AU2001227775A1 - Polishing pad with release layer - Google Patents

Polishing pad with release layer

Info

Publication number
AU2001227775A1
AU2001227775A1 AU2001227775A AU2777501A AU2001227775A1 AU 2001227775 A1 AU2001227775 A1 AU 2001227775A1 AU 2001227775 A AU2001227775 A AU 2001227775A AU 2777501 A AU2777501 A AU 2777501A AU 2001227775 A1 AU2001227775 A1 AU 2001227775A1
Authority
AU
Australia
Prior art keywords
polishing pad
release layer
polishing
release
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001227775A
Inventor
Carl R Kessel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001227775A1 publication Critical patent/AU2001227775A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
AU2001227775A 2000-01-24 2001-01-08 Polishing pad with release layer Abandoned AU2001227775A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09490646 2000-01-24
US09/490,646 US6746311B1 (en) 2000-01-24 2000-01-24 Polishing pad with release layer
PCT/US2001/000729 WO2001053042A1 (en) 2000-01-24 2001-01-08 Polishing pad with release layer

Publications (1)

Publication Number Publication Date
AU2001227775A1 true AU2001227775A1 (en) 2001-07-31

Family

ID=23948921

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001227775A Abandoned AU2001227775A1 (en) 2000-01-24 2001-01-08 Polishing pad with release layer

Country Status (3)

Country Link
US (1) US6746311B1 (en)
AU (1) AU2001227775A1 (en)
WO (1) WO2001053042A1 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NZ519162A (en) * 2002-08-27 2004-10-29 Stephen Ross Hope Abrasive holder
WO2004022283A1 (en) * 2002-09-02 2004-03-18 Elm Inc. Optical disk polishing device
DE60316144T2 (en) * 2002-12-03 2007-12-13 S.C. Johnson & Son, Inc., Racine MOTORALLY DRIVEN CLEANING / POLISHING DEVICE
US6908366B2 (en) 2003-01-10 2005-06-21 3M Innovative Properties Company Method of using a soft subpad for chemical mechanical polishing
FR2858574B1 (en) * 2003-08-08 2007-02-16 Procedes Et Equipements Pour L POLISHING PLATE COMPRISING A POLISHING FABRIC THAT ADDS HORIZALLALLY TO THE SUPPORT
US7565712B2 (en) * 2003-11-26 2009-07-28 S.C. Johnson & Son, Inc. Powered cleaner/polisher
US7160413B2 (en) * 2004-01-09 2007-01-09 Mipox International Corporation Layered support and method for laminating CMP pads
US7198549B2 (en) * 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
US20100009606A1 (en) * 2008-07-10 2010-01-14 3M Innovative Properties Company Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof
US20100009607A1 (en) * 2008-07-10 2010-01-14 3M Innovative Properties Company Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof
US8469775B2 (en) * 2008-07-10 2013-06-25 3M Innovative Properties Company Conversion assemblage adaptable for use in combination with a surface modifying apparatus and method thereof
US20100258527A1 (en) * 2009-04-08 2010-10-14 Honeywell International Inc. Methods of protecting surfaces from polishing residue
TWI510328B (en) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd Base layer, polishing pad including the same and polishing method
WO2012160529A1 (en) * 2011-05-24 2012-11-29 Hanan Frum A motorized handheld polishing and cleaning apparatus
JP5793014B2 (en) * 2011-07-21 2015-10-14 株式会社不二製作所 Side polishing method for hard brittle material substrate
JP5789634B2 (en) * 2012-05-14 2015-10-07 株式会社荏原製作所 Polishing pad for polishing a workpiece, chemical mechanical polishing apparatus, and method for polishing a workpiece using the chemical mechanical polishing apparatus
KR20150114382A (en) * 2013-01-31 2015-10-12 가부시키가이샤 에바라 세이사꾸쇼 Polishing apparatus, method for attaching polishing pad, and method for replacing polishing pad
CN105579194B (en) 2013-09-25 2019-04-26 3M创新有限公司 Multilayer polishing mattress
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
CN107078048B (en) 2014-10-17 2021-08-13 应用材料公司 CMP pad construction with composite material properties using additive manufacturing process
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
USD785339S1 (en) * 2014-10-23 2017-05-02 Griot's Garage, Inc. Hand applicator buffing pad
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
WO2017074773A1 (en) 2015-10-30 2017-05-04 Applied Materials, Inc. An apparatus and method of forming a polishing article that has a desired zeta potential
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. Abrasive delivery polishing pads and manufacturing methods thereof
JP7299970B2 (en) 2018-09-04 2023-06-28 アプライド マテリアルズ インコーポレイテッド Formulations for improved polishing pads
US20210053179A1 (en) * 2019-08-23 2021-02-25 Taiwan Semiconductor Manufacturing Company, Ltd. Novel CMP Pad Design and Method of Using the Same
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ

Family Cites Families (26)

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Publication number Priority date Publication date Assignee Title
US3504457A (en) * 1966-07-05 1970-04-07 Geoscience Instr Corp Polishing apparatus
US3499250A (en) * 1967-04-07 1970-03-10 Geoscience Instr Corp Polishing apparatus
US3863395A (en) * 1974-02-19 1975-02-04 Shugart Associates Inc Apparatus for polishing a spherical surface on a magnetic recording transducer
US4343910A (en) 1980-04-22 1982-08-10 Chesebrough-Pond's Inc. Compositions, articles and methods for polishing surfaces
US4527358A (en) 1983-08-29 1985-07-09 General Signal Corporation Removable polishing pad assembly
US4667447A (en) * 1983-08-31 1987-05-26 Minnesota Mining And Manufacturing Company Coated abrasive sheet material magnetically attached to a support surface on an abrading tool
JP2707264B2 (en) * 1987-12-28 1998-01-28 ハイ・コントロール・リミテッド Polishing sheet and method for producing the same
US4879258A (en) * 1988-08-31 1989-11-07 Texas Instruments Incorporated Integrated circuit planarization by mechanical polishing
AU638736B2 (en) 1989-09-15 1993-07-08 Minnesota Mining And Manufacturing Company A coated abrasive containing a pressure-sensitive adhesive coatable from water
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
IT226758Z2 (en) 1992-07-09 1997-07-01 Norton ABRASIVE TOOL WHICH STRIP DISC AND SIMILAR FOR A SANDING AND SANDING MACHINE
US6069080A (en) 1992-08-19 2000-05-30 Rodel Holdings, Inc. Fixed abrasive polishing system for the manufacture of semiconductor devices, memory disks and the like
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
US5505747A (en) 1994-01-13 1996-04-09 Minnesota Mining And Manufacturing Company Method of making an abrasive article
US5507464A (en) 1994-03-22 1996-04-16 Minnesota Mining And Manufacturing Company Article support using stretch releasing adhesives
US5551136A (en) 1995-04-12 1996-09-03 Advanced Micro Devices, Inc. Pad removal device
US5958794A (en) 1995-09-22 1999-09-28 Minnesota Mining And Manufacturing Company Method of modifying an exposed surface of a semiconductor wafer
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
DE19641118C1 (en) 1996-10-05 1998-04-23 Beiersdorf Ag Removable, self-adhesive hook
US6379221B1 (en) 1996-12-31 2002-04-30 Applied Materials, Inc. Method and apparatus for automatically changing a polishing pad in a chemical mechanical polishing system
EP1016133B1 (en) 1997-04-30 2009-10-07 Minnesota Mining And Manufacturing Company Method of planarizing the upper surface of a semiconductor wafer
US5931724A (en) 1997-07-11 1999-08-03 Applied Materials, Inc. Mechanical fastener to hold a polishing pad on a platen in a chemical mechanical polishing system
WO1999007518A1 (en) 1997-08-06 1999-02-18 Rodel Holdings, Inc. Continuously variable planarization and polishing pad system
JPH11151661A (en) 1997-11-20 1999-06-08 Speedfam Co Ltd Polishing pad with bonding tape and polishing pad bonding method
US6972141B1 (en) 1997-12-12 2005-12-06 3M Innovative Properties Company Removable adhesive tape laminate and separable fastener
US6036586A (en) 1998-07-29 2000-03-14 Micron Technology, Inc. Apparatus and method for reducing removal forces for CMP pads

Also Published As

Publication number Publication date
WO2001053042A1 (en) 2001-07-26
US6746311B1 (en) 2004-06-08

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