TWI295949B - Multi-layer polishing pad material for cmp - Google Patents
Multi-layer polishing pad material for cmp Download PDFInfo
- Publication number
- TWI295949B TWI295949B TW093116204A TW93116204A TWI295949B TW I295949 B TWI295949 B TW I295949B TW 093116204 A TW093116204 A TW 093116204A TW 93116204 A TW93116204 A TW 93116204A TW I295949 B TWI295949 B TW I295949B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing pad
- layer
- polishing
- multilayer
- light transmissive
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 361
- 239000000463 material Substances 0.000 title claims abstract description 71
- 239000000853 adhesive Substances 0.000 claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 claims abstract description 17
- 229920000642 polymer Polymers 0.000 claims description 87
- 238000000034 method Methods 0.000 claims description 42
- 239000002952 polymeric resin Substances 0.000 claims description 38
- 229920003002 synthetic resin Polymers 0.000 claims description 38
- 239000000126 substance Substances 0.000 claims description 28
- -1 resistance Polymers 0.000 claims description 27
- 239000000203 mixture Substances 0.000 claims description 26
- 238000005187 foaming Methods 0.000 claims description 19
- 239000011230 binding agent Substances 0.000 claims description 15
- 229920001971 elastomer Polymers 0.000 claims description 13
- 238000007517 polishing process Methods 0.000 claims description 12
- 229920002635 polyurethane Polymers 0.000 claims description 11
- 238000011065 in-situ storage Methods 0.000 claims description 10
- 229920000515 polycarbonate Polymers 0.000 claims description 10
- 239000004417 polycarbonate Substances 0.000 claims description 10
- 239000004814 polyurethane Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 230000009477 glass transition Effects 0.000 claims description 9
- 229920000573 polyethylene Polymers 0.000 claims description 9
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 8
- 239000000806 elastomer Substances 0.000 claims description 8
- 238000001125 extrusion Methods 0.000 claims description 8
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 8
- 238000002834 transmittance Methods 0.000 claims description 8
- 239000004698 Polyethylene Substances 0.000 claims description 7
- 229920001577 copolymer Polymers 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 229920000098 polyolefin Polymers 0.000 claims description 7
- 239000004677 Nylon Substances 0.000 claims description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 6
- 229920001778 nylon Polymers 0.000 claims description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 6
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 6
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- 239000004793 Polystyrene Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 5
- 229920002223 polystyrene Polymers 0.000 claims description 5
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 229920000058 polyacrylate Polymers 0.000 claims description 4
- 238000006116 polymerization reaction Methods 0.000 claims description 4
- 229920001187 thermosetting polymer Polymers 0.000 claims description 4
- 229920002125 Sokalan® Polymers 0.000 claims description 3
- 239000004584 polyacrylic acid Substances 0.000 claims description 3
- 238000000518 rheometry Methods 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims 4
- 229920000412 polyarylene Polymers 0.000 claims 4
- 229920001721 polyimide Polymers 0.000 claims 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- 229940068984 polyvinyl alcohol Drugs 0.000 claims 2
- 235000019422 polyvinyl alcohol Nutrition 0.000 claims 2
- 239000002202 Polyethylene glycol Substances 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 229920001223 polyethylene glycol Polymers 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 description 221
- 239000002245 particle Substances 0.000 description 23
- 239000007787 solid Substances 0.000 description 17
- 239000000975 dye Substances 0.000 description 14
- 235000012431 wafers Nutrition 0.000 description 12
- 230000000704 physical effect Effects 0.000 description 11
- 238000003795 desorption Methods 0.000 description 10
- 239000000758 substrate Substances 0.000 description 8
- 229920001169 thermoplastic Polymers 0.000 description 8
- 239000004416 thermosoftening plastic Substances 0.000 description 8
- 210000003298 dental enamel Anatomy 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- 239000011148 porous material Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000004377 microelectronic Methods 0.000 description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000008139 complexing agent Substances 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000006260 foam Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229920001477 hydrophilic polymer Polymers 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004831 Hot glue Substances 0.000 description 1
- 229930182559 Natural dye Natural products 0.000 description 1
- 244000061176 Nicotiana tabacum Species 0.000 description 1
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 240000005373 Panax quinquefolius Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000008365 aqueous carrier Substances 0.000 description 1
- 239000000987 azo dye Substances 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 239000006172 buffering agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 229920001600 hydrophobic polymer Polymers 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000000978 natural dye Substances 0.000 description 1
- YCWSUKQGVSGXJO-NTUHNPAUSA-N nifuroxazide Chemical group C1=CC(O)=CC=C1C(=O)N\N=C\C1=CC=C([N+]([O-])=O)O1 YCWSUKQGVSGXJO-NTUHNPAUSA-N 0.000 description 1
- 238000005121 nitriding Methods 0.000 description 1
- 239000001006 nitroso dye Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 239000011146 organic particle Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000001044 red dye Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 125000002730 succinyl group Chemical group C(CCC(=O)*)(=O)* 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/008—Abrasive bodies without external bonding agent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/463,680 US6884156B2 (en) | 2003-06-17 | 2003-06-17 | Multi-layer polishing pad material for CMP |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200513348A TW200513348A (en) | 2005-04-16 |
| TWI295949B true TWI295949B (en) | 2008-04-21 |
Family
ID=33517127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW093116204A TWI295949B (en) | 2003-06-17 | 2004-06-04 | Multi-layer polishing pad material for cmp |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US6884156B2 (enExample) |
| EP (2) | EP1651388B1 (enExample) |
| JP (1) | JP5090732B2 (enExample) |
| KR (1) | KR101109367B1 (enExample) |
| CN (1) | CN100591483C (enExample) |
| AT (1) | ATE416881T1 (enExample) |
| DE (1) | DE602004018321D1 (enExample) |
| MY (1) | MY134466A (enExample) |
| SG (1) | SG149719A1 (enExample) |
| TW (1) | TWI295949B (enExample) |
| WO (1) | WO2005000527A2 (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8277290B2 (en) | 2009-04-24 | 2012-10-02 | Bestac Advanced Material Co., Ltd. | Polishing pad and polishing device |
| US8343586B2 (en) | 2008-11-12 | 2013-01-01 | Bestac Advanced Material Co., Ltd. | Conductive polishing pad and method for making the same |
| US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
| US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
| US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100465649B1 (ko) * | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | 일체형 연마 패드 및 그 제조 방법 |
| JP2004303983A (ja) * | 2003-03-31 | 2004-10-28 | Fuji Photo Film Co Ltd | 研磨パッド |
| EP1466699A1 (en) * | 2003-04-09 | 2004-10-13 | JSR Corporation | Abrasive pad, method and metal mold for manufacturing the same, and semiconductor wafer polishing method |
| US20040209066A1 (en) * | 2003-04-17 | 2004-10-21 | Swisher Robert G. | Polishing pad with window for planarization |
| KR100541545B1 (ko) * | 2003-06-16 | 2006-01-11 | 삼성전자주식회사 | 화학기계적 연마 장비의 연마 테이블 |
| US7435161B2 (en) * | 2003-06-17 | 2008-10-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
| JP2005007520A (ja) * | 2003-06-19 | 2005-01-13 | Nihon Micro Coating Co Ltd | 研磨パッド及びその製造方法並びに研磨方法 |
| US20040259479A1 (en) * | 2003-06-23 | 2004-12-23 | Cabot Microelectronics Corporation | Polishing pad for electrochemical-mechanical polishing |
| US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| US7654885B2 (en) * | 2003-10-03 | 2010-02-02 | Applied Materials, Inc. | Multi-layer polishing pad |
| US6951803B2 (en) * | 2004-02-26 | 2005-10-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method to prevent passivation layer peeling in a solder bump formation process |
| US7059936B2 (en) * | 2004-03-23 | 2006-06-13 | Cabot Microelectronics Corporation | Low surface energy CMP pad |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| CN100424830C (zh) * | 2004-04-23 | 2008-10-08 | Jsr株式会社 | 用于抛光半导体晶片的抛光垫、层叠体和方法 |
| US7252871B2 (en) * | 2004-06-16 | 2007-08-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Polishing pad having a pressure relief channel |
| US7189156B2 (en) * | 2004-08-25 | 2007-03-13 | Jh Rhodes Company, Inc. | Stacked polyurethane polishing pad and method of producing the same |
| US20060089095A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089093A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| US20060089094A1 (en) * | 2004-10-27 | 2006-04-27 | Swisher Robert G | Polyurethane urea polishing pad |
| JP2006346805A (ja) * | 2005-06-15 | 2006-12-28 | Toyo Tire & Rubber Co Ltd | 積層研磨パッド |
| TWI378844B (en) * | 2005-08-18 | 2012-12-11 | Rohm & Haas Elect Mat | Polishing pad and method of manufacture |
| TW200709892A (en) * | 2005-08-18 | 2007-03-16 | Rohm & Haas Elect Mat | Transparent polishing pad |
| US20070111644A1 (en) * | 2005-09-27 | 2007-05-17 | Spencer Preston | Thick perforated polishing pad and method for making same |
| JP2007307885A (ja) * | 2005-11-04 | 2007-11-29 | Ricoh Co Ltd | 画像処理方法、記録物、プログラム、画像処理装置、画像形成装置及び画像形成システム、画像形成方法及びインク |
| KR100741984B1 (ko) * | 2006-02-17 | 2007-07-23 | 삼성전자주식회사 | 화학기계적 연마 장치의 연마 패드 및 그의 제조방법 |
