1354532 厂99: Ϊ2Γ21Γ -· 一 I年·月曰修#)正替換頁 —六、發明說明： 【發明所屬之技術領域】 本發明係有關一種陶瓷金屬化散熱板之製造力1354532 Factory 99: Ϊ2Γ21Γ -·一一年·月曰修#)正换页—六、发明说明: Technical Field of the Invention The present invention relates to a ceramic metallized heat sink manufacturing force
It::別是指可製得…好散熱效率之陶究金屬化 散熱板的製造方法。 【先前技術】 由於電子產業的快速發達，電路板上的電路密度 越來越㈤’造成在使用時電路板所積聚的廢熱越來越 不易散除。 高功率LED需求逐漸增加，造成散熱基板所要 承載之熱量大幅提升，使得散熱基板從舊有pCB提 升為MCPCB基板，然而，在更高功率LED的大量 使用下，因為MCPCB基板的介電層與基板熱膨脹係 •數不匹配而導致板爆及斷路，而且其存在不抗高Ac 馨’電壓的問題，近期乃逐漸改採用陶瓷做為散熱材料。 陶究材料 DBC(Direct Bonded Copper)及 DPC (Direct Plated Copper)加工方式起源於1930年，此 -技術因現今LED產業的蓮勃發展而大放異彩，DBC 技術雖具有高導熱與易加工等特性，但厚銅伴著的強 大熱應力在高溫下也會導致產品的穩定度下降。 有鑑於此，發明人乃著手進行研究改良·，經長期 研究、測試，終於開發完成本發明 0 3 1354532 【發明内容】 因此，本發明 製造方法，係經由 成預定的連接孔洞 電鑄填孔製程時， 依本發明之陶 射鑽孔係從基板的 的孔洞為較小孔徑 為本發明之次一目 曰修(朽正替換 二在提供一種陶瓷金屬化散熱板之 田，鑽孔步驟，於陶瓷基板表面形 I曰此’孔洞的孔徑可以控制在經 能一次填實，不需二次填料者。 曼金屬化散熱板之製造方法，其雷 月面進行’如此能使基板表面形成 ’以利一次填實的電鑄填孔製程， 的。 依本發明之陶究金屬化散熱板之製造方法，進一 二,用垂直連續式濺鍍法於基板上沉積導電層銅 (=)’於進彳浅料可避免落塵掉落在基板上，以提 昇1體產出效率，為本發明之次一目的。 至於本發明之詳細構造、應用原理、作用與功 效，則請參照下列依附圖所#之說明即可得到完㈣ 了解。 【實施方式】 本發明之陶瓷金屬化散熱板之製造方法，包含有 以下步驟： 第一步驟為鑽孔步驟102·•使用聚焦的高溫雷 射’對上色後的陶瓷基板以氣化方式鑽孔加工。為了 克服鑽孔為上大下小的圓椎狀，鑽孔加工的位置4系在 基板的背面，以便線路正面得以形成較小孔徑；丁 1354532 「f ιΠΓ———η j年月日修止替换貞 第二步驟為清潔步驟1〇3:利用氣化鐵（H2S〇4、 Η以)或有機溶劑將基板表面可能殘留的金屬與有機 :又除’取後利用超音波水洗將I板上導通孔内的融 清潔乾淨’以確保基板上》有其 的物質存在； —、第三步驟為導電鋼層沉積步驟104 :當陶瓷基板 :成鑽孔且清潔乾淨後，為使陶瓷基板的表面得以進 行電鑄，本發明利用垂直連續式職鍍法，在基板上沉 積導電層銅（Cu)，並且加上一層中介層（TiCu合金、 丁PTiW合金或NiCr合金）於銅與基板之間以增加線 路附著性； 脚使用垂直連續式賤錢法時，垂直式革巴材係位於腔 粗的左右側，於進行讀時，可同時雙面沉積，落塵 =會直接掉落於基板上，以提昇整體產出效率，而利 」衰輪式（r〇llt〇r〇11)，更*較小體積的預抽腔體， =大幅降餘h與破真空的_。其巾，所述滚輪 = (r〇u t。r〇n)係輸送帶的意思。降低破真空及抽真 :的原’在反應腔體前後有加入小腔 2真空㈣與主腔體—樣低時再打開閘門送入主 A月:’等賤度完畢後’打開腔體送入破真空小腔體進 仃出料，所以可以大幅降低抽真空與破真空..的時間。 並且’在腔體的最前段加裝了離子餘進行清潔的 α乍，確保基板在進入濺鍍腔體内時其表面是完全潔 ”的狀態’進而確保誠完成後金屬層於基板的附著 1^54532 性是可靠的 第四步驟為黃光微影成像步驟105 :係在第一層 金屬上覆蓋不同層數的負型乾膜光阻，再依照不同； 求的第二層金屬厚度，選擇適合乾膜光阻的厚度，配 合適當的加熱滾輪溫度、壓力、貼合速度及乾臈張 力，將光阻貼合於第一層金屬上做為電鍍模具，在適 度的溫度及濕度下，配合適當的曝光能量，在第一層 金屬上經由底片將第二層金屬、線路部份遮&，曝光曰， 硬化第二層金屬線路相反位置的乾膜，放置數分鐘 後’再經由顯影去除第二層金屬線路上的乾膜，保留 、線路以外的乾膜’以便填入第二層金屬線路。 第五步驟為電鑄填孔步驟106 :當上完光阻德， 利用電鑛方式在未被光阻覆蓋的種子層上方進行沉 積，以鍍厚銅線路，並且將通孔填滿導通，達到提供 導電線路，又可幫助導熱。實施時，先進行打底電鑛， 確保電鑛穩定再進行填孔電鍵，製程中用硫酸銅及硫 醆等酸性鍍銅體系，硫酸銅為供給金屬離子之用，硫 酸的，用為增加溶液導電性’減低金屬離子濃度，增 加附者能力，促進陽極腐蝕，防止鹽基性銅鹽或亞銅 鹽產生與沉澱所造成粗糙銅鍍層的問題。 第六步驟為剝膜步驟1〇7 ••剝膜製程的作用主要 用來將曝光顯影後所留下的不要之光阻去除，使用強 驗型溶，藥劑，藉水平式去膜線或浸泡式去膜槽進行 去膜〇實$時’ f·先經由強驗性溶液或其他去膜液將 1354532 Γ99Π2~21)------1It:: It doesn't mean that it can be made... a good way to heat up the metallization. [Prior Art] Due to the rapid development of the electronics industry, the circuit density on the board is becoming more and more (5), causing the waste heat accumulated in the board to be more and more difficult to dissipate during use. The demand for high-power LEDs is gradually increasing, which causes the heat to be carried by the heat-dissipating substrate to be greatly increased, so that the heat-dissipating substrate is upgraded from the old pCB to the MCPCB substrate. However, in the large-scale use of higher-power LEDs, the dielectric layer and the substrate of the MCPCB substrate The thermal expansion system does not match the plate explosion and open circuit, and its existence is not resistant to the high Ac s voltage. Recently, ceramics have been gradually used as heat dissipation materials. DBC (Direct Bonded Copper) and DPC (Direct Plated Copper) processing methods originated in 1930. This technology has been splendid due to the development of LED industry in today's LED industry. DBC technology has high thermal conductivity and easy processing. However, the strong thermal stress associated with thick copper can also cause the stability of the product to decrease at high temperatures. In view of this, the inventors have started research and improvement, and have finally developed and completed the present invention through long-term research and testing. 0 3 1354532 [Invention] Therefore, the manufacturing method of the present invention is performed by forming a predetermined connection hole by electroforming a hole filling process. In the case of the ceramic drilled hole according to the present invention, the hole from the substrate is a smaller aperture for the second aspect of the invention (the replacement of the second is in the field of providing a ceramic metallized heat sink, the drilling step, in the ceramic The surface shape of the substrate 曰 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 According to the manufacturing method of the ceramic metallized heat dissipation plate of the present invention, the conductive layer copper (=) is deposited on the substrate by vertical continuous sputtering. The shallow material can prevent falling dust from falling on the substrate to improve the efficiency of one body production, which is the second object of the present invention. As for the detailed structure, application principle, function and effect of the present invention, please refer to The method for manufacturing the ceramic metallized heat dissipation plate of the present invention comprises the following steps: The first step is a drilling step 102·• Using a focused high temperature thunder The 'ceramic substrate after the coloring is drilled by gasification. In order to overcome the rounded shape of the upper and lower holes, the position of the drilling is 4 on the back of the substrate so that the front side of the line can be formed smaller. Aperture; Ding 1354532 "f ιΠΓ - η j year month repair replacement 贞 second step is cleaning step 1 〇 3: using gasified iron (H2S 〇 4, Η) or organic solvent may leave the surface of the substrate Metal and organic: In addition to 'after taking ultrasonic cleaning, the melt in the via hole of the I board is cleaned to ensure the presence of the substance on the substrate". - The third step is the deposition of the conductive steel layer. Step 104: When Ceramic substrate: After drilling and cleaning, in order to enable electroforming of the surface of the ceramic substrate, the present invention uses a vertical continuous plating method to deposit a conductive layer of copper (Cu) on the substrate and add an intervening layer ( TiCu Gold, butyl PTiW alloy or NiCr alloy) between copper and substrate to increase the line adhesion; when the foot uses the vertical continuous money saving method, the vertical leather material is located on the left and right sides of the cavity, when reading, At the same time, double-sided deposition, falling dust = will directly drop on the substrate to improve the overall output efficiency, while the "reducing wheel type (r〇llt〇r〇11), more * small volume pre-draining cavity, = Significantly reduce the residual h and the vacuum _. The towel, the roller = (r〇ut.r〇n) means the conveyor belt. Reduce the vacuum and the vacuum: the original 'has added before and after the reaction chamber Cavity 2 vacuum (4) and the main cavity body - when the sample is low, then open the gate and send it to the main A month: 'After the completion of the enthalpy, the open cavity is sent into the small vacuum chamber to enter and discharge the material, so the vacuum can be greatly reduced. Breaking the vacuum.. time. And 'the front part of the cavity is equipped with the ion 进行 to clean the α 乍, to ensure that the surface of the substrate is completely clean when entering the sputtering cavity' and thus ensure the adhesion of the metal layer to the substrate after the completion of the 1 ^54532 Sex is reliable. The fourth step is yellow light lithography imaging step 105: covering the first layer of metal with different layers of negative dry film photoresist, and then according to the difference; the second layer of metal thickness is selected to be suitable for drying The thickness of the film photoresist, combined with the appropriate heating roller temperature, pressure, bonding speed and dry tension, the photoresist is applied to the first layer of metal as a plating mold, under appropriate temperature and humidity, with appropriate Exposure energy, on the first layer of metal, through the negative film, the second layer of metal, the line portion is covered and exposed, and the dry film of the second layer of the metal line is hardened, and after being left for a few minutes, the second layer is removed by development. Dry film on the layer metal line, retaining, dry film outside the line 'to fill the second layer of metal line. The fifth step is electroforming hole filling step 106: when the photoresist is finished, the use of electric ore is not Light Depositing over the seed layer covered by the resist to deposit a thick copper line, and filling the through hole to provide conductive lines, which can also help the heat conduction. When implementing, the bottoming electric mine is firstly performed to ensure the stability of the electric ore and then fill. Hole electric button, the process uses acid copper plating system such as copper sulfate and sulfur sulphate, copper sulfate is used for supplying metal ions, and sulfuric acid is used to increase the conductivity of the solution to reduce the concentration of metal ions, increase the ability of the attached person, and promote anodic corrosion. Preventing the problem of coarse copper plating caused by salt-based copper or cuprous salt generation and precipitation. The sixth step is stripping step 1〇7 • The role of the stripping process is mainly used to prevent the exposure after exposure The photoresist is removed, using a strong type of solution, the agent, by the horizontal stripping line or the immersion type stripping tank to remove the film and tamping for $ when 'f· firstly through the strong solution or other de-filming solution will be 1354532 Γ99Π2~ 21)------1
, L年月曰修⑷止替換頁I 光阻?,，再藉由喷灑設備減摘^^適當的 和循環量’清除經由藥劑膨潤過後 . 循環系統收集，清理被去除的光阻，後段再 洗、超音波震！等清潔方式，配合吸水棉及吹乾烘烤 方式，如此完成去除光阻的整個製程。, L years of repair (4) replace page I photoresist?, and then by spraying equipment to reduce ^ ^ appropriate and circulation amount 'clear through the drug after swelling. Circulatory system collection, cleaning the removed photoresist, the latter Wash again, supersonic shock! The cleaning method is combined with the absorbent cotton and the drying and baking method to complete the entire process of removing the photoresist.
