MY134466A - Multi-layer polishing pad material for cmp - Google Patents

Multi-layer polishing pad material for cmp

Info

Publication number
MY134466A
MY134466A MYPI20042300A MYPI20042300A MY134466A MY 134466 A MY134466 A MY 134466A MY PI20042300 A MYPI20042300 A MY PI20042300A MY PI20042300 A MYPI20042300 A MY PI20042300A MY 134466 A MY134466 A MY 134466A
Authority
MY
Malaysia
Prior art keywords
polishing pad
layer
pad material
cmp
layer polishing
Prior art date
Application number
MYPI20042300A
Other languages
English (en)
Inventor
Abaneshwar Prasad
Roland K Sevilla
Michael S Lacy
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Publication of MY134466A publication Critical patent/MY134466A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/008—Abrasive bodies without external bonding agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D13/00—Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
MYPI20042300A 2003-06-17 2004-06-15 Multi-layer polishing pad material for cmp MY134466A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/463,680 US6884156B2 (en) 2003-06-17 2003-06-17 Multi-layer polishing pad material for CMP

Publications (1)

Publication Number Publication Date
MY134466A true MY134466A (en) 2007-12-31

Family

ID=33517127

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20042300A MY134466A (en) 2003-06-17 2004-06-15 Multi-layer polishing pad material for cmp

Country Status (11)

Country Link
US (1) US6884156B2 (enExample)
EP (2) EP1651388B1 (enExample)
JP (1) JP5090732B2 (enExample)
KR (1) KR101109367B1 (enExample)
CN (1) CN100591483C (enExample)
AT (1) ATE416881T1 (enExample)
DE (1) DE602004018321D1 (enExample)
MY (1) MY134466A (enExample)
SG (1) SG149719A1 (enExample)
TW (1) TWI295949B (enExample)
WO (1) WO2005000527A2 (enExample)

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CN117381657B (zh) * 2023-10-30 2025-10-17 安徽禾臣新材料有限公司 一种高孔隙率高模量抛光层的抛光垫及其制备方法
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JP2005001083A (ja) * 2003-06-13 2005-01-06 Sumitomo Bakelite Co Ltd 研磨用積層体および研磨方法

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JP5090732B2 (ja) 2012-12-05
WO2005000527A3 (en) 2005-06-02
US20040259484A1 (en) 2004-12-23
WO2005000527A2 (en) 2005-01-06
DE602004018321D1 (de) 2009-01-22
SG149719A1 (en) 2009-02-27
KR101109367B1 (ko) 2012-01-31
EP1651388A2 (en) 2006-05-03
JP2006527923A (ja) 2006-12-07
EP2025469A1 (en) 2009-02-18
KR20060023562A (ko) 2006-03-14
EP2025469B1 (en) 2013-05-01
CN1805826A (zh) 2006-07-19
TW200513348A (en) 2005-04-16
CN100591483C (zh) 2010-02-24
US6884156B2 (en) 2005-04-26
TWI295949B (en) 2008-04-21
EP1651388B1 (en) 2008-12-10
ATE416881T1 (de) 2008-12-15

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