| US20070212979A1 (en) * | 2006-03-09 | 2007-09-13 | Rimpad Tech Ltd. | Composite polishing pad |
| JP5033357B2 (ja) * | 2006-05-31 | 2012-09-26 | ニッタ・ハース株式会社 | 研磨パッド |
| JP5022635B2 (ja) * | 2006-05-31 | 2012-09-12 | ニッタ・ハース株式会社 | 研磨パッド |
| JP5033356B2 (ja) * | 2006-05-31 | 2012-09-26 | ニッタ・ハース株式会社 | 研磨パッド |
| JP5371251B2 (ja) * | 2007-01-30 | 2013-12-18 | 東レ株式会社 | 研磨パッド |
| JP2008221367A (ja) * | 2007-03-09 | 2008-09-25 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| US8087975B2 (en) * | 2007-04-30 | 2012-01-03 | San Fang Chemical Industry Co., Ltd. | Composite sheet for mounting a workpiece and the method for making the same |
| US20080274674A1 (en) * | 2007-05-03 | 2008-11-06 | Cabot Microelectronics Corporation | Stacked polishing pad for high temperature applications |
| TWI411495B (zh) * | 2007-08-16 | 2013-10-11 | Cabot Microelectronics Corp | 拋光墊 |
| JP5078527B2 (ja) * | 2007-09-28 | 2012-11-21 | 富士紡ホールディングス株式会社 | 研磨布 |
| US8491360B2 (en) * | 2007-10-26 | 2013-07-23 | Innopad, Inc. | Three-dimensional network in CMP pad |
| TWI387508B (zh) * | 2008-05-15 | 2013-03-01 | 3M Innovative Properties Co | 具有終點窗孔之拋光墊及使用其之系統及方法 |
| US20110045753A1 (en) * | 2008-05-16 | 2011-02-24 | Toray Industries, Inc. | Polishing pad |
| US7820005B2 (en) * | 2008-07-18 | 2010-10-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad manufacturing process |
| US7645186B1 (en) | 2008-07-18 | 2010-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad manufacturing assembly |
| JP5222070B2 (ja) * | 2008-09-17 | 2013-06-26 | 富士紡ホールディングス株式会社 | 研磨パッド |
| US8083570B2 (en) * | 2008-10-17 | 2011-12-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad having sealed window |
| TWI370758B (en) * | 2008-12-15 | 2012-08-21 | Bestac Advanced Material Co Ltd | Method for making polishing pad |
| US8192249B2 (en) * | 2009-03-12 | 2012-06-05 | Hitachi Global Storage Technologies Netherlands, B.V. | Systems and methods for polishing a magnetic disk |
| WO2010138724A1 (en) * | 2009-05-27 | 2010-12-02 | Rogers Corporation | Polishing pad, polyurethane layer therefor, and method of polishing a silicon wafer |
| DE102009030297B3 (de) * | 2009-06-24 | 2011-01-20 | Siltronic Ag | Verfahren zum Polieren einer Halbleiterscheibe |
| US9017140B2 (en) | 2010-01-13 | 2015-04-28 | Nexplanar Corporation | CMP pad with local area transparency |
| TWI510328B (zh) * | 2010-05-03 | 2015-12-01 | Iv Technologies Co Ltd | 基底層、包括此基底層的研磨墊及研磨方法 |
| US9156124B2 (en) | 2010-07-08 | 2015-10-13 | Nexplanar Corporation | Soft polishing pad for polishing a semiconductor substrate |
| TWI481470B (zh) * | 2010-10-13 | 2015-04-21 | San Fang Chemical Industry Co | 吸附墊片及其製造方法 |
| US8357446B2 (en) * | 2010-11-12 | 2013-01-22 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Hollow polymeric-silicate composite |
| JP5918254B2 (ja) * | 2010-11-18 | 2016-05-18 | キャボット マイクロエレクトロニクス コーポレイション | 透過性領域を含む研磨パッド |
| US20120302148A1 (en) | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
| DE102011114750A1 (de) | 2011-09-29 | 2013-04-04 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Mikrostrukturträgers |
| DE102011115125B4 (de) | 2011-10-07 | 2021-10-07 | Giesecke+Devrient Currency Technology Gmbh | Herstellung einer mikrooptischen Darstellungsanordnung |
| US9067298B2 (en) | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with grooved foundation layer and polishing surface layer |
| WO2013081665A2 (en) * | 2011-11-29 | 2013-06-06 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
| US9067297B2 (en) * | 2011-11-29 | 2015-06-30 | Nexplanar Corporation | Polishing pad with foundation layer and polishing surface layer |
| JP5893413B2 (ja) * | 2012-01-17 | 2016-03-23 | 東洋ゴム工業株式会社 | 積層研磨パッドの製造方法 |
| US9156125B2 (en) | 2012-04-11 | 2015-10-13 | Cabot Microelectronics Corporation | Polishing pad with light-stable light-transmitting region |
| US9597769B2 (en) * | 2012-06-04 | 2017-03-21 | Nexplanar Corporation | Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer |
| JP2014113644A (ja) * | 2012-12-06 | 2014-06-26 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
| US9186772B2 (en) | 2013-03-07 | 2015-11-17 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad with broad spectrum, endpoint detection window and method of polishing therewith |
| KR20160045093A (ko) * | 2013-08-22 | 2016-04-26 | 캐보트 마이크로일렉트로닉스 코포레이션 | 다공성 계면 및 중실 코어를 갖는 연마 패드, 및 관련 장치 및 방법 |
| TWI556910B (zh) | 2013-10-01 | 2016-11-11 | 三芳化學工業股份有限公司 | 複合硏磨墊及其製造方法 |
| WO2015127077A1 (en) * | 2014-02-20 | 2015-08-27 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
| US9818618B2 (en) * | 2014-05-07 | 2017-11-14 | Cabot Microelectronics Corporation | Multi-layer polishing pad for CMP |
| US9873180B2 (en) | 2014-10-17 | 2018-01-23 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| CN107078048B (zh) | 2014-10-17 | 2021-08-13 | 应用材料公司 | 使用加成制造工艺的具复合材料特性的cmp衬垫建构 |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| JP7066608B2 (ja) * | 2015-09-25 | 2022-05-13 | シーエムシー マテリアルズ，インコーポレイティド | 化学機械的研磨パッド、基板を化学機械的に研磨する方法、及び化学機械的研磨パッドを製造する方法 |
| CN105364731B (zh) * | 2015-09-28 | 2020-11-03 | 沈阳市盛世磨料磨具有限公司 | 一种重负荷砂轮的加工方法 |
| TW202400363A (zh) * | 2015-10-16 | 2024-01-01 | 美商應用材料股份有限公司 | 拋光墊及形成其之方法 |
| US10391605B2 (en) | 2016-01-19 | 2019-08-27 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| US10213894B2 (en) * | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
| DE102016222063A1 (de) | 2016-11-10 | 2018-05-17 | Siltronic Ag | Verfahren zum beidseitigen Polieren einer Halbleiterscheibe |
| US11072050B2 (en) * | 2017-08-04 | 2021-07-27 | Applied Materials, Inc. | Polishing pad with window and manufacturing methods thereof |
| KR101924566B1 (ko) * | 2017-09-04 | 2018-12-03 | 에스케이씨 주식회사 | 고단차 제거용 다층 연마패드 |
| KR102718259B1 (ko) * | 2019-07-23 | 2024-10-16 | 케이피엑스케미칼 주식회사 | 탄성 패드 및 그 제조 방법 |
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| CN117677465A (zh) * | 2021-07-06 | 2024-03-08 | 应用材料公司 | 用于化学机械抛光的包含声学窗口的抛光垫 |
| TR2021017346A2 (tr) | 2021-11-08 | 2021-11-22 | T C Erciyes Ueniversitesi | Rezonans hasarlarini önleyen, öngeri̇lmesi̇z ve etri̇yesi̇z, yekpare, sürdürülebi̇li̇r beton travers |
| CN117381657B (zh) * | 2023-10-30 | 2025-10-17 | 安徽禾臣新材料有限公司 | 一种高孔隙率高模量抛光层的抛光垫及其制备方法 |
| CN118650542A (zh) * | 2024-06-03 | 2024-09-17 | 陈湛 | 一种碳化硅抛光的方法 |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3504457A (en) * | 1966-07-05 | 1970-04-07 | Geoscience Instr Corp | Polishing apparatus |
| US3581439A (en) * | 1968-04-04 | 1971-06-01 | Geoscience Instr Corp | Buff apparatus and method of manufacturing buffs |
| US5257478A (en) * | 1990-03-22 | 1993-11-02 | Rodel, Inc. | Apparatus for interlayer planarization of semiconductor material |
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| US5489233A (en) | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5893796A (en) * | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5605760A (en) * | 1995-08-21 | 1997-02-25 | Rodel, Inc. | Polishing pads |
