AU2002350031A1 - Polishing pads and manufacturing methods - Google Patents

Polishing pads and manufacturing methods

Info

Publication number
AU2002350031A1
AU2002350031A1 AU2002350031A AU2002350031A AU2002350031A1 AU 2002350031 A1 AU2002350031 A1 AU 2002350031A1 AU 2002350031 A AU2002350031 A AU 2002350031A AU 2002350031 A AU2002350031 A AU 2002350031A AU 2002350031 A1 AU2002350031 A1 AU 2002350031A1
Authority
AU
Australia
Prior art keywords
manufacturing methods
polishing pads
polishing
pads
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002350031A
Inventor
Donald P. Dietz
Inc Thomas West
Thomas West
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thomas West Inc
Original Assignee
Thomas West Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomas West Inc filed Critical Thomas West Inc
Publication of AU2002350031A1 publication Critical patent/AU2002350031A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2002350031A 2001-10-29 2002-10-29 Polishing pads and manufacturing methods Abandoned AU2002350031A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US34096201P 2001-10-29 2001-10-29
US60/340,962 2001-10-29
US10/020,081 US20030083003A1 (en) 2001-10-29 2001-12-11 Polishing pads and manufacturing methods
US10/020,081 2001-12-11
PCT/US2002/034618 WO2003037565A2 (en) 2001-10-29 2002-10-29 Polishing pads and manufacturing methods

Publications (1)

Publication Number Publication Date
AU2002350031A1 true AU2002350031A1 (en) 2003-05-12

Family

ID=26692984

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002350031A Abandoned AU2002350031A1 (en) 2001-10-29 2002-10-29 Polishing pads and manufacturing methods

Country Status (3)

Country Link
US (1) US20030083003A1 (en)
AU (1) AU2002350031A1 (en)
WO (1) WO2003037565A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
TWI286964B (en) 2003-03-25 2007-09-21 Neopad Technologies Corp Customized polish pads for chemical mechanical planarization
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI385050B (en) * 2005-02-18 2013-02-11 Nexplanar Corp Customized polishing pads for cmp and methods of fabrication and use thereof
WO2007016498A2 (en) * 2005-08-02 2007-02-08 Raytech Composites, Inc. Nonwoven polishing pads for chemical mechanical polishing
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046729A (en) * 1975-06-02 1977-09-06 Ppg Industries, Inc. Water-reduced urethane coating compositions
US4171391A (en) * 1978-09-07 1979-10-16 Wilmington Chemical Corporation Method of preparing composite sheet material
US4376148A (en) * 1980-09-18 1983-03-08 Norwood Industries, Inc. Impregnated non-woven sheet material with ionically solubilized resin
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
US4342805A (en) * 1980-09-18 1982-08-03 Norwood Industries, Inc. Simulated leather sheet material
US4496624A (en) * 1982-07-14 1985-01-29 Norwood Industries, Inc. Fibrous web impregnated with coagulated polyurethane and polyolefin admixture
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
JPS62140769A (en) * 1985-12-16 1987-06-24 Toyo Cloth Kk Manufacture of abrasive cloth
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
FR2673574B1 (en) * 1991-03-06 1994-11-04 Pierre Delamare PROCESS FOR PRODUCING POLISHING DISCS AND DISCS OBTAINED THEREBY.
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US6287185B1 (en) * 1997-04-04 2001-09-11 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Grinding pad, grinding apparatus and grinding method
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods
US6176763B1 (en) * 1999-02-04 2001-01-23 Micron Technology, Inc. Method and apparatus for uniformly planarizing a microelectronic substrate

Also Published As

Publication number Publication date
US20030083003A1 (en) 2003-05-01
WO2003037565A3 (en) 2003-10-23
WO2003037565A2 (en) 2003-05-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase