WO2003020839A8 - Polishing composition - Google Patents

Polishing composition

Info

Publication number
WO2003020839A8
WO2003020839A8 PCT/JP2002/008925 JP0208925W WO03020839A8 WO 2003020839 A8 WO2003020839 A8 WO 2003020839A8 JP 0208925 W JP0208925 W JP 0208925W WO 03020839 A8 WO03020839 A8 WO 03020839A8
Authority
WO
WIPO (PCT)
Prior art keywords
polishing composition
salt
inorganic acid
polishing
phosphorus
Prior art date
Application number
PCT/JP2002/008925
Other languages
French (fr)
Other versions
WO2003020839A1 (en
Inventor
Norihiko Miyata
Gong-Hong Hong
Junichiro Ando
Original Assignee
Showa Denko Kk
Yamaguchi Seiken Kogyo K K
Norihiko Miyata
Gong-Hong Hong
Junichiro Ando
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002132738A external-priority patent/JP4074126B2/en
Application filed by Showa Denko Kk, Yamaguchi Seiken Kogyo K K, Norihiko Miyata, Gong-Hong Hong, Junichiro Ando filed Critical Showa Denko Kk
Priority to EP02797709A priority Critical patent/EP1425357A1/en
Priority to US10/488,296 priority patent/US20050028449A1/en
Priority to AU2002334406A priority patent/AU2002334406A1/en
Publication of WO2003020839A1 publication Critical patent/WO2003020839A1/en
Publication of WO2003020839A8 publication Critical patent/WO2003020839A8/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

A polishing composition of abrasive grains, a phosphorus-containing inorganic acid or salt thereof and another inorganic acid or salt thereof contained in an aqueous medium is used for the polishing of magnetic disk substrates or the like.
PCT/JP2002/008925 2001-09-03 2002-09-03 Polishing composition WO2003020839A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP02797709A EP1425357A1 (en) 2001-09-03 2002-09-03 Polishing composition
US10/488,296 US20050028449A1 (en) 2001-09-03 2002-09-03 Polishing composition
AU2002334406A AU2002334406A1 (en) 2001-09-03 2002-09-03 Polishing composition

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001266315 2001-09-03
JP2001-266315 2001-09-03
US31796201P 2001-09-10 2001-09-10
US60/317,962 2001-09-10
JP2002132738A JP4074126B2 (en) 2001-09-03 2002-05-08 Polishing composition
JP2002-132738 2002-05-08

Publications (2)

Publication Number Publication Date
WO2003020839A1 WO2003020839A1 (en) 2003-03-13
WO2003020839A8 true WO2003020839A8 (en) 2004-04-15

Family

ID=27347431

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/008925 WO2003020839A1 (en) 2001-09-03 2002-09-03 Polishing composition

Country Status (4)

Country Link
US (1) US20050028449A1 (en)
EP (1) EP1425357A1 (en)
AU (1) AU2002334406A1 (en)
WO (1) WO2003020839A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7306748B2 (en) * 2003-04-25 2007-12-11 Saint-Gobain Ceramics & Plastics, Inc. Methods for machining ceramics
WO2004111145A1 (en) * 2003-06-13 2004-12-23 Showa Denko K.K. Polishing composition and polishing method
JP4202201B2 (en) * 2003-07-03 2008-12-24 株式会社フジミインコーポレーテッド Polishing composition
JP4644434B2 (en) 2004-03-24 2011-03-02 株式会社フジミインコーポレーテッド Polishing composition
JP4267546B2 (en) * 2004-04-06 2009-05-27 花王株式会社 Substrate manufacturing method
JP2006077127A (en) * 2004-09-09 2006-03-23 Fujimi Inc Polishing composition and polishing method using the composition
US7678702B2 (en) * 2005-08-31 2010-03-16 Air Products And Chemicals, Inc. CMP composition of boron surface-modified abrasive and nitro-substituted sulfonic acid and method of use
US20070075042A1 (en) * 2005-10-05 2007-04-05 Siddiqui Junaid A Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method
DE102006007888A1 (en) * 2006-02-21 2007-08-23 Degussa Gmbh Aqueous alumina dispersion for use in melamine resin formulation for making cured product e.g. laminate for furniture or flooring contains highly disperse alumina surface modified with amino- and/or hydroxy-substituted organophosphonic acid
SG139699A1 (en) 2006-08-02 2008-02-29 Fujimi Inc Polishing composition and polishing process
US20090124173A1 (en) * 2007-11-09 2009-05-14 Cabot Microelectronics Corporation Compositions and methods for ruthenium and tantalum barrier cmp
JP2009164186A (en) 2007-12-28 2009-07-23 Fujimi Inc Polishing composition
SG188775A1 (en) * 2011-09-30 2013-04-30 Hoya Corp Manufacturing method of glass substrate for magnetic disk, magnetic disk, and magnetic data recording/reproducing device
JP6940315B2 (en) * 2017-06-22 2021-09-22 山口精研工業株式会社 Abrasive composition for magnetic disk substrates

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5783489A (en) * 1996-09-24 1998-07-21 Cabot Corporation Multi-oxidizer slurry for chemical mechanical polishing
AU5460898A (en) * 1996-11-26 1998-06-22 Cabot Corporation Composition and method for polishing rigid disks
US5759917A (en) * 1996-12-30 1998-06-02 Cabot Corporation Composition for oxide CMP
US6217416B1 (en) * 1998-06-26 2001-04-17 Cabot Microelectronics Corporation Chemical mechanical polishing slurry useful for copper/tantalum substrates
KR100447552B1 (en) * 1999-03-18 2004-09-08 가부시끼가이샤 도시바 Aqueous Dispersion, Aqueous Dispersion for Chemical Mechanical Polishing Used for Manufacture of Semiconductor Devices, Method for Manufacture of Semiconductor Devices, and Method for Formation of Embedded Wiring
CN100335580C (en) * 1999-08-13 2007-09-05 卡伯特微电子公司 Polishing system with stopping compound and method of its use
US6527817B1 (en) * 1999-11-15 2003-03-04 Cabot Microelectronics Corporation Composition and method for planarizing surfaces
US6471884B1 (en) * 2000-04-04 2002-10-29 Cabot Microelectronics Corporation Method for polishing a memory or rigid disk with an amino acid-containing composition
WO2001076819A1 (en) * 2000-04-07 2001-10-18 Cabot Microelectronics Corporation Integrated chemical-mechanical polishing

Also Published As

Publication number Publication date
EP1425357A1 (en) 2004-06-09
AU2002334406A1 (en) 2003-03-18
WO2003020839A1 (en) 2003-03-13
US20050028449A1 (en) 2005-02-10

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