| US5910846A (en) * | 1996-05-16 | 1999-06-08 | Micron Technology, Inc. | Method and apparatus for detecting the endpoint in chemical-mechanical polishing of semiconductor wafers |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| US5692950A (en) * | 1996-08-08 | 1997-12-02 | Minnesota Mining And Manufacturing Company | Abrasive construction for semiconductor wafer modification |
| US6475253B2 (en) * | 1996-09-11 | 2002-11-05 | 3M Innovative Properties Company | Abrasive article and method of making |
| US6328642B1 (en) * | 1997-02-14 | 2001-12-11 | Lam Research Corporation | Integrated pad and belt for chemical mechanical polishing |
| US6287185B1 (en) * | 1997-04-04 | 2001-09-11 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
| AU7138198A (en) * | 1997-04-18 | 1998-11-13 | Cabot Corporation | Polishing pad for a semiconductor substrate |
| US6108091A (en) * | 1997-05-28 | 2000-08-22 | Lam Research Corporation | Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing |
| US6117000A (en) * | 1998-07-10 | 2000-09-12 | Cabot Corporation | Polishing pad for a semiconductor substrate |
| JP2000071167A (ja) * | 1998-08-28 | 2000-03-07 | Toray Ind Inc | 研磨パッド |
| US6908374B2 (en) * | 1998-12-01 | 2005-06-21 | Nutool, Inc. | Chemical mechanical polishing endpoint detection |
| KR100585480B1 (ko) * | 1999-01-21 | 2006-06-02 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | 개선된 연마 패드 및 기판의 연마 방법 |
| US6089963A (en) * | 1999-03-18 | 2000-07-18 | Inland Diamond Products Company | Attachment system for lens surfacing pad |
| CN1150601C (zh) * | 1999-03-31 | 2004-05-19 | 株式会社尼康 | 抛光设备及半导体器件的制造方法 |
| US6224460B1 (en) * | 1999-06-30 | 2001-05-01 | Vlsi Technology, Inc. | Laser interferometry endpoint detection with windowless polishing pad for chemical mechanical polishing process |
| US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
| US6524164B1 (en) * | 1999-09-14 | 2003-02-25 | Applied Materials, Inc. | Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus |
| EP1224060B1 (en) * | 1999-09-29 | 2004-06-23 | Rodel Holdings, Inc. | Polishing pad |
| JP2001162510A (ja) * | 1999-09-30 | 2001-06-19 | Hoya Corp | 研磨方法並びに磁気記録媒体用ガラス基板の製造方法及び磁気記録媒体の製造方法 |
| WO2001045900A1 (en) * | 1999-12-23 | 2001-06-28 | Rodel Holdings, Inc. | Self-leveling pads and methods relating thereto |
| DE10004578C1 (de) * | 2000-02-03 | 2001-07-26 | Wacker Siltronic Halbleitermat | Verfahren zur Herstellung einer Halbleiterscheibe mit polierter Kante |
| JP2001319901A (ja) * | 2000-05-08 | 2001-11-16 | Nikon Corp | 研磨パッド、化学機械研磨装置、基板表面の平坦化方法、及び半導体デバイス製造方法 |
| US6428386B1 (en) | 2000-06-16 | 2002-08-06 | Micron Technology, Inc. | Planarizing pads, planarizing machines, and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies |
| JP2002001647A (ja) * | 2000-06-19 | 2002-01-08 | Rodel Nitta Co | 研磨パッド |
| JP3788729B2 (ja) * | 2000-08-23 | 2006-06-21 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2002124496A (ja) * | 2000-10-18 | 2002-04-26 | Hitachi Ltd | 研磨加工の終点検出計測方法及びその装置、並びにそれを用いた半導体デバイスの製造方法及びその製造装置 |
| JP2002170799A (ja) * | 2000-11-30 | 2002-06-14 | Nikon Corp | 測定装置、研磨状況モニタ装置、研磨装置、半導体デバイス製造方法、並びに半導体デバイス |
| JP2002178257A (ja) * | 2000-12-12 | 2002-06-25 | Nikon Corp | 研磨面観測装置及び研磨装置 |
| US6632129B2 (en) * | 2001-02-15 | 2003-10-14 | 3M Innovative Properties Company | Fixed abrasive article for use in modifying a semiconductor wafer |