，第七步驟為飯刻步驟108 ··蝕刻製程是將一個材 料使用化學反應或物理撞擊作用去移除的技術，本發 明使用濕蝕刻，經由化學反應來達到蝕刻目的，將所 要蝕刻的材料經由浸泡，或將化學溶液噴灑至被蝕刻 物，經由溶液與被蝕刻物間的化學反應，來移除薄膜 表面的原子’以達到蝕刻的目的。 、 製程中先藉由強酸型藥劑來移除鈦鋼合金層，該 層是使用物理氣象沉積之濺鍍方式形成，該導電8層主/ 要作為後段電鍍金屬材料所需之電流傳導路徑，可由 金屬、合金或沉積數層金屬層構成的，如銅、錫、鎳、 鈦鉻等合金其中之一所組成。在經由喷灑裴置喷灑 強酸藥劑並與鈦銅合金表面產生化學反應移除該導 電層，後段再經由加壓水洗、超音波震盪等清潔方 式，配合吸水棉及吹乾烘烤方式完成蝕刻的整個 程。 、 第八步驟為磨刷步驟109 :磨刷步驟主要用以處 理前製程所產生的融渣、厚度不均、銅凸、溢鍍、= 銲後粗糙而使基板表面平整。製程前段使用砂帶研磨 整平線路表面，後段再以不織布拋光拋細線路表面。 UM532The seventh step is the rice cooking step 108. · The etching process is a technique of removing a material using a chemical reaction or a physical impact. The present invention uses wet etching to achieve an etching target through a chemical reaction, and the material to be etched is passed through Soaking, or spraying a chemical solution to the object to be etched, removes atoms on the surface of the film through a chemical reaction between the solution and the object to be etched for etching purposes. In the process, the titanium steel alloy layer is first removed by a strong acid type agent, and the layer is formed by a physical meteorological deposition sputtering method, and the conductive 8 layer main/supplied as a current conduction path required for the rear plated metal material, A metal, alloy or a plurality of layers of a metal layer such as copper, tin, nickel, titanium chromium or the like. The conductive layer is removed by spraying a strong acid agent through a spray device and chemically reacting with the surface of the titanium-copper alloy, and then cleaning by means of pressurized water washing, ultrasonic vibration, etc., followed by absorbing cotton and drying and baking. The whole process. The eighth step is a brushing step 109: the brushing step is mainly used to treat the slag generated by the pre-process, the thickness unevenness, the copper bump, the overflow plating, and the roughness after the soldering to make the surface of the substrate flat. The front part of the process is ground with a belt to level the surface of the line, and the rear section is polished with a non-woven cloth to polish the surface of the line. UM532
L上月日修必止替換A 然後進入水洗段，清洗基本 粉，清洗成品板上的孔Μ在銅表Μ銅 士 w η 的孔而或切割後的殘屬及粉末，清 洗私遠在板面或孔徑内之举 物。除了㈣近接水洗d 污染 供尺洗與加壓水洗以得到良好的洗淨 ^文果’知局產品的良率冰，，番—Γ / 士 m 7艮羊外，逛可使用超音波震盪清洗 去除產品表面的雜污，清哚 & /月洗不易 >月洗的細縫，使導通 ;月在置產化的目的。最後再用吸水滾輪吸乾基 板表面、強風吹乾孔洞内部，熱風循環風機 ; 内吸附之水氣。 L% 第九步驟為絕緣層防護印刷步驟110 ♦•在第二層 f路上，為了防止焊鎖及導體間的短路或外來的機二 傷害、濕氣等的危害’需要在線路上覆蓋一絕緣層， 以保持良好的線路導通、絕緣性’因此使用熱固型θ 谭塗料作為表面絕緣層，使用時，先透過網版印製第 三層於第二層金屬線路上’再經由第-次熱烘烤：將 内部有機物完全揮發，再經第二次熱烘烤，硬化第三 層線路。當所需精度、準確度的要求較高時， 擇感光型油墨，先全面印刷，再藉曝光、顯影使第三 1絕緣層線路成形，最後經熱處理讓油墨中的環氧& 脂，底硬化。此外，防焊漆亦可作為識別標誌及填‘ 之途，當作為識別標誌時，與前述方式相同；當作為 填孔用途時，則需要藉由重覆印刷，達到填孔1實‘…。 第十步驟為表面改質步驟m :表面改質（銀、鎳 金、鎳鈀金）為表面最終處理之製程，不管是電鍍或 曰修(&止替换頁 年 缝’目㈣是要將金屬鍍在^上i 面金屬層不作可楛古# &，日 民峪上，形成的表 铲☆ 面輝錫強度、打線強度，如.果 λ ’s線路上的金屬為銀層還可提 化；如果鍍在銅線路上的 ·率，但易氧 屬，可提高產品的穩定i。屬為孟層則因金為惰性金 上之陶完金屬化散熱板之製造方法’經由以 广王乂驟，不僅能使陶瓷基板金屬化，且 重的清潔輔助製程，基板可 。夕 ^, 双』从在几全無雜質的情形下 V成線路，進而提供產品的穩定度。 以庫γϊ發明之陶竞金屬化散熱板之製造方法，更可 以應用於以下之樣品需求，包括： 實施例一：[擋牆製程] 擋心為了在LED晶粒上方以點夥 螢光粉時，藉擋牆使，玄Y 布 出。田釉使，合恥侷限在一定範圍内而不流 本發明提供三種解決方案，包 膠製程和貼環製程。其中， 有網印m .. 網印製程’是利用防銲油墨作為基材 ，上，.該製程又細分兩小製程；其十之-為顯影型： 此方式為先全面印刷，印篇丨― p刷印刷-成後，曝光顯影，最後 ::形成。另-種為熱固型，此方法為印刷完 後直接成形。 