CN108054171A - 一种柔性基板及其制备方法和一种电润湿显示用基板 - Google Patents
一种柔性基板及其制备方法和一种电润湿显示用基板 Download PDFInfo
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- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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- G02B26/004—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid
- G02B26/005—Optical devices or arrangements for the control of light using movable or deformable optical elements based on a displacement or a deformation of a fluid based on electrowetting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
- H01L27/1244—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits for preventing breakage, peeling or short circuiting
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Abstract
本发明公开了一种柔性基板及其制备方法和一种电润湿显示用基板,柔性基板包括依次设置的柔性衬底、固态导电层和液态金属层,当固态导电层在弯曲或折叠过程中受到机械损伤或热损伤时,具有流动性的液态金属可以修补固态导电层的损伤,能够实现固态导电层的修复,同时提高了导电层的导电性能,相较于传统的只含有固态导电层的电润湿显示用基板,本发明的电润湿显示用基板具有更好的电润湿显示效果。
Description
技术领域
本发明涉及柔性电子显示领域,尤其是涉及一种柔性基板及其制备方法和一种电润湿显示用基板。
背景技术
随着以计算机技术为核心的信息产业的飞速发展和应用,显示技术已广泛应用于生产和日常生活中,成为现代社会人们获取信息的重要途径之一。柔性显示技术具有轻便和折叠的优势,是未来显示技术的一个重要的发展方向。
柔性显示器中的柔性基板对显示器件起着支撑和保护的作用,决定了器件的柔韧性和使用寿命,影响显示器的显示效果、能耗和器件寿命。美国专利US 2015/0287747A1公开了一种含有丙烯酸树脂或聚酰亚胺树脂的柔性基板及制备方法,其中柔性基板包含了薄膜晶体管层。这种柔性基板在弯曲的状态下有效避免了晶体管的破坏,提高了器件的稳定性,但是其使用的导电材料经过大量的弯曲之后会影响导电层的导电效果。专利CN107230517 A公开了一种柔性导电膜及加工方法,其中柔性导电层是将混合有银纳米线的胶水涂布在柔性基材层上,形成厚度小于等于50μm的柔性导电膜,这种导电膜的制备工艺较为简单,薄膜整体实现变薄,但是这种膜需要银纳米线有较高的覆盖率,否则容易造成缺陷,影响显示效果。
因此,鉴于以上问题,有必要寻找一种具有自修复功能的柔性基板,使基板具有柔韧耐弯曲性质的同时,具有导电自修复能力,以提高器件的使用寿命和显示效果。
发明内容
针对现有技术的缺陷,本发明所要解决的技术问题是提供一种柔性基板及其制备方法和一种电润湿显示用基板,具有柔韧耐弯曲性质和导电自修复能力。
本发明所采取的技术方案是:
本发明提供了一种柔性基板,包括依次设置的柔性衬底、固态导电层和液态金属层。
优选地,所述液态金属层为含镓合金层、伍德合金层、汞层、汞齐层中的至少一种,所述含镓合金层为铟、锡、锌、铋、银、铝中的至少一种金属与镓组成的合金层。
进一步地,所述液态金属层的厚度为0.1~100μm。
优选地,所述固态导电层为固态金属材料层、无机氧化物导电材料层、有机导电材料层中的至少一种。
进一步地所述固态导电层的厚度为10~1000nm。
更进一步地,所述柔性衬底的材料为环氧树脂、苯乙烯热塑性弹性材料、聚硅氧烷、聚烯烃热塑性弹性材料、环烯烃聚合物、环烯烃共聚物、热塑性聚氨酯、聚酯型弹性体、聚酰胺热塑性弹性材料中的至少一种。
本发明还提供一种上述的柔性基板的制备方法,包括以下步骤:
取柔性衬底,利用磁控溅射、化学气相沉积、物理气相沉积、溶液镀膜中的任一种方式在所述柔性衬底上制备固态导电层;
采用喷涂、旋涂、浸涂、狭缝涂布、棒涂、刮板涂布、丝网印刷、注入、喷墨打印中的任一种方式在所述固态导电层上制备液态金属层。
