AU2605401A - Flexible polishing pad having reduced surface stress - Google Patents

Flexible polishing pad having reduced surface stress

Info

Publication number
AU2605401A
AU2605401A AU26054/01A AU2605401A AU2605401A AU 2605401 A AU2605401 A AU 2605401A AU 26054/01 A AU26054/01 A AU 26054/01A AU 2605401 A AU2605401 A AU 2605401A AU 2605401 A AU2605401 A AU 2605401A
Authority
AU
Australia
Prior art keywords
polishing pad
reduced surface
surface stress
flexible polishing
flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
AU26054/01A
Inventor
Xuyen Pham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2605401A publication Critical patent/AU2605401A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/02—Backings, e.g. foils, webs, mesh fabrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU26054/01A 1999-12-30 2000-12-28 Flexible polishing pad having reduced surface stress Withdrawn AU2605401A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09475903 1999-12-30
US09/475,903 US20020077053A1 (en) 1999-12-30 1999-12-30 Flexible polishing pad having reduced surface stress
PCT/US2000/035510 WO2001049449A2 (en) 1999-12-30 2000-12-28 Flexible polishing pad having reduced surface stress

Publications (1)

Publication Number Publication Date
AU2605401A true AU2605401A (en) 2001-07-16

Family

ID=23889647

Family Applications (1)

Application Number Title Priority Date Filing Date
AU26054/01A Withdrawn AU2605401A (en) 1999-12-30 2000-12-28 Flexible polishing pad having reduced surface stress

Country Status (3)

Country Link
US (1) US20020077053A1 (en)
AU (1) AU2605401A (en)
WO (1) WO2001049449A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI238100B (en) * 2003-09-29 2005-08-21 Iv Technologies Co Ltd Polishing pad and fabricating method thereof
US7349067B2 (en) * 2004-06-21 2008-03-25 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
EP3599050A1 (en) * 2018-07-27 2020-01-29 Steinemann Technology AG Grinding assembly for a grinding machine

Also Published As

Publication number Publication date
US20020077053A1 (en) 2002-06-20
WO2001049449A2 (en) 2001-07-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase