent circuits. , when the line width is widened and the narrower circuit is used to separate the circuit, the problem is solved. 'I think about the application, for example, Japanese Special Report No. 58-18_ is as follows, ί. First, a resin protective film is coated on an insulating substrate. A groove and a through hole for forming a corresponding circuit pattern are formed on the insulating substrate coated with the protective film by a mechanical force or a laser beam #7j. Next, an activation layer is formed. Next, the resin protective film is peeled off, and only the groove is guided by the enthalpy, and the shape of the hole is _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ T^ part or through the inside of the through hole _ and so on to make a patent application for the absence of electricity and the content of the amp; (Japanese singularity 2_-118818 曰 特 特 特 特 特 2〇〇 9-104086, etc.) . The circuit forming method of the patent application. Referring to Fig. 23, first, as shown in Fig. 23A, a resin film 86 is applied on the surface of the insulating substrate a, which is inhibited by the material, and is on the insulating substrate a of the 14 lining b. The groove "go through the hole d. In addition, although the surface of the surface is the same as that of the surface of the surface of the surface of the slab, the groove c may be deeper on the surface of the gully. Next, as shown in Fig. 23C, the total magnetic θ + and the surface of the through-hole 4 and the surface of the resin film 15 are coated with the electric ore n. Here, the 'keybox catalyst' conceptually includes its precursor to peel off the resin skin b) to form an acoustic opening on the residual portion of the plating catalyst e after the groove and the ship are formed, as shown in FIG. In the method of manufacturing a multilayer circuit board having a high density, it is known to form a via hole which is a hole for interlayer connection side by side, and FIG. However, if these addition methods are applied, referring to the addition method of Fig. 24, it is possible that Qiansheng Town has a problem. The circuit in which the first electric circuit 11 has been formed is prepared as shown in Fig. 1. The circuit h is mounted on the surface of the circuit board g on the surface of the five-way substrate g. Further, the circuit 1 of the S 1 circuit h is formed, and then, as shown in the figure, the electrically insulating layer 1 of the first circuit h is formed. Next, as shown in Fig. 24C, a resin film J is formed on the insulator. Next, as shown in Fig. 24D, the surface of the white material is subjected to laser processing, and the circuit pattern k of the resin film id t and the interlayer connection hole m are formed. The circuit pattern is just to the electric hard (four) position. Material, the connection hole m, the first to reach the electrode substrate g! The i-th circuit is "zero-out. The surface is shown on the surface of the resin film j, the surface of the circuit pattern u ίί ray, and the exposed first circuit _ surface has "outside" although not electroless from the following From the point of view of electroplating, there is no electric iron contact on the surface of the ίί h, but the electric ore touch is coated on the entire insulation layer - it can achieve a simplified operation. 87 201146113 = film j. Then, as shown in Fig. 4, an electroless plating film is formed on the upper surface to form a wire 2f gas on the insulating layer i, so that the electroless electric surface grows from the second circuit h of the bottom of the interlayer connection m. This is filled with a plating metal. The layer of wealth is turned over to form ^ ^ and j like this in the part of the circuit _ k and the connection of the occupational power into the conductor i, the circuit part of the wiring trench (four) is wide and the depth of the hole is also _ 'the reason for the formation of the hetero-conductor Very short, the diameter of the i_ interlayer connection hole is deeper than that of the wiring trench circuit portion, so plating metal filling takes a long time. Therefore, if some of the conductors are not finished at the end of the electroless plating, as shown in Figure 2, if will not be sufficient 'because the circuit and the connection hole fiΞ i if the wire is electroless until the connection is used The knife is quilted, filled, and the part of the road will be shaped to be short-circuited, etc. 'There is a literature suggesting to reduce the volume of the hole for interlayer connection, so as to fill the metal in a short time ί 'so that the hole for interlayer connection The depth changes and the filaments of the inter-layer holes are reduced. Fine, as far as the former is concerned, there are a lot of _, _ implementations. Further, in the latter case, the connection between the holes for the interlayer connection and the circuit becomes small, and the reliability of the connection between the layers is lowered. If ,ί, ί, the diameter of the contact hole is reduced to the same width as the width of the wiring pattern of the circuit pattern, or below, although the metal filling can be completed in a short time, but at this time, the electric clock film will depend on The crotch surface of the flip hole grows from the bottom (4), and also grows from the side of the circuit pattern, so that it is easy to generate voids inside the metal post. The object of the present invention is to provide a method for manufacturing a kind of rural circuit, which is the above-mentioned problem in the case of the additive method in the case of manufacturing a multilayer circuit substrate by the build-up method, even if the fine electrical connection and the interlayer connection hole are used. If it is mixed, it can be filled and smeared in the layer=connection system, and it can prevent the part from forming excess &

</ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The outer surface of the path H on which the insulating layer is formed on the circuit formation surface of the circuit board forms an opening in the insulating layer to make the first electrical circuit; and the exposed first electric circuit is filled with gold by the ore metal. The threat forming step; the outer surface of the insulating layer and the top portion of the metal pillar are formed by the step of forming a fine skin pebbles: the outer surface of the functional fat film has a predetermined depth of at least a thickness above the thickness of the fat and the predetermined a groove and/or a hole of a shape to form a circuit_forming step of the circuit _; a catalyst-coated ruthenium coated with a plating catalyst on the surface of the film and the surface of the circuit a layer removing the lining film removal step; and yokeing the insulating layer only yoke electroless money 'in the portion of the circuit pattern of the residual electrocaloric catalyst and the exposed portion of the metal pillar to form a thin electrode to form a layer on the limpid layer 2 electrical circuits while making this insulation The second electrical circuit of the layer and the second electrical circuit of the circuit substrate are electrically connected to each other through the metal pillar. If the method is used, the insulating layer forming step, the opening forming step, and the metal before the circuit pattern formation are used. In the column forming step, the interlayer connection holes are filled with the electro-mineral metal in advance, so that it is not necessary to care whether or not the excess conductor is formed in the circuit portion, and it is possible to take time to sufficiently fill the holes in the interlayer connection holes. Further, since the circuit pattern has not been formed, the electricity is generated. The coating film does not grow from the side of the circuit pattern, prevents the generation of voids, and satisfies the metal filling condition. Then, after the metal filling of the interlayer connection holes is completed, the film forming step, the circuit pattern forming step, and the catalyst coating step are utilized. The film removing step and the plating step 'the conductors of the circuit portion are formed by the additive method described with reference to FIGS. 23A to 23E, so that a fine conductor having high precision can be formed in a short time, and an unnecessary conductor can be prevented from being formed in the circuit portion. The above content 'even if the fine circuit pattern and the interlayer connection hole are mixed In addition, the additive method can be suitably applied to smoothly manufacture a multilayer circuit substrate by the build-up method. The "metal pillar" formed by the metal pillar forming step is thicker than the conductor layer constituting the electrical circuit. The conductive convex portion that protrudes in a direction perpendicular to the vertical direction may be used, and the shape thereof is not particularly limited. For example, 'the section other than the cylindrical or corner column 89 201146113, which is a fixed columnar shape' also includes a conical shape or a truncated cone shape in which the cross-sectional shape changes in the longitudinal direction. σ The "groove" of the circuit pattern formed in the circuit pattern forming step is mainly a matching, = trench "opening" - such as an opening for the electrode potential portion. However, depending on the situation, it is also possible to use a hole for the layer (which is different from the hole for interlayer connection completed by the previous metal filling). Although the circuit pattern forming step is formed to have the same thickness as the resin film and/or the opening is formed, 'because the circuit pattern remains on the outer surface of the insulating layer, the conductor layer of the electric circuit is formed on the insulating outer surface. In the state surface, when a groove having a depth exceeding the thickness of the resin film is formed, the portion or all of the portion is located at the portion of the conductor layer which is formed by the electric layer, or is entirely buried in the insulating sound. In the latter case, 'the thickness of the conductor layer can be increased' to ensure that the electric i can also eliminate or reduce the protrusion of the conductor layer from the insulating layer. The circuit prevents the circuit from being removed from the insulating layer. In the circuit pattern forming step, the portion of the second electric circuit of the top of the metal column is used as the electrode portion. The reason is that when you know this, the metal pillar forming step is to 'fill the plating metal into the circuit diagram and the column grows to the i-edge; when the surface-induced, the gold is drilled below the outer surface of the insulating layer. Position 睥, the outer surface of the underside of the if road pattern is dug, but the wire is stopped at the length of the edge of the j-domain. Hunting this, you can easily reach the two columns of the 2011 20111313 step: the step of the step of the step after the metal column is removed, the top of the metal column is removed to electricity, thereby, in the circuit pattern forming step, the metal column The top of the account is eight out or big. If so, the position of the top of the modified metal post can be surely achieved so that the top of the column does not protrude from the bottom surface of the circuit pattern. In addition: Bubenfa (5)^Supply another type* has an interconnected electrical circuit* The method of manufacturing the substrate includes: forming a first electrical circuit by forming a first hole of the first electric circuit a hole forming step; filling the opening with an electric ore metal to form a metal pillar on the column of the bovine electric circuit, and forming a metal paste on the outer surface of the insulating layer and the top of the metal post The outer surface of the film is formed with (4) forming a circuit ίί (4) a depth and a predetermined shape of the groove and/or the opening to form a circuit pattern forming step; a surface of the resin film and the catalyst plating step of the insulating plating catalyst The resin film is removed from the catalyst i, and the solid wire 1 is de-energized. On the Deng knife of the residual plating method and the exposed portion of the metal column, a Thunder road and an electric gas circuit are formed. 'At the same time, the second electric step of the insulating layer; the electroplating in which the circuit is connected to the interlayer through the metal post is not formed from the electric circuit_forming step, the village in the top of the metal column is shouted, and the step is removed. ^ The distance from the outer surface of the figure to the bottom surface of the circuit _ d Bu circuit d2 ^ ° &lt; ^ ^ ^ 30 〇 / o part will not from the circuit diagram step, in the metal column top = go step, the resin film is removed in the film surface more back to the heart scale, == ==== 91 201146113 = The body layer protrudes from the outer surface of the insulating layer, taking into account the distance from the outer surface of the circuit 产生 generated on the circuit forming surface to the bottom surface of the circuit pattern (that is, the circuit pattern is ίί 'f circuit and interlayer The connection hole is very good. The shelter "b" is in the gold-type age, the Wei metal-filled county reaches the circuit pattern electric 'by' in the circuit pattern forming step 'the top of the metal column 3 way out, in the film In the removing step, the top of the metal post is exposed at a specific electrical position, so that the feature is not seen from the bottom surface of the circuit pattern at the top of the metal column at the stage of the circuit pattern forming step and the step of forming the film. It is easy to achieve. Exposed j af 3 ί is a column forming a step, the system _ no electrolysis Wei made the electric film from the electric ί began to grow 'to fill the hole with the money metal. Because of the use of the column '., gas. Electro-mineral core of electroless ore, The invention can be formed reasonably. The invention can also form a step in the formation of a metal pillar, and the surface of the insulating layer is electrically opened (four) s; the surface of the first electrical circuit is coated with a plating catalyst and the metal is inhibited. The electrolysis is carried out, and then the electrolysis is carried out to remove the metal on the outer surface 11 f of the insulating layer including the surface of the insulating layer by electromagnetism. The surface of the outer surface of the insulating layer is formed on the surface of the layer containing the layer. The electrolytic electric ore layer is used as a power supply layer necessary for electrolytic electrowinning, so that the metal column is formed reasonably enough. @', 六ΐ本ί明中' resin film should be dissolved by a given liquid or a resin film that is swelled and removed from the insulation or peeled off. By using the resin film, the resin can be easily removed from the surface of the insulating layer. If the resin film is removed, the resin on the resin film will be scattered. The scattered electric ore catalyst will be formed on the insulating layer to form an excess electric ore film on the part. If 92 201146113 = and the resin film is removed from the surface of the insulating layer, it is possible to prevent the multilayer circuit substrate of the present invention from being sufficiently filled with metal by the multi-stage holes manufactured by the above manufacturing method, and it is not in the circuit. A multilayer circuit substrate in which a part of the excess conductor is formed without causing a problem such as a short circuit. Do not = that is, the fourth embodiment of the present invention includes the following technical contents. Ϊΐ Ϊΐ ΐΪ 四 四 四 四 ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; ; And a predetermined shape of the groove and or opening to form a circuit step; on the surface of the resin film and the circuit pattern contact, a catalyst coating step; removing the exposed portion of the resin metal column from the insulating layer The electroplating film is: ίElectrical: electricity simultaneously makes the second electrical circuit of the insulating layer and the electroless metal step in which the metal post is connected. And if *: as in the manufacturing method of the multilayer circuit substrate described in the claim 4-1, in the circuit_forming step, the circuit pattern of the circuit is formed from the top of the metal pillar to cover the top of the metal pillar The portion of the second electric rolling circuit formed by the method is used as a pad portion for an electrode. In the method, the top of the bottom of the manufacturing circuit of the multi-way board described in the item 4-1 is not from the circuit pattern, and the manufacturing method of the multilayer circuit board is as described in claim 4-3. 'wherein' in the metal pillar forming step 'the position where the plating metal is filled to the bottom surface of the circuit pattern, whereby in the circuit pattern forming step, the top of the metal pillar is not exposed or the item 4-5 is requested. In the method of manufacturing a multilayer circuit board according to the third aspect of the invention, after the metal pillar forming step, the top of the metal pillar is removed to the bottom surface of the circuit pattern, whereby the metal pillar is exposed or protruded in the circuit pattern forming step. ° Claim 4-6. A method of manufacturing a multi-layered wire board having interconnected electrical circuits and interlayer connections includes: forming an insulating layer on the electric_form φ of the circuit earth plate on which the third money circuit is formed a layer forming step; in the case of the second, the surface is formed with an opening to expose the opening of the ith electrical circuit; the "j 1 electrical circuit is filled with the plating metal to form the metal ... Forming a resin on the outer surface of the insulating layer and the top of the metal pillar; forming a trench and/or an opening having at least the depth of the _^# and the opening from the outer surface of the resin film to form a circuit of "electrical" forming step; forming a second electrical circuit on the surface of the resin portion and on the portion of the pattern = gold, such that the insulating-edge layer pillar forms a step, and the Wei metal ^ = $1 in the metal In the circuit pattern forming step, the position of the metal pillar is further retracted at the bottom surface of the circuit pattern to expose the top of the column at the bottom surface of the outer surface _ is df^na, when the top of the insulating pillar When the distance is d2, 〇&lt;d2$dl circuit diagram The bottom surface to the metal request item 4 to 7. The method of manufacturing the circuit board according to the request item 4~~1~4___6 ^, wherein the multilayer electric circuit described in any one of the metals starts to use the electroless ore to make electricity In the step, 'the first electric X 露出 is exposed, and the hole of 201146113 is filled with the plating metal. Item 4-8. The manufacturing method of the two sheets described in item i of the item 4-μ-6, in the metal sheeting step, on the surface of the insulating layer, and the inner wall surface of the insulating layer And on the surface of the exposed i-th electrical circuit, the non-electrolytic Wei is applied to the surface of the contact medium, and then electroplating is performed to fill the opening with a thunder, and then, the surface including the insulating layer is The plating metal deposited on the kneading side is removed. The appearance of the item 4-9. The manufacturing method described in any of the items (a) to 4-8, wherein the resin film is dissolved or expanded by a predetermined liquid, The resin film removed by dissolution or peeling off is dissolved. Item 4-10. A multilayer circuit board manufactured by the manufacturing method of claim 4 -> 4_9. According to the present invention, even if the fine Wei Lai case and the Lai connection are mixed, it is enough to properly form the multi-layer circuit [the fourth embodiment of the invention]. The structure of the multilayer circuit board (1) of the present embodiment, and the arrangement of the interlayer connection holes G21 (with the metal post G22) and the like. As shown in the present embodiment, the present embodiment provides a multilayer circuit substrate (1) in which an electric circuit G26 and an interlayer = hole G21, that is, via holes are connected to each other. The circuit "wire width line G26a and electrode pad portion G26b. The electrode pad and the interlayer connection hole G21 are overlapped. The I-Ι line in Fig. 19 indicates that the cut position of the end view of Fig. 2Q to Fig. 22 is two. For the circuit board, the symbol (1) 1 is the first electrical circuit, the symbol G20 ciif ❿Γ 1 is the interlayer connection hole, the symbol G22 is the metal pillar, the symbol (10) the two 1 junction film '5' G24 is the circuit pattern, and the symbol G25 is the electric forging catalyst. ^G26 is a 苐2 electrical circuit. As shown in Fig. 2〇1, the first electrical circuit G11 annihilated on the circuit substrate G1G and the insulating layer (10) stacked on the circuit G1G are formed on the multilayer circuit substrate. In the second electric circuit (10), the interlayer connection hole G21 (with the metal post G22) on the insulating layer G2G is connected to the interlayer. 95 201146113 &lt; Circuit board preparation step&gt; In the manufacturing method of the present embodiment First, as shown in FIG. 2A, the first electric circuit G11 (four) wire plate G1G is prepared (the circuit-based sizing step). Further, in 20A, the first circuit G11 is placed on the circuit board (10). On the surface, it may be buried on the surface of the circuit board G10. The formation method of the jth circuit Gu is not closed. For example, a conventional circuit such as subtraction or addition may be formed = formation. Further, the circuit substrate may be formed only on one side or on both sides. Further, the multilayer circuit board may be used. The stack substrate may be used in the production of a multilayer circuit board. The specific example of the organic substrate is, for example, an epoxy resin, an acrylic resin, or a poly A substrate composed of a carbonated resin, a polyimide resin, a polyphenylene sulfide, a cyanate resin, a benzoxazine resin, and a bimaleimide resin. The circuit substrate (10) can be used as a substrate. The sheet material, the film dipping material, and the molded body having a three-dimensional shape are not particularly limited. The degree of the circuit board (10) is not particularly limited. For example, when it is a sheet, a film, or a prepreg, the thickness can be set to be more uniform. / It is set at about 20 to 200 μπι. In addition, the circuit, the substrate (10), the 说,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Next, as shown in Figure 20, there is a setting! The insulating layer G2 is formed on the circuit substrate (the circuit substrate). (Insulation layer forming step). The color=layer G2G, 'secret is not particularly limited. Specifically, for example, sheet, film, and And a three-turn shaped body or a grease coating. The thickness of the insulating layer G20 is not particularly limited. Specifically, when it is a sheet, a film, or a prepreg, it is preferably set to, for example, 10~ 2 〇〇 μιη, more preferably set at about 2 〇 to 1 〇〇 μηι. The insulating layer G2 〇 may also contain inorganic fine particles such as SiO 2 particles. The surface of the insulating layer substrate (10) is stacked on the surface, Film or prepreg, shape. Alternatively, 'insulating layer (10), can also be applied to the surface of the circuit board (10) after the liquid 'curing the wire', or tools such as tools and frames can be placed into the insulating layer material. 'Pressure to harden to form a three-turn shaped body, or the same as the piece 96 201146113, the (4) obtained by the nailing is stacked on the circuit base after being pressurized to make it expand and fit, to harden, or to add ... force to harden it to form a three-dimensional shaped body. Ϊ 缘 缘 f tG2G can be used to make a variety of ribs and layers of the substrate. Specific examples of the organic substrate include, for example, epoxy resin, propylene resin, polycarbonate, polystyrene resin, polyphenylene sulfide, and cyanic acid. A substrate made of a resin such as vinegar resin or a resin such as a fat or a bismaleimide resin.

The resin is not limited as long as it constitutes various organic groups t j which can be used in the production of a circuit board. Specifically, for example, two-year-old A-type double-type F-type epoxy resin, two-year-old S-type epoxy resin, aryl-based epoxy=phenolic epoxy resin, alkylphenol phenolic epoxy resin, and two-part epoxy Phenol ίί = its naphthalene resin: decadiene type epoxy resin, epoxide and epoxide of condensation product of 'hydroxyl-containing aromatic aldehyde, trimeric isocyanuric acid trihydrate, alicyclic Epoxy resin, etc. Further, in order to impart flame retardancy, the epoxy resin, the nitrogen-containing resin, the fluorenone-containing resin, and the like may be obtained. In addition, the above-mentioned Wei resin and Μ月曰 may be separately produced, or two or more types may be used in combination. Further, when the substrate is composed of the above respective resins, generally, a curing agent is contained for curing. The curing agent is not particularly limited as long as it is a usable curing agent. Specifically, for example, di- succinimide, benzene sizing agent, phthalic anhydride: hydrazine: „, amino triterpenoid curing agent, nitrous acid vinegar resin, etc. The phenolic curing agent, for example, phenolic type A curing agent such as an aralkyl type or a terpene type. For further imparting flame retardancy, for example, a phenol resin which has been subjected to a varnish or a cyanate resin which has been denatured by I, or the like can be used. The above-mentioned respective curing agents may be used singly. Two or more kinds of curing agents may be used in combination. Further, although it is not particularly limited, since the circuit pattern is formed by laser processing, it is preferable to make a lightning flux of 1 GG nm to 4 GGnm. A resin having a good light absorption rate. Specifically, for example, a polyimide resin, etc. The insulating base material (insulating layer) may further contain a filler. The filler may be inorganic micro-97 201146113. If it contains a tree material, the 'concave and convexity of the filler on the laser path can improve the adhesion between the plating and the resin. The material of the microparticles, specifically, for example, oxidized engraving, ^s(ain) ^ ^ Stupid · Titanium ι〇2 phase 1^ dielectric constant Filling material; hard ferrite magnet; (〇H)2) ^ ft^blS(Al (OH)2) ^ ^ 月匕萨铉笪二ί, &amp; pentoxide (sb205), strontium salt, zinc borate, Molybdenum compound, hard

Tso ) ; ^^^40,)(03⁄4) ^ With Bu CaCC>3), s material. The inorganic fine particles may be used alone or in combination of two or more. These inorganic fine particles are evaluated by the functions of dielectric constant, _: property, particle size distribution, and degree of freedom of color tone, and are appropriately blended in the second place. also. Ten can easily achieve the purpose of filling. In addition, although there is no special = two only f 〇 using a filler having an average particle diameter below the thickness of the insulating layer, it is preferable to use a filler having a mean particle size of 〜1 〇μηι. . In addition, in the inorganic fine particles, in order to improve the dispersibility in the insulating base, the dispersibility of the particles in the neighboring substrate may be contained, for example: Epoxy, (10), ρί Γ ”, In addition to the styrene-based weiss-based and methyl-propenyl-oxygenate, in order to improve the chemical properties of the inorganic fine particles in the insulating substrate, the distributed ship may also have a special system. ^ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , For the split yarn, the above-mentioned fine fraction may be separately prepared, or two types may be combined: &lt;=, regarding the organic fine particles, specifically, for example, rubber particles The surface of the surface (circuit formation surface) is superposed on the insulating layer. = Heat 98 201146113 The material type and resin type of the circuit board G10 may be different from the material type and resin type of the insulating layer G20. However, the circuit G10 and The viewpoint that the insulating layer G2G is well-closed is considered to be The phase is good. ^The different types are typically more of the same kind with each other. &lt;Opening Hole Formation Step&gt; Next, as shown in Fig. 20C, laser processing is performed from the surface (outer surface) side of the insulating layer (10) to The interlayer connection hole is formed on the insulating layer G2, and the first circuit G11 is exposed. The laser beam is exposed to the first circuit G11. The detailed description of the surrounding technology, based on the detailed description of the laser processing and its surrounding technology described in other steps, is the same as that of the same. Eight', and 'in the _ laser plus the king exposed the first f road Gn Long butterfly + not shown). Miscellaneous wire conduction is not good due to 'definitely and used to remove the glue treatment. About the desmear treatment, can make = redundant> Beyond thief dissolve Guer Knowing the method, however, the desmear treatment may be omitted in response to the situation. &lt;Metal column forming step&gt; ^ On the 'exposed first' circuit GU shown in Fig. 20D, the benefit power 1 is used. The electric money metal fills the interlayer connection hole G21: in the layer, λίίίίίίίίίίίίίίί In addition, when the surface is formed, when the electrolytic plating is performed, the inner wall surface of the opening G21 on the surface of the insulating layer G20 and the exposed plating catalyst are exposed to the electric arc catalyst. The surface of the surface is electroplated, and after the electrolysis dissimilar opening G2 is applied, the electro-mineral metal deposited on the outer surface side of the opening layer G20 including the insulating layer metal pillar G22 is removed. The shape, size, and interval of the threat G22 are, for example, approximately cylindrical, and the sound of the grain is specific to the metal column of about 5 to 5 mm, and the diameter of the bottom surface is not the same as that of the G22. Table-shaped or truncated cone shape 99 201146113 In addition, FIG. 20D shows a case where the metal post G22 grows to the height of the outer surface (surface) of the insulating layer G20 in the metal post forming step. However, not limited thereto, in the metal post forming step, the metal post G22 may also grow to a position where it does not reach the surface of the insulating layer G20. Of course, the position where the metal post G22 grows beyond the bottom surface of the circuit pattern G24 formed by the circuit pattern forming step described later is used as a condition. When the resin film G23 is formed in the film formation step described later, the interlayer connection hole G21 in which the first circuit G11 and the second circuit G26 are connected to each other is sufficiently filled, and the formation of pores can be prevented. Good metal column G22. &lt;Thin film forming step&gt; Next, as shown in Fig. 20E, a resin film G23 is formed on the outer surface of the insulating layer G2 and the top of the metal post G22 (film forming step). The resin film (photoresist) G23 is not particularly limited as long as it can be removed in the skin removing step described later. The resin film G23 is preferably a resin film which is easily dissolved or removed from the surface of the insulating layer G2 by dissolution or swelling of a predetermined liquid. Specifically, for example, a film composed of a soluble resin which can be easily dissolved by an organic solvent or an alkaline solution, or a fine film which can be made fine by a fineness of a predetermined liquid (fine liquid). Correction, swellability, and lipid film 'except that it does not substantially determine the liquid dissolution, but it is easily swelled and partially dissolved by a predetermined liquid in addition to the resin film which is separated from the surface of the insulating layer G2G by swelling. Further, the resin film which is easily peeled off from the surface of the insulating layer G20 due to swelling or dissolution, or a resin film which is dissolved by a predetermined (four) and which is easily peeled off from the surface of the insulating layer G2G due to dissolution. By using these resin films, the resin film can be easily removed from the surface of the insulating layer. If the resin film is broken when the resin film is removed, the electric energy catalyst of the dragon's in-service grease may once again be coated on the insulating layer and form a surplus film on the part. When the resin film is easily removed from the surface of the insulating layer, it is possible to prevent the formation of the resin film G23 from being unspecified. Specifically, for example, „ G2^ surface (outer surface) is coated with a liquid material 可 which can form a resin film 之后, and then dry _ method 妓 coating the liquid material on the support substrate 100 201146113 ί The resin film of Rongίΐ is transferred to the surface of the insulating layer G20

Legal profession. Further, in another method, for example, the resin "method of the two-ply material" composed of the resin film G23 formed in advance is not limited. Specifically, a spin coating method or a stick coating method of one feather is used. j, as in the case of Baizhi used for the Axis fine G23 feeding, Kirin (10) silk removed the nuclear lion to remove /, and ..., especially limited. It is preferable to use a resin having a degree of swelling of a predetermined liquid of 50% or more or more than 1% by weight, preferably using a degree of swelling at f, and further, the strip is continued, and the swelling degree of the film is required. _ can be based on the weight before swelling and

:ί = swelling degree sw= Um(8)—m(b)]/m(b)丨X1QQ These resin films are coated with the compound of the county liquid on the surface of the insulating layer G2G, and the emulsion is read by the method. After the coating of the elastic liquid or the emulsion is applied to the material of the branch, the film formed by drying is transferred onto the surface of the insulating layer G2, and the like can be easily obtained. Specific examples of the elastomer include an olefinic elastomer such as a styrene-butadiene copolymer, an acrylic elastomer such as an acrylate copolymer, and a polyester elastomer. When these elastomers are used, it is possible to easily form a resin film having a desired degree of swelling by adjusting the degree of crosslinking or the degree of gelation of the elastomer resin particles dispersed in the suspension or the emulsion. ▲ In addition, the resin film is particularly preferably a film whose swelling degree changes depending on the pH of the swelling liquid. When the liquid film conditions in the catalyst coating step described later are different from the liquid conditions in the film removal step described later, the resin film G23 can be made under the pH value in the catalyst coating step. The insulating layer G2 〇 maintains a high adhesion force, and the resin film G23 is easily peeled off and removed under the pH value in the film removing step. More specifically, 'for example, when the catalyst coating step described later is provided with, for example, a step of the hetero-metal contact treatment at pH 1 101 201146113, the subsequent step of removing the membrane is provided in the range of pH 12 to 14. In the alkaline solution, the resin film is more preferably 4 (%) or less on the acidic catalyst metal colloidal solution, and the swelling degree of the test solution is preferably I 01 , and more preferably 100 °. Above /°, preferably at 500°/. the above.

For example, a dry film resist for forming a pattern of a printed wiring board formed of an elastomer having a predetermined amount of carboxyl groups (hereinafter also referred to as D ^ alkaline developing type resist) a sheet obtained after being fully cured, or a thermosetting or inspecting developing sheet, etc. Specific examples of the elastomer of the if silk, for example, containing a carboxyl group disintegrating as a silk component, causing impurities in the molecule A styrene-based elastomer such as a styrene-butadiene-based or a acrylate-based copolymer, or a resin film having a degree of melamine, and is also easily formed in the step = a resin skin which is more swelled by a predetermined liquid and which is dissolved by the liquid. The slow-acting base in the elastomer swells the resin film due to the aqueous solution, and has a tree-shaped scorpion film from the G2G. The molecular weight of the polymer of the carboxyl group is determined by the molecular weight of the carboxyl group. For example, (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid , itaconic acid, maleic anhydride, etc. The proportion of sulfhydryl groups in the elastomer, the pot acid should be a letter ~ 2 〇〇〇 'more suitable should be ~ _. When the acid equivalent is too small (the county's amount is relatively too much =) ' with solvent or other The compatibility of the composition is lowered, and the resistance to the electroless plating pretreatment liquid tends to be lowered. In addition, when the acid equivalent amount is too small, the amount of the rear group is relatively small, and the peeling property to the alkaline aqueous solution is small. There will be a tendency to decrease. Further, the molecular weight of the elastomer is preferably from 10,000 to 10,000, more preferably from 20,000 to 50,000, and most preferably from 20,000 to 60,000. When the molecular weight of the elastomer is too large, the peeling property tends to decrease, and when it is too small, the viscosity is lowered. It is difficult to maintain the uniform thickness of the resin film, and the resistance of the treatment liquid tends to deteriorate with respect to the electroless electricity. 102 201146113 .nt ^ In addition, DFR is made of an acrylic resin containing a carboxyl group of a predetermined amount, a ring of a ring of a child, or a acetaminophen resin, etc., as a resin, for example, DFR, for example, Asahi Kasei Co., Ltd. The series made by the company. In addition, as for the other resin film, for example, J has a ruthenium base and the benzene ^ ^ ^ ^ ^ ^ Chuan Chemical Co., Ltd. made by Naxi 29") ^. Resin which is a main component (for example, "French F" manufactured by LEKTRACHEM Co., Ltd.) Resin 臈 G23 ' is applied to the surface of the insulating layer G2 by a conventional spin coating method or a stick coating liquid or emulsion. After the above:: A tool such as a 缘 edge laminator will be formed on the surface of the DFR on the support substrate and then fully cured, and the thickness can be easily formed. For example, it should be below ¥, It should be 5μηι Bu and Ο] 1 or more 'more suitable for Ιμιη. When the thickness is too strict, = injection processing or machining to form a fine circuit drop = tilting outwards ~ when the thickness is too much, there will be difficulty in forming a film thickness of the flat f ^ ' ΐ resin film fat should be used, for example, to be acid The same amount of the acrylic acid in the 100~_left resin to the fine silk, that is, in addition to the above, the tree wax film G23 preferably has the following characteristics, and the resistance to the liquid medicine is high; (2) which will be described later. Film ^. Dry, Jl and remove the resin film (photoresist); (3) high film formation; (4), Shibuya, (5) high preservation. Regarding the electroplating core-attached chemical solution, in the case of the gel-like catalyst system in the case of 103 201146113, in the case where the catalyst is provided as a weak catalyst, the m-catalyst system is resistant to a pH of 1 to 12. In addition, when the fpH value is 1~11, the photoresist is not immersed in the liquid medicine order, and the photoresist is generally used as a film sample, which is generally ancient or dissolved, and has a function of light resistance. another

St, left and right, but this is not the second == 吏 12 to Η, you can easily remove the light _. Comparison: PH value Processing temperature is room temperature ~ 50. (:, processing time is = degree is about 1~1〇%' sprinkle treatment, but not limited to this. In order to be absolutely: open: two, to, collapse or spray becomes a report I., CA tears 4 , 力 缘 材料 材料 成 / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / / The time is arbitrary. If it is, the dry film-formed photoresist will also have a three-layer structure that prevents the recording of the film and the cover film, but it is of course stored at room temperature. The best, but must also be kept in the cold; ^ ς ^ must be separated in the 5 scales of the dry film composition will not separate, the bend will not decrease and the crack from the above point of view, the resin film G23 can be (a a polymer resin obtained by polymerizing at least one or more kinds of monomers having at least one polyunsaturated group of a carboxylic acid or an acid group in a molecule, and at least one or more monomers. Or a resin composition of the polymer resin. For the related art, for example, Kaiping No. 7-281437, JP-A-2-231-231 19〇, Japan special opening ^ -201851, etc.. About (8) monomer 'for example: (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid, itaconic acid, maleic acid needle, maleic acid half vinegar , butyl acrylate, etc., may be used alone in 104 201146113, or may be used in combination of two or more. Regarding (b) monomer, generally, for example, is non-acidic and has (a) polymerizable unsaturated group in the molecule. However, it is not limited to this. It can be selected by maintaining various properties such as resistance in the plating step and flexibility of the cured film. Specifically, there are thiol-propion m-based and f-based (10) acid B. Vinegar, isopropyl isopropyl isopropyl S, methacrylic acid, f-acrylic acid, second butyl vinegar, propylene terephthalate, methacrylic acid 2 _ vinegar, methacrylic acid 2 There are also vinyl alcohols such as vinyl acetate and vinegar, methyl propylene or polymerizable styrene derivatives, etc. In addition, there is a bismuth acid in the molecule. Or the polymerization of acid needles can also be produced. Furthermore, in the form of a three-dimensional cross-over A complex amount of acid 100-~2_ contained in the resin when the resin contains a filament in the resin, such as a hydroxyl group, a mercapto group, an amine group, a mercapto group or a vinyl group; Preferably, the excitation is _ _, more preferably (10) ～ 6 (10). When the acid is a working solvent or a contact thereof, the impurity or the electrical surface is resistant to the work: the ratio of the composition of the monomer (8) is preferably 5 to 70 mass. %. Day--, the main resin (adhesive resin) with the polymer resin as a main monomer, filler or other additives, etc., at least one of them, about 5, 〇〇〇~50,000 If the weight is flat eight; 2: If the electric ore core is attached to the liquid chemical resistance (acid resistance to iis liquid resistance, to prevent laser processing), easy to use, or to be light plasticizer The _sexuality of the two' can be considered. Specifically, for example, in order to combine various resistances, it is possible to add cross-linked dilute isopropyl vinegar, methyl acrylic acid, butyl sulfonate, ethyl propionate, methyl propyl hydrazide, dibutyl methacrylate, Propylene 105 201146113 f-based acid 2 · ethyl acetate 1 - propyl acrylate 2 · propyl _ and so on. The other styrene, styrene, or mercapable "or. 丄 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 About monoenoic acid H Μ hex: alcohol-f-based acrylic vinegar small 4 · cyclohexane diol dimethyl propanol dimethyl acrylate vinegar, polyethylene glycol dimethyl acrylate vinegar, Sa 9 9 private A polyoxyalkylene glycol dimethyl propylene such as fermented dimethacrylate, etc.: a new pair of phenyl phenyl propyl methacrylate, glycerol trimethyl methacrylate酉 、 , 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三 三A silyl group, a polyfunctional bis group containing an amino carboxylic acid vinegar, a dilute 1, and the like. It is also possible to define the above-mentioned monomer or the oligomer of the monomer-reactive oligomer. Specifically, for example, dioxotomy, hydrazine, ίη clay, kaolin, oxidized chin, sulfuric acid pin, oxidation Ming, oxygen filler Rong's ice mother, glass, acid acid unloading, limestone, magnesium sulfate, fibrin, organic f ϋ. In addition, the preferred thickness of the photoresist is α1~1()μ1η is very thin, so the filler should be small in size. The average particle size can be used, and the coarse particles are passed through the cutter, but they can also be broken when dispersed, and the coarse particles can be removed by rubbing. Other additives include, for example, a photopolymerizable resin (photopolymerization initiator, a coloring agent (dye, pigment, chromonic pigment), a thermal polymerization initiator, a ring-based substance, or a crosslinking agent such as urethane). In the circuit pattern forming step described below, the resin film G23, because of the relationship of laser processing, etc., must be given to the sister material by the Xiang Lei laser: machine selectable carbon dioxide gas laser, excimer laser or W -YAG laser, etc. These laser-powered sizing machines have various m-wavelengths, and materials with higher absorption rates for the wavelengths can improve the efficiency and efficiency. Among them, UV_YAG lasers are suitable for fine processing, The wavelength is 3 times higher frequency spectrum 35^, 4 times higher harmonic 266mn, photoresist material (resin 106 201146113 two == this rate, the second is better choice i is good iiη has selectivity - relatively low absorption rate The photoresist material will be better than the concentration energy. The more it can pass through the light-resistance, the second material can be obtained. _ "Good two-two absolute system = mouth setting photoresist = color edge layer (10) laser The ease of processing and its relationship, etc., &lt;circuit pattern forming step&gt;, as shown in Fig. 2GF The surface of the resin film (10) (the outer surface of the film), the predetermined depth of the resin film G23 or more, and the predetermined pattern to form the circuit pattern (four) circuit pattern forming step). The road pattern G24 can be laser-assisted, The cutting or molding type is mainly used as a groove for wiring gamma (refer to Figure 19), '

Hii'i brother Ke'f Guan G24 can also include the connection of the Ø disc's step to form the metal column G22 closed hole (5) 1 different interlayer connection to produce the circuit pattern G24 with the thickness of the resin film (10) iiL'o In the case where the circuit pattern G24 on the surface (outer surface) of the other surface is formed, the circuit pattern G24 which is formed on the surface of the resin film G23 is formed. The right side of the ® 20F and the central metal posts G22, G2 ^ j ' will be formed into the insulating layer (10) and in the state of the insulating layer (10): &amp; circuit pattern G24. Back to the W surface) Buried 3 The width of the groove applied to the circuit pattern G24 is not particularly limited. In the case of laser processing, it is easy to form a circuit pattern f G24 even if the line width is in the fine groove under the (4). Specifically, cutting processing such as laser processing or cutting processing, press molding, or the like can be used. For the fine circuit pattern G24, laser processing should be used. Using laser to enhance, control 107 201146113 out "or power" insulation layer G2G excavation depth, etc. will be easier to adjust. Type processing 'for example, it should be made in the nano printing thank you use the micro tree 2 electricity' after the electroless The mineral film defines the fourth (4) 2 Jf7, which indicates that the circuit pattern G24 is formed in such a manner that the circuit pattern G24 is previously exposed from the bottom surface of the circuit pattern G24 at the top of the gold layer pillar it metal pillar G22. This is because, as follows In the case of the G20, the resin constituting the insulating layer G2 is easily removed, but the structure of the metal money constituting the metal pillar G22 is difficult to remove. &lt;catalyst coating step&gt; Pro = shown in Fig. 2GG' on the surface of the resin film G23 and on the surface of the circuit 3 = 24, the electric money catalyst G25 (catalyst slope step) is coated. That is, on the surface of the G24 and the unshaped On the surface of the ship G24, the electric power is on the surface of the G24. In addition, from the point of view of the electroless ore that will be described later, it is necessary to cover the surface of the metal column G2 with the plating catalyst G25. On the other side of the electricity _ media G25 can make the work easier. Here,; plating The medium G25 conceptually includes its precursor. The electro-mineral catalyst G25 is intended to form a catalyst that is not previously provided in the electroplating step described later, and the electro-mineral catalyst G25 can be solved by ', , and f. Electric flipping 'no mosquitoes. Correction, can also pre-slope drive, she will remove the film after G23 to make electricity _= =. Specific examples of electricity money touch G25, for example: in addition to metal peak ^, platinum

In addition to the Bf Ag metal, it also contains precursors that can form such metals. &quot; About the method of coating the plating catalyst G25, for example, after treatment with an acidic Μ-% colloidal solution which can be treated under ==; More specifically, for example, the following method. First, 'the solution of the surface of the insulating layer G2G on which the circuit _ G24 is formed (cleaning agent, blending agent) is determined by the predetermined Si first-passer, and the soft side agent of sodium persulfate-sulfuric acid is used. Soft Yu 108 201146113 ^ Processing. Then, it is connected to a sulfuric acid aqueous solution or a hydrochloric acid aqueous solution having a pH of 丨2, and is immersed in a pre-dip liquid to be vaporized in a vaporized stannous/concentration of about 1%. Prepreg treatment on the surface of the reed. Thereafter, it is further impregnated with an acidic catalyst metal colloidal solution containing an acidification such as a gasification of a vaporization amount and a gasification value of 1 to 3 to produce =Pd and Sn. Then 'between the adsorbed stannous chloride and the gasified 1 bar _==ta2+pdcl2-Sncl4+Pd丨). Thereby, the electric clock can be used, and the conventional acidic Pd can be used as the acid catalyst metal colloidal solution, and a commercially available company using a commercially available acidic catalyst metal colloidal solution can be used. With the catalyst coating treatment, as shown in Fig. 2〇G, the Wei catalyst G25 is coated on the surface of the resin film and on the surface of the &lt;1 road pattern G24. &lt;Thick film removal step&gt; The resin film G23 (skin removal step) was removed from the insulating layer (10) as shown in the film. That is, when the touch (2) is a soluble fat = or the test solution dissolves the resin film G23, it is removed from the surface of the insulating layer G2 (). When the film G23 is a swellable resin, the resin film G23 is swollen using a predetermined liquid, and is peeled off from the surface of the insulating layer G2. good

(4) Film removal step 'The electric ore catalyst 25 can be left on the surface of the insulating layer G20 on which the circuit pattern G24 is formed. On the other hand, the electric clock _ G25, which is coated on the tree J, is removed from the absolute layer (10) together with the resin film. Here, from the electric ore catalyst G2 that prevents the self-insulating layer G2 from being removed, the Wei edge is again coated; | G2G on the silk surface, the tree skin, the = ^ machine fine G23 mineral wire _, as long as The base material G10, the insulating layer (10) and the electric sputum 〇25 are substantially decomposed or the tree smear film G23 is turned or the swelled coating is removed from the insulation: the degree of removal can be broken, and the other wire values are fixed. 109 201146113 Liquid, It is preferable to select according to the kind, thickness, etc. of the resin film G23. Specifically, for example, when a photocurable epoxy resin is used as the photoresist resin, an organic solvent or a photoresist removal agent of an alkaline aqueous solution or the like can be used. In addition, for example, when the resin film G23 is made of an elastomer such as a di-seal elastomer, an acrylic elastomer, or a polyester-based elastomer, or when the resin film G23 has at least one polymerization in the molecule (8) a monomer of at least one of a carboxylic acid or an acid anhydride-containing carboxylic acid or an acid anhydride, and (9) a polymer obtained by polymerizing at least one monomer polymerizable with the (8) monomer, or a resin containing the polymer resin In the case of the composition, when it is formed of the above-mentioned carboxyl group-containing acrylic resin, an aqueous test solution such as a sodium hydroxide aqueous solution having a concentration of about 丨1% to about 〇% is preferably used. Further, when an electroplating process which is treated under the acidic conditions described above is used in the catalyst coating step, the resin film G23 is swollen under the acidic conditions under a swelling condition of 6 〇% or less, and under 40%, under the test conditions. An elastomer having a degree of 5% or more, such as a di-semi-elastic elastomeric elastomer and a polyacetate-based elastomer, or a dicarboxylic acid having at least one polymerizable unsaturated group in the a-knife f Or at least 1 octagonal monomer of an acid anhydride and at least one or more kinds of monomers which can be polymerized with the monomer, or a polym'j complex or a tree-containing polymer The aforementioned Wei group-diluted acid 'tetra(4) lipid is formed. The resin film has a 1 value of 11 to 14 Å, preferably an alkaline aqueous solution having a enthalpy of 12 to 14, for example, a sodium oxynitride having a concentration of two right, which is easily dissolved or swollen, and is removed by dissolution = i. S outside the 'in order to improve the solubility or susceptibility' can also be used in the impregnation of the wave. In addition, it can be peeled off with light force as needed. In the method of removing the resin film G23, for example, the resin film G23 is immersed, and the layer G2 〇 is immersed in the liquid for removing the resin film for a predetermined period of time and the outside of the column. Removability, when it is impregnated, when it is difficult to peel off or dissolve and remove, it may be required to &lt;Electric money step&gt; "Improve the electroless bond to the insulating layer G20" as shown in Fig. 201 Residual electric ore catalyst G25 on the part of the circuit pattern G24 and the exposure of the metal column G22 110 201146113 G2 ° 2 竑, & 使 亥 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 ° 绝缘 绝缘 绝缘 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 电路 ί ί Through the metal column G22, the fine-grained step G' method can be used to form a part of the on-board circuit _ G24, which can be partially coated with an electroplating catalyst (10). Aluminium (a metal of Aim electrolysis money) such as copper (CU), nickel (10), Ming (four), miscellaneous '& primary age (four) plating is excellent by the material, it is better to be resistant to street or The adhesion to the tan material is excellent, and the film thickness of the electroless plating film is not particularly limited. In terms of body, ιομηι' is preferably about 1 to 5 μm. In the eight-electroplating step, the portion of the plating layer G25 remains on the surface of the insulating layer G20: an electroless plating film is deposited. If so, it can be formed only 2, the conductive layer of the circuit G20 is formed with high precision. On the other hand, it is also possible to prevent the electroless bond film from being deposited on the portion where the circuit = (10) is not formed. Therefore, even a plurality of line widths are formed at a narrow pitch interval. The narrow fine wiring G26a does not leave an excess plating film between the adjacent wirings G26: Therefore, it is possible to prevent the problems such as short-circuiting or migration, and the laser plating process can be performed on the surface of the insulating layer G20. The electroless plating film is deposited on the surface, whereby a new second circuit G26 is formed on the surface of the insulating layer G20, and the second circuit G26 of the insulating layer G20 and the first circuit G11 of the circuit board G10 are transmitted. The interlayer connection hole G21 or the metal pillar G22 is connected between the layers. % L passes or repeats the steps ', as shown in FIG. 19, a multilayer circuit having the second circuit G26 on the surface of the insulating layer 2 is formed. Substrate G1. Then, at ^ In the circuit board G1, the electric circuits Gil and G26 and the interlayer connection hole G21 are connected to each other in each layer, and the electrical circuits G11 and G26 of the respective layers are connected to each other through the interlayer connection 111 201146113 access hole G21. In the manufacturing method described in the embodiment, the second circuit can be freely adjusted by adjusting the depth of the circuit diagram with respect to the insulating layer G2G. The second circuit (10) can be formed on the portion of the insulating layer G20. Or the second circuit G26 is formed in a portion of the base second circuit (10) at a different depth from each other, so that the circuit thickness of the thicker g road G26 is larger, so that the circuit has a larger strength and power. In the manufacturing method of the present invention, the metal forming step and the metal pillar forming step of forming the circuit pattern G24 can be used in advance to electrically fill the metal for the interlayer connection hole G21 into the contact hole (9). When the metal is filled, since the circuit pattern I does not grow from the side of the electric gate, it is possible to prevent the pores from being filled, and then, due to the step of connecting the holes G21 between the layers, the circuit is formed. Step conductor Phi catalyst, it is two and a plating step, is connected to the above additive method between the first and second circuit pattern G26 G24 Lang, even slight build-up method using the circuit for producing the paste layer iv ^^ circuit 1 '. Also (4) suitable for the addition method, in the manufacturing method of the sample, in the circuit pattern forming step, it is preferable to insert the pad G ^ 顶部 at the top of the column G22 of the metal 丝 如 如 如 26 ;^图^). In the manufacturing method of the present embodiment, the metal pad portion G26b is used in the manufacturing method of the present embodiment, which is capable of sufficiently supporting the mounting part by utilizing the erroneous effect of the insulating layer (#4) body layer, and is capable of sufficiently supporting the mounting part, in the gold 112 201146113 hole G21 filling plating metal. Since the conductor, that is, the electric circuit (1) is used as the electroplating core for electroless plating, the metal post G22 is simply formed. In addition, in the manufacturing method of the present embodiment, in the step of forming the metal pillar, the surface of the layer G20, the inside of the interlayer connection hole (2), and the surface of the exposed first electric circuit G11 are covered. The plating catalyst G25 is coated, and after electroless plating is applied to the plating catalyst, the electrolytic plating is performed, thereby filling the interlayer connection with G-21, and then removing the surface of the insulating layer G2. The outer layer of the insulating layer G2 赖 赖 it ;; Since the electroless (four) plating layer formed on the outer surface of the insulating layer G2G including the surface of the insulating layer (10) is used as the electrolysis layer, the metal pillar G22 can be formed reasonably. In the production method of the present embodiment, the resin film G23 is preferably a resin film which can be dissolved by a predetermined liquid and swelled to be removed or removed from the insulating layer G2G. The tree-like film G23, such as Hai, can be easily and smoothly removed from the surface of the insulating layer G2〇: the film G2^:^ is removed or peeled off. When the resin film G23 is removed when the resin film G23 is removed, the electro-mineral catalyst G25 on the resin film (9) is scattered, and the plated catalyst G25 is scattered: the coating is not covered, and the insulating layer G2 An excess plating film is formed on the portion of the crucible. Since the resin film G23 can be easily and smoothly removed from the insulating layer G as described above, such problems can be prevented. In the multilayer circuit board ω manufactured by the manufacturing method of the present embodiment, even if the fine case G24 and the interlayer connection hole G21 are mixed, the metal filling of the interlayer connection hole (10) can be sufficiently and smoothly performed, and the circuits G11 and G26 are The connection between the interlayer connection holes G21 is good, and it is possible to prevent the circuit portion from forming an unnecessary conductor. The multilayer circuit board G which is less likely to cause a short circuit or the like can be used. Therefore, the application force can be suitably applied: the method is successful, and the build-up method is used smoothly. A multilayer circuit substrate G1 is manufactured. As a result, the multilayer circuit substrate G1 on which the electric circuit G26 having a high shape accuracy is formed can be obtained. By using the method of manufacturing the multilayer circuit board 〇1, it is possible to manufacture a multilayer circuit board Q1 which can be used for applications such as an IC board, a mobile electric printed wiring board, and a three-dimensional circuit board, which have a narrow width of the wiring G26a and a small gap between the wirings G26a. . In addition, in the method of manufacturing a multilayer circuit board, the resin film G23 is made to contain a fluorescent substance, and after the above (4) is removed, the surface of the prefecture is irradiated with purple 113 201146113 external light or near-ultraviolet light, and the fluorescence is utilized. The luminescence of the substance checks whether the film is completely removed. In the method of manufacturing a multilayer circuit board of the embodiment, the metal line G26a having a very small interval between the line width and the wiring G26a can be formed. In this case, there is a problem that the resin film G23 between the metal wires G26a adjacent to each other, for example, cannot be completely removed. When the film G23 of the metal wiring G26a is formed, a plating film is formed on the portion, causing problems such as migration or short-circuit. ^ When the resin film G23 contains a fluorescent substance, the film removal surface can be irradiated with a predetermined light source after the film removal step, so that the film G23 remains partially saturated, thereby checking the fineness Go to the location where Pico County is completely removed. - In the present inspection step, the fluorescent material f contained in the resin film G23 may be formed by a predetermined light source, and the other is not limited. And such as: Fluoresceine, Eosine, Pyronine G and so on. The portion where the luminescent portion of the fluorescent substance is detected is the portion of the residual tree sapphire film G23. Therefore, by removing the portion where the light is detected, it is possible to prevent the formation of the portion. By this, it is possible to prevent the occurrence of migration or short-term problems from occurring in the [fourth embodiment of the second embodiment]. The fourth to second embodiments of the present invention will be described with reference to Fig. 2 . In addition, the same reference numerals are used for the constituent elements of the same or the same phase of the disk, and the description thereof is omitted, and the description of the characteristic portion of the fourth to second yoke is added. Metal ί ί f ΐ ΐ ' As shown in Fig. 21D, in the metal pillar forming step, the top of if in C is not exposed from the bottom surface of the circuit pattern G24 ^ is quite G22 as shown in the training, in the circuit with the formation In the step, the circuit pattern G24 is formed without being exposed or protruded from the bottom surface of the circuit diagram_4. As a result, as shown in FIG. 211, in the electric ore step, 114 201146113 can prevent the conductor layer formed on the top of the metal post G22 from protruding from the insulating layer g, thereby eliminating or reducing the circuit G26 in the insulating layer (10). Step into ^ f. Raw bumps. Therefore, even if the number of stacks is increased, the above-produced product does not become large, and a fine circuit can be formed. 7 The resulting bumps or the steps of the pattern of the 4-th implementation can be used to grow the gold hybrid G22 to the insulating layer (10) = column ^, for example, by secret engraving, etc. = the position of the bottom surface, whereby the circuit pattern G24 is formed in the step of forming the circuit pattern G24 as shown in Fig. 21F to the circuit pattern G24 without the top of the metal pillar G22 being formed from the circuit. If the page is highlighted, the shape of the electric gate (10) is broken. The fourth embodiment of the present invention will be described. In addition, the same or equivalent constituent elements of the disk are the same as those of the first embodiment. 4th and 3rd embodiment, as shown in Fig. 22F, the groove of the same depth and the groove of the same depth === (10) in the i-face and road pattern plating step, the second thunder class, Figure 221 does not have 'in the second one': the fine circuit pattern ^ and the layer = layer = = shape = enough to apply the additive method, the instrument layering method ^ ^, there is no shadow for the technical features of the present invention Layer circuit board (1), [fourth to fourth embodiment] The outer iff 25 illustrates the fourth to fourth embodiments of the present invention. In addition, the fourth symbol of the disk is denoted by the same reference numeral, and the detailed description thereof will be omitted. The description of Liguang's abbreviated section only explains the steps. &lt;Circuit Substrate Preparation Step&gt; • The circuit board (10) of the musical cell circuit G11 shown in Fig. 25A (circuit substrate preparation step) 115 201146113 &lt;insulating layer forming step&gt;, as shown in Fig. 25B Otherwise, the insulating layer G2 is formed on the surface (circuit forming surface) of the circuit substrate on which the first circuit G11 has been formed (insulating layer forming step &lt; opening forming step &gt; Next, 'inserting as shown in Fig. 25C' The surface (outer surface) of the layer G2 is subjected to a laser beam G21 (opening forming step) on the insulating layer (10). ^, the interlayer connection hole (9) reaches the circuit board (10) of the first circuit (1) The circuit G11 is exposed. &lt;Metal column forming step&gt; Next, as shown in Fig. 25D, the exposed interlayer hole G2 is filled with electroplated metal from the exposed third circuit block 11 by electroless, ore or electrolytic recording. A metal pillar G22 is formed in the interlayer connection hole G21 (metal pillar forming step). In the fourth to fourth embodiment, as shown in FIG. 25D, in the metal pillar forming step, the soil pillar 22 does not grow to the insulating layer. The height of the surface of the G20. The plating metal is filled to the unreached in the circuit The position of the bottom surface of the circuit pattern G24 formed in the step of forming the film. <Thin film forming step> Next, as shown in Fig. 25E, a resin film G23 (film) is formed on the outer surface of the insulating layer G20 and the top of the metal post G22. [Formation step). &lt;Circuit pattern forming step&gt; Next, as shown in Fig. 25F, a groove having a predetermined depth or more and a predetermined shape of at least the thickness of the resin film G23 is formed from the surface (outer surface) of the resin film G23. And / or opening a hole to form a circuit pattern G24 (circuit pattern forming step). The circuit pattern G24 can be formed by laser processing, cutting processing or profile processing, etc. 5 Hai 4th-4th aspect, as shown in Figure 25F The resin film G23 remains on the metal post G22 in the circuit pattern forming step as indicated by the symbol A. That is, the relationship of the position where the metal post G22 does not grow to the bottom surface of the circuit pattern G24 in the metal post forming step. And remaining, the residual resin film G23 is removed in the subsequent film removing step. Thus, in the circuit pattern forming step, the top of the metal column G22 does not The bottom surface of the road pattern G24 protrudes to form a circuit pattern 116 201146113 rnmG23 ^ 卩 将 ^ G G 23 23 23 G G G G G G G G G G G 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 触 触 触 触 触 触 触 触 触 触 触Step &gt; Next 'as shown in Fig. 25G, in the resin sulphate lord® * 〇 24 〇 25 (^t^ &lt; film removal step > more retracted record ^ 1 卩 in the ratio of the bottom surface of G24 &lt;Electroplating step&gt;, as shown in Fig. 251, an electroless electric ship is formed on the portion of the circuit _ G24 in which the electric _ _ _ _ _ _ _ _ _ _ _ _ _ 2 of the insulating layer = ^ = The plating catalyst G25 is not left on the exposed portion of the mtf 22, and it is a kind of miscellaneous chemical growth. Further, the second circuit G26 of the peach edge layer G2G and the circuit board (10) are connected to each other via the metal post G22 (electroplating step). Through the eight-consistency pattern, as shown in 81 25F, in the circuit pattern forming step, the Si ^ = portion does not protrude from the bottom surface of the (five) 4 _ 彳 彡 去 去 去 去 去 去 去 去 去 去 去 去 去 去 去 她 她 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属The bottom surface of the pattern G24 is exposed at a position further backward. As a result, if i/kg does not prevent the conductor layer formed on the top of the metal post G22 from protruding from the outer surface of the insulating layer G20, thereby eliminating and reducing the circuit (10) on the insulating layer (10) The resulting bumps. More specifically, as shown in an enlarged view of FIG. 26, when the outer surface of the insulating layer (10) reaches the bottom surface of the circuit pattern G24 of 117 201146113 (that is, the depth of the circuit pattern G24), the bottom surface of the circuit pattern G24 is set to The distance from the top of the metal post G22 (that is, the (four) (four) paste of the metal post G22 (10) is set to d2, 〇 &lt; as 疋, due to the depth of the road pattern G24 from the outer surface of the insulating layer G2〇 to the bottom surface of the circuit pattern 〇24 The distance (reverse depth) from the bottom surface of the d-circuit pattern G24 to the top of the metal post G22 is set to 汜. Therefore

Ifϊίί 2 degrees^ is smaller than the depth dl of the circuit pattern G24. Therefore, the conduction of the circuit (10) = is sufficiently filled with the metal of the interlayer connection hole G21, and the connection between the circuit G26 and the interlayer connection hole G21 is excellent. Use or cover to reduce the 应 or 犯 of the 应, or the wiring G26a of the circuit pattern G24, the width of the groove or the (four) part (the size of the _ hole, etc., except for &lt; 2 „0〇/ 〇 ' ' ' can also be 〇 汜 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 G G G G G G G G G G G G G G G G G G G G G G G G G G G The step towel 'metal column G22 Ψ mine is at a position that is more retracted than the bottom surface of the circuit pattern G24. The bottom of the metal column before the step of removing and finely removing the ilU is easy to reach the top of the metal column G22. In the case of the G20 surface excavation circuit pattern G24, the top of the metal column G22 and the surface circuit G2 of the insulating layer G20 ^ the bottom surface 3 high ^ the top of the metal column G22 from if (the top of the t^iG22 is not reached Μ L secret, the state of the metal pattern of the metal pillar road pattern G24 is prominent; the surface of the metal surface G22 is not electrically charged [ΪAdditional description of the implementation aspect] Figure 27, in more detail, the (C) opening formation 118 of the fourth embodiment is performed. 201146113 Step, (E) Film forming step, (G) The dielectric coating step is as follows: The metal column G22 may be in the shape of a truncated cone or a truncated cone as described in the step of forming the metal pillar according to the fourth embodiment, and Fig. 27C shows the fourth embodiment. In the case of the (C) opening forming step, the interlayer connection hole G21 having a shape in which the diameter of the surface side of the insulating layer G2 is larger than the diameter of the first circuit G11 is formed. As shown in Fig. 27E, in the (8) film forming step of the 4-1st embodiment, the surface of the insulating layer G2 and the top of the metal post ο are formed with the metal for filling the resin film 〇 23 (10). The column G22 also forms an insulation, that is, a shape in which the metal length is larger. Also, when the circuit pattern forming step irradiates the surface of the resin skin with a laser beam, the large diameter portion of the metal column G22 is shielded. And Jing produces the part of the insulating layer G2G that has not been removed. As a result, in the (6) catalyst overcoating step of the catalyst (4)^4-1 implementation, the plating is applied to the insulating layer: ί 09 ϋ, in The side of the metal post G22 is not covered with the plating catalyst G25, so in the metal column ^ tam ί ff f022 ί As shown in FIG. 201, the metal ^ 2 protruding from the bottom surface of the metal ==:::: is difficult to cover the case where the catalyst G25 is applied to the circuit pattern G24 119 201146113 - 4, even if the upper portion is lower than the lower portion The thick metal post G22 does not have a problem of poor connection between the metal crucible G22 and the second electric circuit G26. [Fifth Embodiment] The present invention further relates to a circuit formed by embedding a circuit layer composed of a conductor. In the past, a circuit board in which a circuit layer made of a conductor is embedded can be formed by a CMp (Chemical Mechanical Polish) method (for example, Japanese Patent Publication No. 2000-49162). Figure 33 shows an embodiment of the CMP method. In the CMp method, first, as shown in Fig. 33 (a), a circuit trench illusion (groove portion) is formed by laser processing on the surface of the insulating substrate K1. Next, as shown in (B), an electroless plated film 6 is formed on the entire surface of the insulating substrate κ1 including the circuit trench K3. Then, as shown, after applying a voltage to the electroless plating film K6 to form an electrolytic plating film K2 on the entire surface of the insulating substrate K1, as shown in (9), the grinder K22 will electrically charge the film 21 and The electroless plated film 6 is removed from the surface of the insulating substrate K1 to expose the surface of the insulating substrate K1. By the above steps, the circuit board on which the circuit layer K13 is embedded can be obtained, and the circuit board 10 can be set to a width of, for example, about 30 μΓΠ, so that a high-precision circuit board can be obtained (10). . However, the circuit substrate K1〇 formed in the above manner, as shown in FIG. 3 to: the insulating base (4) of the J-containing circuit trench Κ3 is removed by the bismuth f' and the remaining electric ore is removed, g Then, as shown in Fig. 34(C), since the polishing force applied by the polishing ray film is different, the surface of the electric film formed by the removal of the electric film is removed, and since the exposed filler K11 is caused by the filler K11 on the surface. Will not be able to maintain the original shape. : The chance of smashing and falling off the road is higher, and the subsequent step may be caused by pollution. In addition, due to the grinding of the surface of the insulating substrate K1, the surface can be exposed. The filler K11 is used as a starting point to generate minute cracks. Further, since the filler K11 on the surface is broken, the substrate characteristics such as thermal expansion property or strength may be =, and the circuit board in which the circuit layer composed of the conductor is buried may be produced. The method, for example, the conventional transfer method, the transfer method is to form the surface with the surface of the circuit layer opposite to the surface of the insulating substrate to adhere to the edge of the edge, and then turn the circuit layer. The substrate is printed and embedded in the insulating substrate, and the circuit layer is pressed and embedded in the insulating substrate, and is formed by contacting the resin coating on the outer surface of the insulating substrate. The problem that the adhesion of the material is low. The bottom surface v of the square g for improving the adhesion can be treated by the CZ treatment on the surface (circuit layer, bottom surface) of the metal foil provided on the release material, although Improve the adhesion of the bottom of the circuit layer = side bribe Sex, silk forming a narrow layer of secret layer two transfer method - generally the depth of the circuit layer is formed into a circuit layer with different taste. In addition, the transfer path formed by the g layer of the circuit ==== short There is a limit of 'so that it can't be made between the circuit layers. It is very short ^1 in _# (four) stealing, the law, such as subtraction method, accumulation method, etc., it is difficult to form ^ 3酉 =. Furthermore, even if fine wiring can be formed, if the peeling material μ 3 & degree is too strong, it cannot be transferred onto the insulating substrate, and the yield is too weak, and it is difficult to get from the material. Micro-cause, peeling the material and the sound of the dense surface by ρ丨^ Λ,, ''W peeling off the material and the circuit ^ electricity; layer transfer to the insulation ^ control will become more difficult, but also can not be fine with another In the case where the insulating substrate is multilayered, if the transfer method is employed, since 121 201146113 does not form a circuit on the insulating core, a circuit is formed on the release material in advance, and then transferred onto both sides of the insulating substrate. It is difficult to wire the wire between the layers, so it is difficult to align the position with high precision. </ RTI> The problem of the present invention is to provide a high-precision circuit substrate which does not lower the adhesion height of the circuit layer even if the filler is broken. Also, the fifth embodiment of the present invention includes the following technical contents. a circuit substrate formed by forming an insulating substrate formed of a filler-containing ore material into a circuit layer formed of a surface material, wherein a contact surface of the characteristic substrate is formed along a protruding shape of the filler contact surface. [Claim 5-2. The circuit substrate as recited in claim η, wherein the contact surface of the insulating substrate and at least part of the request from the contact surface are filled with the request 5-3. Or in 5-2, the exposed surface filler of the j insulating substrate is not exposed. Earth, /, request item 5.4. As in the request item 5_1~5-3, the circuit board described in the item, iT^5-6. As claimed in item 5 - 丨~5-5 The exposed surface of the circuit A described in the item is very flat and is not invented on the boundary line with the insulating substrate. Since the exposed surface of the insulating substrate is made of a filler material, it is possible to prevent the material from being ^^ Maintains the shape by filling the filler with a low insulating base. In addition, since the characteristics of the substrate such as electric heat spreadability or strength are reduced to form a concavo-convex shape, the contact surface of the material follows the protruding shape of the filler, and the circuit layer and the insulating substrate are combined in a concave-convex manner, so that the circuit can be improved 122 201146113 Adhesion of the layer to the insulating substrate. And the invention of the life = ^ 5-5 is due to the contact of the circuit layer with the insulating substrate 2, so that the circuit layer does not penetrate the resin layer but directly with the insulating substrate, so that the circuit layer can be further improved. The adhesion of the circuit layer ss===;= With the invention of Ray 5:4, the contact surface of the insulating substrate with the circuit layer facilitates the contact surface to make the filler protrude, so that the fine surface is formed into a concave-convex shape. In this way, a high-precision circuit substrate having high adhesion is obtained. Twisting, γΓ^明' is made thin by making the exposed surface of the circuit layer very flat, and at the same time eliminating the inter-board between the circuit layer and the insulating substrate - and making the circuit substrate flat Very smooth circuit base = 8. = The implementation of the circuit board for the application of T - an example of the insulation of the base iK1 __ is formed using a circuit layer 103 composed of a right H 驹 4: 1 + 〒. In the case where the filler K11 is in the form of a ruthenium and a ruthenium, a spherical filler κη is used. 4 of κΐ3: the exit surface) forms a flat surface. That is, the width W of the circuit layer illusion 3 is secret. In the circuit layer, the circuit &gt; K1 &amp; = &amp; gas characteristics can be improved. Then, there is no height difference between the surface of the patterned circuit layer K13 and the surface of the insulating substrate K1. By this, the entire surface of the circuit board K1G is flat, and the thin circuit board K10 can be made. The exposed surface of the insulating base material K1 is different from the case where it is formed by the CMp method. That is, in the case of formation by the CMp method, the insulating substrate K1 in which the filler K11 shown in FIG. 34 is broken and exposed is formed, but the exposed substrate κιο of FIG. 2 is not exposed on the exposed surface of the insulating substrate K1. In the vicinity of the filler κ ϊ ΐΐΐΐ ΐΐΐΐ , , , , , , , , , , 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘 绝缘The surface resin layer K12 is composed of a resin component which does not contain =1, and which coats the film of the surface of the rim substrate K1. Here, the term "resin component" refers to a component other than the filler K11 forming the insulating base material (2) other than the resin, and further contains a component such as a curing agent or a component. In Fig. 2, the surface resin layer is closer to the surface side (outer side) than the line. Since the sample resin layer K12 covers the filler KU, it is possible to fill _ and produce a filler or a micro-wei problem. The surface of the road surface κι is embedded in the surface of the insulating substrate κι (with the protruding surface of the insulating substrate 2 ^ 2, the contact surface of the filler K11, and the contact surface of the circuit layer 1 〇 3 is formed to form a filler Fantasy 1 ί. f road layer κ ΐ 3 money edge substrate κι like this job concave shape i: degree; ^ circuit layer κ ΐ 3 and insulation substrate κι improve adhesion, and form ί, layer KU with insulating substrate K1 The contact surface, _ may also be ii =, the resin layer of the edge substrate K1 is in contact, however, in the illustrated aspect, ί is % j, and the filler κ ΐ 1 protruding to the contact surface of the circuit layer κ ΐ 3 is in contact. The surface of the road is not set to the surface of the resin layer 2, the filler Ku is exposed, the circuit shore $ of the filler K11 contact. If, because the circuit layer K13 does not pass through the ▲ face line followed by 1 touch, _ more advance - step increase 124 201146113 Unbroken fillers as shown in the figure, the filler κΐ1 should be used to capture the hemispherical ball that is not damaged and protrudes. Contact. If so, make = K11; and directly contact the circuit layer K13, to turn over the resin substrate 4 Μ ^ circuit groove K3 road surface protruding and exposed. Contact the bottom surface and side with the filler K11. That is, in addition to the adhesion of the bottom surface, the adhesion of the side surface is also S; ==; = small high-precision circuit substrate in the circuit board K10 of the present invention, since the adhesion is as described above The layer K13 is formed in a very narrow width (W) to the height (T) ratio (W/T). It is preferable that the circuit board K13 of the circuit layer K13 having w/τ within the range is α1 or more and 3G 3 The preferred energy sample: by this, the width of the circuit layer 13 can be reduced, and the high-precision earth plate Κ 10 can be obtained. If the W/Τ is smaller than the range, there is a doubt that practical application cannot be applied. If w/τ is larger than this range, it may not be possible to achieve high precision (higher density of the circuit). Alternatively, the circuit layer Κ13 may be formed into a three-dimensional electrode, and at this time, (w/τ) is not set. The upper limit of the circuit board Κ10 of the present invention can be obtained by being affected by the height τ of the circuit layer Κ13. With high adhesion, it is relatively easy to measure the height τ (depth) of the circuit layer 13 for each layer of the circuit layer. Therefore, the circuit substrate 10 having the circuit layers 13 of different depths can be produced in a simple manner. The circuit board 10 is illustrated as a flat plate. However, as will be described later, the circuit board 10 may be a three-dimensional circuit board 60. That is, the present invention is not limited to the circuit in which the circuit layer 13 is formed on the planar insulating substrate Κ1. The substrate Κ10. Specifically, if the insulating substrate Κ1 is made of a three-dimensional insulating substrate 125 201146113 having a low-dimensional three-dimensional surface, the circuit layer K13 having the correct wiring can be obtained as shown in FIG. The circuit substrate κιο (stereo circuit board Κ6〇). [Method of Manufacturing Circuit Board] A method of manufacturing the circuit board of the present invention will be described. The circuit board 10 of the present invention can be obtained by a method comprising the steps of: forming a film forming film of the resin film 2 on the surface of the substrate κ; and forming the resin with the outer surface of the film 2 as a reference. The concave portion of the resin film Κ 2 having a deeper thickness is formed in a circuit pattern shape of the circuit pattern portion. The surface of the circuit pattern 以及 2 and the surface of the resin film Κ 2 are coated with a catalyst or a precursor thereof. a catalyst coating step of the material 5; a coating removal step of removing the resin coating film from the insulating substrate Ki; and a portion where the plating catalyst or the substance Κ5 remains after the resin coating ruler 2 is removed A plating treatment step of forming the electroless plating film Κ6 is formed. Although the manufacturing method is not limited to the method, it is preferable to form the above circuit base &amp; With such a manufacturing method, it is relatively easy to leave the plating catalyst or its precursor Κ5 on the portion where the plating film is to be formed and to remove the plating catalyst or its precursor Κ5 from the other portions. Therefore, by performing the plating treatment step of forming the electroless Wei film 6, the electroless plated film 6 can be easily formed on the portion where the plating catalyst or its precursor Κ5 remains, i.e., the portion to be formed into a smear film.乂 Therefore, it is possible to use an easier method on the surface of the insulating substrate, the degree = road layer K13. In other words, it is possible to maintain the scale of the formed circuit: as a result, even if a plurality of circuits are formed at a predetermined interval distance, for example, it is possible to prevent fragments of the electroless plating film from remaining between the circuits, and therefore, Enough 'short circuit or migration problems. In addition, the desired depth = electrical profile if can be formed. Description of the steps in the manufacturing method of the upper wire plate First, as shown in Fig. 29 (A), the surface film K2 of the insulating base material K1. In addition, this step corresponds to a film forming step. Μ%曰, as shown in Fig. 29(B), a concave portion having a depth deeper than the thickness of the protective film coating 2 is formed on the outer surface of the resin coating K2 to form a pattern portion of the filler 3 126 201146113. The circuit trench Κ3, °/ circuit pattern portion having a recess portion deeper than the thickness of the resin film K2 may be the circuit trench obtained by excavating the insulating substrate Κ1; or, if necessary, on the insulating substrate Κ1 The portion K3 is defined to form the through hole K4. Further, a portion in which an electroless ore film is formed by forming an electric field m by the circuit trench, that is, a limiting step. In addition, Further, this step corresponds to a circuit pattern formation description. Next, regarding the circuit pattern portion, the surface of the circuit trench K3 is formed on the surface of the circuit trench K3 and the pre-dried plating catalyst or removed. The resin film Κ2 is removed from the insulating substrate Ki S3: $, the catalyst or its precursor K5, and the ‘the ίίίί 于 树脂 resin film Κ 2 is placed. In addition, this step = plating. The electroless plating 臈Κ6 is carried out by the insulating substrate κι of I. That is, the electroless electricity film K6 is formed on the electroless portion, and the electroless electricity film K6 is formed by the electromagnetism K6 when the electric circuit j has = road = Κ3 The circuit layer K1 = the wrapper of the road layer κ ΐ 3 . Further, the circuit board shown in Fig. 29 (?) is formed as shown in Fig. 29 (?). If the circuit board is =, a high-precision circuit layer 127 can be formed on the insulating base material K1. &lt;Laminating film forming step&gt; The resin substrate is formed on the surface of the insulating substrate K1 without forming a resin containing a filler (the mm of the resin substrate constitutes a peach-based domain). The tree moon 曰 of various organic substrates may be used, and the others are not particularly limited. Specifically, for example, tree ί, 聚醯亚卿, polyphenyl sulphide, poly benzene (tree knowledge, subtraction correction &amp; And _, double riding amine resin.

The production 7 is a day for constituting various organic substrates which can be used as a circuit board, and the others are not particularly limited. Specifically, for example, A-oxygen resin, double-finished F-type epoxy resin, double-type s-type epoxy resin, bismuth-oxygen 2 phenol epoxy resin, alkyl phenol novolac type epoxy resin; Oxygen resin, pentacyclopentadiene type epoxy resin, benzene_ and the above-mentioned epoxy resin, nitrogen-containing resin, fluorenone-containing resin, etc., having an epoxy group having a phenolic property . Further, it is possible to paste (4) wall paste and gamma H. When the base material is formed of the above-mentioned respective resins, in general, the curing agent can be used as long as it is a hardener which can be used for curing. Limited time. Specifically, for example, dicyandiamide and benzene are hardened: a hard sputum, a cyanotriazine phenolic curing agent, a cyanate resin, and the like. This phenol is f! , ΐ. _ type, aromatic type, (four) type and other hardeners. In addition, as for the hardening, the above-mentioned respective curing agents may be used alone or in combination of two or more. "Chemical agent, for example, a hardener such as a phenolic type, an aralkyl type, or a _ type. For example, a flame-retardant property can be used, for example, a quaternary-denatured benzene resin or a transesterified product, etc. 128 201146113 The various hardeners can be used in combination of two or more types. Slaughter, limited to 'only due to the use of laser force to form a circuit diagram ~ 4GGnm wave circumference of the laser light absorption rate is good, the month of the month and the body For example, awakening imine resin, etc. The particles can be filled with κ ιι ι 该 该 该 ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ When exposed to the unbroken state, the filler K11 protrudes from the uneven surface formed by the filler K11 to improve the adhesion between the plating and the resin. The material of the fine particles, specifically, for example, an oxidation can (4), ί BaT = ^WN), High dielectric constant filling material such as nitride 1_), dioxo_), titanate ί; hard ferrite magnet strip material, wind oxidation town _(0H)2), hydroxide 1 _) 2 ), Sancha Lazhega 03): pentoxide (Sb2〇5), strontium salt, zinc borate, Compound, hard fat mm; ^(Mg3(Si4〇1〇)(〇H)2)' ^SBl(BaS04) 'Material. 'The money microparticles, can be used for single thieves, micro-pillars, can also be combined Two or more kinds of inorganic fine particles, because of the relative dielectric constant, the obstruction, the particle size distribution, and the color-degree of freedom, etc. The particle size design can easily achieve a high degree of filling. Further, the inorganic fine particles can be surface-treated with S3 in order to improve the dispersibility in the insulating substrate. The dispersibility of the inorganic dimer in the H-edge substrate may also contain a decane coupling agent. Regarding the ceramsite, the coupling agent 'specifically' is, for example, an epoxy epoxide system, a Wei Ke Wei system, an amine base stone eve. An alkadienyl phthalocyanine system, a stupid vinyl oxalate system, a mercapto propylene decyloxy decane system, a propylene gas sulphate system, a titanate sulphur coupling agent, etc. The mixture may be used alone or in combination of two or more. In addition, the insulating substrate IG In order to improve the dispersibility of the inorganic fine particles in the insulating base material, a dispersant may be contained. Specific examples of the dispersant include an alkyl ether system, a sorbate system, an alkyl polyether amine system, and a polymer. The dispersing agent may be used alone or in combination of two or more kinds thereof. 129 201146113 Further, the organic fine particles, specifically, for example, the particle diameter of the rubber % is preferably an insulating substrate. The thickness f of K1 is ^^ grain position/body, and the 5' average particle size is preferably 〇〇1~1〇μιη, and the average particle size is more than '2 5μ=. If the particle size of the filler K11 is within this range, it is insulated. It is relatively easy to form the surface resin layer Κ12 of the substrate κ with the filler KU, and the adhesion of the circuit trench Κ3 of the filler to the circuit layer Κ13 is also advanced. A埴

When the average particle size of the material KU is smaller than the above range, the adhesion effect of the filler κη may be reduced due to the shape of the concave and convex shape. On the contrary, if the filler K is used, a fine circuit trench may not be formed. K3: ΐίΐΓ is measured by a light scattering method using a laser diffraction particle size distribution meter, and the fungus is used as a sphere equivalent diameter (arithmetic average particle diameter). The shape of the filler crucible 11 is not particularly limited, and a spherical shape can be used. In addition to this, it is possible to use a frequency such as a broken shape, such as a spheroidal filler. The content of the material K11 is preferably 1 〇 to 95 mass after hardening. /0, more preferably 30 to 90% by mass, preferably 50 to 85 by mass ^; in the case of the content of m ^ into the standard _ in the case of more advanced steps to increase the filler 3 has 1, which can be made of resin The thermal expansion of the material K1 is close to the thermal expansion of the formed conductor circuit. When the content 1 is lower than the range, the adhesion between the circuit layer K13 and the insulating base material K1 is combined, and the difference is 'inflated', and the reliability of the substrate in the heat Wei τ is lowered. On the contrary, when the content of the filler crucible 11 is higher than the range, the filler K11 is exposed from the surface of the edge substrate K1, and when the insulating substrate K1 is stacked with other substrates, the fluidity may be deteriorated. Produce a bruise. The insulating base material K1 is a member which is formed in a suitable manner from a resin domain containing the above components. A solvent may also be added to the resin composition. At this time, the insulating base material K1 is hardened after the machine J is in the flow (four) state, and then the surface resin layer not containing the filler K11 is formed on the surface of the color edge substrate K1. K12. That is, since the resin composition has fluidity, the filler K11 is not directly exposed to the surface and is buried inside, so that the film layer of the resin component (component other than the filler K11) is formed on the uncured insulating base. On the surface of the material K1. Then, due to the maintenance of the state 130 201146113 K1 sound (four) ancient ★ r ^ f * CMP * ' if the grounding of the insulating substrate is removed and close to the surface layer exposed. The surface of the crucible K11 is observed to be polished. The aspect of the peripheral substrate K1 is not particularly limited. Specifically, t can be . In other words, if it is a sheet, a film, or a prepreg, it can be 2G~1 (%m or so. In addition, the insulating base has 3 inorganic fine particles such as rolled ruthenium particles. (Resin coating) 4=The film can be removed in the film removal step, and other solutions can be easily dissolved in an organic solvent or an inert solution, and it is easy to remove from the bottom of the crucible. In addition, the swellable resin film has a μ degree to the liquid (swelling/night) and is, for example, 50 Å/〇 or more. The resin film is easily removed from the insulating base. The material is peeled off. If 丄, ί更容f ίΐί, a high-precision circuit layer K13 is formed on the surface. In addition, the second, ', 匕3 are more swelled with respect to the liquid and will be dissolved by the liquid. The resin coating film is swelled with respect to the liquid (swelling liquid), and at least a part of the resin film is melted or dissolved, and is easily dissolved from the surface of the insulating substrate κι. However, there is no specific method for forming the film of K2. Specifically, for example: 131 201146113 After the liquid material of the resin film can be formed, a method of applying the material to the branch plate after drying, and then transferring the film to the surface of the insulating substrate κι after drying, etc.涂::ΐ is not particularly limited. Specifically, 'for example: a conventional spin coating-srxr s ; ?; i::rT:;!r: the thickness of the resin covering K2, preferably in 〇lum to t , the roughness of the circuit groove K3 or the through hole K4 formed by force or machining tends to decrease. In addition, when the thickness of the grease film K2 # is too thin: The resin film Κ 2 having an average film thickness is formed. A preferred swellable resin film is exemplified as the resin film Κ 2. The resin film is preferably a resin f having a flatness of (10) or more. f, it is more suitable for the swelling of the swelling liquid above the service resin film. There is a Ϊ 鳞 鳞 ' 在 该 该 该 覆 好 好 覆 覆 覆 覆 覆 覆 覆 覆 覆 覆 覆 覆 覆 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在ί material κι 方ί The same method can be used. Specifically, for example, after the insulated shaft is finely covered with mica (four), it is made into After coating the liquid material on the support substrate, the method of forming the film after drying is applied to the surface of the edge K1. «υΐίί The liquid material of the resin film is, for example, elastic. The suspension of the body 1 is a specific example of the elastomer, for example, styrene-butadiene-based, non-special-dilute (tetra)-physical-propene-based copolymerization, ^, 3, _sexual, etc. The elastomer can be easily swelled into a swellable resin film with a desired degree of swelling by converting the fresh brood of the _“= county-like touch tester. The body Ϊΐίί film K2 is preferably at the insulating base. A resin coating film K2 formed by coating an elastic-, cardinal liquid or a ritual liquid on the surface of the material K1, and then forming a resin coating layer K13 on the surface of the coating using 132 201146113. Self-recording of the surface of the substrate K1 on the surface of the high-precision electricity, another H-fat toK2 should be secret Nair (four) t-coating and coating on the surface of the support substrate i is a very fine-grained K2, excellent in quantity The point of view is that it is better to use the diene elastomer, the acrylate body, and the ΐίί3 body of the county. In addition to f, the diene elastomer is more a resin film having a desired degree of swelling. In addition, the liquid which forms ==== has a larger degree of swelling, and can also be easily used. 4: The conditional condition is used to observe the adhesion of the liquid in the step of picking up the cover. , away. The swellable resin film is easily peeled off under the pH value in the gamma step, for example, when the catalyst coating step is provided, for example, at the pH of 1 to 3 In the solution (hetero-touch solution), the step ί = step ' and the film removal step is provided in the range of pH 12 to 14 when the swelling resin coating is applied to the lower colloidal solution The swelling degree should be below 6〇%, more preferably at 4〇%. It is best to be in; Lincaiyi is in Guanshe, more than 働%% 133 201146113 These swellable resin coatings, for example: The sheet formed of the elastomer of the carboxyl group is used for the photocurability of the dry film resist (hereinafter also referred to as DFR) for forming a pattern of the printed wiring board, and is fully hardened. The sheet obtained after that is either a thermosetting or an inspectible developing sheet, etc. Specific examples of the elastomer having a carboxyl group include, for example, a monomer unit having a slow group as a copolymerization component, and a carboxyl group in the molecule. Diene elastomer or acrylate copolymer such as styrene-butadiene copolymer Acrylic elastomers, polyester elastomers, etc., etc. By using these elastomers, the acid equivalent, crosslinking degree, gelation degree, etc. of the elastomer dispersed in the suspension or emulsion are adjusted. A swellable resin film having a desired degree of susceptibility to swelling can be formed. The ruthenium resin in the elastomer swells the swellable resin film due to the aqueous solution, and has a function of covering the swellable resin and peeling off the surface. In addition, the acid equivalent means a specific example of a monomer unit having a carboxyl group per unit equivalent of, for example, (meth)acrylic acid, fumaric acid, cinnamic acid, crotonic acid'iconic acid, and maleic anhydride. The content ratio of the carboxyl group in the carboxyl group-containing elastomer is preferably from 100 to 2,000, more preferably from 100 to 80 (when the acid equivalent is too small, compatibility with the solvent other composition) If the acid equivalent is too large, the peeling property to the alkaline aqueous solution tends to decrease. 0 _ , and the molecular weight of the elastomer is preferably i. 10,000 to 1 million, more preferably 20,000 ~6 When the molecular weight of the elastomer is too large, the tree will be low, and the touch will be too small. It is difficult to maintain the uniform thickness of the swellable resin film, and the pretreatment &amp; tolerance will also deteriorate. In addition, the resin coating film is, for example, a polymer resin made of (a) at least one monomer having at least one gas anhydride in the molecule, and at most one or more kinds of monoterpenes of __ or When these resin coatings are used, it is easy to form a fat-reducing surface on the surface of the prepreg base material K1. If so, the high-precision circuit of the insulating base material K1 is formed. In addition, the scale resin coating large 134 201146113 can be used to effectively dissolve and remove the liquid used in the coating removal step. In addition to the removal, the resin composition adds at least one kind of silk to the polymer resin. (10) acid transesterification of DFR with the amount of mosquitoes in the case of substances, monomers, fillers or other added main fats.

The fat, the present vinyl ruthenium resin, the benzoic acid, the urethane acetal resin can be used for the specific example, such as the 曰 特 特 2 2 2 2 2 - 23119 ; Z-2_51, JP-A-212262, Japan = The dry film of the fat composition is fully cured, and the sheet g = shadow type DFR, for example, which is manufactured by Asahi Kasei Co., Ltd. In addition, for other swellable resin coatings, for example, a resin containing = as a main component (for example, Yoshikawa Chemical Co., Ltd. = "NAZDAR229") or υ = LEKTRACHEM Co., Ltd. Miscellaneous"). (For example, the swellability __, the resin (4) float or emulsion coating is applied to the surface of the substrate by a conventional thief method or a stick _, or a vacuum laminator or the like is formed on the branch plate. ❾DFR 占 占 = = = = = = = = = = = 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 The photoresist material of the film is also the following material. The necessary characteristics of the photoresist material constituting the resin film, for example, (绝缘) in the catalyst-separating step described later, the insulation of the impregnated resin film is formed. The liquid of the substrate (electric recording core-attached chemical solution) has high resistance; (2) in the film removal step described later, for example, the insulating substrate on which the sap is formed is immersed in the test liquid. In the step, the resin film (photoresist) can be easily removed; (3) the film forming property is high; (4) the dry film (DFR) is more compatible; (5) the storage property is higher, etc. The attached liquid, although detailed later in the text, is in the case of, for example, an acidic Pd ~~Sn colloidal catalyst system. Acid value 1 to 2 φΗ) solution. In addition, in the case of an alkaline Pd ion catalyst system, the catalyst is weakly alkaline to the catalyst. 135 201146113 The resistance must be known, and the adhesion to the plating core is resistant, which means that when the photoresist is film-forming. = Responsibility does not ^ Bu, this is not the = knife know, the thickness of the photoresist film is 1 ~ ι 〇 左右 惟 惟 惟 惟 惟 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 臈 « « The photoresist film can be easily removed by ί ΐ. The water solubility is about 1~10%, and the treatment temperature is room temperature ~ thief and 10 mils. - It is usually treated by dipping or _, but not limited to this. Μ is 1~ In order to form a photoresist on the insulating material, a film is formed = ί: a uniform film that is trapped. In addition, although the thin medium = 疋 is used for the sake of simplicity, the adhesion is required at the time of bonding. It cracks because the bendability does not decrease. The composition of the dry film is not separated, the fat composition is mainly composed of the main resin (the adhesive tree can be added with a polymer, a monomer, a filler or other additives, etc.), and at least the pot is also formed into a knife. The direct-bond type polymer II, etc. can also be grafted to branch. Off = molecular weight is about ~ _, preferably 5_~5_〇. If 5, right knife is too large, alkali stripping Or the dry film adhesion may be deteriorated. 6. In order to improve the resistance of the nuclear deposit of the electric ore, to prevent thermal deformation during laser processing, or to control the movement, it is also possible to introduce cross-linking points. The composition of the resin can be obtained by polymerizing the following materials (8) and (b). A carboxylic acid having a polymerizable unsaturated group in the knife or the celsius. 5 ·· ^ ^ 0 85f ί ^ 200°-231190 9 2001 On: newspaper. For the (8) substances, for example, (meth)acrylic acid, fumaric acid, guinea ί, itaconic acid, maleic anhydride, maleic acid half vinegar, butyl citrate, etc., used alone or in combination 2 More than one kind. (b) 14 II·J-V may be selected in such a manner as to maintain various properties such as resistance in the plating step and flexibility of the cured film. Specifically, there are methyl methacrylate methyl sulfonate, sulfhydryl amide, (tetra) hetero (10), and methacrylate. The other two,? Acrylic acid 2_ by vinegar, methacrylic acid 2_ by propylene vinegar Another phase of vinyl acetate with vinyl alcohol 1 or a polymerizable styrene derivative. In addition, in the molecule = and = carboxylic acid, acid anhydride, can also be obtained. Furthermore, it is capable of stimulating a monomer having a strong number of unsaturated groups, and a reactive functional group such as a base or a cleavage group; The weight of the polymer of the carboxyl group. Among them, in the case where one equivalent of the solubility or the pre-treatment of the electric ore is resistant to the medium or other composition, the peeling property tends to decrease as the m decreases. In addition, when the acid equivalent is too high, 〇二聪生曰 has a tendency to decrease. In addition, the composition ratio of the w monomer is 5 to 兀. The ease of use (4) or the light plasticizer can be considered as a dryness imparting material. Specifically, for example, the secret of the material is: various cross-linking can be added with cross-linked vinegar vinegar, T-based bismuth acrylate, methacrylic acid vinegar, methacrylic acid third butyl vinegar, methyl propyl hydride: Acid second butan vinegar, sub-based propylene Yingong B S 曰, 2-hydroxypropyl methacrylate and the like. In addition, 137 201146113 includes a vinyl alcohol lysine, a methylated styrene derivative, and the like. Further, it is also possible to use in the molecule: it is also possible to include two or more kinds of photopolymerizable monomers. About monoenoate, or polypropylene glycol dimethyl acrylate, polyethylene glycol dipropyl fm ^ ^ § iSI ^ ^ ^ ^ ester ... new methyl acrylate vinegar, glyceryl trimethyl acrylate Two: acid ester, trimethylolpropane triepoxypropyl ether, trimethyl dimethyl acrylate, trimethyl acrylate vinegar, 2, 2 - bis (4 Α 妒 妒 妒 pentoxide Phenyl)propane burned, polyfunctional external amide containing amino carboxylic acid vines may also be an oligomer of the above-mentioned material or reaction, and has a filler. The filler is not particularly limited, specifically, for example: bismuth, bismuth aluminum oxide, magnesium hydroxide, calcium carbonate

Magnesium magnesium, aluminum borate, organic fillers, etc. In addition, the thickness of the photoresist; L is better. It can be made small, cut = can also be broken when it is in politics, and filtered to remove coarse particles. Nippon, if?, for example, photopolymerization tree (photopolymerization initiator broad polymerization to prevent color gamut dyes, pigments, chromophoric pigments), thermal polymerization primers or amines . Subtraction of the substrate in the processing program, for example, sometimes when using the mine, 'must use the laser to the photoresist:; = r excimer laser or w-ray = ί == Jiff wavelength' using the wavelength The material with higher absorption rate, ί 可提ί, wave 35 W4 times high reading wave 266nm f times is the better choice. Another aspect, sometimes using the absorption rate 138 201146113

Sv good light: If the light absorption with lower absorption rate is used at the beginning, the advantages are different due to the absorption rate of the first field, so it is better to use the laser light absorption rate adjusted due to 廄d4=, w Light resistance. In the case of the material, the circuit pattern forming step is formed on the insulating substrate K1 by a circuit pattern forming step, and the method of the portion is not particularly limited. Specifically, for example, in the insulating substrate K1 of the crucible 2, when a fine circuit having a desired shape and a high depth γ is formed by external processing of the resin coating 2, laser processing is preferably used. You can freely adjust the depth of cut by changing the laser output, etc., t, the electric power, the pattern forming step is to use the laser to form the circuit diagram when you use the laser to form a fine circuit, select ^ l, By changing the output of the laser, etc., it is easy to adjust the depth of the groove K3 such as the depth of cut. This point is also a better choice for the connection of the through hole, and the capacitor is buried and insulated. In the field of press-type reinforcement, it is preferable to use, for example, in the technical field of nano-printing, the step of using the flip-flop circuit _ part, the _ punch 2 = ^ open circuit pattern portion, which is a preferred choice. The traces are formed. U is formed. Holes κ Γ ^ 可 方 方 方 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 上 。 。 Then, by forming the plating, a via hole or an inner via hole can be formed. @e...Electric fresh 冤 With this step, the shape of the circuit groove K3 can be limited. The shape of the circuit pattern portion such as the diameter and position of the through hole Κ4. Further, the '139 201146113 pattern forming step' may be excavated to a thickness larger than the thickness of the resin coating layer 2, or may penetrate the insulating layer. However, by using this step, the filler K11 can be made The circuit surface is exposed. Then, if the exposed surface of the circuit ^ Κ 3 is formed by laser processing, the inner layer of the insulating layer is formed by laser processing to form J J: external. Then, since the electroless electricity is not applied to the hardened insulating substrate κι, the inside of the insulating substrate K1 and the circuit layer can be formed by the circuit pattern forming step of the circuit trench Κ3, etc. There is no special limit. In addition, when laser processing is used, a fine circuit of 20 μm or less can be opened. Therefore, when the circuit diagram ^ 〇 = lower = minute ' _ « the antenna circuit to be fine-machined: second degree 'under the use of filled-in-key elimination == ===, the money is the depth of the circuit layer κ ΐ 3 . The step of coating the plating catalyst or its precursor on the surface of the circuit trench 3 and the surface of the resin film 2 is carried out. At this time, in the case of 2, the surface of the through-hole 4 (4) will also be covered by the medium or its precursor, and the precursor of the electroplating process will be in the process of the electroplating process. Lai's miscellaneous forms an electroless _ membrane and 3 * prepared ° ° Wei catalyst 'as long as the well-known electroless Wei Wei media can be, i he is limited. In addition, the precursor of the plating catalyst may be pre-coated, and the plating catalyst may be generated after the phase is ΐί. _Specific examples of electroplating, for example, gold recording 0, silver (Ag Fu, or a precursor for forming these metals. For the method of coating the plating catalyst or its precursor K5, for example: used in ~3 The treatment of the acidic pd-Sn gel solution which can be treated under acidic conditions 140 201146113 'Method of treating the moxibustion liquid. Specifically, for example, the following method. The shape of the surface and the through hole K4 The insulating substrate κι is given in the solution of the established day = 匕 ii boundary == solution (cleaning agent, blending agent), and the agent is subjected to soft and careful t, and the soft sodium sulfate-sulfuric acid is used in the insulation ϊΐ Γϋ For the liquid wipe of the main component, the pre-dip treatment of the vaporized ion-absorbing tin-plated sheet is carried out, and then the acidity of the acidic Pd such as a gel containing the chlorinated medium colloidal value of 1 to 3 is immersed. Plating touch ίί rPd and Sn. 镰, in the suction of gasification of stannous contact with the production of oxygen 1

Sn t plating contact solution, can be known _ sexual inhibition - electric dream program can also be used in the commercial use of acidic electric solvent gel solution of the "sister order, for example: RdimandHaaS electronic materials shares reasonable iL Bu" The thief is in the process of removing the _ gold lung-like spray film. The predetermined liquid in the removal step is an experimental solution, and the (4) _ degree of the resin coating liquid is preferably in the following 'the method for preparing the test solvent' The peeling of the resin film under the acidic condition is peeled off in the alkaline solution after the catalyst coating step. Therefore, it can be correctly in the catalyst coating step. The second part: ί the part of the plating film 'and the plating catalyst or its precursor, the through hole ^4 is covered by the coating, the surface of the trench Κ3, the precursor It and the resin film The surface of the crucible 2 is coated with an electric ortho-catalyst or 141. 201146113 &lt;Step of removing the coating film&gt; The step of removing the coating film is a step of removing the resin coating film K2 from the insulating base material K1 subjected to the catalyst coating step. The method of removing the resin coating film K2 is not particularly limited. Specifically, for example, : a method in which the resin film K2 is swollen by a predetermined solution (swelling liquid), and then the resin film K2 is peeled off from the insulating substrate K1; the resin film K2 is swollen with a predetermined solution (swelling liquid), and After the partial dissolution of the resin film K2 from the insulating substrate K1, a method of removing the resin film K2, and a method of dissolving and removing the resin film K2 with a predetermined solution (swelling solution), etc. The resin film Κ2 may be swelled, and the other is not particularly limited. Further, the swell or dissolve may be such that the insulating substrate K1 coated with the resin film Kj is immersed in the swell solution. The method of time, etc. Then, it is also possible to improve the removal efficiency by immersing the coffee ultrasonic wave. In addition, when it is swelled and peeled off, it can be peeled off with light force. The far film removal step, Preferably, after the resin coating film K2 is swollen with a predetermined liquid, or a part of the resin coating film is dissolved by a predetermined liquid, the resin coating film K2 is peeled off from the insulating substrate. Manufacturing method is easier The insulating substrate is peeled off from the resin film, whereby it is easier to form a highly precise circuit on the insulating material. In addition, the step of removing the film is preferably a step of dissolving the resin film with a predetermined liquid. According to these manufacturing methods, it is relatively easy to remove the grease film from the insulating base material, whereby it is easier to form a high-precision circuit on the insulating substrate. In addition, the swelling is used. In the case where the resin film Κ2 is used as the resin film Κ2, the liquid (swelling liquid) which swells the swellable resin film Κ2 is not required to substantially make the insulating substrate κι and the electric ore. Catalyst or its precursor Κ5 eight^

Further, it is not particularly limited as long as it dissolves and only swells or dissolves the swellable resin film Κ2. Further, it is preferable to use a liquid which swells the swellable resin film 艮2 to such an extent that it is easily peeled off. These swelling liquids can be selected according to the type of the swellable resin coating κ, and the thickness is preferably selected. Specifically, for example, when the swellable resin is coated with an elastomer, an acrylic elastomer, a polyester elastomer, or the like, it has at least one polymerization in the knives of 142 201146113 (a). A polymer which is obtained by polymerizing at least one of a sulphuric acid or a sulphuric acid, and (b) a polymer which can be polymerized with at least one or more monomers polymerized with the (a) monomer In addition, when the laser plating treatment is performed in the above-mentioned acidic conditions, the fine resin coating film K2 should be made of a swelling property under acidic conditions. 40% or less, for example, an elastomer such as an olefin, an elastomer or a poly-sl-type elastomer, having a degree of swelling of 5% or more under the test conditions, and (8) /, to a polymerizable unsaturated group. At least one of a carboxylic acid or an acid anhydride, and (b) a resin composition film containing the polymer resin containing at least one or more of the polymer resin and a turmeric resin film containing 竣i Use a PH value of 12 to 14 waves. In addition, you can also "need to be: =: two can be used in the immersion of the supersonic wide, for example: Further, in order to increase f, the film may be swelled only when it is not swelled, and may be irradiated as needed. Further, &lt;Plating treatment step&gt; The insulating group after removal of the solid film Κ2 is shown In the method of processing the material XIihai electroless ore, the insulating substrate of the precursor Κ5 is deposited on the part of the electroplating contact 33 catalyst or its precursor K5 is(Ai)t 〇' ^(Go)'

s Choice. In addition, when Ni is contained, it is preferable to be better than J 143 201146113. The film thickness is not particularly comparable. Specifically, for example: o.i heart Γ ί and (4) or so. In particular, when the depth of the circuit trench K3 is made thicker than 1 thick, a metal wiring having a large sectional area can be formed. At this time, it is preferable to increase the strength of the metal wiring. The electroless plating ruthenium 6 is deposited on the portion of the insulating substrate κ by the electric scale step. The part of the f slot is analyzed ί ί , f does not want to form a circuit trench = the fine circuit ' does not leave excess electrode film between adjacent circuits. This is enough to prevent problems such as short circuit or migration. The screen dispels part of the silk layer 魏13 of Weihong 6. That is, the circuit i electric power f-touch or its precursor Κ5 and the electroless plating film form the circuit layer 从13 from the formed steps, so that the circuit layer 不13 ^! surface does not pass through other layers and fillers K11 contacts to form electricity, so the lin gets a higher adhesion. Further, in the illustrated off-sample, K13 is more prominent than the insulating base material K1, but it is also possible to embed a part of the circuit layer K13 in the circuit layer substrate κι in the insulation. [Inspection step] Manufacturing method of the substrate (4) The towel may further include an inspection step and cause the sputum f to be contained, and after the film removal step, whether or not the fluorescing film is completely removed. In other words, the resin film (four) 1 is irradiated with external light to the surface to be inspected after the film removal step, and the presence or absence of the film X f film to remove the fatigue position can be detected by the light emission of the fluorescent material. Therefore, in the method of manufacturing a circuit board, the circuit layer KG having a line width and a very narrow line interval can be formed. The snow 'when' the line width and the line spacing are very narrow 'between the adjacent portions' may also occur when the resin coating which should be removed is not removed by the king. In addition, in the circuit diagram 144 201146113 ΐ 狮 的 的 的 的 也 也 也 也 也 也 也 也 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 卿 电路 电路 电路 电路 电路 电路 电路 电路 狮 狮 狮 树脂 树脂 树脂When the mineral film Κ6 is likely to be a fragment of the residual resin film κ2 which may be a problem such as migration or short-circuit, it may become a cause of poor thermal conductivity or conduction loss. After the fine-removing step of the resin is contained, the coating is irradiated with a predetermined light source to make the remaining part of the resin film, because the fluorescent substance is # ί # Being completely removed or the film is not completely removed, as shown by the 狭 3〇, when the line width and line spacing are not

Between K8, there may be a resin coating that has not been completely removed. U: Specialized 3, an electroless plating film K6 will be formed on this part, and then U will be transferred to the grain, and the above inspection step will be detected. Whether or not the film is not completely removed, and the portion which has not been removed by the wire is used to explain the step of inspecting the resin film to contain the fluorescent material, and the firefly can be used for removing the film. θ, ^ = the fluorescent substance contained in the resin film κ2 in the step of scrutiny, the mouth should have a luminescent characteristic, and the others are not particularly limited. For example, FlUoresceme, E〇sine, Pyr〇nine G Wait. The power of the electric motor/film is removed, and the part that is illuminated is removed, so that the problem can be prevented. By this, it is possible to prevent migration or short-circuiting, etc. &lt;De-slag treatment step&gt; In the manufacturing method of the IS-channel substrate K1G, 'in the electric clock processing step, the glue is removed, and the apricot is finished. The pre- or post-implementation process may further include performing a desmear treatment step. By performing the de-doping treatment, the excess resin of the battery can be removed. Further, in the case of a multilayer circuit substrate which is intended to have the obtained circuit substrate 145 201146113, the surface of the portion of the insulating substrate where the electroless plating film is not formed may be roughened to improve the circuit substrate The adhesion of the upper layer. Alternatively, the degreasing treatment may be performed on the interlayer and the bottom. Thereby, it is possible to remove the excess resin attached to the interlayer. Further, the desmear treatment is not particularly limited, and a conventional desmear treatment can be used. Specifically, for example, a treatment of immersing in a permanganic acid solution. Through the above steps, the circuit substrate κιο shown in Fig. 29(E) can be formed. Further, in the circuit pattern forming step, since the thickness of the resin film K2 is excavated, a circuit composed of the electroless ore film K6 can be formed at a deep portion of the insulating substrate κι as shown in FIG. Layer K13. Specifically, as shown in Fig. 31(A), an electric circuit can be formed between the plurality of conductive layers at positions different in depth from each other (electroless plating films K6a to K6d in the drawing). This processing is stopped in the middle of the circuit trench K3, and the electroless plating film is formed to have the same thickness. Further, the electroless ore film is formed from the bottom surface and the side surface of the circuit trench K3. In addition, as shown in Fig. 31 (9), the circuit on the insulating substrate is K3, and the electroless plating film K6e~K is formed in the circuit layer K13 by means of _ no electric contact domain transfer path &amp; In the case of electroplating, when the electroplating reaches the surface, it will not be able to select the electrolyzed liquid suitable for the treatment. This: Because the sample 2 is easier to form a circuit with a larger cross-sectional area, it can be electrically added. Good appearance. J electric hole Jinli Jing production, each circuit layer Κ 13 set circuit trench Κ 3 deep moon early method to obtain depth (height Τ) different circuit layers Κ 13. [Method of manufacturing three-dimensional circuit substrate] Figure 32 is a schematic cross-sectional view showing the steps of manufacturing a three-dimensional circuit substrate and a five-step processing step for manufacturing a three-dimensional circuit substrate. These 146 201146113 methods are easier to form a circuit layer across the height difference Κΐ 3 First, as shown in Fig. 32(A), on the surface with the height difference, the position of the head = K2. Correction, the step is two steps of the film, the three-dimensional insulation button K51 can be gamma f (four) to view the stereo = The fat is mixed and has no limitation. The fresh formed body paste has better production efficiency. Resin used in the preparation of resin molded body (4) == ^ 丄 polycarbonate, polyamide resin, various polyester resin, poly brew = =, polystyrene, cyanate g resin, benzene chew In the case of the present invention, the filler Ku is omitted in Fig. 32. The formation method of the resin film K2 is not particularly limited. Specifically, for example, the method of forming the embodiment of the planar wire plate K1G, the method of forming the film, and then, as shown in FIG. 32(B), the appearance of the resin film K2 is formed. The circuit pattern portion having a depth deeper than the thickness of the grease-coated film 2 is not particularly limited. The method of forming the circuit pattern portion is the same as that of the circuit board 10 and the like. By the circuit pattern portion of "=^ Κ3, etc., it is limited to form an electroless plating film by electroless plating, that is, to define a portion where the circuit layer Κ13 is formed. H = When the circuit follows the alkali (four). Then, as shown in Figure 3, 2 (Q shows 'on the surface of the circuit diagram of the circuit trench K3 and so on and unshaped The surface of the resin pattern portion 2 of the resin coating 2 or its precursor Κ5 is particularly limited to the surface of the electric money catalyst or its precursor Κ5. Specifically, for example, The same as the substrate (4): method, etc. In addition, 'this step is equivalent to the catalyst coating step. Using these media' can be as shown in Figure 32(C) on the circuit surface of the circuit trench and the age The surface of the crucible 2 is covered with an electric side medium or a precursor thereof. Then, 'as shown in Fig. 32(D), the crucible film K2 is removed from the three-dimensional insulating substrate K51. The circuit of the insulating substrate K51 g 曰 147 147 201146113 ^, on the surface of the forming portion of the road (4) electric etchant or its precursors, "the plating on the surface of the resin covered illusion" The method of removing the resin coating film κ2 from the resin coating film is not particularly limited in a state in which the catalyst or the front ft is applied to the coating film 2 . And η is listed as the same method as that of the circuit board 10, and the like. This step corresponds to the film removal step. Continuing with the above, it is necessary to remove the resin film κ2 from the three-dimensional... In this way, there is no electricity in the residual electrocatalyst or its precursor. That is, the crucible 6 as the circuit layer 13 is formed on the portion of the shaft having the circuit trench or the side through hole 4 . The electroless shovel film Κ 6 _ is not particularly limited. Specifically, the formation method of the same aspect of the ruthenium film and the like. Further, in this step, as shown in Fig. 32(E), the three-dimensional circuit substrate (10) on which the circuit layer 13 is provided on the three-dimensional shape insulating substrate 51 can be formed. In the case of the formed three-dimensional circuit substrate, even if the line width and the line interval of the circuit layer 13 of the insulating substrate are narrow, the electric wiring can be formed with high precision. Further, in the case of the three-dimensional circuit board (10), even if the surface of the substrate has a step, the circuit can be formed accurately and easily. [Sixth embodiment] The present invention further relates to a circuit board including an insulating layer, an electric circuit, and a dielectric layer. Portable information terminal devices such as mobile phones, computers, peripheral devices, and electrical devices such as §fl豕 electrical products are rapidly becoming highly functional. Accompanied by the wire (4) on the secrets of these electrical devices, the electrical circuit is also required to be further increased in density. In order to satisfy the high density requirements of the electric circuits L2, it is desirable to have an electrical circuit method capable of accurately forming a line width and a line spacing (the width of a portion between the phase difference L2 and the electric circuit L2). In the circuit trench 4 of the insulating layer 近年来, the semiconductor device is used in recent years, in the circuit trench 4 of the insulating layer 利用 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 An electrical circuit 2 is formed. The thin towel of the department f is first subjected to laser processing on the surface side of the insulating layer U provided on the back side of the ® 42 (A) to form a circuit dragon L4. To do, the bottom of the job-removing trench L4 is implemented from the bottom of the circuit trench L4 to the surface of the first-electric circuit L7, which is the surface of the _(1)-transform L7. The surface side of the insulating layer U is treated with a degumming treatment liquid to remove fine particles such as ^. The surface of the insulating layer U is subjected to an electrolysis treatment to form an electroless electrolytic circuit L1q. Then, as shown in the figure, the m electrolysis (4) shouts the face to implement the electric 'L 4^mLL5 L3, and the ore layer forms the second electric shame 2. Further, the electric ore layer is deposited so as to be the entire surface of the color edge layer L1.

