CN100591483C - 用于化学机械抛光的多层抛光垫材料 - Google Patents

用于化学机械抛光的多层抛光垫材料 Download PDF

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Publication number
CN100591483C
CN100591483C CN200480016709A CN200480016709A CN100591483C CN 100591483 C CN100591483 C CN 100591483C CN 200480016709 A CN200480016709 A CN 200480016709A CN 200480016709 A CN200480016709 A CN 200480016709A CN 100591483 C CN100591483 C CN 100591483C
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CN
China
Prior art keywords
polishing pad
layer
polishing
workpiece
transmissive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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CN200480016709A
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English (en)
Chinese (zh)
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CN1805826A (zh
Inventor
阿班纳沙瓦·普拉萨德
罗兰·K·塞维利亚
迈克尔·S·莱西
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CMC Materials LLC
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Cabot Microelectronics Corp
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/008—Abrasive bodies without external bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
CN200480016709A 2003-06-17 2004-06-03 用于化学机械抛光的多层抛光垫材料 Expired - Lifetime CN100591483C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/463,680 2003-06-17
US10/463,680 US6884156B2 (en) 2003-06-17 2003-06-17 Multi-layer polishing pad material for CMP

Publications (2)

Publication Number Publication Date
CN1805826A CN1805826A (zh) 2006-07-19
CN100591483C true CN100591483C (zh) 2010-02-24

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CN200480016709A Expired - Lifetime CN100591483C (zh) 2003-06-17 2004-06-03 用于化学机械抛光的多层抛光垫材料

Country Status (11)

Country Link
US (1) US6884156B2 (enExample)
EP (2) EP2025469B1 (enExample)
JP (1) JP5090732B2 (enExample)
KR (1) KR101109367B1 (enExample)
CN (1) CN100591483C (enExample)
AT (1) ATE416881T1 (enExample)
DE (1) DE602004018321D1 (enExample)
MY (1) MY134466A (enExample)
SG (1) SG149719A1 (enExample)
TW (1) TWI295949B (enExample)
WO (1) WO2005000527A2 (enExample)

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JP2024525530A (ja) * 2021-07-06 2024-07-12 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための音響窓を含む研磨パッド
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EP2025469B1 (en) 2013-05-01
TW200513348A (en) 2005-04-16
EP1651388B1 (en) 2008-12-10
SG149719A1 (en) 2009-02-27
DE602004018321D1 (de) 2009-01-22
KR101109367B1 (ko) 2012-01-31
CN1805826A (zh) 2006-07-19
TWI295949B (en) 2008-04-21
US6884156B2 (en) 2005-04-26
WO2005000527A3 (en) 2005-06-02
EP1651388A2 (en) 2006-05-03
KR20060023562A (ko) 2006-03-14
US20040259484A1 (en) 2004-12-23
MY134466A (en) 2007-12-31
WO2005000527A2 (en) 2005-01-06
JP5090732B2 (ja) 2012-12-05

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