點膠製程，本發明是透過精密的點膠機進行點 膠，此設備是透過精確的線馬平台及點膠控制器的搭 配，點製出不同形狀的檔牆，並穩定的控制擋牆位置 的準確性。 貼環製程，係依不同需求製作不同材質的環圈 (FR4、鋁圈、陶瓷圈等）’然後經定位後貼置於基板 貫施例·一.[免銀表面製程] 為了因應產品有更高的反光表面，需使用亮銀製 程。施作時，是在剝膜步驟（第七步驟）之前，即在電 鍍後用來保護金屬表面不被侵蝕，後續剝膜蝕刻完成 後再進行化學鍍銀，使保持電鍍出來的亮面。 亮銀表面的製作，係以直流電源供應器在線路的 最表面電鍍緻密而光亮的鋼，以化學鍍的方式在銅的 表面/儿積一層很薄的金屬保護層（鎳或銀），此保護層 可在種子層蝕刻製程中，保護線路電鍍出的亮面銅， 不被蝕刻而使表面產生霧化現象降低反射，當種子層 蝕刻元畢後再以不蝕刻鋼的溶劑去除金屬保護層，使 •良路月b保持原有電錢出的亮度，最後再以浸鍵銀的方 式於線路上沉積-層銀’以達到高反射表面之散熱基 實施例三：[電鍍銀製程] 為了使線路表面有更厚且緻密的銀層，而 因為圓面钒治^ 銀製 、/.，，，设雜，不能拉導線時，則需使用此電鍍 2以二先在銅線路電鍍完成後，直接進行電鍍銀 a几成所需電路，緊接著移除電鍍框架的乾膜光 1354532 Γ 一j-L last month will be replaced by A and then enter the washing section, clean the basic powder, clean the holes on the finished board, the holes in the copper surface, or the residual residue and powder after cutting, cleaning the private board Objects in the face or aperture. In addition to (4) near-washing d pollution, the ruler wash and pressurized water wash to get a good wash ^ Wenguo 'the yield of the product of the ice, the Fan-Γ / 士 m 7艮 sheep, wandering can use ultrasonic shock cleaning Remove the dirt on the surface of the product, clear the & / month wash is not easy > the monthly washing of the slits, make the conduction; the purpose of the month of production. Finally, the surface of the substrate is sucked by the suction roller, the inside of the hole is blown by strong wind, and the hot air circulating fan is used to adsorb the moisture in the air. L% The ninth step is the insulation protection printing step 110 ♦• On the second layer f road, in order to prevent the short circuit between the welding lock and the conductor or the external damage of the machine two, moisture, etc., it is necessary to cover an insulation layer on the line. In order to maintain good line conduction and insulation', therefore, a thermosetting θ tan coating is used as the surface insulating layer. When used, the third layer is printed on the second layer of metal through the screen, and then the first heat is applied. Baking: The internal organic matter is completely volatilized, and after a second hot baking, the third layer is hardened. When the required precision and accuracy are high, the photosensitive ink is selected, firstly printed, and then the third insulating layer is formed by exposure and development, and finally the epoxy & grease in the ink is heat-treated. hardening. In addition, the solder resist can also be used as the identification mark and fill in the way. When it is used as the identification mark, it is the same as the above-mentioned method. When it is used for the hole filling, it is necessary to repeat the printing to achieve the hole filling. The tenth step is surface modification step m: surface modification (silver, nickel gold, nickel palladium gold) is the final surface treatment process, whether it is electroplating or tampering (& replace the page year seam 'mesh (four) is to be Metal plating on the surface of the metal surface of the surface of the surface of the metal surface is not 楛 楛 # # , , , 日 日 日 日 ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ ☆ 强度 强度 强度 强度 强度 强度 强度 强度 强度If the rate is plated on the copper line, but the azo is genus, it can