The thunder 3 '1°Fig. 42(F) shows the 'clear CMP method to the surface of the insulating layer L1 by the squaring layer U wire correcting the second circuit U in the above problem' Providing - the transmission loss of the electrical circuit that reduces the circuit of the device and the electrical circuit connected to the layer, and the evaluation of the transmission loss of the electrical circuit L2 in the prior art " ί ^ 4 is in use The inner surface of the same strip of the slag J in the through hole ^ will be roughened by the desmear treatment liquid. Therefore, 3,: fruit, plate 2 electric 吝 gas, electric road U and The interface of the insulating layer U is depleted by the rough via circuit L2. According to this repentance, the present invention has been completed by the researcher 149 201146113. The circuit substrate of the present invention is provided with an insulating layer L1. An electric circuit L2 and a dielectric layer L3' on the insulating layer L1 are formed with a circuit trench L4 and a through hole L5 communicating with the circuit trench L4. The electrical circuit L2 is disposed in the circuit trench. In the groove L4, the interlayer L3 is disposed in the through hole L5, and the surface roughness of the inner surface of the circuit trench L4 The surface roughness of the inner surface of the through hole L5 is smaller. In the present invention, the ratio of the surface roughness of the inner surface of the through hole to the surface roughness of the inner surface of the circuit groove (the surface roughness of the inner surface of the through hole / The surface roughness of the inner surface of the circuit trench is preferably in the range of 1.05 to 200. Further, in the present invention, the inner surface of the circuit trench L4 is J1S (Japanese)

Industrial Standards; Japanese Industrial Standards) B〇601: 2001 The surface roughness (the average roughness of the nose) Ra is preferably in the range of 0.01 to 〇.5μηι. Further, in the present invention, the surface roughness (arithmetic mean roughness) Ra defined by JIS Β0601: 2001 of the inner surface of the through hole L5 is preferably in the range of 0.5 to 2 μm. That is, the sixth embodiment of the present invention includes the following technical contents. Claim 6 - 1. A circuit board comprising an insulating layer, an electrical circuit disposed on the insulating layer, and a via, on which a circuit trench and a via hole communicating with the circuit trench are formed, the electrical The circuit is disposed in the trench of the circuit, and the interlayer is disposed in the via hole. The surface roughness of the inner surface of the trench is smaller than the surface roughness of the inner surface of the via. The circuit board of claim 6, wherein the ratio of the surface roughness of the inner surface of the through hole to the surface roughness of the inner surface of the circuit trench (surface roughness of the inner surface of the through hole) / The surface roughness of the inner surface of the circuit trench is in the range of 丨〇5 to 200. The circuit board according to claim 6 to 1, wherein the surface roughness Ra specified by JIS B0601:2〇〇1 of the inner surface of the circuit trench is 0.01 to 0.5 μm. Within the scope. The circuit board according to any one of claims 6 to 3, wherein the inner surface of the through hole is j][SB〇6〇1 : 2〇〇1 The specified surface roughness Ra is in the range of 〇, 5 to 2 μm. 150 201146113 Right according to the present invention, by reducing the surface roughness of the inner surface of the circuit trench of the insulating layer, the interface between the circuit trench and the electrical circuit inside the circuit trench is smoothed, thereby reducing the transmission of the electrical circuit. loss. Hereinafter, embodiments of the present invention will be described. Fig. 35 shows an embodiment of the structure of the circuit substrate of the present invention. The circuit board has a first insulating layer L6 and a first electrical circuit stacked in sequence! 7. The structure of the insulating layer L1 (second insulating layer L1) and the electric circuit L2 (second electrical circuit L2). The surface of the first insulating layer L6 is very flat, and a second electrical circuit L2 is stacked on the surface of the first insulating layer L6. The second insulating layer L1 is stacked in such a manner as to be in contact with the first insulating layer L6 on the surface of the first insulating layer L6, and thus the first electrical circuit L7 is buried in the second insulating layer L1. A circuit trench L4 is formed on the surface of the second insulating layer L1, and a second electrical circuit L2 is provided in the circuit trench L4. In addition, the second insulating layer L1 is formed with a through hole L5' for connecting the first electrical circuit L7 and the second electrical circuit L2. The through hole L5 is provided with a medium for conducting the first electrical circuit L7 and the second electrical circuit. Layer L3. In the circuit substrate, the surface roughness of the inner surface of the circuit trench L4 is smaller than the surface roughness of the inner surface of the through hole L5. Therefore, the smoothness of the interface between the inner surface of the circuit trench L4 and the second electrical circuit L2 in the path trench L4 is reduced, whereby the transmission loss of the second electrical circuit L2 becomes small. In order to sufficiently reduce the transmission loss of the first electrical circuit L2, the surface roughness of the inner surface of the circuit trench L4 is preferably in the range of 0.01 to 0.5 μm, more preferably in the range of 〇 5 to 4 4 μm. Thus, the surface roughness of the inner surface of the circuit trench L4 is set to 0.5 μm, and particularly to 〇4 μm or less, the smoothness of the interface between the inner surface of the circuit trench and the second electrical circuit [2 can be sufficiently improved. , so that the transmission loss will be reduced. In addition, the surface roughness of the inner surface of the through hole L5 is preferably in the range of 〇5 to 2 μm, more preferably in the range of 0.5 to 1.5 divisions. At this time, the inner plating layer of the through hole 电镀 is electrically insulated) and the second insulation The adhesion of the layer U is increased, so that the circuit substrate is sinful. In addition, the surface roughness of the inner surface of the through hole L5 and the inner surface of the circuit trench L4 151 201146113 = the surface roughness is (10) 1.2 to 50 Hereinafter, it is preferable that the surface of the inner surface of the circuit board is in the range of the surface of the circuit board L4. The circuit board can be manufactured by an appropriate method. [First Manufacturing Method] Substrate==^丝魏基板邮-Wei Wei. Wei Ming The circuit, ring ITaT^I^ ° ^ ^ ^ Double-see A oxygen tree, 双, F-type epoxy resin, oxygen resin, benzene __ ring Oxygen resin, dazzle base =, square, _ epoxy resin, naphthalene epoxy resin, sesquicyclopentadiene type 曰 曰 cage age if i benzene 蛾 moth base material family _ condensation product epoxide, 3. The above-mentioned epoxy resin and eucalyptus: 曰·, in terms of epoxy resin and resin, the above-mentioned products can be used alone. Shame Resin and resin may be used in combination of two or more. Each of the kings used in the early history = 'When the base material is used to form the base material, generally, in order to harden, the hardener can be used as long as it is a usable hardener. ...special limit? . Specifically, for example, dicyandiamide, a phenolic curing agent, a cerium-lanthanum curing agent, an aminotriazine-based curing agent, a cyanic acid resin, and the like. The stupidity is 152 201146113 μ!! Such as: secret type, aromatic type, _ type and other hardeners. In order to further advance the benzene of the scale-denatured or pass the ^2, the above-mentioned hardeners may be used alone for the hardener, and although there is no particular limitation, the laser is used. Finished work = the filler will be exposed, the bumps of the filler can increase the electricity and _ 1. The material of the oxidized itfci machine microparticles, specifically, for example, oxidation, l/), _ _ qing, fine 2 3), pentoxide (St > 2 〇 5), strontium salt, sulphuric acid, molybdenum compound, hard Month t ro f ; ^^〇»〇x〇H)2) ^ τΛ^mother. The above-mentioned inorganic granules can be used singly or in combination of two or more kinds. These inorganic microparticles are due to their properties, relative dielectric constant, flame retardancy, particle size distribution, and color t-phase; Further, although it is not particularly limited, it is preferable that the filler having an average thickness of _~1 〇μηη is preferably used in the filler below the thickness of the first insulating layer L6. 更5 ～5μιη Filler. Further, the inorganic fine particles are subjected to surface treatment in order to improve the dispersion coupling agent in the first insulating layer L6. Further, the first insulating layer L6 may have a dispersibility of the inorganic fine particles in the first insulating layer L6, and may also contain a mixture of stones and a mixture. The Wei coupled ship has no special ship. Specifically, the ages are: epoxidite, amine-based Wei, ethylene-based Wei, styrene-based smelting, human diterpene, Wei, hexyloxy, titanate, etc. Wei coupling agent special. The Wei coupling agent may be used singly or in combination of two or more kinds of 153 201146113. Further, the first insulating layer L6' is not particularly limited as long as it has a dispersibility in order to increase the dispersibility of the inorganic fine particles in ?L6. Octa s, for example, an alkyl ether system, a sorbate system, an alkyl polyether amine system, an ancient eight agent, and the like. The dispersant may be used singly or in combination of two or more kinds. Specifically, the organic fine particles are not limited to the rubber fine particles A to the insulating layer L6. Specifically, the thickness of the sheet, the _, the prepreg, and the three-dimensional shape is not particularly limited. Specifically, if it is a film of the sheet temple, it is preferably, for example, 10 to 500 μm, more preferably 2 to 2 cm. , ^ When - absolutely, layer L6 can also contain dioxins # money particles. &quot; Thunder 7 ··^iff ^ on the surface of the first - Wei _L7. The first electric circuit 7 can be formed in the first insulating layer L layer U as shown in Fig. 36 (4) by a conventional electric circuit forming method such as a subtractive method or an additive method. Thereby, the first electrification layer L1 is made of, for example, the first insulating layer L1. Secondly, various organic substrates of the first two τ' are formed. Cloth tree = ί; ίί == coated on the surface of the insulating layer L6, ', using the conventional multilayer circuit substrate: resin, grease, (10) acid resin, poly-imine resin, etc.; When the heating age is increased and the prepreg is used as the insulating substrate, the connector is as shown in Figure 36 (B) as a resin film L8 (film formation step /.,, 'in the second insulation The resin layer 臈L8 is formed on the surface of the layer L1, as long as the county At-fishing-port + other has no special ship 7. It can be removed in the detachment step, ', slaves, for example, organic solvents or Alkaline solution light* 154 201146113 Easily soluble soluble resin', or a resin which is swelled by a swellable liquid, a resin film L8, etc., which is easy to remove accurately. It is preferable to make the resin L8. In addition, it is preferable that the lying resin is coated with L8', for example, the swelling degree of the liquid (swelling liquid) is preferably 5% or more. In addition, the moisturizing resin film L8' is removed. a resin which does not substantially dissolve with respect to the liquid (swelling liquid) but which is easily peeled off by the surface of the second insulating layer L1 due to f= The ruthenium of the film L8 is also dissolved in the resin 兮 liquid which is swelled with respect to the liquid (the swelling liquid is swelled, and at least a part thereof is easily dissociated from the surface of the second insulating layer U), and The resin film L8 which is peeled off by the surface of the insulating layer L1 is dissolved. The method of forming the resin layer L1 is not particularly limited. Specifically, for example, the cloth can form a liquid material of the resin film U. 〇/{^ ' ' / or 疋 coating the liquid material on the support substrate and then transferring the dried Si-forming film U onto the surface of the second insulating layer U The method is not limited, and specifically, for example, a known red transfer coating method or a stick coating method.

under. The thickness of the crucible should be less than 1 〇, and it is more suitable for the thickness of the L8 resin coating L8, preferably above ο.ίμηι, and more than μΓη. When the thickness of the resin coating L8 is too thick, in the step of smashing, in the step of _ laser blasting or adding H ΐ ί ι, there will be a resin coating which is difficult to form a uniform film thickness (4): For example, it is preferable to use a resin _ U, and it is preferable to use a swelling degree of the swelling liquid at 50%. The method for forming the smear film L8 is not particularly limited. The formation method can be the same. Specifically, two = 155 201146113 A liquid material of a grease-coated material, for example, a two-component body such as a suspension of an elastomer, a acrylic acid = a body, and a poly elastomer. The swellable resin film L8 having a desired degree of swelling such as a degree of crosslinking of the elastomer resin particles or a gelation g degree is used. PH value changes = == 2 ^ = 宜宜 __ depending on the liquid secret of the swelling liquid: gamma coating 'by the step in the steps of the Lai step The cover is tight and is easily peeled off at a very high level. The pH of the swellable resin film L8 is stained under the pH value. For example, when the S_clay coating step is provided, for example, at a pH of 1 to 3, the electrocatalyst is a colloidal solution (10) of a catalytic metal. In the colloidal solution); = step 'and the film removal step is provided at a pH of 12 to Η = = film resin _ L8 swelling step, the _ resin film L8 for the sense of electricity The degree of conversion should be below _, and 10 〇 / Π ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ ΐ For the swellable resin film L8, for example, a sheet formed of a net body having a certain amount of f soil can be used as a dry film resist for forming a pattern of a printed wiring board (hereinafter also referred to as The graded, age-old type of photoresist in DFR) is fully cured (four) or thermosetting graded sheet. Specific examples of the elastomer having a carboxyl group include, for example, a di-semi-elastomer including a styrene-butadiene-based copolymer having a fluorene-based J-position as a copolymerization component and having a filament in a molecule. A total of isopropyl _elastomers and poly 156 201146113

An ester elastomer or the like. When these elastomers are used, the swellable resin coating L8 of the desired alkali swelling degree is adjusted by adjusting the (four) hetero-acid equivalent, the (four) degree, or the fox material. The carboxyl group A ls in the elastomer is left. The final acid is as fine as 1% equivalent of ί ΐ ΐ monomer# specific examples 'for example, '(meth)acrylic acid, fumaric acid, cinnamon S owed, baldanic acid, itaconic acid, maleic anhydride, etc. . The content of several groups in the filament-containing elastomer is preferably 〇2~2'' (10)~_. When the acid equivalent is too much, the compatibility of the product becomes lower, and the compatibility of the pretreatment liquid will be increased. In addition, when the acid equivalent is too large, the lion's nature of the miscellaneous water test will be lowered. The molecular weight of the elastomer should be! 10,000 ~ Hu Wan, more preferably 20,000 ~ When the molecular weight is too large, the peeling property tends to decrease, too 'to maintain the thickness of the swellable resin coating L8 is uniform, and the resistance to the electric "two liquids will also In addition, in the case of J, the DFR contains an acrylic resin containing a predetermined amount of carboxyl groups, a styrene resin, a phenol resin, or a urethane fine resin as a resin. The specific material of the 4 DFR is disclosed in Japanese Unexamined Patent Publication No. Hei No. Hei No. Hei No. Hei No. 11-212262. -^ The dry film of the resin composition is fully hardened = the testability is turned over 8 times, and the rosin sold by Asahi Kasuga Koto is to be grease-coated L8, for example: containing silk and "nazd" =9 ^月曰ίί, such as "104F" manufactured by LEKYCHEM Co., Ltd., manufactured by Yoshikawa Chemical Co., Ltd.). U曰U, for example, your German resin film U, after coating a resin suspension or emulsion on the surface of an insulating substrate by a conventional drowning method such as spin coating or stick coating. When the dfr formed on the support substrate is bonded to the surface of the insulating substrate and then fully cured, it can be easily formed by a ^ 157 201146113 if. The grease film U' is not coated with the film of the above-mentioned resin film. For example, the photoresist material constituting the resin film u has the following materials. The necessary characteristics of the photoresist material are as follows: (1) The resistance of the liquid (electron bond core = liquid solution) of the wire thief L8 in the later-mentioned county (10) is high; (2) in the film removal step described later, for example ^The step of immersing the alkaline alkaline Xie (Lin (3 Gu Ji; (4) dry film night' although there will be a detailed description, but in the case of, for example, acidic pd from the ?1 catalyst system, all are acidic_value 1~2) Aqueous solution. (In the case of pH 8=d, the catalyst-providing catalyst is weakly considered to be m/曰, and it is acidic outside. It is known from the above that the electrolyte is attached to the electro-nuclear nucleus: It is necessary to withstand the pH value i~u, and it is more suitable to have a pH value of W2. Another ^ ^ can live, when the light-resistance county is immersed in the test towel, the 3 f photoresist is Wei. In addition, In fact, the immersion temperature is not 1 ^ 1 〇 minutes, the thickness of the photoresist film is 1~1 〇 post, but the cover f is removed to remove the step (4) although the lion liquid, Lai Wen will have The system is fine, for example, aqueous solution of Na0H or carbonic acid. The photo-resist film can be easily removed by pH 12 to 14. Na〇H = ^ degree is about 1~10%, and the treatment temperature is room temperature ~ thief, When handling, ^1〇不〇, generally by dipping or spraying However, it is not limited to this. It is also important to form a photoresist on the insulating material. Film formation is also important. H-holes, etc. are lacking in uniform film. In addition, although the manufacturing steps are simplified or ', = The film is dried, and the film is thinned in order to ensure easy handling characteristics. In addition, the film is dried by a laminator (reporter, vacuum) = σ, ,, and the color edge material. The temperature is room temperature ~16 (rc, pressure or time is followed by 惫, 158 201146113 If so, adhesion is required at the time of bonding. Therefore, the dry film-formed photoresist also has the function of preventing the adhesion of impurities. Generally, the carrier film and the cover film are formed by the user. However, it is not limited to this. It is of course the best to store at room temperature, but it must be able to be refrigerated or frozen. The composition of the dry film is not separated at these low temperatures, and the flexibility is not broken and the crack is formed. θ In addition, the resin film L8 has, for example, (8) at least one polymerizable unsaturated group in the molecule. At least one or more monomers of a carboxylic acid or an acid anhydride and (8) A polymer obtained by polymerizing at least one monomer of a monomer polymerization or a resin composition containing the polymer resin. σ The resin composition is mainly composed of the polymer resin as an essential component. Oligomers, monomers, fillers or other additives. The main resin should preferably have a branch. Regarding the molecular weight, the arithmetic mean molecular weight is preferably ~5_. When the amount of rape is too small, the bending property of the electroplating core is attached. The resistance (liquid resistance) of the liquid tends to decrease. In addition, the repellency of the sputum tends to deteriorate the dryness of the dry material: the chemical resistance of the Nandian money core and the suppression of the laser plus control It is also possible to introduce a cross-linking point. The composition of the polymer resin of the main resin of the d-transaction as described above can be as follows; (b) can be associated with the (diabetic ' θ 20 〇Τ ^ 2000-23 Π 90 士A, enoic acid, fumaric acid, cinnamic acid, crotonic acid, yuric acid, i.] lyric acid and half vinegar, propylene vinegar vinegar, etc., can be single 犹 κ,% hibiscus liver 'horse and beauty ,tit is non-acidic and has a polymerizable unsaturated in the molecule. Membrane brewing, methyl propyl hydrazine? In terms of, there are methyl methacrylate isopropyl isopropyl ester, n-butyl methacrylate, methyl 159 201146113 acrylic acid third butyl vinegar, methacrylic acid third butyl vinegar, methacrylic acid 2 _ vinegar, 2-hydroxypropyl methacrylate and the like. Further, there are esters of vinyl alcohol such as vinyl acetate, methyl methacrylate, and styrene derivatives which are polymerizable with styrene (tetra). Further, polymerization using a diacid or an acid anhydride having one of the above polymerizable unsaturated groups in the two sub-groups can also be known. Further, in a manner capable of three-dimensional crosslinking, a monomer having a = unsaturated group is selected from the monomers used for the polymer, and an epoxy group, a silk group, an amine group, a guanamine group, and an ethyl group 4 are selected. The reactive functional group is introduced into the molecular skeleton. The acid equivalent f of the slow-radical amount contained in the resin is preferably 100 to 2 Å, which is preferably _. The acid equivalent herein refers to the weight of the polymer having i groups therein. When the acid equivalent is too low, the compatibility with other components of the working solution or the resistance of the treatment liquid before plating may be lowered. In addition, when the acid equivalent is too = 'the stripping will reduce the _ direction. In addition, (8) monomer sister rate is 5~7〇. The monomer or the silk material may be any one which has resistance to an electrically difficult-to-attach chemical solution or can be easily removed with an alkali. In addition, in order to improve the adhesion of the dry film (DFR), the plasticity imparting material is provided. Further, in order to improve various resistances, it is possible to add an i-form and s, and it is a τ-based acrylic acid, an f-propyl acrylate, a methyl propylene, a methacrylic acid, or a methacrylic acid. , acrylic acid-hydrazine, methyl acrylate acid by ethyl acetonate, methyl acrylate acid 2 _ propyl esters and the like. Further esters of vinyl alcohol, methacrylonitrile, styrene or polymerizable poly-t can also be obtained. Furthermore, polyfunctional unsaturation can also be included. Things. The α may be any of the above monomers or the oligomer which reacts the monomer. The upper ruthenium η may also contain other photopolymerizable monomers. About mono α · , 6 — hexanol dimethacrylate , Bu 4 — cyclohexane diol dimethyl propylene 酉 酉 j j propylene glycol dimethyl propylene _, polyethylene glycol dimethyl acrylate vinegar , if propyl ester, glycerol 3-based acrylic acid 酞A-deuterated propylene ether trimethacrylate, 2,2-methylpropenyloxypentaethoxyphenyl, urethane-containing More $ 160 201146113. Correction, 'Village Zhuangshu's frequency of monomer reaction oligo hydroxide, filling t if there is no particular limitation, such as: dioxide dioxide eve, oxidation Ming, oxygen ϋ ϊ ϊ bow, clay, white clay, oxidation , sulfuric acid lock, acid soda, organic filler Rong% ice I mother, glass, acid acid unloading, gray stone, sulfuric acid lock, the size of the small material is ί. ° can make ~_(four)' so that it is broken when it is dispersed, and the coarse particles are cut, but it can also be used as a light-inhibiting resin (photopolymerization initiator), and polymerization to prevent cockroaches, pigments, and chromophores. A crosslinking agent such as a pigment), a thermal polymerization initiator, an epoxy abalone or a urethane formate. Mx d-based base material * In the printing process of the printing plate, laser processing is sometimes used, when using a stroboscopic laser excimer laser or a UV-YAG laser. The inherent wavelength, using a material with a high absorption rate for this wavelength can be 〇^(10)—The laser is suitable for fine processing, the laser wavelength is 355nm, 4 times higher harmonic 266nm, light The absorption rate of the material is expected to be above. The wavelength of the temple is increased by 'such as ® 36 (shown by Q' to remove part of the resin film L8 while removing the resin from the surface of the second insulating layer L1 in the blade removing to form on the second insulating layer L1. Circuit trench L4 (circuit trench forming step). The method of forming the circuit trench L4 is not particularly limited. Specifically, on the second insulating layer u on which the resin film L8 is formed, From the outer surface side of the resin coating film u, cutting processing such as laser processing or die cutting processing or press molding processing or machining is performed to form a circuit groove L4 having a desired shape and depth. For the fine electrical circuit L2 with precision, laser processing should be used. If laser processing is used, the laser depth can be changed to freely adjust the depth of cut. In addition, for press molding, for example, printing in nanometers should be used. The molding process using a fine resin used in the technical field. With this step, the shape, depth, position, and the like of the circuit trench L4 are defined. 161 201146113. The width of the circuit trench L4 formed by the circuit trench forming step , The electric circuit L2 ii can be easily formed. Further, the depth of the circuit trench L4 becomes the depth of the electrical circuit U formed by the local secret layer Li when the height difference of the second insulating layer Li is eliminated. L4 Lu Lai L4, the slave king condition 'make the circuit trench mi degrees in the range of the better with ~ 〇. 5 division. ♦ ♦ 拙 拙 L L L , , , , , The groove L4 and the dielectric catalyst coating step of the resin film L8). The inner surface of the gamma circuit trench using the grease film L8 and the entire surface of the unprocessed tree film L8 are covered with an electric etchant or its precursor L9. De-energizing: The drive L9 is used in the electric ore processing step to utilize the electric charge. The electroless ore film L10 may be formed on the portion of the plating film UG, and the mineral catalyst may be used as long as it is used in a conventional electroless ore catalyst. Correction can also listen to the precursors of Lai Wei, for example, after ί, the catalyst is generated. The specific precursor (Pd), platinum (pt), silver (Ag), etc. of the electric medium, or the method of making the metal = the electric money catalyst or its precursor L9 ί ^== For the treatment, please take a look at the method of treating the S moxibustion. Specifically, for example, the following method. The surface of the second insulating layer L1 which forms the circuit trench 1^ and the via 5 is then subjected to the sodium sulfate-sulfuric acid soft etching solution as needed. Then, the aqueous solution of sulfuric acid or hydrochloric acid having a pH of 1 to 2 is vaporized and then acid-washed. Then, the immersion liquid of the chloride ion absorbing layer L1 is treated in a prepreg which is immersed in the main component of the flute 1 or the like. Thereafter, it was immersed in an acidic plating '^' liquid containing an acid Pd-Sn gel or the like having a gas-catalytic gel and having a pH of 1 to 3 to agglomerate and adsorb Pd and Sn. Then, a redox reaction (SnCl2 + PdCl2-&gt; SnCl4 + Pd|) is generated between the adsorbed gasification sub-162 201146113 and the gasification handle. Thereby, the plating catalyst, that is, metal palladium, is precipitated. For the acidic electro-mineral catalyst colloidal solution, a conventional acidic Pd_Snb-gel/catalyst solution can be used, and a commercially available electron microscope long-order using an acidic electric solvent catalyst colloidal solution can also be used. For such procedures, for example, systemized vendors of Rohm and Haas Electronic Materials LLC. By the catalyst coating treatment, the plating catalyst or the pot liner L9 can be coated on the inner surface of the circuit trench L4, the inner wall surface of the pass L5, and the surface of the resin film L8. As shown in Fig. 36(E), the resin film L8 is swollen or dissolved with a predetermined liquid to remove it. By this rotation, the plating catalyst or its precursor L9 can be left on the inner surface of the processing-shaped groove L4, and will be removed. The method of removing the electric ore catalyst or the precursor L9 adhering to the surface of the resin coating film L8 in addition to the resin coating film L8 is not particularly limited. Specifically, for example, after the liquid (expansion) swells the resin L8, the second insulating layer film is peeled off by the coating film U; after the resin coating portion is partially dissolved by a predetermined solution (swelling liquid), 彳The second 纟L1 _L1 swells the tree S3 Ιί: As long as it is capable of making the resin coating U _ _ limit. Correction, the _ or turn, may be performed by immersing the second insulating layer U of the predetermined ί皮® in the swell. ^ ίίΐίΐ ‘It can also be peeled off gently when it is immersed in the ultrasonic wave to improve the removal of the other a ^. In the case of the description of the coffee U, the __ resin film L8 does not mean == sex = the film U swelled liquid (swelling liquid), as long as the solution is used to make the first, the color edge layer U and the The electro-mineral catalyst or its precursor L9 will only swell or dissolve the swellable resin coating U; otherwise, there is no special ship. Further, it is preferred to use a liquid which allows the swellable resin film u ^ to 163 201146113 to be easily peeled off. These swelling liquids can be selected according to the type of the swelling resin coating u or the J degree. Specifically, for example, when the swellable resin film L8 is composed of a thin elastomer, an acrylic elastomer, a poly-g-based elastomer, or the like, (8) has at least one dance-unsaturated group in the molecule. At least one or more monomers of the acid or the acid field, and (b) at least one or more kinds of the polymerizable resin which can be polymerized with the (8) monomer, or a polymer resin obtained by the polymerization, or a composition containing the polymer Containing the rebel base of the C-line pure fat, it is advisable to make an aqueous test solution such as a solution of aquarium hydroxide. &quot;10/. Left and right

^, when using the electro-mineral treatment under the acidic conditions mentioned above in the catalyst-independent step, the secret___(4) is light under acidic conditions, and the degree of swelling is above 60% under the condition of 60% J t it For example, an elastomer such as a dioxane, a ruthenium elastomer, or a polyester (tetra) physin, or (8) at least one of a polymerizable unsaturated decanoic acid or _:

The polymerization of the monomer-polymerized J ΐΐ resin composition and the silk-containing acrylic resin obtained by polymerization of one or more kinds of monomers is carried out by using an aqueous solution having a enthalpy value of 12 to 14. =a τ ΐϋΐ ΐϋΐ 氧化 氧化 纳 , , ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ ΐϋΐ I. A method of injecting another film, for example, a method of swelling a resin. =u is immersed in the swelling solution for a predetermined period of time, and only the suspicion is preferably irradiated with ultrasonic waves during the impregnation. When the other is not peeled off, it can be peeled off as needed. The "household display" is subjected to electroless plating treatment on the inner surface of the residual electric medium or its precursor L9 to form an electrolysis circuit. _ This step 'in the circuit fine = mine touch is covered with electricity in the part covered with electric clock catalyst or its _L; power out: 164 201146113 L10 (plating layer) method. Aluminum (Α^, etc. for 1 no, electricity, metal, such as: copper (Cu), nickel (10), climbing), select i,. In addition, the electroplating of the towel component is excellent in conductivity, and is preferable, and is preferable. When N1 is used, the adhesion to the recording or the solder is excellent, and the film thickness of the electroless ore film L10 is excellent and the helmet is particularly eye-shaped. ,, ~ 1 〇 post, more suitable for the left ^, the term 疋. Specifically, for example, the 〇·ι basin is turned forward. The electroless money film UG is deposited on the portion of the second recording layer u where the catalyst or L9 remains. If so, the portion that can be formed correctly forms the electroless surface L1G. On the other hand, the portion of the 20-inch electric circuit L2 analyzes the electroless ship L10. L2 Α __ axis complex line width narrow small electrical circuit 2 1 ΪΪ adjacent to the electric Wei Road U residual excess plating film. Therefore, it is possible to prevent problems such as short circuit or migration. b As shown in Fig. 37(B), on the second insulating layer u, a surface ϋ from the bottom surface of the circuit trench L4 to the first electrical circuit port is formed by laser processing. At this time, the glue L11 remains on the surface of the first electric circuit L7 exposed at the bottom of the through hole. The inner surface of the through hole L5 is subjected to degumming treatment, and the second/n-11 is removed as shown in Fig. 37(C). The desmear treatment is not particularly limited, and a conventional degumming/one place can be employed. Specifically, for example, a treatment of impregnating a permanganic acid solution. Further, by the desmear treatment, the resin on the inner surface of the through hole L5 is made into a coarse sugar, and the surface _ degree of the three-hole L5 _ surface is increased, and the inner surface of the _ circuit groove L4 is covered by the electrolytic electric surface L1G. Therefore, the circuit is difficult to be _ _ face will not _ go to the rubber in the Wang Li liquid and become rough. Therefore, the surface roughness of the inner surface of the circuit trench L4 is smaller than the surface roughness of the inner surface of the via hole L5. 'After the desmear treatment, as shown in Fig. 37(D), the inner surface of the circuit trench L4 and the inner surface of the via hole L5 are subjected to an electroless plating treatment. At this time, the electroless plated film L10 existing on the inner surface of the circuit trench and the first gas circuit L7 exposed at the bottom of the through hole L5 function as a plating core, and the plating layer is on the side of the circuit trench B 146 201146113 and The inside of the hole L5 grows. The second electric circuit L2 is formed on the inner side of the Liu circuit trench L4, and the first electric circuit L7 is turned on, and the gas circuit L2 and L7 are applied to the second side; the other side can also be the same as the side. - The first-electrical treatment of the exposed electrical circuit. At this time, the 'key layer sings from the bottom of the through hole L5 to the bottom of the through hole L L4 to fill the hole. This is by the build-up method, even the substrate L1. . Borrowing and other issues occur ^=2 electricity =. The lower layer can also be formed to prevent short-circuiting or migration. Next, as shown in Fig. 38 (9), the pair U. L5. At this time, the through hole of J = which is outlined in the through hole L5 is slag Lll. Residual on the surface of the electric milk circuit L7

The inner surface of the through hole L5 is subjected to degumming treatment to remove the slag L11, except that ϊΐ, 杳1 fi 3 ΪΪ is removed. By the desmear treatment, the main M is roughened, and the surface roughness of the inner surface of the through hole L5 becomes large. The resin becomes thicker. After the rubber is processed, as shown in Fig. 38(D), the s: 2i τ J is deplated. At this time, at the bottom of the through hole L5, the gas is exposed as a nucleus, and the layer is formed on the inner side of the through hole L5. Alternatively, the second side of the through hole L5 can be pressed and pressed. Mine treatment. This day, the car is out of the 筮Τ7 λλΓ The plating layer of this temple is deposited from the bottom of the through hole L5, and the electric ore layer is filled with the through hole U. 166 201146113 Next, as shown in Fig. 38(E) The film L8 is formed on the surface of the second insulating layer L1 (film forming step). Next, as shown in Fig. 39 (A), part of the resin film L8 is removed, and at the same time, the removing blade is further The resin is removed from the surface of the first insulating layer L1 to form a circuit trench L4 on the second rim edge sound L1 (circuit trench forming step), if the circuit is formed after performing desmear treatment on the inside of the via hole The groove L4, so that the surface roughness of the circuit trench is more than a portion of the through hole L5__table_roughness L4 overlaps with the through hole L5, and the upper portion of the through hole u is integrated with the circuit trench l^. · The road groove L4_' is set to guard the hiding, so that the surface (10) of the inner surface of the Weilu groove w is Ra in a range of preferably 0.01 to 〇5 。. Next, as shown in Fig. 39(B), 电镀' is coated on the circuit trench L4 and the outer surface of the resin with a plating catalyst or its precursor L9 (catalyst coating step). ',,, as shown in Fig. 39 (C) ) shown by 'swelling or dissolving the resin 8 with a predetermined liquid to ϋ: (fine removal step) ^» by this step, the potty: the resin film formed outside the circuit groove L4 formed by laser processing The electric sputum on the surface of L8 or its precursor will be the lei iLH39(D)i of the =, and the internal surface of the residual electrocatalyst or its precursor L9 ΓΛ ^ 解, so that the electric ore layer grows inside the electricity = 枰 L4, and forms a second electrical circuit [2. 4 electric tower correction by this] in the circuit clearing groove L4 set the first - 歯 赍攸 二 two second conduction the second Electrical circuit port and the second circuit board L10. The clothing is made as shown in Fig. 35 [Third manufacturing method] The substrate is described in detail. The common method of the method is omitted. First, it is the same as the first manufacturing method, such as 罔The first electrical circuit P is disposed on the L6, and is further disposed on the first insulating layer 167 201146113. On the second insulating layer L1, as shown in item 4 (B), The resin film L8 is placed, but the resin is removed from the surface of the second insulating layer L1 to rise the circuit trench L4 in the second insulating layer (circuit trench forming step). When the alkali battery slot L4 is used, the processing is set. The cake is such that the inner surface of the trench U of the circuit is in the range of preferably α〇1~〇5μιη. Next, as shown in FIG. 4(C), the circuit trench L4 is included. The second surface of the inner surface, including the plating catalyst or its precursor L9 (catalyst coating step 4 dielectric coating treatment, can be read on the circuit L4 _ surface and not = 9 shot to read the second insulation layer L1 The entire surface is covered with a catalyst or its precursor το = 'such as ^ (10) (9) * 'to the second insulation covered with electric orthodontic catalyst or its precursor 9 = circuit groove L4 _ surface The outer surface of the layer u is subjected to an electric power = J treatment to form an electroless plating film L1 (electric money processing step). Using the electrician 箸Ϊΐπΐ Figure 41 (Α), on the second insulating layer L1, the bottom surface of the wei ί 沟槽 沟槽 到达 到达 到达 到达 到达 L 11 11 11 11 11 11 11 := (8) where f is, the _ is performed on the through hole L5 to remove the 袓^2 s. According to the desmear treatment, the surface of the inner surface of the through hole L5 is deeper in the inner surface of the resin L5, and the thickness of the inner surface of the inner surface L5 is increased. Since the electroless plating film L1G of the circuit trench L4 is covered, the circuit trench L4_ does not face. Because ^ becomes rough. Therefore, the surface roughness of the inner surface of the circuit groove u is smaller than the surface roughness of the inner surface of the pupil L5. After the slag treatment, as shown in Fig. 41 (〇, the second insulation layer L1 is not converted to the outside. The scale, the Wei test (4) and the first electrical circuit L7 in the through hole function as an electric core. The function of the electric shovel layer is on the side of the road L8 _ side, the inner side of the through hole L5 and the second insulating layer u. For this, a second electrical circuit u is formed inside the circuit trench L4, = 168 201146113 hole L5 A dielectric layer L3 that electrically connects the second electrical circuit L2 and the first electrical circuit L7 is formed on the inner side, and the plating layer is further grown on the surface of the second insulating layer L1. Alternatively, the first electrical circuit L7 and the electroless plating film L10 may be provided. Electrolytic ore treatment is applied to increase the thickness of the electric ore layer by applying a voltage. Next, as shown in Fig. 41 (D), the electrodeposited layer on the surface side of the first insulating layer L1 is removed by a CMP (Chemieal Meehanli Polish) method. Thereby, the surface of the second insulating layer L1 and the surface of the first electric circuit L2 are exposed to the outside. Through these steps, the circuit board L10 shown in Fig. 35 is produced. '[Seventh embodiment] The present invention More about a circuit base that can be used in various electronic and electrical devices In order to achieve high performance of electronic and electrical devices, it is desirable to have a circuit board that is wired in a fine and high-density manner. In order to form a circuit in such a subtle and masculine manner as in this case, a conventional document is disclosed in an insulating base. The groove is formed on the surface of the material, and the groove is filled with a metal conductor to form a circuit (see, for example, Japanese Laid-Open Patent Publication No. 2009-81211, etc.). The trench is filled with a metal conductor to form a circuit, and the micro-density and south density can also prevent the circuit from being broken, ensuring the insulation between the circuit and forming a circuit with high reliability. The J-type system indicates the insulating substrate M1. The trench M2 is filled with the metal conductor M3 to recognize the circuit substrate formed by the electric quantity = 4. That is, first, as shown in the figure, the entire surface of the insulating substrate M1 also includes the inside of the trench M2. Case 2 Electrocoating: 电ίϊElectrical ore catalyst for electric ore Μ5. Next, it is impregnated and smashed with electroless Wei, thereby applying the electrolysis ore film attached to the electric ore catalyst Μ5. Membrane Μ 6 (6) Figure 48 (c) On the entire surface of the insulating substrate M1, which is shown in the second part, after the electrolysis, the thick 'like to form the electroless Wei film ^ 边 side 1, the electrolytic key film through the direct current, while immersing the electrolytic band y electrolysis The electric ore layer M7. Hunting is deposited on the surface of the electroless electroless ore film 169 201146113 = 6 like this groove, and the electrolytic plating layer M7 can be deposited in the groove (10) by the electroless electric clock film M6 and the electrolytic electric ore. The metal conductor M3 composed of the layer M7. At this time, the electroless ore film M6 or the electrolytic plating layer M7 is also formed on the surface other than the groove M2 of the substrate M1, after forming the electric (four) plating layer M7 as described above, The surface of the ground insulating substrate M1 is removed as shown in Fig. 48(E), and the electroless plating film M6 or electrolytic electrowinning layer exposed on the surface of the insulating substrate leg is removed, thereby making each groove The metal _ M3 filled in M2 is independent of each other, and the circuit M4 is formed by the metal conductor M3 in the trench M2. As described above, by performing electroless plating and electrolytic plating, the metal conductor M3 can be filled in the trench M2 to form the circuit M4. However, in the conventional embodiment of FIG. 48, the 'trench M2_filled metal conductor (10) is mostly formed of electric ore, and the metal conductor M3 formed by electrolytic plating like this has a crystal grain size combination. Not uniform (refer to Figure 47 described later). Then, when the size of the crystal grains is not uniform, the mechanical properties, thermal characteristics, and electrical characteristics of the conductor M3 are lowered, and the reliability of the circuit M4 causes a problem. In view of the above problems, it is an object of the present invention to provide a circuit board capable of forming a metal body in a trench for circuit formation by crystallization of fine particles and fine crystal grains, and the reliability of the circuit is high. In the circuit board of the present invention, the circuit forming trench M2 is formed on the surface of the insulating base substrate M1, and the metal conductor M3 formed by plating is filled in the trench forming river 2 for circuit formation, and the crystal grain of the metal conductor M3 is formed. The average diameter is less than 1〇. μ If the metal conductor Μ3 filled in the trench M2 for circuit formation has an average diameter of 1 〇μηι or less, which is formed by an average and fine crystal granule, it can be improved. Mechanical properties, thermal characteristics, and g gas characteristics of the metal conductor M3. Further, in the present invention, the metal conductor M3 in the trench M2 for circuit formation is formed by electroless plating. By forming the metal conductor M3' by electroless plating as described above, the metal conductor can be formed by granules which are averaged and fined as described above. 170 201146113 That is, the seventh embodiment of the present invention includes the following technical contents. A circuit board of claim 7, wherein the circuit forming trench is formed on the surface of the insulating base material, and the gold forming f-forming conductor formed by plating is filled in the circuit forming trench. The average diameter of the crystal grains of the conductor is 1 μm or less. The circuit board as recited in claim 7, wherein the metal conductor in the trench for forming a circuit is formed by electroless plating. According to the present invention, the metal « M3 ' filled in the trench Μ 2 for circuit formation is formed by electroplating, and the average diameter of the crystal granules is 1 〇 μηη u and is formed by average and fine crystal grains. Therefore, the mechanical properties, thermal characteristics, and electrical characteristics of the metal conductor river 3 can be improved, and a highly reliable circuit Μ4 can be formed. The following is a description of the embodiments of the present invention. The insulating base material M1 of the present invention is not particularly limited as long as it is manufactured by a Kelvin circuit board. Specifically, for example, a resin-containing grease raft is used as long as it is a manufacturing process that can be used for a circuit board. In addition, the resin of the organic substrate may be, and the others are not particularly limited. Specifically, the case of the ether ether, the bismuth, the miscellaneous, the polyphenylene ii tree, the chlorate vinegar resin, the benzopyrene resin, Double Malay face ring _Wei fine purpose, silk benzene ride _ lion's purpose, double shaft in the dilute ring of the five difficult 'only 妓 妓 射 电 电 职 职 if if if if if if if 魏 魏 魏 魏 魏 魏 魏 魏 魏. Specifically. This is also a type A epoxy resin, a double-aged F-type epoxy resin, and a double-sided S-type ring. Each of the above-mentioned epoxy resins may be used alone: == 171 201146113 A phenol-based curing agent, an acid anhydride-based curing agent, an aminotriazine phenolic curing agent, and an acid cool resin. The phenolic curing agent is, for example, a hardening agent such as a phenolic type, an aromatic type or a terpene type. In order to further impart flame retardancy, a phosphorus-denatured phenol resin or a phosphorus-denatured cyanate resin or the like may be used. These hardeners may be used singly or in combination of two or more. Further, although it is not particularly limited, since a circuit pattern is formed by laser processing, it is preferable to use a tree having a good absorption rate of laser light in a wavelength range of 100 to 400 nm. Specifically, for example, a polyimide resin or the like. The insulating substrate M1 may also contain a filler. The filler may be inorganic fine particles or may be fine particles, and is not particularly limited. Since the filler is contained, the filler in the laser processing portion is exposed, and the unevenness of the filler can improve the adhesion between the plating and the resin. (3) Materials constituting the inorganic fine particles, specifically, for example, alumina (a12〇3), magnesium oxide (MgO), boron nitride (BN), aluminum nitride (A1N), cerium oxide (Si〇2) , high dielectric constant filling material such as titanic acid (BaTi〇3) 'titanium oxide (Ti〇2); magnetic filling material of hard ferrite magnet f; magnesium hydroxide (10) (〇h) 2), (A1 (〇h) 2), three _ records (Sb > 2 〇 3), pentoxide (% 2 〇 5), strontium salt, zinc sulphate, saponin, (CaC 〇 3), mica, and the like. The above inorganic fine particles may be used singly or in combination of two or more kinds. These inorganic fine particles 'have high heat conductivity, relative dielectric properties, heterogeneity, her distribution, and color degree of freedom. Therefore, when the desired performance is achieved, 'proper blending and particle size design can be performed. Ten, the purpose of extreme enthusiasm and filling. Further, although it is not particularly limited, when the insulating substrate M1 is formed on the surface, it is preferable to use a filler having an average particle diameter of at least one, and it is particularly preferable to prepare an average particle diameter in the range of ～1_ 〇.〇5μιη~5μηι range of fillers. In the insulating substrate M1, in order to improve the decane coupling agent, the eutectic coupling agent may also be contained in the insulating substrate M1. Off Vinyl Wei, stupid thief = Wei Wei, Shuji Wei series, amine Wei system, olefinic oxime 糸 'methacryl oxime oxane system, acrolein 172 201146113 coupling _. The above-mentioned Wei even t μι Dispersant may be separately produced, or two or more types may be used in combination. ^ On i Road: Organic microparticles, specifically, for example, rubber particles. The πίί ΐt insulation ί#Μ1 is not particularly limited, and specifically, it can be used for pre-reading and molding of a two-dimensional job. The insulating substrate is defined, for example, in the case of a sheet, a film, or a prepreg, and is 10 to 200 μm, more preferably about 2 to 100 μm. A groove for forming a circuit on the surface of the miscellaneous substrate M1 is as shown in Fig. 44(A). The groove (10) is formed in the same pattern shape as the circuit pattern provided on the surface of the insulating substrate M1. The method of ϊΐΐί circuit shape groove M2 is not specific, for example, ϋίίί L performs laser reinforcement, die-cutting, or profile processing to form the desired pattern shape, width and depth.曰 “: work method, etc. When you want to form a fine circuit with precision, you should use laser plus ^. If you use laser plus king, you can freely adjust the cutting depth and other parameters by changing the laser output. For the press-type processing, it is preferable to use a molding method using a fine resin as used in the technical field of nano-printing. A through-hole of a portion such as a hole is used as a groove for the circuit formation. The step of forming the trench M2 on the insulating substrate M1 defines the pattern shape and width of the circuit formed on the insulating substrate M1. The width of the trench M2 is not particularly limited. When laser processing is used, it is easier to form the trench μ] with a fine width having a line width of 20 μm or less. Further, the depth of the trench M2 becomes the thickness of the circuit M4. As described above on the surface of the insulating substrate M1 Forming trenches for circuit formation After M2, the plating catalyst M5 is attached to the surface of the insulating substrate M1 on the side where the groove m2 is formed. The electric ore catalyst M5 is attached to the periphery of 173 201146113 including the groove m2 as shown in Fig. 44(B). The surface of the insulating substrate M1 is in the surface of the insulating substrate M1. The medium M5 serves as a core for depositing the plating metal when electroless plating is performed. Regarding the electric medium M5', it is sufficient to use a conventional catalyst for electroless money, and the pottery has no limitation. Alternatively, it can also be coated with a (four) plated precursor to make electricity. Specific examples of the electric clock catalyst M5 include, for example, metal palladium (tetra), platinum, (Ag), or the like, or a precursor formed of these metals. For the method of coating electroplating_milk (including its precursor), for example, the method of treating the re-mixed solution after the pH value 丨~3 is carried out under the condition of _ acidic pd-%. Specifically, for example, the following method. First, on the surface of the insulating substrate M1 on which the circuit shape M2 is formed, the oil or the like is subjected to a predetermined time in the solution (cleaner, blending agent) of the surfactant. Then, if necessary, it is treated with a soft side agent of sodium persulfate-sulfur. Then, it is pickled with an acid such as a sulfuric acid aqueous solution or a hydrochloric acid aqueous solution having a pH of 1 to 2. Next, it was immersed in a treatment of the surface of the stannous chloride m at a concentration of about G. 1%. After that, it is immersed in an acidic plating catalyst colloidal solution containing an acidic Pd~~Sn colloid such as an f f1 value of 1 to 3 to reduce and adsorb Pd and Sn H in the adsorbed limb (Asia A redox reaction occurs between tin and chlorination (3⁄43⁄4+pdcl2—SnCU + , catalyzed by a catalyst, ie, metallurgical β), and the other is a conventional solution. Acidic pd-=glue. _solution, etc. can also take into account the commercially available "platform" of the miscellaneous solution. For such procedures, for example: Roj^^dHaas Electronic Materials Co., Ltd. After the plating catalyst M5 is attached to the surface of the insulating base material M1 including the inner peripheral surface of the trench for forming a circuit, as described above, the electroless ore portion f is performed. For the electroplating treatment, the f-edge substrate M1 coated with the electro-mineral catalyst M5 may be impregnated into the electroless plating solution to deposit an electroless plating metal on the 4-position of the plating catalyst M5. Method, etc. Metals that can be used for electroless plating 'for example: copper (〇1), nickel (Ni), cobalt (c〇), 174 201146113 Weaving _ excellent electrical properties is better, it is better than ί ^, the resistance of the new or the solder is excellent, the electric money can be as shown in Figure 44 (c), forming very On the entire surface of the thin insulating substrate M1. In addition, 2 ^, # ^^^ The film thickness of the base coffee, such as the insulating substrate mi of the electroless plating film M6, is impregnated in the mine In the electroless electroless ore with increased speed, continue electroless hunting. Continue electroless plating like 14 samples, as supplemented by 5144(9), precipitate electroless neodymium on the solution of yi=8 and stack electroless galvanic, M ? Yun 2...*Electrically rolled electric ore layer Μ8 fills the interior of the trench Μ2, and then electrolyzes the non-electrolytic gangue 6 and the electroless plating layer Μ8 in the trench-like conductor tS. The treatment of the electric ore until the electroless plating layer should be used to fill the trench = inner. At this time, the electroless ore film Μ6 is also formed on the surface of the insulating substrate M1 of the trench Μ2, in the insulation On the surface of the substrate M1, an electroless ore layer is also accumulated. Then, by grinding the surface of the insulating substrate M1, it is absolutely necessary. The electroless plating film and the electroless plating layer M8 which are exposed on the surface of the substrate M1 are removed. The polishing is not particularly limited, and for example, CMP (Chemical Mechanical Polishing) can be carried out. CMp method a method of polishing the surface of the insulating substrate M1 with a polishing pad while flowing the polishing liquid. The electroless plating film river 6 protruding from the surface of the insulating substrate M1 and the etching liquid may be roughly used before the CMP method is performed. The electroless plating layer M8 is dissolved and removed. As described above, the electroless plated film M6 and the electroless plated layer M8 on the surface of the insulating base material M1 are removed, whereby "as shown in Fig. 44 (E), The metal conductor M3 composed of the electroless ore film M6 and the electroless key layer M8 filled in the trench M2 is independent of each trench M2, and the metal 175 201146113 filled with the trenches M2 forms the circuit M4. . The metal conductor M3 forming the circuit M4, by grinding, "the surface forms a single-surface with the surface of the insulating substrate M1. Then, due to the body M3, as described above, the electroless plating is performed" = the conductor M3 will It is formed by the average and fine crystals of the granules. (Ref., Zhao Xiu, Na, electrical characteristics. Here, the size of the crystal grain of the metal conductor M3, the average diameter length is set to be less than 5 μηη, preferably Below 3μηη. The smaller the melon length of the crystal grain block, the better, the lower limit of the wire is set. The average diameter of the crystal fiber is long, and the crystal grain of the metal wire Μ3 can be averaged and fined, and the gold and the conductor are made. The mechanical properties, thermal characteristics, and electrical characteristics of the M3 are improved. The average diameter length is 5 at any position of the SIM image towel obtained as described later _46 or Fig. 47, and the straight line ' of 2 is disposed in the 1st division The average 値 of the length of each crystal grain block is calculated for each crystal on the straight line above the line ί ί Γ Ϊ li li % li li li li li li li li li li li li li li li li li li li The number of f blocks 'divide the excitation by the crystallization The average diameter length of the block can be obtained by the number of blocks. The age H table * Another embodiment of the present invention. The embodiment of Fig. 44 is electrically, and the medium M5 is formed as shown in Fig. 44 (9). Then, as shown in FIG. 44(c), a very thin electroless ore film M6 is formed, and on the electroless electric clock film M6, ',, electrolytic cell layer VT8' is formed in FIG. 45. In the aspect, as shown in FIG. 45(A), after the plating catalyst M5 is attached to the surface of the insulating substrate m including the trenches (10) and (4), the insulating substrate M1 is continuously immersed in the electroless plating. In the liquid, as shown in Fig. 45(B), a very thin electroless plating film M6 is not formed, but only the electroless ore layer M8:t is buried in the trench M2_, that is, only The electrolytic key layer is filled with a metal conductor M3 inside the trench M2. At this time, the electroless plating layer M8 is formed on the surface of the insulating core in addition to the trench M2_, and the surface of the insulating substrate M1 is formed. The electroless ore layer (10) is removed by polishing, whereby the metal conductor milk can be filled in each of the grooves M2 as shown in FIG. 45(C) to form the circuit M4. 176 201146113 Hereinafter, the manufacturing method of the present embodiment will be described in more detail based on the embodiments. In addition, the details of the present invention are not intended to call any example of τ. (Example 1)环氧 的 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧 环氧'Laminage _, is a butanone _ κ) suspension coated with styrene in the main surface of the oxy-corrosion tree, coated with styrene (polyfisBR) [Japan (stock) company, 600, particle diameter 2 〇〇nm, the solid form component is 15%], and it is obtained by drying it at 8 过 for 30 minutes. Then, a groove having a shape as shown in Fig. i (9) is applied to the epoxy resin substrate on which the film has been formed by using a laser and having a depth of two. In addition, the Rayman is a MODEL5330 manufactured by ESI Corporation equipped with a UV-YAG laser. , 壬Μ^ΐ, 'Immerse the epoxy resin substrate of the domain trench in the cleaning and conditioning agent [Interface, grasp t liquid 'PH&lt; 1,: RGhmandHaas Electronic Materials Co., Ltd. C/N3320] After editing, wash with water. Then, soft magnetic treatment was carried out using a soft sodium sulfate-sulfuric acid pH &lt;1. Then, use the PD side array pley Fareast (stock) company Ξοίΐ 气f gas. Then, 'impregnated in a gelatinous solution containing stannous chloride and 1 bar of chlorinated, 夂-Sn [CAT44, manufactured by Shipley-Fareast Co., Ltd.] Resin ^^1 without electric shock is difficult to achieve in a tin-like state T adsorbed on the epoxy VIII q H impregnated in the catalyst solution [ACC19E, ShiPley_Fa_(share) of ρΗ&lt;1 to produce a nucleus. Then, the epoxy substrate was recorded as 5% liquid of pHi4 + ultrasonically treated and immersed for 1 G minutes. As a result, the green® of the surface is completely peeled off. At this time, there are no film fragments or the like on the surface of the epoxy resin substrate. New Zealand, the epoxy resin substrate was immersed in electroless A, CM328L, CM328C, and Shipley-Fareast Co., Ltd.] for electroless copper plating treatment. (4) Hii solution plating treatment 'analysis 4 thickness electric shock coating. (Sweeping A-type microscope) Observing the epoxy substrate which was subjected to electroless copper plating treatment. The electroless ore film was formed correctly in the portion where the processing was performed in the county. 177 201146113 The swelling degree of the other 1 swellable resin film was computed by the following. . The SBR suspension for forming a swellable resin film was coated on the release paper, and dried at 80 C for 30 minutes. Thereby, a resin film having a thickness of 2 μm was formed. Then, the formed film was forcibly peeled off to prepare a sample. Then, the prepared sample is weighed to about 2 g. The sample weight at this time was taken as the weight m (b) before swelling. Then, the sample taken from Cong was immersed in 2 (four). The sodium hydride of c 5 〇 /: aqueous solution l 〇 ml passed ls minutes. Further, other samples were also immersed in 1 〇ml of 20 ± 2 C hydrochloric acid 5% aqueous solution (pH 1) for 15 minutes. Then, the centrifugal separation was carried out by using a centrifugal separator at 1 〇〇〇G for about 1 minute, and the moisture attached to the sample was removed. Weaving, measuring (4) The weight of the swelled sample after separation is taken as the weight m (a) after swelling. From the obtained pre-swelling weight m(b) and Ϊ, weight; m(8), the degree of swelling was calculated from the "swell degree SW, (8) - (%)" equation". In addition, other conditions are subject to the measurement method of 验8ί1〇ΐ5 8 test swelling. At this time, the degree of swelling of the 5% aqueous solution of sodium hydroxide of ρΗ14 was 75〇%. On the other hand, the degree of swelling of the aqueous solution of PH1 in hydrochloric acid was 3%. (Example 2) θ In addition to the polymer containing an enemy group [manufactured by Sakamoto Zeon Co., Ltd., the acid equivalent weight is 5 〇〇, the average molecular weight of the aliquot is 25 _ 'solid form component 2 ()% styrene-butadiene The butanone _K) suspension of the Qiu 1 (ship) (manufactured by 曰本z(10)(股), the acid equivalent 600' particle diameter 2〇〇nm, solid form component, other than the example i The swelling degree of the 5% aqueous solution of sodium hydroxide in PH14 is %. On the other hand, hydrochloric acid 5 for PH1. /. The degree of swelling of the aqueous solution was 3% by weight. w·Remedy for the manufacturing method of the above-mentioned "brake", the swelled portion of the age-peeling swelled portion. Therefore, it can be correctly electrolessly plated on the part touched by the coin. In addition, since the lining resin is more easily covered by the lion, the film removal step is easier and more accurate. Then, the SEM (scanning type mirror) is used to observe the vertical cross section of the electric wire 178 201146113 obtained by the above-mentioned formula with respect to the longitudinal direction of the circuit trench. The thickness of the formed film is about 5 μm, and the depth D of the circuit trench is about 2 〇 ^, and the T/D is about 〇.25. (Second Embodiment) Hereinafter, a manufacturing method of the present embodiment will be described more specifically based on examples. In addition, the model 15 of the present invention is not explained by the following examples (Example 2-1). First, the dioxin of the average particle diameter α5μηΐ (Admatechs j limited public SO-C2) ), 850S), which is a double-enzyme A, and dicyandiamide (a Japanese-made company) The insulating substrate is a substrate in which the content of the oxygen-cut particles is % by weight and the thickness is ΙΟΟμηι. Next, a film of a styrene-butadiene (SBR) having a thickness of 2 μm (resin coating) was formed on the surface of the insulating base material. Further, the formation of the film is carried out on the main surface of the J-edge substrate, and a butanone-butadiene copolymer (·butanone K) suspension is applied [manufactured by Zeon Co., Ltd., acid equivalent). _, particle diameter · nm 'solid form component 15%] 'and at 80. (3) After 30 minutes of drying, the insulating substrate having the resin film formed thereon was subjected to laser processing to form a circuit groove having a substantially rectangular cross section having a width of 2 μm, a depth of 20 μm, and a length of 30 mm. 'Laser and Guard uses a laser light irradiation device (MODEL5330 manufactured by ESI Corporation) equipped with a UV-YAG laser. Next, the insulating substrate on which the circuit trench has been formed is immersed in a cleaning agent (surfactant solution, PH&lt;1: C/N3320 manufactured by Rohm and Haas Electronic Materials Co., Ltd., followed by washing with water. Then, soft etching was performed with a soft etchant of sodium persulfate-sulfuric acid pH. Then, PD404 (Shipley_Fareast) was used. Co., Ltd., PH&lt;1) pre-dip step. New Zealand, impregnated with acidic Pd-Sn colloidal solution containing PH1 of gasified stannous, palladium-palladium [CAT44, ah (four) is poor (share) company] In the case of the electroless copper forging core (catalytic metal), it is adsorbed on the insulating substrate in the form of a gel-like state. 179 201146113 The catalytic entanglement of the shares JHPH&lt;1 (ACC19E, Shipley-Fareast residue) SBR stomach 'f thoroughly Stripping. At this time, 'iShiDle P, fragments, etc. are not present on the surface of the insulating substrate. Then, the insulating substrate is immersed in CM328A, c made of electroless plating solution P fareast Co., Ltd. for electroless copper electrowinning treatment. Lei, electricity, and electric recording processing 'formed a thickness (4) on the groove of the circuit, and the cover is smashed. The electroless copper shovel is processed (filling the circuit to fill the circuit / θ). In addition, the degree of swelling of the scented resin film was determined according to the following method: (10) V. The SBR suspension for forming a swellable resin film was coated on the nucleating paper, and dried at (4) 3 G minutes, thereby forming a thickness of 2 μ_. Then, the film formed by the film is forcibly peeled off, and a sample is prepared. The sample is obtained by weighing about .02 g. The weight of the sample at this time is taken as before swelling: ft m (b) Weaving, the sample weighed was immersed in l〇ml of NaOH solution of NaOH 21 for b minutes. In addition, other samples were also immersed in a 5% aqueous solution (pHi) of 20±2 C hydrochloric acid. 15 minutes in i〇ml. Then centrifuge with a centrifuge for 10 minutes. The water is attached to the sample, and then the weight of the swelling sample after separation is measured as the weight m (a) after swelling. The weight m(a) ' is based on the different formula of the swelling degree sw=[m(a)—m(b)] /m(b) X100 (%)”, and the other conditions are used j!SL1 〇15 8.27 (Measurement method of alkaline swelling degree). At this time, the degree of swelling of the 5% aqueous solution of sodium hydroxide to pH 14 was 750%. On the other hand, the degree of swelling of a 5% aqueous solution of hydrochloric acid at pH 1 was 3 Å/〇. (Example 2-1) The same procedure as in Example 1 was carried out, except that the insulating base material having a cerium oxide particle content of 3% by mass was replaced with an insulating base material of 5% by mass. (Examples 2 - 3) In addition to the etched substrate of the insulating layer 180 201146113 t containing the cerium oxide particles having an average particle diameter of 〇.5 μηι, (Example 2-4) The particles having a particle diameter of 〇5 μm are used as the particles of 〇5 μm, and the amount of the material is ==°/=the insulating substrate is composed of a dioxin having an average particle diameter of 15 ==石夕^^^^^ In addition to the replacement of the % insulating substrate, the other (Examples 2 - 5) contain an oxide substrate having an average stalk size of G 々 m, and the insulating substrate having a content of 30 Å / 0 contains The average particle diameter is j, such as the force of the dioxide, and the other is the same as the insulating substrate of 75% by mass. The other disk example 1 is the same. /', (Examples 2-6) The insulating base material of the SiO 2 particle having a diameter of 〇.5 μm was replaced with the insulating substrate containing the SiO 2 particles having an average particle diameter of 〇. 5 μίη. The other example was the same as that of Example 1. (Example 2 — 7) In addition to the cerium oxide particles having an average particle diameter of 〇.5 μιη, and the content is 30 The mass % of the insulating base material was the same as that of Example 1 except that the ruthenium dioxide particles having an average particle diameter of 〇〇5 μm were used, and the content of the insulating base material was 50% by mass. —1) In addition to an insulating substrate that does not contain a filler [from a double-type epoxy resin (850S manufactured by DIC Co., Ltd.) and dicyandiamide as a hardener (DICY, manufactured by Japan Carbide Industries Co., Ltd.) The substrate made of the substrate was the same as that of Example 1 except that it was an insulating substrate. The Examples 2-1 to 7 and Comparative Example 2-1 were evaluated as follows. (The shape of the circuit trench) First The insulating substrate on which the circuit trench was formed was cut at a position 7 in a direction perpendicular to the extending direction of the circuit trench. The cut was observed with a microscope (ΚΗ-77〇0, manufactured by Hirox Corporation, 181 201146113). Then, the evaluation was carried out according to the following evaluation criteria. ◎. The position at which the resin was eluted (the position at the crucible) was not confirmed. The position where the resin was eluted was confirmed, and one of the seven positions was present. △ .^ Endure In the position where the fat is dissolved, there are 2 positions in 7 positions. X · The position where the resin is eluted is confirmed, and in 7 positions, there are 3 positions (electroplating is not attached), and the electroless ore is The circuit trench of the insulating substrate (the width of 2_, the length of the plating layer, before filling the plating, with the microscope 〇乂 700 有限 有限 有限 么 700 700 700 -7-7700), observe the formation of the overall plating layer. Then, according to The following § parity basis was evaluated. 〇Δ ◎. At the end, the position where the plating layer was not formed was not confirmed (1), and the position where the electric ore layer was not formed was found, and there was one position. It was confirmed that there was no position where the electric ore layer was formed, and there were two positions. X: It is confirmed that there is no position where the electric display is not formed, and there are three places (the key is peeled off) ^ ίο solution, the circuit trench (width 2_, length mm) in the insulating substrate is formed into the electric ore layer, and the electric ore is filled. Before using the microscope (KH-7700 made by Hirox Co., Ltd. to steal the gentry, according to the following servants, the whole layer of the Wei layer of the cake secrets was approved. Then, the root ◎. Yuan Wang / confirmed the electric ore layer The position where the peeling was removed (〇〇: The position at which the plating layer was peeled off was confirmed. There was one position. Λ I confirmed the position where the plating layer was peeled off, and there were two positions. X: The position where the plating layer was peeled off was confirmed, and there were three evaluations. The results are shown in Table i. Set on top. [Table 1] Fill in the average particle diameter of the filler/depth of the circuit trench (%) -----—average particle diameter (//m) content (quality) %) The shape of the circuit trench is plated without adhesion plating. 1 Example 1 1 0.5 30 ◎ ◎ 182 201146113

Example 2 Ϊ50 ©) 1 ◎ ◎ Example 3 Example 4 1.5 30 7.50 ◎ ◎ (〇) 50 7.50 ◎ ©) (r^\ lean example 5 1.7 75 8.50 ◎ (Q) Example 6 Example 7 0.05 30 0.25 Δ A Δ 50 0.25 Δ 〇 Comparative Example XXUX; that is, in the case of an insulating substrate of two-rolled cerium particles (Examples 2-1 to 7) 'When using an insulating substrate not containing a filler' When the circuit was formed, it was more able to stop the resin elution problem in the circuit. Further, in Examples 2-1 to 7, it was possible to prevent the problem of plating adhesion or plating peeling more than Comparative Example 2-1. Therefore, according to the embodiment 2 - 丨 to 7, a circuit board having high adhesion between the electric circuit and the insulating base material can be obtained. (Third embodiment) (A) Circuit board preparation step: preparation for hardening The copper foil of the money copper stacking board ("R1515T" manufactured by Matsushita Electric Works Co., Ltd.) is removed by etching to form a circuit board (thickness: 500 μm) of a predetermined electric circuit. (Β) 苐1 insulating layer forming step: on the circuit board Stacking the first insulating layer formed of the epoxy resin sheet on the circuit forming surface That is, it is composed of a bisphenol-based epoxy resin ("850S" manufactured by DIC Co., Ltd.) and a curing agent, dicyandiamide (rDICY, manufactured by Japan Carbide Industries Co., Ltd.) Ethyl-4-methyl-Dynamics, "2E4MZ"), smelting sulphur dioxide as an inorganic filler ("FB1SDX" manufactured by Electric Chemical Industry Co., Ltd.), and decane coupling agent (Momentive perf_ance Materials Japan) A sheet f (thickness: 60 μm) composed of a resin composition of "A_187" manufactured by the limited liability company, butanone (oxime) as a solvent, and a resin composition of ruthenium-dimethylformamide (DMF) is placed thereon. On the circuit formation surface of the circuit board, a PET film ("TN100" manufactured by Toyobo Co., Ltd.) was placed on the outer surface of the sheet composed of the resin composition, and the stack was placed on the surface. 4pa, i〇 (r heat-molded for 7 minutes under rc to bond it, and then heat-hardened at 175 ° C for 90 minutes to cure the sheet. Thereafter, the PET film was peeled off to make Stacking the first insulating layer on the circuit substrate 183 201146113 (C) Opening forming step: Laser processing is performed on the first insulating layer from the outer surface to form an opening having a diameter of 50 μm on the first circuit to expose the second circuit. Laser light irradiation device (ESI public = "MODEL5330") equipped with UV-YAG laser. "(D) Metal column forming step. After forming the opening, the substrate is immersed in the sulfuric acid-based etching solution for 5 minutes. The acid cleaning treatment is performed on the surface of the second electricity exposed by the substrate forming the opening. Then, after rinsing with water,

The formation of a gold vein on the pores is formed. The electroless copper J mine 2 ("sp_2" manufactured by Uemura Kogyo Co., Ltd.) which has been immersed in the substrate is subjected to 7 to 8 hours to make the first electric circuit portion at the bottom of the opening. Precipitate, grow and form a metal column. X (E) a second insulating layer forming step and a film forming step: subsequently, and the ith insulating layer forming step _, stacking on the outer surface of the first insulating layer and the top of the metal and pillar ' The second insulating layer (thickness: 1 〇 μιη) having the same first insulating layer. Next, a butyl ketone (ΜΕΚ) suspension of styrene-butadiene copolymer (SBR) was applied to the outer surface of the second insulating layer by a spin coating method [manufactured by Zee Co., Ltd., Japan) 2 〇〇 nm, the solid form component is 15%], and dried under a thief for 3 minutes to form a resin film having a thickness of 2 μm. (F) Electrode formation step: Next, for the stacked body in which the lion is formed, = a fine groove having a width of 2 () μηη and a depth of 15 Å is formed as a circuit pattern by laser processing at a predetermined position. In addition, the laser processing is carried out using MODEL5330 manufactured by uv-YAG ESI. (G) Catalyst coating step: Next, the laser-processed stack was immersed in a cleaning conditioner (C/N332G) towel, and then washed with water. Then, in order to prevent the decomposition of the adhered ditin, the PD4〇4 [made by Shipley_Fareast Co., Ltd.] was used to advance the prepreg step. Then, it was immersed in a catalyst liquid [CAT44, manufactured by Shipley Fareast Co., Ltd.], and palladium which became an electroless copper plating core was adsorbed onto the stacked body on which the resin film was formed in a state of a tin-gel. (Hy film removal step: Next, the stack in which the tin-palladium gel is adsorbed is subjected to ultrasonic treatment in a 5% sodium hydroxide aqueous solution and impregnated for 1 minute to swell the surface SBR film, and The resin film is peeled off. Then, on the surface of the stacked body 184 201146113: Some of the work is done to emit light. Indeed; solution S=i: 2^, the purchase of oil "physical body ====== The metal wiring formed by the non-transfer electric power. Γ^又, ^外: The swelling degree of the resin film is measured according to the following method. That is, the demoulding of the stripping cloth is used for the Weiyuan New Zealand. Thickness formed on the liquid plate ίϊίίί^ΐί^

1X1 in the age. Then, 'weak the sample taken at 20±2〇C ^ ' to measure the weight of the swelled sample after centrifugation, and use it as the pre-swelling weight m after swelling and re-squeezing the two f, and the weight after swelling. m, the degree of swelling is calculated from the formula of "swelling ϋ ϋ = 隹ί - mVm, Xl 〇〇 (%)". In addition, it has to be done. At this time, (fourth embodiment) (Α) circuit board preparation step: preparing a hardened thin pile # board (Panasonic Electrician's ship heteronuclear alkali established electric (9) insulating layer forming step: on the circuit forming surface of the circuit board An insulating layer formed of an epoxy resin mooncake sheet is stacked thereon, that is, a dicyandiamide (Japan) containing (a) A-type epoxy resin 185 201146113 ("850S" manufactured by DIC Corporation) as a hardener "DICY" manufactured by Carbide Industries Co., Ltd.), 2-ethyl-4-methylimidazole (2E4MZ manufactured by Shikoku Chemicals Co., Ltd.) as a hardening accelerator, and molten oxidized hair as an inorganic filler ( "FB1SDX" manufactured by Denki Chemical Industry Co., Ltd., and decane coupling agent (Momentive Performanee)

Sheet consisting of "a-187" manufactured by Materials Japan Co., Ltd.), Ding Gang (MEK) as a solvent, and a resin composition of N,N-didecylguanamine (DMF) (thickness: 60 μηι) After being placed on the circuit formation surface of the circuit board, a ruthenium film (face ()" manufactured by Toyo Co., Ltd.) is placed on the outer surface of the sheet composed of the resin composition, and the stack is placed. The sheet was cured by heat-hardening at 175 t: for 9 minutes under pressure heating at a minute and minute pressure. Thereafter, the PET film was peeled off to obtain a stacked body in which an insulating layer was stacked on the circuit substrate. (C) Opening and Opening Step: The insulating layer is subjected to laser processing from the outer surface to form an opening having a diameter of 50 μm on the first circuit to expose the second circuit. Laser processing was carried out using a laser light irradiation apparatus (ESI GM "MODEL5330") equipped with a UV-YAG laser. Ff&gt;) Metal pillar forming step: after forming the opening, the substrate is immersed in %. The sulfuric acid-based liquid was subjected to an acidic cleaning treatment for the first electric foot exposed by the opening of the substrate after 5 minutes. Then, after rinsing with water, in order to form a metal pillar on the substrate, the substrate is immersed in 7 () &lt; t of electroless copper electric age 艮 艮 "sp-2") 7~8 In hours, make electricity 1 open. The electric circuit part of the 丨 is deposited and grown to form a metal column. The cloth recording sequence H rotates on the outer surface of the Wei edge layer 8

Zewurvxi t-butanol copolymer (SBR) butanone (ΜΕΚ) suspension [日 ^ (4) ^ 'particle diameter 2GGnm, solid form composition 15%], at 8 ° ° C1 Ά 30" bell Lai' (10) Thickness - the resin film. The road pattern forming step is employed. Next, a width of 2 squeaks and a depth of 15 divisions are formed on the stacked body in which the resin film has been formed. In addition, the laser is equipped with a MODEL5330 manufactured by ESI Corporation, UV-YAG Laser &amp; 186 201146113. (G) Catalyst and other steps: Next, the laser-processed stack is immersed in a main cleaning agent (C/N3320), followed by washing with water. Then, in order to prevent the decomposition of a stick of tin attached to the 'pre-dip step using PD404 [ShiPley-Fareast Co., Ltd.]. Then, it is immersed in the catalyst liquid [CAT44, Shipley_Fareast (the squad 7 ^ butterfly - _ _ adsorption to formation (^ film removal step: then, will adsorb the tin-transformed stack, 虱 emulsified aqueous solution) Ultrasonic treatment and impregnation for 1 minute, the surface UV film f ? ' and the resin film peeled off. Then 'the surface of the stack is confirmed to have a part of the glory. Confirm ί

Shipleyi!^ Copper plating film. Narrow, and - the straw is precipitated; the electroless groove of the 111 is buried. ..., order... electrolytic copper electro-mine treatment (filling the electric clock) until the circuit stack is observed (4) by electroless plating, the stack is formed by the non-"high-precision square paper coated on the insulating base ^ Method of measurement. That is, the film having the same thickness, i.e., the film formed of the thick f on the epoxy resin substrate, was used as a sample in the case of the suspension suspended by the resin film. #后$ : 越越. New, strong contact with the formation of the sample weight as a swelling material weighing (10)% or so. At this time, I entered the _ 〇 ^ ^ ^ ^. Weaving, _ heart separator, etc. are removed. Then, after measuring the centrifugation, the weight of the swelling sample after the water knife attached to the sample is taken as the weight after swelling, 187 201146113, based on the obtained weight before swelling m, and the amount after swelling, m = SW = (m —m,)/m,xl〇〇 (% “m, from “expanding his condition to use jjS u〇15 827 (in addition to ^. In addition, the degree of swelling obtained is about 750%. The method). (Fifth Embodiment) (Embodiment 5-1) First, an insulating substrate is formed on a support substrate. The material of the insulating substrate K1 is used in the sentence "餹(4)S") As a hard second ================================================================ Sit (4E4j "^ base -4, ball-shaped smelting and oxidizing of the filler, electric chemistry, two saga x", flat η7 (four), Wei huahehua limited liability = system "A-187"), a resin composition of methyl ethyl ketone (MEK) as a solvent, and N'N-di-f-decylamine (tetra). In the circuit formation surface of the sheet-like insulating base material κ plate composed of the resin composition, the ρετ film (the ΤΝ100 manufactured by Toyobo Co., Ltd.) is placed in the tree-shaped area. The stack is at 〇4Pa, i(8). After c is added for ι minutes, it is heat-molded to be bonded, and then hardened by heat hardening at 175 t for 9 minutes to cure the edge substrate K1. Thereafter, the PET film was peeled off to prepare an insulating New K1 stack on the support substrate. The insulating substrate K1 after the job is replaced by 75 wt% of the substrate. In addition, the surface and the cross section of the insulating base material K1 were observed with an optical microscope, and it was confirmed that the filler K11 was not exposed, and the surface resin layer K12 was formed. Then, a resin film Κ 2 of a styrene-butadiene copolymer (SBR) having a thickness of 2 μm was formed on the surface of the insulating substrate Κ1. Further, the resin coating film 2 is formed by coating a butanone (MEK) suspension of a styrene-butadiene copolymer (SBR) on the main surface of the epoxy resin substrate [Japan Zeon Corporation] The system has an acid equivalent of 600, a particle diameter of 200 nm, and a solid form component of 15%], and is dried at 8 (TC) for 30 minutes. The insulating substrate κι having a resin film K2 is used. In addition, laser processing uses Hi i DEU33() with W-YAG laser. Observed by laser microscopy after laser processing, 树=, tree channel groove K3 ship edge substrate K1 Silk is cleaned and tempered / 7H&lt;1: RotoandHaas Electronic Materials Co., Ltd. &lt;1 沾1Γ 'after 'cleaning' with water. Then, soft etching is performed with a soft silver sulphuric acid-based pH soft stencil. After that, the prepreg step is carried out by using the company (PH), PH &lt;1]. Then, the acidic Pd-% colloidal solution 2 (stock) of the PH1 is immersed in the flame, and the precursor of the unelectrolyzed copper core is made. K5 is cut on the surface of the insulating lion and the resin is covered, = I - 八q ί ΐ 'impregnation fpH &lt;1 Catalyst solution [ACC 19E, ShiPley-Fareast (share) A ° to produce the core. The core is made into the electro-mineral core of electroless ore. Detach ί, ί, place the insulating substrate K1 at 5% of pH 14. Ultra-wave treatment in an aqueous solution of sodium hydroxide and impregnation for 10 minutes. Thereby, the resin film on the surface is smashed into a lion. The scales, the edge of the substrate, the magic material, the resin coating K2 Then, Weiyuan substrate, _, CM328C, electroless copper key treatment. (7) A call using electroless copper plating treatment, precipitation of thickness of 3~5μιη helmet to observe the electroless enamel plating of insulating materials K1 On the surface, the film K6 is formed correctly on the y_ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Apply a ____ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The sample scale obtained is about G.G2g. The weight of the sample at this time Run then weigh i _. Then 'dip the sample taken in 20 ° 2 of hydrogen 2 〇 ml for 15 minutes. In addition, other samples are also impregnated; 孤 孤 acid 5 〇 / ° aqueous solution (pH1) 15 minutes in 10 ml. Then use a centrifugal separator to carry out centrifugation at 1 〇〇〇G for about 1 〇 minutes. The moisture attached to the LjK material is measured. n Measure the swelled sample after the separation ^ weight ' ί After swelling, it weighs 4 m (8). From the obtained swelling before weight 4 m (b) and after the month / j weight J m (8), according to "swelling degree sw = [m (a) _ m (b)] / m (b) x] (% The formula of ") is used to calculate the degree of swelling. In addition, other conditions are measured by the measurement method of nS]L1〇158.2 sexuality. At this time, the degree of swelling of the 5% aqueous solution of sodium hydroxide to pH 14 was 75 %. On the other hand, the degree of swelling of the aqueous solution of hydrochloric acid in a pH of 3% was 3%. According to the above steps, the circuit board κιο shown in Fig. 28 can be obtained. (Example 5.2) A styrene-butadiene copolymer (SBR) was used in addition to a carboxyl group-containing polymer [manufactured by Zee Co., Ltd., an acid equivalent of 500, a weight average molecular weight of 25,000, and a solid form component of 2% by weight]. The 酉 酉 _ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ κ At this time, the degree of swelling of the sodium hydroxide aqueous solution of ρΗ14 was 1% by mass. On the other hand, the degree of swelling of a 5% aqueous solution of hydrochloric acid at pH 1 was 3 % by weight. Thereby, the circuit board κίο shown in FIG. 28 can be obtained. According to the manufacturing method of the above embodiment, by peeling off the swellable resin film, the catalyst can be plated on the surface of the substrate on which the circuit is to be formed. Thereby, the electroless plating film can be accurately formed on the portion covered with the plating catalyst. Further, since the swellable resin film is easily peeled off by the swelling action, the film removing step is relatively easy to perform accurately. 190 201146113 (苐6 embodiment) ^1〇〇μΠ1 66), on one side of the first insulating layer L6, by the method of forming a thickness of 2 (), the width of 5 ϋ salt as a Α type _ _Bus Co., Ltd., "=) °, f amine (gamma of Japan Carbide Industries Co., Ltd. i), 2_ethyl-4-electric system as a hardening accelerator: "2 jobs") Spheres as inorganic fillers = = (5) "FB1SDx" manufactured by Chemicals Co., Ltd., average - Γ! (M〇mentive Prance Materials Japan * = A~187 made by A), methyl ethyl ketone as a solvent Sheets of thickness ιο〇μιη composed of (MEK) and N,N-diΙί composition

^: Haidi-,,, the color edge layer L6 is provided on the surface of the first electrical circuit L7, and then the outer surface of the sheet composed of the resin composition is loaded with ErTm〇〇j } , 〇.4Pa ΙΟ ί , ^ 1 minute of compression plus face-length reading, hiding 175. (: Next (4) After 9 G minutes of heat hardening 2, the PET film is peeled off to stack the second insulating layer u., and the thickness of the styrene-butadiene copolymer (SBR) is formed on the surface of the βHil-insulating layer L1. 2 μm of the resin film L8. Further, the resin film L8 is formed on the main surface of the epoxy resin substrate, and the styrene-butadiene copolymer (SBR) is coated with methyl ethyl ketone (MEK Hongfu liquid) [Nippon ZeN Co., Ltd., acid equivalent _, particle diameter: 200 nm 'solid form component 15%], formed by drying at 8 (rc for 3 minutes), μ ^ then, with resin coating In the second insulating layer L1 of L8, a circuit groove L4 having a substantially rectangular cross section having a width of 20 μm and a depth of 3 μm is formed by laser processing, and a MODEL 5330 manufactured by ESI Corporation equipped with a UV-YAG laser is used for the laser processing. The surface roughness Ra of the inner surface of the formed circuit trench L4 is 〇·2 μηη. Next, the outer surface of the second insulating layer L1 in which the trench is formed is immersed in the cleaning conditioner [surfactant solution pH>l: C/N3320 manufactured by Rohm and Haas Electronic Materials Co., Ltd. Then, it was washed with water. Then, it was subjected to a soft etching treatment with a soft etchant of ρΗ&lt;1 of sodium persulfate 191 201146113. Then, pD4〇4 (pH1 &lt;1 manufactured by Shipley-Fareast Co., Ltd.) was used. The prepreg step was carried out, and then impregnated into an acidic Pd-Sn colloidal solution (manufactured by CAT44 'Shipley-Fareast Co., Ltd.) containing PH1 of vaporized stannous and palladium chloride to form an electroless copper plating core. The palladium is adsorbed on the inner surface of the circuit trench L4 and the surface of the resin film L8 in a tin-palladium gel state. Then, the catalyst solution (ACC19E, manufactured by Shipley-Fareast Co., Ltd.) is impregnated with PH &lt;1 ) to produce a palladium core. Next, 'the outer surface of the second insulating layer L1 is placed in a 5% aqueous solution of sodium hydroxide to be ultrasonically treated and impregnated for 10 minutes. Thereby, the resin film L8 on the surface is made. In the case of swelling, it is completely peeled off. At this time, fragments of the resin coating film L8 are left on the surface of the second insulating layer u. Next, the first insulating layer L1 is immersed in the electroless electric clock liquid (Qy [328A, CM328L, CM328C, manufactured by Shipley-Fareast Co., Ltd.) In the electroless copper plating treatment, an electroless copper plating film having a thickness of 3 to 5 μm is deposited by electroless copper plating treatment, and the first insulating layer L1 'passed by electroless copper plating is observed by SEM (scanning microscope) It was found that the electroless plated film L10 was correctly formed on the inner surface of the circuit trench L4. Next, the bottom of the circuit trench L4 was subjected to laser processing to form a bottom from the circuit trench L4~ to the first electrical circuit L7. The surface has a diameter of 5 〇 μηι through hole L5. Then, desmear treatment was carried out using a desmear solution (Swelling Dip Securiganth®, manufactured by Concentrate Compact CPAtotech Co., Ltd.) under the conditions of swelling at 80 ° C, 5 minutes, and a meal of 80 ° C and 1 minute. The surface roughness of the inner surface of the through hole L5 after the glue removal/inspection treatment was i.4 pm. Next, the second insulating layer L1 was immersed in an electroless liquid crystal liquid (CM328A, CM328L, CM328C, manufactured by Shipley-Fareast Co., Ltd.) to perform electroless copper plating treatment. The electroless copper plating treatment is performed to deposit a plating layer in the via hole L5 and in the circuit trench L4 to form a via [3 and a second electric circuit L2. The transmission loss of the second electric circuit L2 of the obtained circuit board was measured by a network divider (Azient Co., Ltd. 8753E). Further, in the circuit board obtained by roughening the inner surface of the circuit trench L4 by the stripping/checking process in the first embodiment, the transmission loss of the second electrical circuit L2 of 192 201146113 is also measured. As a result, it was confirmed that the transmission loss was lower than that of the circuit board in which the circuit 1 formed on the second insulating layer L1 was roughened by the S-test in the first embodiment. (Example 7) (Example 7-1) An epoxy resin substrate [R1766K® insulating substrate M1 manufactured by Matsushita Electric Industrial Co., Ltd.) having a thickness of ΙΟΟμηη was used. Then, the surface of the insulating base material M1 is subjected to laser processing to form a groove M2 having a substantially rectangular cross section having a width of 20 μm and a depth of 30 μm (refer to Fig. 44 (a)]. In addition, the laser processing uses MODEL5330 with uv-yag laser &amp; Then, 'the insulating substrate mi to be formed with the groove M2 is in the cleaning agent [interface/tongue solution 'pH&lt;l: R〇hm and Haas Electronic Materials Co., Ltd. C/N332p] The mixture was immersed for 5 minutes at 38 ° C for cleaning and conditioning treatment, and then washed with hot water for 2 minutes. Next, the pre-dip step was carried out at 38 ° C for 1 minute using PD 404 Taoey-Fareast (s) = ' ρ Η &lt;1] ', and washed with water = 1. Then, the acidic pd-% colloidal liquid [CAT44, manufactured by Shipley-Fareast Co., Ltd.] containing vaporized stannous and vaporized palladium was immersed in a crucible condition for catalyzed treatment. 'The gel which is made into an electroless copper bond nucleus in the form of a tin-! gel is adsorbed on the insulating substrate M1 and washed with water. Next, in a catalytic solution of ρΗ&lt;丨[ACCIQE 'Shipley-Fareast Co., Ltd.], a 38 〇c conditional impregnation/knife clock was used for catalytic treatment to produce a palladium core as a plating catalyst M5 [refer to the figure). 44(B)]. After that, the insulating substrate M1 to which the plating catalyst M5 is attached is subjected to electroless plating treatment in the helmet electrolysis copper liquid [CM328A, CM328L, CM328C, ShiPley_Fareast Co., Ltd.] Electroless copper plating film M6 with Ιμιη [refer to Fig. 44 (C)]. Next, at 6 〇. (:, 'two times over 15 minutes of drying, and heated at 18 〇 for 6 minutes, and Next, the insulating substrate (4) thief having the electroless copper plating film M6 formed thereon is washed for 5 minutes, and washed with a thief for 1 minute, followed by sulfuric acid etching. The treatment liquid, in the bell's slight anger, cleaned with water. Silk at 0^ 193 201146113 treatment 'and washed with water.

After that, in electroless plating solution [CM328A, CM328L, QVBMC

In the Shipley-Fareast company, 7 is used. The conditions of bismuth are immersed for 3 minutes without electroless copper plating treatment. The electroless sputum M8 with a film thickness of 35 μm is deposited, and the inside of M2 is completely filled by the electroless ore layer M8 [Fig. 4 Dry. Next, the surface of the insulating new M1 is polished by the CMP method, except for the electroless copper plating film M6 filled in the groove sample and the electroless copper plating layer exposed on the surface of the electroless copper plating layer M8. 6 and ., the copper ore layer M8 is removed [Fig. 44 (E)]. If so, the circuit board M4 can be formed by forming the circuit M4 from the electroless copper plating film M6 of the trench M2 and the electrodeless M3 of the electroless copper electric M8. (4) The metal conductor M3 of the cup-shaped conductor forming circuit M4 is as described above, and the SIMI of the conductor M3 is found as shown in FIG. 46, and the crystal grain block is flattened and then according to FIG. The length of the average diameter of the SIM is 4 μη. The d (9) and the aaa pellets are thousands (Comparative Example 7-1), which is the same as in the first embodiment, on the surface of the insulating substrate M1 [see Fig. 48(A)], and The plating catalyst M5 is formed on the surface of the phase M2 material M1 of the embodiment i. [Refer to the figure: the same conditions as in the case of Example 1, the insulating substrate M1_face is formed by the C electric copper film. Μ6 [Refer to Fig. 48(C)]. Unloading the non-electrolytic ΪΐΪ ΪΐΪ η r , ,, material, 1 formed an electroless copper plating film Μ6, and then using acid 4GC, 1 reading force for 1 minute Washed in water. Then in the hot water of 25〇Γττ, #—! 进, C is washed into the 仃1 for the pickling treatment, and after water, the electroless copper plating is called and the electrolysis copper is on the village I industry. Co., Ltd. "Evp straight = 9G minutes under conditions, electrolyzed copper" was plated at 25C, and the film thickness was 35μπι. 194 201146113 = groove. The inside of M2 is completely filled with the electrolytic copper electric ore layer M7 [Fig. 2] The second connector is dried at 60 C for 15 minutes. The surface of the insulating substrate mi is ground, except for the electroless copper in the trench M2. Electric film _ and electrolytic copper money layer m7, _

The electroless copper battery exposed on the surface of the μ trU and the electrolytic copper = M7 are removed [Fig. 48(E)]. In this way, the gold constituting by the groove M ====the copper side Μ7 is used, and the granules are large and uneven. Then, according to the SIM image of Fig. 47, the method of the present invention: The measured crystal granules have an average diameter length of 12 μm. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1(a) to (ε) are schematic cross-sectional views for explaining respective steps of an electric method of a second embodiment. Figs. 2(A) to 2(B) are explanatory views showing the state of the insulating substrate after the step of forming the circuit trench and the step of the plating process in the first embodiment. Fig. 3 is an explanatory view for explaining an inspection procedure for inspecting a film to remove fatigue by using a fluorescent material to emit a fluorescent substance. 4(A) to (E) are cross-sectional views for explaining the steps of manufacturing the three-dimensional embodiment of the first embodiment. Fig. 5 (A) to (E) are schematic cross-sectional views for explaining respective steps of forming gold by a conventional full addition method. Figure 6 is a schematic cross-sectional view showing the circuit shape formed by the conventional full additive method. However, FIG. 7(A) to (Ε) are schematic cross-sectional views for explaining the steps of manufacturing the circuit substrate of the second embodiment. Figs. 8(A) to 8(B) are explanatory views showing the state of the insulating substrate Α1 in the step of forming the circuit trench and the step of forming the plating process in the second embodiment. — 195 201146113 FIGS. 9(A) to 9(B) are explanatory views showing a state of the insulating base material A21 when an insulating base material A21 not containing a filler is used. 10(A) to (E) are schematic cross-sectional views for explaining respective steps of manufacturing the three-dimensional circuit A of the second embodiment. Soil Fig. 11 (A) to (E) are schematic cross-sectional views for explaining the steps of forming a metal wiring by a conventional full additive method. &lt;&gt; Fig. 12 is a schematic cross-sectional view for explaining a circuit shape formed by a conventional full additive method. Fig. 13 is a partial plan view showing the structure of an electric circuit and the arrangement of interlayer connection holes of the multilayer circuit board according to the embodiment of the present invention. 14 is an end view taken along the line I-I of FIG. π, showing a circuit board preparation step of the manufacturing method of the multilayer circuit substrate of the third embodiment, and (B) a step of forming the edge layer. (C) opening forming step, (D) metal pillar forming step, (£;) second insulating layer forming step and film forming step, (F) circuit pattern forming step, (G) catalyst coating step, ( H) a film removal step and (I) a plating step. 15 is an end view taken along line I-I of FIG. 13 and shows a (A) circuit board preparation step and (B) an i-th edge layer forming step of the method for manufacturing a multilayer circuit substrate according to the third embodiment. (c) opening forming step, (D) metal pillar forming step, 第) second insulating layer forming step and skin forming step, (F) circuit pattern forming step, (G) catalyst coating step, (H) Film removal step and 1 plating step. 16 is an end view taken along line I-I of FIG. 13 and shows a (A) circuit board preparation step, and (B) a second layer formation step of the method for manufacturing a multilayer circuit substrate according to the third embodiment. (C) a sail forming step, (D) a metal pillar forming step, (6) a second insulating layer forming step and a skin forming step, (7) a circuit riding forming step, (G) a catalyst coating step, (H) a film removing step, and (I) Steps for money. Fig. 17 (A) to (E) are diagrams showing a circuit for forming a circuit board by a fine addition method. 18(A) to 18(G) are diagrams for explaining a problem in the case of applying the additive method when manufacturing a multilayer circuit board by the build-up method. Fig. 19 is a partial plan view showing the structure of the electric circuit 196 201146113 and the arrangement of the interlayer connection holes, etc., of the multilayer circuit board of the present invention. Fig. 20 is a (A) circuit board preparation step, and (B) insulation forming step of the method for manufacturing a multilayer electric circuit substrate according to the [1] line end view of Fig. 19, showing the fourth embodiment. (C) opening forming step, (D) metal pillar forming step, (£) film forming step, (F) circuit pattern forming step, (G) catalyst coating step, (8) film removing step, and 1 plating step. FIG. 21 is an end view taken along line 1-1 of FIG. 19, showing (A) a circuit board preparation step, (B) an insulating layer forming step, and a manufacturing method of the multilayer circuit substrate of the fourth embodiment. (C) opening forming step, (D) metal pillar forming step, (6) film forming step, (F) circuit pattern forming step, (G) catalyst coating step, (η) film removing step, and (I) plating step Fig. 22 is an end view taken along line I-I of Fig. 19, showing (A) circuit board preparation step, (b) insulating layer forming step, and (b) manufacturing method of the multilayer circuit substrate of the fourth embodiment. (C) opening formation step, (D) metal pillar formation step, (6) film formation step, (F) circuit pattern formation step, (G) catalyst separation step, (H) film removal step, and (I) plating step 23(A) to (E) are diagrams for explaining a circuit for forming a circuit board by an additive method. Figs. 24(A) to (G) are diagrams for explaining the case of manufacturing a multilayer circuit board by a build-up method. Fig. 25 is an end view taken along the line I-I of Fig. 19, showing the fourth embodiment. (A) circuit board preparation step, (B) insulating layer forming step, (C) opening forming step, (D) metal pillar forming step, (E) film forming step, (F) Circuit pattern forming step, (G) catalyst slope step, (H) film removal step, and (I) plating step. Fig. 26 is surrounded by the symbol X of Fig. 25 for explaining the features of the fourth to fourth embodiments. Figure 27 is a (C) open-cell forming step, (E) film forming step, and (G) catalyst-coated step of Figure 20 for explaining the fourth embodiment in more detail. Fig. 28 is a cross-sectional view showing a section 197 201146113 of an embodiment of the circuit board of the present invention. Fig. 29 (A) to (E) are diagrams for explaining the circuit-based steps of the present day and month. Fig. 31 (A) and (9) are explanatory diagrams for explaining the inspection procedure for inspecting the removal of the coating film by using the luminescence property of the resin coating film. It is shown that the thickness of the resin film is formed in the circuit to form a circuit pattern portion (circuit trench Fig. 2 is a schematic cross-sectional view showing an embodiment of the circuit board of the present invention. Α) indicates the state of the system, (8), (the state of the stencil display. Fig. j is a cross-sectional view of the circuit substrate of one embodiment of the present invention. 36 (A) or even (E The step of the first manufacturing method of the same circuit board as the step of the first manufacturing method of the same circuit board is shown in Fig. 36. (4) or (E) shows the step of the second manufacturing method of the same circuit board. It is a step profile ^ shown by Na 38 of the second manufacturing method. 40(A) or even (〇) indicates that the step of the third manufacturing method of the same circuit board is the same as that of the step of the third manufacturing method shown in Fig. 40, which is represented by =&amp;(4) or (F) One implementation of the manufacturing steps of a conventional circuit substrate 198 201146113 FIG. 43 is a cross-sectional view showing an embodiment of a conventional circuit substrate. Fig. 44 is a schematic cross-sectional view showing the steps of the manufacturing process of the embodiment of the present invention, and (A) to (e). Fig. 45 is a view showing another embodiment of the embodiment of the present invention, and (A) to (6) are schematic cross-sectional views showing respective steps of the manufacturing process. Fig. 46 is a photograph of a SIM image of a conductor metal of Example ,, (8) a SIM image of 1 倍, and (B) a SIM photo of 3000 times. Fig. 47 is a photograph of a SIM image of the conductor metal of Comparative Example 1, which is a SIM photograph of 1〇〇(10) times, and (B) is a SIM photograph of 3000 times. Fig. 48 is a schematic cross-sectional view showing a manufacturing process of the conventional example, and (A) and (b). [Main component symbol description] A, X symbol

Al, A21, A100, a, D Bu D2 Bu D100, Kl, Ml Insulation substrate A2, A22, D2, D22, K2, L8 Resin coated soil A3, A23, D3, D23, L4, K3 Circuit trench A4 , D4, K4 through hole A5 catalyst metal A6 plating layer (electrical circuit) A10, A60, D10, D60, F10, G10, K10, g, X circuit substrate An, Dn, Kii filler A5 Bu D51 three-dimensional insulating substrate A101 , D101 through hole A102, D102, F26, G25, M5, e, η bond Α103, D103 photoresist layer 、104, D104, F25, G24, k circuit pattern A105, D105 metal wiring A106, D106 plating part A110, D110 Photomask 199 201146113 A23a Part A7, A25 without plating layer Plating layer A25a Plating layer peeling portion D depth D2a ' K2a Residual D5 plating catalyst or its precursor D6 electroless plating film (electrical circuit) D8 electric circuit F1 , G1 multilayer circuit substrate

F11, h first electric circuit F20 first insulating layer F2 m inter-layer connection hole F22, G22, q metal post F23 second insulating layer F24, G23, b, j resin film F27 second electric circuit F27a, G26a wiring F27b G26b electrode pad portion F30 insulating layer (whole insulating layer) G11 first electric circuit G20, i insulating layer G20a, part of the insulating layer not removed G21 interlayer connection hole G26 second electric circuit K5 electroplating catalyst or its precursor Electrolytic plating film K6, K6a to K6h, L10, M6, f K8 Circuit wiring Κ 12 surface resin layer Κ 13 circuit layer Κ 21 electrolytic plating film 200 201146113 K22 grinder K51 three-dimensional insulating substrate K60 three-dimensional circuit substrate L1 insulating layer (second insulating layer L2 electrical circuit (second electrical circuit) L3 via L5 via L6 first insulating layer L7 first electrical circuit L9 plating catalyst or its precursor L11 slag M2 circuit forming trench M3 metal conductor M4 circuit M7 electrolysis Electroplated layer M8 electroless plating layer T thickness (or height) W width 1-1, 彳-彳' section line c groove d through hole dl, d2 distance p second circuit 201

Claims (1)

201146113 VII. Patent application scope: A circuit substrate comprising: an insulating substrate formed with a resin film on a surface thereof, and a concave portion having a depth exceeding a thickness of the resin film is formed on the basis of an outer surface of the resin film Thereby forming a circuit trench having a desired shape and depth, and coating a plating catalyst or a precursor thereof on the surface of the circuit trench and the surface of the resin film, and then peeling the resin film And an electroless magnetic film, which is electrolessly plated to the insulating substrate, thereby forming on the trench of the sinus circuit; the thickness of the electroless plating film is relative to the trench of the circuit The depth is below 〇5. 2. The circuit substrate of claim 1, wherein the thickness of the electroless plated film is greater than or equal to the depth of the circuit trench. 3. The circuit substrate according to the scope of the patent application, wherein the thickness of the electroless ore film is 〇.1~ΙΟμη. 4. The circuit substrate of any one of the above-mentioned patents, wherein the depth of the trench of the 3H circuit is 1 to 5 μm. A method of manufacturing a circuit board, comprising: a film forming step of forming a resin film on a surface of the insulating substrate; and a circuit trench forming step of reducing the surface of the resin by the outer surface of the resin Take the 趿 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , For example, in the method of manufacturing the circuit board of the fifth aspect of the patent application, 'the thickness of the groove in the groove of the 2011 201146113 is relative to the electricity 7, and the substrate (4) of the fifth item is ΐ,夜体: 'The second system is a method of manufacturing the f-substrate of the insulating film after the partial coating of the resin film after the resin film is swollen with a predetermined liquid, after the partial coating of the insulating film Li 8 The fineness of the liquid film on the liquid is 5% by weight or more. The method for manufacturing a circuit board according to the seventh aspect of the invention, wherein the predetermined liquid in the step of removing the coating is carried out in the step of disposing the catalyst in the metal catalyst solution of the catalyst An experimental solution, the resin is coated with the acid catalyst metal gel to test the test _ 彡 在 in the article to ±. Gua Wo violates 50/. 10. The method of manufacturing a circuit board according to the fifth aspect of the invention, wherein the film removing step is a method of manufacturing a circuit board according to the fifth aspect of the patent of the fourth aspect of the invention, wherein the resin film is dissolved/dissolved by a predetermined liquid. Wherein, the secret film is a resin coating formed by drying a suspension or emulsion of an elastomer on the surface of the insulating substrate and then drying. 12. The method of manufacturing a circuit board according to the fifth aspect of the invention, wherein the resin film is a resin film formed on a support substrate or a resin film formed on a surface of the edge substrate . The method of manufacturing a circuit board according to claim 11, wherein the S-elastomer is a group consisting of a diene-based elastomer having a carboxyl group, an acrylic elastomer, and a polyester-based elastomer. Selected in the middle. 14. The method of producing a circuit board according to claim 13, wherein the diene elastomer is a styrene-butadiene copolymer. The method of producing a circuit board according to the fifth aspect of the invention, wherein the resin film comprises a resin comprising a carboxyl group-containing acrylic resin 203 201146113 having an acid equivalent of from 1 〇〇 to 800. The method for producing a circuit board according to claim 5, wherein the resin coating is at least one of an acid or an acid anhydride having at least one polymerizable unsaturated group in the molecule (8). The monomer and (b) are a polymer resin obtained by polymerizing at least one monomer which is polymerized with the monomer (a) or a resin composition containing the polymer resin. The method for producing a circuit board according to claim 16, wherein the polymer resin has an acid equivalent of from 100 to 800. 8. The method of manufacturing a circuit board according to claim 5, wherein the resin film has a thickness of 10 μm or less. The method of manufacturing a circuit board according to the fifth aspect of the invention, wherein the circuit trench has a portion having a width of 20 μm or less. '20. The method of manufacturing a circuit board according to claim 5, wherein the fi if1 forming step is a step of forming a circuit trench by laser processing. In the method of manufacturing the circuit board of the fifth aspect of the patent, in the basin, the 27-groove forming step is a step of forming a circuit trench by a press method. And a method of manufacturing a circuit board according to the fifth aspect of the invention, wherein the method of manufacturing the circuit substrate of the fifth aspect of the insulating substrate 23 is formed in the step of forming the circuit trench in the upper forming step, wherein In the method of manufacturing the circuit board of the fifth aspect of the present invention, the method of manufacturing the circuit board of the fifth aspect of the present invention is a method for manufacturing a circuit board of the fifth aspect, in which the coating material is exposed and the material is weak. Illumination touch ihi: membrane removal 瑕 Eight, schema: 204