CN113261393A - 导线、电子设备及导线的制作方法 - Google Patents

导线、电子设备及导线的制作方法 Download PDF

Info

Publication number
CN113261393A
CN113261393A CN201980073480.5A CN201980073480A CN113261393A CN 113261393 A CN113261393 A CN 113261393A CN 201980073480 A CN201980073480 A CN 201980073480A CN 113261393 A CN113261393 A CN 113261393A
Authority
CN
China
Prior art keywords
layer
conductive
wire
repair
fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980073480.5A
Other languages
English (en)
Inventor
雷晓华
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Royole Technologies Co Ltd
Original Assignee
Shenzhen Royole Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Royole Technologies Co Ltd filed Critical Shenzhen Royole Technologies Co Ltd
Publication of CN113261393A publication Critical patent/CN113261393A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B7/00Insulated conductors or cables characterised by their form
    • H01B7/10Contact cables, i.e. having conductors which may be brought into contact by distortion of the cable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)

Abstract

本申请实施例提供一种导线(100),所述导线(100)包括依次层叠设置的导电层(10)、修复层(20)和弹性封装层(30),所述修复层(20)为可活动的导电层,当所述导电层(10)被拉伸后出现裂纹时,所述修复层(20)在所述弹性封装层(30)的挤压作用下至少部分填充于所述裂纹内,以使所述导电层(10)在所述裂纹处导通,从而实现所述导线(100)的自修复功能,避免造成所述导线(100)断路或电阻激增而使产品失效的情况,保证所述导线(100)的导电性能,有利于保证所述电子设备的使用可靠性,增加使用寿命。

Description

PCT国内申请,说明书已公开。

Claims (25)

  1. PCT国内申请,权利要求书已公开。
CN201980073480.5A 2019-03-15 2019-03-15 导线、电子设备及导线的制作方法 Pending CN113261393A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/078255 WO2020186384A1 (zh) 2019-03-15 2019-03-15 导线、电子设备及导线的制作方法

Publications (1)

Publication Number Publication Date
CN113261393A true CN113261393A (zh) 2021-08-13

Family

ID=72519475

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980073480.5A Pending CN113261393A (zh) 2019-03-15 2019-03-15 导线、电子设备及导线的制作方法

Country Status (2)

Country Link
CN (1) CN113261393A (zh)
WO (1) WO2020186384A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115356791A (zh) * 2022-08-01 2022-11-18 武汉华星光电半导体显示技术有限公司 盖板、显示面板及显示装置
CN115811828A (zh) * 2022-12-05 2023-03-17 武汉大学 3d打印自修复柔性电路及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120261172A1 (en) * 2011-04-14 2012-10-18 Yung-Shu Yang Structure and pattern forming method of transparent conductive circuit
CN106031312A (zh) * 2014-02-21 2016-10-12 学校法人早稻田大学 自我修复型配线及伸缩器件
CN106229333A (zh) * 2016-09-26 2016-12-14 昆山工研院新型平板显示技术中心有限公司 导线
CN107123470A (zh) * 2017-05-05 2017-09-01 北京科技大学 一种柔弹性导电薄膜及其制备方法
CN108054171A (zh) * 2017-11-28 2018-05-18 华南师范大学 一种柔性基板及其制备方法和一种电润湿显示用基板
CN109417850A (zh) * 2016-06-21 2019-03-01 微软技术许可有限责任公司 柔性互连
CN109448889A (zh) * 2018-12-05 2019-03-08 业成科技(成都)有限公司 自修复导电结构及其制备方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5584657B2 (ja) * 2011-07-08 2014-09-03 株式会社日立製作所 自己修復性積層構造体及び自己融着絶縁電線
CN106409152B (zh) * 2016-09-26 2019-03-08 昆山工研院新型平板显示技术中心有限公司 一种金属线、金属线自修复的方法以及柔性显示屏
CN106549021B (zh) * 2016-12-02 2018-10-09 京东方科技集团股份有限公司 柔性显示基板、柔性显示装置及其修复方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120261172A1 (en) * 2011-04-14 2012-10-18 Yung-Shu Yang Structure and pattern forming method of transparent conductive circuit
CN106031312A (zh) * 2014-02-21 2016-10-12 学校法人早稻田大学 自我修复型配线及伸缩器件
CN109417850A (zh) * 2016-06-21 2019-03-01 微软技术许可有限责任公司 柔性互连
CN106229333A (zh) * 2016-09-26 2016-12-14 昆山工研院新型平板显示技术中心有限公司 导线
CN107123470A (zh) * 2017-05-05 2017-09-01 北京科技大学 一种柔弹性导电薄膜及其制备方法
CN108054171A (zh) * 2017-11-28 2018-05-18 华南师范大学 一种柔性基板及其制备方法和一种电润湿显示用基板
CN109448889A (zh) * 2018-12-05 2019-03-08 业成科技(成都)有限公司 自修复导电结构及其制备方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115356791A (zh) * 2022-08-01 2022-11-18 武汉华星光电半导体显示技术有限公司 盖板、显示面板及显示装置
CN115356791B (zh) * 2022-08-01 2024-04-12 武汉华星光电半导体显示技术有限公司 盖板、显示面板及显示装置
CN115811828A (zh) * 2022-12-05 2023-03-17 武汉大学 3d打印自修复柔性电路及其制备方法
CN115811828B (zh) * 2022-12-05 2024-10-15 武汉大学 3d打印自修复柔性电路及其制备方法

Also Published As

Publication number Publication date
WO2020186384A1 (zh) 2020-09-24

Similar Documents

Publication Publication Date Title
Yim et al. Design and understanding of anisotropic conductive films (ACFs) for LCD packaging
JP5551012B2 (ja) 配線体接続構造体
US3971610A (en) Conductive elastomeric contacts and connectors
CN113261393A (zh) 导线、电子设备及导线的制作方法
KR20140087014A (ko) 유연 도전 부재 및 그것을 사용한 트랜스듀서
KR20200108879A (ko) 플렉시블 기판, 전자 디바이스, 전자 디바이스의 제조 방법
EP3439447A1 (en) Electromagnetic-wave shield film
JP2015508219A (ja) 第1の金属コンポーネントと被覆された第2の金属コンポーネントとの結合部
JP3541777B2 (ja) 異方性導電接続材料
CN1809902A (zh) Ptc热敏电阻和电路保护方法
WO2020004660A1 (ja) 伸縮配線部材
JP6806328B2 (ja) 電子装置
CN107516778A (zh) 一种弹性连接器、电子组件及电子设备
KR20040095298A (ko) 유연성 양도전층 및 그를 이용한 이방 도전 시트
CN209183284U (zh) 液态金属导线
JPWO2003079497A1 (ja) 異方導電シート及びその製造方法
KR101420031B1 (ko) 박막형 태양 전지 모듈의 제조 방법
CN101436440B (zh) 导电颗粒及各向异性导电粘结剂膜
JP4542842B2 (ja) 電極間接続構造
JPWO2003079494A1 (ja) 異方導電シートおよびその製造方法
JP2017188450A (ja) 配線接続構造
CN113261392A (zh) 电连接组件、电子设备及电连接组件的制备方法
CN113690149A (zh) 一种芯片键合结构、方法及设备
JP2000021470A (ja) 導電部材とこれを用いた低圧縮低抵抗コネクタ
JP2004214014A (ja) 電気コネクタ

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210813