本发明还提供一种电润湿显示用基板,包括上述的柔性基板。
优选地,还包括疏水绝缘层。
进一步地,所述疏水绝缘层为固-液复合膜结构、光刻胶、含氟聚合物材料、聚对二甲苯中的至少一种。
本发明中的固-液复合膜结构指的是申请日为2017年8月15日申请号为201710698184.0的在先专利CN107335490A中所述的固-液复合膜结构,由多孔性的聚合物薄膜及能提高电润湿性能的液体组成。
更进一步地,所述疏水绝缘层的厚度为0.1~100μm。
本发明的有益效果是:
本发明提供一种柔性基板,在固态导电层上添加有液态金属层,当固态导电层在弯曲或折叠过程中受到机械损伤或热损伤时,具有流动性的液态金属可以修补固态导电层的损伤,因为液态金属具有很好的导电性能,因此不但可以实现固态导电层的修复,还能够提高导电层的导电性能。由于液态金属氧化后能够很好地附着在导电层上,所以只需将液态金属涂覆在固态导电层上,就能达到修复固态导电层导电性能的目的,简单快捷,提高了器件的使用寿命和显示效果。
附图说明
图1为实施例1中的柔性导电基板;
图2为固态导电层/液态金属层弯曲前后的扫描电镜图;
图3为实施例2中弯曲实验过程中的方阻变化图;
图4为实施例3中的电润湿显示用基板;
图5为电润湿原理图;
图6为电润湿曲线图;
图7为实施例7中的电润湿显示用基板的结构示意图;
图8为实施例8中的电润湿显示用基板的结构示意图。
具体实施方式
以下将结合实施例和附图对本发明的构思、具体结构及产生的技术效果进行清楚、完整地描述,以充分地理解本发明的目的、特征和效果。显然,所描述的实施例只是本发明的一部分实施例,而不是全部实施例,基于本发明的实施例,本领域的技术人员在不付出创造性劳动的前提下所获得的其他实施例,均属于本发明保护的范围。
实施例1
参见图1,本实施例提供一种柔性基板,包括依次设置的柔性衬底1、固态导电层2和液态金属层3,所述柔性衬底1选用聚对苯二甲酸乙二醇酯(PET),所述固态导电层2为固态导电膜氧化铟锡(ITO),所述固态导电层2的厚度为20nm,所述液态金属层3为镓铟锡合金材料(Galinstan)层,所述液态金属层3的厚度为6.02μm。
本实施例还提供一种上述柔性基板的制备方法,包括以下步骤:取一柔性衬底,用超纯水和无水乙醇冲洗表面,利用磁控溅射方式将固态导电层ITO沉积在柔性衬底上,然后利用喷涂法将Galinstan涂覆到所述固态导电层上。在制备过程中,Galinstan首先在空气中被分散成微滴,同时微滴表面迅速氧化形成薄氧化膜,而后在固态导电层上进行沉积,由于氧化膜的作用,Galinstan能够较好的附着在ITO导电膜上。
本实施例中柔性衬底以聚对苯二甲酸乙二醇酯为例、固态导电层以氧化铟锡为例、液态金属层以镓铟锡合金材料为例进行说明,实际中柔性衬底的材料可以为聚酯、环氧树脂、苯乙烯热塑性弹性材料、聚硅氧烷、聚烯烃热塑性弹性材料、环烯烃聚合物、环烯烃共聚物、热塑性聚氨酯、聚酯型弹性体、聚酰胺热塑性弹性材料中的至少一种;固态导电层可以为固态金属材料层、无机氧化物导电材料层、有机导电材料层中的至少一种;液态金属层可以为含镓合金层、伍德合金层、汞层、汞齐层中的至少一种,所述含镓合金层为铟、锡、锌、铋、银、铝中的至少一种金属与镓组成的合金层。
实施例2
取实施例1中的柔性基板进行弯曲实验,实验前后固态导电层/液态金属层的扫描电镜图如图2所示,图2a为实验前未进行弯曲的图片,此时固态导电层处于完整状态,图2b为进行弯曲实验后的图片,此时的固态导电层出现有规律的裂痕,液态金属层覆盖在固态导电层上或渗入到固态导电层的裂缝中。
对比例1:对比例1中的柔性基板,包括依次设置的柔性衬底PET和设置在柔性衬底上面的固态导电层氧化铟锡(ITO)。取对比例1和实施例1中的柔性基板,测定其在弯曲实验中的电阻变化,实验结果如图3所示,从图中可以看出随着弯曲次数的增加,对比例1中柔性基板的方阻呈周期性上升,升高趋势明显,经过2000次弯曲实验后的方阻为初始方阻值的30多倍,而本发明中的柔性基板的方阻变化不大,变化趋势基本为一条直线。
上述两个实验结果表明在固态导电层上设置液态金属层,不但可以实现固态导电层的修复,还能够提高导电层的导电性能。
实施例3
参见图4,本实施例提供一种电润湿显示用基板,包括实施例1中的柔性基板和疏水绝缘层4,所述疏水绝缘层4为固-液复合膜结构,具体为填充了硅油的多孔性聚四氟乙烯膜,所述疏水绝缘层4的厚度为0.1μm。
本实施例还提供一种上述电润湿显示用基板的制备方法,包括以下步骤:取实施例1中的柔性基板,在所述液态金属层上涂覆疏水绝缘层,涂覆的方式可以是但不限于粘贴、旋涂、线棒涂布、印刷中的任一种。
图5为电润湿原理图,在上述电润湿显示用基板上滴加液滴5,使用金属电极丝6连接液滴与固态导电层2,通过改变施加在液滴5与固态导电层2之间的电压来改变液-固界面张力,从而改变液滴5在疏水绝缘层4表面的接触角以实现液体的驱动和空间分布的改变,最终达到对透射光或反射光进行光开关的功能,实现显示功能。
实施例4
对比例2:对比例1中的电润湿显示用基板包括依次设置的柔性衬底、固态导电层和疏水绝缘层,三者的材料和厚度均与实施例3中的电润湿显示用基板相同。
取对比例2和实施例3中的电润湿显示用基板进行实验,以测定弯曲测试前后电润湿显示用基板的电润湿性能的变化,实验结果如图6所示,图中实心图案代表施加电压增大的过程,空心图案代表施加电压减小的过程,曲线①代表弯曲测试前对比例2中电润湿显示用基板的电润湿曲线,曲线②代表弯曲测试后对比例2中电润湿显示用基板的电润湿曲线,曲线③代表弯曲测试前实施例3中电润湿显示用基板的电润湿曲线,曲线④代表弯曲测试后实施例3中电润湿显示用基板的电润湿曲线,实验结果显示,仅含有固态导电层的电润湿显示用基板在经过弯曲实验后,电润湿效果远远不如初始状态,而涂覆了液态金属层的电润湿显示用基板在弯曲实验前后的电润湿效果基本没有变化。
实施例5
本实施例提供一种柔性基板,包括依次设置的柔性衬底、固态导电层和液态金属层,所述柔性衬底选用聚酰亚胺薄膜(PI),所述固态导电层为掺杂氟的氧化锡导电膜(FTO),所述固态导电层的厚度为1000nm,所述液态金属层为镓铟合金层,所述液态金属层的厚度为0.1μm。
实施例6
本实施例提供一种柔性基板,包括依次设置的柔性衬底、固态导电层和液态金属层,所述柔性衬底选用聚萘二甲酸乙二醇酯(PEN),所述固态导电层为金层,所述固态导电层的厚度为10nm,所述液态金属层为伍德合金层,所述液态金属层的厚度为100μm。
实施例7
参见图7,本实施例提供一种电润湿显示用基板,包括依次设置的柔性衬底1、固态导电层一20、液态金属层3、固态导电层二21和疏水绝缘层4,所述柔性衬底1选用环氧树脂,所述固态导电层一20为氧化铟锡层,所述固态导电层一的厚度为300nm,所述液态金属层3为汞层,所述液态金属层的厚度为10μm,所述固态导电层二21为以聚3,4-乙撑二氧噻吩(PEDOT)掺杂聚苯乙烯磺酸钠(PSS)的聚合物薄膜导电层,所述固态导电层的厚度为300nm,所述疏水绝缘层4为光刻胶,所述疏水绝缘层4的厚度为30μm。
实施例8
参见图8,本实施例提供一种电润湿显示用基板,包括依次设置的柔性衬底1、固态导电层一20、液态金属层30、固态导电层二21、液态金属层31和疏水绝缘层4,所述柔性衬底1选用苯乙烯热塑性弹性材料,所述固态导电层一20为金层,所述固态导电层一20的厚度为10nm,所述液态金属层30为汞齐层,所述液态金属层30的厚度为0.1μm,所述固态导电层二21为银层,所述固态导电层二21的厚度为100nm,所述液态金属层31为镓铟锡合金材料层,所述液态金属层31的厚度为50μm,所述疏水绝缘层4为聚对二甲苯,所述疏水绝缘层4的厚度为100μm。
本发明的创新点在于在固态导电层上设置液态金属层,其他类似的结构如实施例7中的夹心结构“固态导电层/液态金属层”以及本实施例中的叠层结构“固态导电层/液态金属层/固态导电层/液态金属层”等其他类似的变形结构均在本发明的保护范围之内。
Claims (10)
1.一种柔性基板,其特征在于,包括依次设置的柔性衬底、固态导电层和液态金属层。
2.根据权利要求1所述的柔性基板,其特征在于,所述液态金属层为含镓合金层、伍德合金层、汞层、汞齐层中的至少一种,所述含镓合金层为铟、锡、锌、铋、银、铝中的至少一种金属与镓组成的合金层。
3.根据权利要求2所述的柔性基板,其特征在于,所述液态金属层的厚度为0.1~100μm。
4.根据权利要求1-3任一项所述的柔性基板,其特征在于,所述固态导电层为固态金属材料层、无机氧化物导电材料层、有机导电材料层中的至少一种。
5.根据权利要求4所述的柔性基板,其特征在于,所述固态导电层的厚度为10~1000nm。
6.根据权利要求5所述的柔性基板,其特征在于,所述柔性衬底的材料为环氧树脂、苯乙烯热塑性弹性材料、聚硅氧烷、聚烯烃热塑性弹性材料、环烯烃聚合物、环烯烃共聚物、热塑性聚氨酯、聚酯型弹性体、聚酰胺热塑性弹性材料中的至少一种。
7.权利要求1-6任一项所述的柔性基板的制备方法,其特征在于,包括以下步骤:
取柔性衬底,利用磁控溅射、化学气相沉积、物理气相沉积、溶液镀膜中的任一种方式在所述柔性衬底上制备固态导电层;
采用喷涂、旋涂、浸涂、狭缝涂布、棒涂、刮板涂布、丝网印刷、注入、喷墨打印中的任一种方式在所述固态导电层上制备液态金属层。
8.一种电润湿显示用基板,其特征在于,包括权利要求1-6中任一项所述的柔性基板。
9.根据权利要求8所述的电润湿显示用基板,其特征在于,还包括疏水绝缘层。
10.根据权利要求9所述的电润湿显示用基板,其特征在于,所述疏水绝缘层的厚度为0.1~100μm。