| US6544107B2 (en) * | 2001-02-16 | 2003-04-08 | Agere Systems Inc. | Composite polishing pads for chemical-mechanical polishing |
| JP2003133270A (ja) * | 2001-10-26 | 2003-05-09 | Jsr Corp | 化学機械研磨用窓材及び研磨パッド |
| US6722249B2 (en) * | 2001-11-06 | 2004-04-20 | Rodel Holdings, Inc | Method of fabricating a polishing pad having an optical window |
| JP2003220550A (ja) * | 2002-01-24 | 2003-08-05 | Sumitomo Bakelite Co Ltd | 研磨用パッドおよびその製造方法 |
| US6524176B1 (en) * | 2002-03-25 | 2003-02-25 | Macronix International Co. Ltd. | Polishing pad |
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| KR100465649B1 (ko) * | 2002-09-17 | 2005-01-13 | 한국포리올 주식회사 | 일체형 연마 패드 및 그 제조 방법 |
| JP2005001083A (ja) * | 2003-06-13 | 2005-01-06 | Sumitomo Bakelite Co Ltd | 研磨用積層体および研磨方法 |
-
2003
- 2003-06-17 US US10/463,680 patent/US6884156B2/en not_active Expired - Lifetime
-
2004
- 2004-06-03 WO PCT/US2004/017564 patent/WO2005000527A2/en not_active Ceased
- 2004-06-03 KR KR1020057024127A patent/KR101109367B1/ko not_active Expired - Lifetime
- 2004-06-03 CN CN200480016709A patent/CN100591483C/zh not_active Expired - Lifetime
- 2004-06-03 JP JP2006517174A patent/JP5090732B2/ja not_active Expired - Fee Related
- 2004-06-03 DE DE602004018321T patent/DE602004018321D1/de not_active Expired - Lifetime
- 2004-06-03 EP EP04776265A patent/EP1651388B1/en not_active Expired - Lifetime
- 2004-06-03 SG SG200705357-2A patent/SG149719A1/en unknown
- 2004-06-03 AT AT04776265T patent/ATE416881T1/de active
- 2004-06-03 EP EP08017326.3A patent/EP2025469B1/en not_active Expired - Lifetime
- 2004-06-04 TW TW093116204A patent/TWI295949B/zh not_active IP Right Cessation
- 2004-06-15 MY MYPI20042300A patent/MY134466A/en unknown
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8343586B2 (en) | 2008-11-12 | 2013-01-01 | Bestac Advanced Material Co., Ltd. | Conductive polishing pad and method for making the same |
| TWI465315B (zh) * | 2008-11-12 | 2014-12-21 | Bestac Advanced Material Co Ltd | 可導電之拋光墊及其製造方法 |
| US8277290B2 (en) | 2009-04-24 | 2012-10-02 | Bestac Advanced Material Co., Ltd. | Polishing pad and polishing device |
| US10022842B2 (en) | 2012-04-02 | 2018-07-17 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
| US10722997B2 (en) | 2012-04-02 | 2020-07-28 | Thomas West, Inc. | Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads |
| US11090778B2 (en) | 2012-04-02 | 2021-08-17 | Thomas West, Inc. | Methods and systems for centrifugal casting of polymer polish pads and polishing pads made by the methods |
| US11219982B2 (en) | 2012-04-02 | 2022-01-11 | Thomas West, Inc. | Method and systems to control optical transmissivity of a polish pad material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5090732B2 (ja) | 2012-12-05 |
| WO2005000527A3 (en) | 2005-06-02 |
| MY134466A (en) | 2007-12-31 |
| US20040259484A1 (en) | 2004-12-23 |
| WO2005000527A2 (en) | 2005-01-06 |
| DE602004018321D1 (de) | 2009-01-22 |
| SG149719A1 (en) | 2009-02-27 |
| KR101109367B1 (ko) | 2012-01-31 |
| EP1651388A2 (en) | 2006-05-03 |
| JP2006527923A (ja) | 2006-12-07 |
| EP2025469A1 (en) | 2009-02-18 |
| KR20060023562A (ko) | 2006-03-14 |
| EP2025469B1 (en) | 2013-05-01 |
| CN1805826A (zh) | 2006-07-19 |
| TW200513348A (en) | 2005-04-16 |
| CN100591483C (zh) | 2010-02-24 |
| US6884156B2 (en) | 2005-04-26 |
| EP1651388B1 (en) | 2008-12-10 |
| ATE416881T1 (de) | 2008-12-15 |
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