improve the stability of the product. I belong to the Meng layer, because of the manufacturing method of the metal-based heat sink on the gold-inert gold. Wang Hao, not only can make the ceramic substrate metallized, and the heavy cleaning auxiliary process, the substrate can be. Xi ^, double "from a few without impurities, V into a line, and thus provide product stability. The invention can also be applied to the following sample requirements, including: Example 1: [Retaining wall process] The stop is used to block the phosphor powder above the LED die. The wall makes, Xuan Y out. The field glaze makes the shame limited to a certain extent. The present invention provides three solutions, an encapsulation process and a patching process. Among them, a screen printing m.. screen printing process 'is using a solder resist ink as a substrate, on the top. The process is subdivided into two small processes; - for the development type: This method is the first full-printing, printing 丨 - p brush printing - after exposure, development, and finally:: formed. Another type is thermoset, this method is directly formed after printing. In the rubber process, the invention is to dispense through a precise dispensing machine. The device is matched with a precise line platform and a dispensing controller to produce different shape walls and stably control the position of the retaining wall. Accuracy. The ring-laying process is to make rings of different materials (FR4, aluminum ring, ceramic ring, etc.) according to different requirements. Then, after positioning, it is placed on the substrate. Example 1. [Silver-free surface process] In order to respond The product has a higher reflective surface and needs to use a bright silver process. It is applied before the stripping step (the seventh step), that is, after the electroplating, to protect the metal surface from being eroded, after the subsequent stripping etching is completed. Electroless silver plating to keep The bright surface is plated. The bright silver surface is made of a DC power supply that is plated with dense and bright steel on the outermost surface of the line, and a thin metal protective layer is deposited on the surface of the copper by electroless plating. Nickel or silver), this protective layer can protect the bright copper plated by the circuit during the seed layer etching process, and the surface is fogged without being etched to reduce the reflection. When the seed layer is etched, the steel is not etched. The solvent removes the metal protective layer, so that the good road month b maintains the brightness of the original electricity money, and finally deposits the layer-silver on the line by dip-key silver to achieve the heat-dissipating base of the highly reflective surface. [Electroplating Silver Process] In order to make the surface of the circuit have a thicker and denser silver layer, and because the round surface vanadium is treated with silver, /.,, and the wiring is not possible, the plating is required to be used. After the copper line plating is completed, the silver plating a is directly performed into a required circuit, and then the dry film light of the electroplated frame is removed 1354532 Γ a j-
ί·^ Λ日修(/)止替換I 阻，讓應移除的種子層裸露出來，再以保護層覆蓋於 電鍍線路上方，然後以蝕刻液移除種子層，即可將完 整的圖樣顯現出來，最後再將保護層剝離即完成製 程。 因此’可有以下三種方式實施： 方式一：直接在光罩上拉導線，在蝕刻步驟（第 九步驟）之後施作電鑛銀。 方式二：在電鑄填孔（第六步驟）之後，經剝獏、 膜刷拋平表面，再曝上一層光阻以保護露出來的種子 層不會被電鍍上銀，然後再經剝膜、蝕刻種子層，完 成此製程。 方式三：在電鑄填孔（第六步驟）之後，直接電鍍 銀’㈣膜過後’再上—反向綠覆蓋銅線路並裸露 種子層，再經#刻去除種子層，最後去除光阻完成此ί·^ 修日修 (/) stop the I resistance, let the seed layer to be removed exposed, and then cover the plating line with a protective layer, then remove the seed layer with an etchant to reveal the complete pattern Come out, and finally peel off the protective layer to complete the process. Therefore, it can be implemented in the following three ways: Method 1: Pull the wire directly on the reticle and apply it as an electric mineral after the etching step (the ninth step). Method 2: After the electroforming hole filling (the sixth step), the surface is peeled off by a stripping brush, and then a photoresist is exposed to protect the exposed seed layer from being plated with silver, and then stripped. Etching the seed layer to complete the process. Method 3: After electroforming hole filling (sixth step), directly electroplating silver '(4) film after 're-up-reverse green covering copper line and bare seed layer, then removing the seed layer by #刻, finally removing the photoresist this
此方式可直接使用種子層當導線電鍍，不會有增 加導電線路的問題，此外，製程中電鍍出的銀層，在 银刻製程令都有保護層的保護，所以產品完成後都可 保有完整的表面及特性。 綜上所述，本發明之陶完金屬化散熱板之製造方 法’其並未見諸公開佶用，人 . .. X 使用&衣專利法之規定，懇請 賜准專利’貫'為德便。 需陳明者，以卜辦、+· 土 β θ 斤述者乃疋本發明較佳且體的實 施例，若依本發明之構想所作之改變m之功能 「弱 1354532In this way, the seed layer can be directly used for wire plating, and there is no problem of increasing the conductive line. In addition, the silver layer plated in the process has protection layer protection in the silver engraving process, so the product can be kept intact after completion. Surface and characteristics. In summary, the method for manufacturing the ceramic finished heat-dissipating plate of the present invention is not disclosed in the public, and the use of the patent for the use of the patent is stipulated. Will. Those who need to be clarified, and the functions of the present invention are better and better, and the function of the change according to the concept of the present invention is "weak 1354532".
作用.，仍未超出說明書-與圖示J•所涵蓋之精神時，均H 、七. •久 · 在本發明之範圍内，合予陳明。 1354532 &年月3修止替换頁 【圖式簡單說明】 流程圖 第1圖係本發明之製作步驟 【主要元件符號說明】 102 :鑽孔步驟 103 :清潔步驟 104 :導電銅層沉積步驟 105 :黃光微影成像步驟 106 :電鑄填孔步驟 107 :剝膜步驟 108 :蝕刻步驟 109 :磨刷步驟 110 :絕緣層防護印刷步驟 Π1 :表面改質步驟Function. If it has not exceeded the spirit of the manual and the diagram covered by J., it is H, VII. • Long · Within the scope of the present invention, it is combined with Chen Ming. 1354532 & Year 3 Repair Replacement Page [Simplified Schematic Description] Flowchart Fig. 1 is a manufacturing step of the present invention [Main component symbol description] 102: Drilling step 103: Cleaning step 104: Conductive copper layer deposition step 105 : yellow light lithography imaging step 106: electroforming filling step 107: stripping step 108: etching step 109: brushing step 110: insulating layer protective printing step Π 1: surface modification step