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108770220A (zh) * | 2018-06-22 | 2018-11-06 | 北京梦之墨科技有限公司 | 一种电路制备方法 |
CN111128023A (zh) * | 2019-12-23 | 2020-05-08 | 华南理工大学 | 一种韧性可调的柔性基板结构及其制备方法 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104678547A (zh) * | 2015-02-02 | 2015-06-03 | 华南师范大学 | 电润湿基板及其制造方法、电润湿显示器件 |
CN105044903A (zh) * | 2015-08-19 | 2015-11-11 | 华南师范大学 | 电润湿显示下基板的制备方法 |
US20160048229A1 (en) * | 2014-08-16 | 2016-02-18 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel with flexible touch sensor and method for manufacturing the same |
CN106252236A (zh) * | 2015-06-10 | 2016-12-21 | 全南大学校产学协力团 | 可伸缩电路基板及其制作方法 |
-
2017
- 2017-11-28 CN CN201711213126.7A patent/CN108054171A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160048229A1 (en) * | 2014-08-16 | 2016-02-18 | Tpk Touch Solutions (Xiamen) Inc. | Touch panel with flexible touch sensor and method for manufacturing the same |
CN104678547A (zh) * | 2015-02-02 | 2015-06-03 | 华南师范大学 | 电润湿基板及其制造方法、电润湿显示器件 |
CN106252236A (zh) * | 2015-06-10 | 2016-12-21 | 全南大学校产学协力团 | 可伸缩电路基板及其制作方法 |
CN105044903A (zh) * | 2015-08-19 | 2015-11-11 | 华南师范大学 | 电润湿显示下基板的制备方法 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108770220A (zh) * | 2018-06-22 | 2018-11-06 | 北京梦之墨科技有限公司 | 一种电路制备方法 |
WO2020186384A1 (zh) * | 2019-03-15 | 2020-09-24 | 深圳市柔宇科技有限公司 | 导线、电子设备及导线的制作方法 |
CN113261393A (zh) * | 2019-03-15 | 2021-08-13 | 深圳市柔宇科技股份有限公司 | 导线、电子设备及导线的制作方法 |
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WO2020228253A1 (zh) * | 2019-05-13 | 2020-11-19 | 中国科学院宁波材料技术与工程研究所 | 一种柔性传感器及其制备方法 |
CN111128023A (zh) * | 2019-12-23 | 2020-05-08 | 华南理工大学 | 一种韧性可调的柔性基板结构及其制备方法 |
CN111128023B (zh) * | 2019-12-23 | 2022-01-18 | 华南理工大学 | 一种韧性可调的柔性基板结构及其制备方法 |
CN111430062A (zh) * | 2020-04-03 | 2020-07-17 | 香港理工大学 | 一种弹性导体复合膜及其制备方法 |
WO2021197462A1 (zh) * | 2020-04-03 | 2021-10-07 | 香港理工大学 | 一种弹性导体复合膜及其制备方法 |
CN111430062B (zh) * | 2020-04-03 | 2024-04-30 | 香港理工大学 | 一种弹性导体复合膜及其制备方法 |
CN114724770A (zh) * | 2022-03-24 | 2022-07-08 | 西南民族大学 | 一种液态金属柔性导体的制备方法 |
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