TWI370758B - Method for making polishing pad - Google Patents

Method for making polishing pad

Info

Publication number
TWI370758B
TWI370758B TW097148792A TW97148792A TWI370758B TW I370758 B TWI370758 B TW I370758B TW 097148792 A TW097148792 A TW 097148792A TW 97148792 A TW97148792 A TW 97148792A TW I370758 B TWI370758 B TW I370758B
Authority
TW
Taiwan
Prior art keywords
polishing pad
making polishing
making
pad
polishing
Prior art date
Application number
TW097148792A
Other languages
Chinese (zh)
Other versions
TW201021968A (en
Inventor
Chung Chih Feng
I Peng Yao
Yung Chang Hung
Chun Ta Wang
Wei Te Liu
Original Assignee
Bestac Advanced Material Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bestac Advanced Material Co Ltd filed Critical Bestac Advanced Material Co Ltd
Priority to TW097148792A priority Critical patent/TWI370758B/en
Priority to US12/536,164 priority patent/US20100146863A1/en
Publication of TW201021968A publication Critical patent/TW201021968A/en
Application granted granted Critical
Publication of TWI370758B publication Critical patent/TWI370758B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW097148792A 2008-12-15 2008-12-15 Method for making polishing pad TWI370758B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW097148792A TWI370758B (en) 2008-12-15 2008-12-15 Method for making polishing pad
US12/536,164 US20100146863A1 (en) 2008-12-15 2009-08-05 Polishing pad having insulation layer and method for making the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097148792A TWI370758B (en) 2008-12-15 2008-12-15 Method for making polishing pad

Publications (2)

Publication Number Publication Date
TW201021968A TW201021968A (en) 2010-06-16
TWI370758B true TWI370758B (en) 2012-08-21

Family

ID=42238906

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097148792A TWI370758B (en) 2008-12-15 2008-12-15 Method for making polishing pad

Country Status (2)

Country Link
US (1) US20100146863A1 (en)
TW (1) TWI370758B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI621501B (en) * 2017-01-06 2018-04-21 三芳化學工業股份有限公司 Polishing pad and polishing apparatus
US10022836B2 (en) 2014-09-19 2018-07-17 San Fang Chemical Industry Co., Ltd. Polishing pad, polishing apparatus and method for manufacturing polishing pad

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104742007B (en) * 2013-12-30 2017-08-25 中芯国际集成电路制造(北京)有限公司 Chemical mechanical polishing device and chemical and mechanical grinding method
TWI516373B (en) * 2014-01-17 2016-01-11 三芳化學工業股份有限公司 Polishing pad, polishing apparatus and method for manufacturing polishing pad
JP7198395B2 (en) * 2019-02-05 2023-01-04 東レコーテックス株式会社 polishing sheet

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
JP4444522B2 (en) * 2001-03-13 2010-03-31 東レコーテックス株式会社 Polishing pad
US8602851B2 (en) * 2003-06-09 2013-12-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Controlled penetration subpad
CN1684799A (en) * 2002-09-25 2005-10-19 Ppg工业俄亥俄公司 Polishing pad for planarization
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US20090047884A1 (en) * 2007-08-15 2009-02-19 Ppg Industries Ohio, Inc. Chemical mechanical polishing pad structure minimizing trapped air and polishing fluid intrusion

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10022836B2 (en) 2014-09-19 2018-07-17 San Fang Chemical Industry Co., Ltd. Polishing pad, polishing apparatus and method for manufacturing polishing pad
TWI630982B (en) * 2014-09-19 2018-08-01 三芳化學工業股份有限公司 Polishing pad, polishing apparatus and method for manufacturing polishing pad
TWI621501B (en) * 2017-01-06 2018-04-21 三芳化學工業股份有限公司 Polishing pad and polishing apparatus
US10702970B2 (en) 2017-01-06 2020-07-07 San Fang Chemical Industry Co., Ltd. Polishing pad and polishing apparatus

Also Published As

Publication number Publication date
US20100146863A1 (en) 2010-06-17
TW201021968A (en) 2010-06-16

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees