AU2002334406A1 - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- AU2002334406A1 AU2002334406A1 AU2002334406A AU2002334406A AU2002334406A1 AU 2002334406 A1 AU2002334406 A1 AU 2002334406A1 AU 2002334406 A AU2002334406 A AU 2002334406A AU 2002334406 A AU2002334406 A AU 2002334406A AU 2002334406 A1 AU2002334406 A1 AU 2002334406A1
- Authority
- AU
- Australia
- Prior art keywords
- polishing composition
- polishing
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-266315 | 2001-09-03 | ||
JP2001266315 | 2001-09-03 | ||
US31796201P | 2001-09-10 | 2001-09-10 | |
US60/317,962 | 2001-09-10 | ||
JP2002-132738 | 2002-05-08 | ||
JP2002132738A JP4074126B2 (en) | 2001-09-03 | 2002-05-08 | Polishing composition |
PCT/JP2002/008925 WO2003020839A1 (en) | 2001-09-03 | 2002-09-03 | Polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002334406A1 true AU2002334406A1 (en) | 2003-03-18 |
Family
ID=27347431
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002334406A Abandoned AU2002334406A1 (en) | 2001-09-03 | 2002-09-03 | Polishing composition |
Country Status (4)
Country | Link |
---|---|
US (1) | US20050028449A1 (en) |
EP (1) | EP1425357A1 (en) |
AU (1) | AU2002334406A1 (en) |
WO (1) | WO2003020839A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7306748B2 (en) * | 2003-04-25 | 2007-12-11 | Saint-Gobain Ceramics & Plastics, Inc. | Methods for machining ceramics |
WO2004111145A1 (en) * | 2003-06-13 | 2004-12-23 | Showa Denko K.K. | Polishing composition and polishing method |
JP4202201B2 (en) * | 2003-07-03 | 2008-12-24 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP4644434B2 (en) | 2004-03-24 | 2011-03-02 | 株式会社フジミインコーポレーテッド | Polishing composition |
JP4267546B2 (en) * | 2004-04-06 | 2009-05-27 | 花王株式会社 | Substrate manufacturing method |
JP2006077127A (en) * | 2004-09-09 | 2006-03-23 | Fujimi Inc | Polishing composition and polishing method using the composition |
US7678702B2 (en) * | 2005-08-31 | 2010-03-16 | Air Products And Chemicals, Inc. | CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use |
US20070075042A1 (en) * | 2005-10-05 | 2007-04-05 | Siddiqui Junaid A | Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method |
DE102006007888A1 (en) * | 2006-02-21 | 2007-08-23 | Degussa Gmbh | Aqueous alumina dispersion for use in melamine resin formulation for making cured product e.g. laminate for furniture or flooring contains highly disperse alumina surface modified with amino- and/or hydroxy-substituted organophosphonic acid |
SG139699A1 (en) | 2006-08-02 | 2008-02-29 | Fujimi Inc | Polishing composition and polishing process |
US20090124173A1 (en) * | 2007-11-09 | 2009-05-14 | Cabot Microelectronics Corporation | Compositions and methods for ruthenium and tantalum barrier cmp |
JP2009164186A (en) | 2007-12-28 | 2009-07-23 | Fujimi Inc | Polishing composition |
US8974561B2 (en) * | 2011-09-30 | 2015-03-10 | Hoya Corporation | Manufacturing method of glass substrate for magnetic disk, magnetic disk, and magnetic recording / reproducing device |
JP6940315B2 (en) * | 2017-06-22 | 2021-09-22 | 山口精研工業株式会社 | Abrasive composition for magnetic disk substrates |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5783489A (en) * | 1996-09-24 | 1998-07-21 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
WO1998023697A1 (en) * | 1996-11-26 | 1998-06-04 | Cabot Corporation | Composition and method for polishing rigid disks |
US5759917A (en) * | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
US6217416B1 (en) * | 1998-06-26 | 2001-04-17 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrates |
DE60015411T2 (en) * | 1999-03-18 | 2005-10-27 | Kabushiki Kaisha Toshiba, Kawasaki | Aqueous dispersion slurry for chemical mechanical polishing process |
WO2001012741A1 (en) * | 1999-08-13 | 2001-02-22 | Cabot Microelectronics Corporation | Polishing system with stopping compound and method of its use |
US6527817B1 (en) * | 1999-11-15 | 2003-03-04 | Cabot Microelectronics Corporation | Composition and method for planarizing surfaces |
US6471884B1 (en) * | 2000-04-04 | 2002-10-29 | Cabot Microelectronics Corporation | Method for polishing a memory or rigid disk with an amino acid-containing composition |
JP2003530227A (en) * | 2000-04-07 | 2003-10-14 | キャボット マイクロエレクトロニクス コーポレイション | Integrated chemical mechanical polishing |
-
2002
- 2002-09-03 US US10/488,296 patent/US20050028449A1/en not_active Abandoned
- 2002-09-03 EP EP02797709A patent/EP1425357A1/en not_active Withdrawn
- 2002-09-03 AU AU2002334406A patent/AU2002334406A1/en not_active Abandoned
- 2002-09-03 WO PCT/JP2002/008925 patent/WO2003020839A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
EP1425357A1 (en) | 2004-06-09 |
WO2003020839A1 (en) | 2003-03-13 |
WO2003020839A8 (en) | 2004-04-15 |
US20050028449A1 (en) | 2005-02-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |