JP5584657B2 - 自己修復性積層構造体及び自己融着絶縁電線 - Google Patents
自己修復性積層構造体及び自己融着絶縁電線 Download PDFInfo
- Publication number
- JP5584657B2 JP5584657B2 JP2011151416A JP2011151416A JP5584657B2 JP 5584657 B2 JP5584657 B2 JP 5584657B2 JP 2011151416 A JP2011151416 A JP 2011151416A JP 2011151416 A JP2011151416 A JP 2011151416A JP 5584657 B2 JP5584657 B2 JP 5584657B2
- Authority
- JP
- Japan
- Prior art keywords
- self
- resin
- healing
- laminated structure
- thermosetting resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920005989 resin Polymers 0.000 claims description 237
- 239000011347 resin Substances 0.000 claims description 237
- 229920001187 thermosetting polymer Polymers 0.000 claims description 109
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 46
- 229920000647 polyepoxide Polymers 0.000 claims description 42
- 239000003822 epoxy resin Substances 0.000 claims description 41
- 239000003795 chemical substances by application Substances 0.000 claims description 39
- 229920006287 phenoxy resin Polymers 0.000 claims description 33
- 239000013034 phenoxy resin Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 27
- 229920005992 thermoplastic resin Polymers 0.000 claims description 25
- 239000003054 catalyst Substances 0.000 claims description 22
- 230000004888 barrier function Effects 0.000 claims description 19
- 239000003431 cross linking reagent Substances 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 12
- 239000004020 conductor Substances 0.000 claims description 9
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920000178 Acrylic resin Polymers 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 135
- 239000002966 varnish Substances 0.000 description 47
- 239000000758 substrate Substances 0.000 description 25
- 231100000241 scar Toxicity 0.000 description 19
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 18
- 239000002904 solvent Substances 0.000 description 18
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 15
- 239000012948 isocyanate Substances 0.000 description 15
- 150000002513 isocyanates Chemical class 0.000 description 15
- 239000011521 glass Substances 0.000 description 13
- 239000007787 solid Substances 0.000 description 13
- 238000005520 cutting process Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 8
- 208000032544 Cicatrix Diseases 0.000 description 8
- 230000037387 scars Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 6
- 239000004640 Melamine resin Substances 0.000 description 6
- 229920000877 Melamine resin Polymers 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229920006337 unsaturated polyester resin Polymers 0.000 description 6
- 229920001807 Urea-formaldehyde Polymers 0.000 description 5
- 210000003298 dental enamel Anatomy 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 239000002952 polymeric resin Substances 0.000 description 5
- 239000004962 Polyamide-imide Substances 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 239000002775 capsule Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 230000007613 environmental effect Effects 0.000 description 4
- 210000003746 feather Anatomy 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 4
- 229920006122 polyamide resin Polymers 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 230000008439 repair process Effects 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 3
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- ULUZGMIUTMRARO-UHFFFAOYSA-N (carbamoylamino)urea Chemical compound NC(=O)NNC(N)=O ULUZGMIUTMRARO-UHFFFAOYSA-N 0.000 description 1
- VZXPHDGHQXLXJC-UHFFFAOYSA-N 1,6-diisocyanato-5,6-dimethylheptane Chemical compound O=C=NC(C)(C)C(C)CCCCN=C=O VZXPHDGHQXLXJC-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B1/00—Layered products having a non-planar shape
- B32B1/08—Tubular products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/06—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
- B32B17/10—Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
- B32B27/308—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/3405—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions with at least two coatings of organic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/42—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes polyesters; polyethers; polyacetals
- H01B3/427—Polyethers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/762—Self-repairing, self-healing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/308—Wires with resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B7/00—Insulated conductors or cables characterised by their form
- H01B7/02—Disposition of insulation
- H01B7/0208—Cables with several layers of insulating material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Organic Insulating Materials (AREA)
- Insulated Conductors (AREA)
- Adhesive Tapes (AREA)
Description
Claims (13)
- 基材上に、自己修復性樹脂層及びその外層に熱硬化性樹脂トップコートが形成された積層構造体であって、前記自己修復性樹脂層は、未硬化の架橋可能又は硬化可能な熱可塑性樹脂を含み、前記熱硬化性樹脂トップコートは前記架橋可能な熱可塑性樹脂の架橋剤又は硬化剤或いは硬化触媒を含み、前記架橋可能又は硬化可能な熱可塑性樹脂は加熱された状態で、前記熱硬化性樹脂のトップコートの欠陥内に侵入して、前記架橋剤又は硬化剤或いは硬化触媒と反応して熱硬化性樹脂に変化して前記熱硬化性樹脂のトップコ−トを修復することを特徴とする自己修復性積層構造体。
- 前記熱硬化性樹脂トップコートと前記自己修復性樹脂層との間にバリア層が形成されていることを特徴とする請求項1に記載の自己修復性積層構造体。
- 前記未硬化の熱可塑性樹脂がフェノキシ樹脂であることを特徴とする請求項1に記載の自己修復性積層構造体。
- 前記未硬化の熱可塑性樹脂がフェノキシ樹脂とビスフェノールA型エポキシ樹脂の混合物であることを特徴とする請求項1に記載の自己修復性積層構造体。
- 前記未硬化の熱可塑性樹脂がブチラール樹脂であることを特徴とする請求項1に記載の自己修復性積層構造体。
- 前記熱硬化性樹脂トップコートがアクリル樹脂であることを特徴とする請求項1〜5のいずれかに記載の自己修復性積層構造体。
- 導体上に、自己修復性樹脂層及びその外層に自己融着した熱硬化性樹脂のトップコートが形成され、前記自己修復性樹脂層は、未硬化の架橋可能又は硬化可能な熱可塑性樹脂を含み、前記架橋可能な熱可塑性樹脂は加熱された状態で、前記熱硬化性樹脂のトップコートの欠陥内に侵入して、前記架橋剤又は硬化剤或いは硬化触媒と反応して熱硬化性樹脂に変化して前記熱硬化性樹脂のトップコートを自己修復することを特徴とする自己融着絶縁電線。
- 前記熱硬化性樹脂トップコートと前記自己修復性樹脂層との間にバリア層が形成されていることを特徴とする請求項7に記載の自己融着絶縁電線。
- 前記未硬化の熱可塑性樹脂がフェノキシ樹脂であることを特徴とする請求項7に記載の自己融着絶縁電線。
- 前記未硬化の熱可塑性樹脂がフェノキシ樹脂とビスフェノールA型エポキシ樹脂の混合物であることを特徴とする請求項7に記載の自己融着絶縁電線。
- 前記未硬化の熱可塑性樹脂がブチラール樹脂であることを特徴とする請求項7に記載の自己融着絶縁電線。
- 前記熱硬化性樹脂トップコートがアクリル樹脂であることを特徴とする請求項7に記載の自己融着絶縁電線。
- 請求項7に記載の自己融着絶縁電線を用いたことを特徴とする電気機器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011151416A JP5584657B2 (ja) | 2011-07-08 | 2011-07-08 | 自己修復性積層構造体及び自己融着絶縁電線 |
US14/131,095 US20140141254A1 (en) | 2011-07-08 | 2012-06-29 | Self-repairing laminated structure and self-fusing insulated wire |
PCT/JP2012/066654 WO2013008646A1 (ja) | 2011-07-08 | 2012-06-29 | 自己修復性積層構造体及び自己融着絶縁電線 |
EP12811308.1A EP2749410B1 (en) | 2011-07-08 | 2012-06-29 | Self-repairing laminated structure and self-bonding insulated wire |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011151416A JP5584657B2 (ja) | 2011-07-08 | 2011-07-08 | 自己修復性積層構造体及び自己融着絶縁電線 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2013018142A JP2013018142A (ja) | 2013-01-31 |
JP2013018142A5 JP2013018142A5 (ja) | 2013-05-09 |
JP5584657B2 true JP5584657B2 (ja) | 2014-09-03 |
Family
ID=47505942
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011151416A Expired - Fee Related JP5584657B2 (ja) | 2011-07-08 | 2011-07-08 | 自己修復性積層構造体及び自己融着絶縁電線 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20140141254A1 (ja) |
EP (1) | EP2749410B1 (ja) |
JP (1) | JP5584657B2 (ja) |
WO (1) | WO2013008646A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6331219B2 (ja) * | 2014-08-08 | 2018-05-30 | 株式会社安川電機 | 可動電機、コイルの製造方法 |
KR20180090255A (ko) * | 2015-12-04 | 2018-08-10 | 후루카와 덴키 고교 가부시키가이샤 | 자기 융착성 절연 전선, 코일 및 전기·전자 기기 |
CN113261393A (zh) * | 2019-03-15 | 2021-08-13 | 深圳市柔宇科技股份有限公司 | 导线、电子设备及导线的制作方法 |
US11446915B2 (en) * | 2019-06-14 | 2022-09-20 | Ut-Battelle, Llc | Roll-to-roll slot die coating method to create interleaving multi-layered films with chemical slurry coatings |
CN110619974B (zh) * | 2019-08-22 | 2020-12-18 | 百通赫思曼工业(苏州)有限公司 | 一种基于自修复的自检测高强度超薄抗弯曲胶带电线电缆 |
DE102021100950A1 (de) | 2021-01-19 | 2022-07-21 | Audi Aktiengesellschaft | Komponentengehäuseanordnung, elektrische Komponente und Verfahren zum Verschließen einer Beschädigungsöffnung in einem Komponentengehäuse |
CN113527983B (zh) * | 2021-07-30 | 2022-05-31 | 中山大学 | 一种免修饰可回收的光热驱动自修复环氧防腐涂层材料的制备方法 |
CN113845313B (zh) * | 2021-09-17 | 2023-11-03 | 成都拓米双都光电有限公司 | 复合涂层及制备方法、超薄玻璃及制备方法、终端设备 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4127695A (en) * | 1975-10-07 | 1978-11-28 | Matsushita Electric Industrial Co., Ltd. | Method of insulating electromagnetic coils |
DE2629779C3 (de) * | 1976-07-02 | 1985-04-04 | Saint Gobain | Verfahren zur Herstellung einer zweischichtigen Folie mit Selbstheileigenschaften unter Verwendung von Polyurethanen als Splitterschutzschicht eines Sicherheitsglases |
JPS59159640A (ja) * | 1983-02-28 | 1984-09-10 | Fujikura Ltd | 自己接着性絶縁電線およびこれを用いた密閉形圧縮機用電動機 |
JPH0740491A (ja) * | 1993-07-06 | 1995-02-10 | Toyota Motor Corp | 自己修復性積層構造体及びその製造方法 |
JPH0992040A (ja) * | 1995-09-26 | 1997-04-04 | Fujikura Ltd | 自己接着性絶縁電線 |
US6589603B1 (en) * | 2000-05-02 | 2003-07-08 | Ppg Industries Ohio, Inc. | Process for forming multi-layer coatings on three-dimensional multi-faced substrates and product made according to such process |
JP2003031063A (ja) * | 2001-07-18 | 2003-01-31 | Toshiba Corp | 電気絶縁用樹脂モールド品 |
US20070087201A1 (en) * | 2005-10-13 | 2007-04-19 | Michael Wimmer | Self-bonding coating composition |
GB0806921D0 (en) * | 2008-04-16 | 2008-05-21 | Airbus Uk Ltd | Composite laminate with self-healing layer |
JP2011005766A (ja) * | 2009-06-26 | 2011-01-13 | Konica Minolta Holdings Inc | 自己修復層付積層体及び成形体 |
-
2011
- 2011-07-08 JP JP2011151416A patent/JP5584657B2/ja not_active Expired - Fee Related
-
2012
- 2012-06-29 EP EP12811308.1A patent/EP2749410B1/en active Active
- 2012-06-29 US US14/131,095 patent/US20140141254A1/en not_active Abandoned
- 2012-06-29 WO PCT/JP2012/066654 patent/WO2013008646A1/ja active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP2749410A1 (en) | 2014-07-02 |
EP2749410A4 (en) | 2015-04-15 |
EP2749410B1 (en) | 2018-06-06 |
WO2013008646A1 (ja) | 2013-01-17 |
JP2013018142A (ja) | 2013-01-31 |
US20140141254A1 (en) | 2014-05-22 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5584657B2 (ja) | 自己修復性積層構造体及び自己融着絶縁電線 | |
JP6108368B2 (ja) | 絶縁電線及びそれを用いた回転電機 | |
JP2007294702A (ja) | 電気絶縁線輪、全含浸コイルおよびこれらを用いた回転電機 | |
JP6824372B1 (ja) | 絶縁シート及びその製造方法、並びに回転電機 | |
US20160042836A1 (en) | Insulated Wire, Rotary Electric Machine, and Method for Manufacturing Insulated Wire | |
WO2008145190A1 (en) | Laminate for electrical machines | |
WO2017094789A1 (ja) | 自己融着性絶縁電線、コイル及び電気・電子機器 | |
WO2012144361A1 (ja) | 回転機コイルおよびその製造方法 | |
JP2016072301A (ja) | 絶縁材、この絶縁材を用いた絶縁コイル、これらの製造方法、ならびにこの絶縁コイルを具備する装置 | |
JP2017199566A (ja) | 絶縁電線及びその製造方法並びに電気機器の製造方法 | |
JP2010193673A (ja) | ドライマイカテープ、それを用いた電気絶縁線輪,固定子コイル及び回転電機 | |
JP2017128667A (ja) | 自己融着性樹脂組成物及び自己融着性絶縁電線 | |
US20180048205A1 (en) | Insulation wire, rotary electric machine, and manufacturing method of insulation wire | |
WO2015121999A1 (ja) | 絶縁電線、回転電機及び絶縁電線の製造方法 | |
JP7237111B2 (ja) | 絶縁シート及びその製造方法、並びに回転電機 | |
JP5832735B2 (ja) | 耐熱自己融着性塗料及び耐熱自己融着性エナメル線 | |
JP2009201228A (ja) | 絶縁シート、絶縁シートを用いた回転電機及び回転電機の製造方法 | |
JP2017157491A (ja) | 絶縁電線及びその製造方法 | |
JP2014107212A (ja) | 端子付電線及びその製造方法 | |
JP5766352B2 (ja) | 回転電機固定子コイル絶縁用液状熱硬化性樹脂組成物、それを用いた回転電機及びその製造方法 | |
JP2017183076A (ja) | 絶縁電線 | |
JP2000044803A (ja) | 熱硬化組成物およびそれを用いた極低温用機器 | |
JP4876454B2 (ja) | フラットケーブル用絶縁フィルムおよびそれを用いたフラットケーブル | |
WO2016021036A1 (ja) | 回転電機用固定子及び回転電機 | |
JP2016039045A (ja) | 絶縁電線、回転電機及び絶縁電線の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130322 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130322 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140708 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140718 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5584657 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
LAPS | Cancellation because of no payment of annual fees |