TW200516133A - Polishing kit for magnetic disk - Google Patents

Polishing kit for magnetic disk

Info

Publication number
TW200516133A
TW200516133A TW093124985A TW93124985A TW200516133A TW 200516133 A TW200516133 A TW 200516133A TW 093124985 A TW093124985 A TW 093124985A TW 93124985 A TW93124985 A TW 93124985A TW 200516133 A TW200516133 A TW 200516133A
Authority
TW
Taiwan
Prior art keywords
magnetic disk
oxidizing agent
acid
kit
polishing
Prior art date
Application number
TW093124985A
Other languages
Chinese (zh)
Other versions
TWI359859B (en
Inventor
Kiyoteru Osawa
Hiroaki Kitayama
Toshiya Hagihara
Original Assignee
Kao Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kao Corp filed Critical Kao Corp
Publication of TW200516133A publication Critical patent/TW200516133A/en
Application granted granted Critical
Publication of TWI359859B publication Critical patent/TWI359859B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/048—Lapping machines or devices; Accessories designed for working plane surfaces of sliders and magnetic heads of hard disc drives or the like
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

A polishing kit for a magnetic disk containing (A) a slurry containing an alumina, (B) an oxidizing agent solution containing an oxidizing agent, and (C) an acid agent solution containing an acid; a polishing kit for a magnetic disk containing (A) a slurry containing an alumina, and (D) an additive solution containing an oxidizing agent and an inorganic acid; and a polishing kit for a magnetic disk containing (A) a slurry containing an alumina, and (C) an acid agent solution containing an acid, wherein the polishing kit is used with an oxidizing agent solution (B) containing an oxidizing agent. The polishing composition kit can be suitably used for the manufacture of high-quality magnetic disk substrates such as hard disks.
TW093124985A 2003-09-09 2004-08-19 Polishing kit for magnetic disk TWI359859B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003317191A JP4336550B2 (en) 2003-09-09 2003-09-09 Polishing liquid kit for magnetic disk

Publications (2)

Publication Number Publication Date
TW200516133A true TW200516133A (en) 2005-05-16
TWI359859B TWI359859B (en) 2012-03-11

Family

ID=33095507

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124985A TWI359859B (en) 2003-09-09 2004-08-19 Polishing kit for magnetic disk

Country Status (6)

Country Link
US (1) US20050054273A1 (en)
JP (1) JP4336550B2 (en)
CN (1) CN1613607B (en)
GB (1) GB2406098B (en)
MY (1) MY137560A (en)
TW (1) TWI359859B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2007060869A1 (en) * 2005-11-24 2009-05-07 Jsr株式会社 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
US20070122546A1 (en) * 2005-11-25 2007-05-31 Mort Cohen Texturing pads and slurry for magnetic heads
KR20090031571A (en) * 2006-07-18 2009-03-26 제이에스알 가부시끼가이샤 Aqueous dispersion for chemical mechanical polishing, method for producing the same, and chemical mechanical polishing method
JPWO2008117573A1 (en) * 2007-03-27 2010-07-15 Jsr株式会社 Chemical mechanical polishing aqueous dispersion, kit for preparing the aqueous dispersion, chemical mechanical polishing method, and semiconductor device manufacturing method
JP5403922B2 (en) * 2008-02-26 2014-01-29 富士フイルム株式会社 Polishing liquid and polishing method
JP5782257B2 (en) * 2008-05-01 2015-09-24 Jsr株式会社 Chemical mechanical polishing aqueous dispersion, kit for preparing the chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
US20100096584A1 (en) * 2008-10-22 2010-04-22 Fujimi Corporation Polishing Composition and Polishing Method Using the Same
CN103127874B (en) * 2013-03-01 2014-12-17 上海卫康光学眼镜有限公司 Polishing liquid dispersion assistant, polishing liquid containing dispersion assistant, and preparation method and application of polishing liquid
JP6366308B2 (en) * 2014-03-12 2018-08-01 株式会社ディスコ Processing method
JP7096714B2 (en) * 2017-06-26 2022-07-06 花王株式会社 Silica slurry for polishing liquid composition
WO2019004161A1 (en) * 2017-06-26 2019-01-03 花王株式会社 Silica slurry for polishing-liquid composition

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5478435A (en) * 1994-12-16 1995-12-26 National Semiconductor Corp. Point of use slurry dispensing system
JPH09190626A (en) * 1995-11-10 1997-07-22 Kao Corp Abrasive material composition, substrate for magnetic recording medium and its production, as well as magnetic recording medium
KR100761636B1 (en) * 1996-09-30 2007-09-27 히다치 가세고교 가부시끼가이샤 A Cerium Oxide Particle
US6004193A (en) * 1997-07-17 1999-12-21 Lsi Logic Corporation Dual purpose retaining ring and polishing pad conditioner
US6149696A (en) * 1997-11-06 2000-11-21 Komag, Inc. Colloidal silica slurry for NiP plated disk polishing
JP2000063805A (en) * 1998-08-18 2000-02-29 Showa Denko Kk Composition for abrasive finishing of magnetic disc substrate
US5972124A (en) * 1998-08-31 1999-10-26 Advanced Micro Devices, Inc. Method for cleaning a surface of a dielectric material
CN1203529C (en) * 1999-08-17 2005-05-25 日立化成工业株式会社 Polishing compound for chemimachanical polishing and method for polishing substrate
JP4238951B2 (en) * 1999-09-28 2009-03-18 株式会社フジミインコーポレーテッド Polishing composition and method for producing memory hard disk using the same
JP2001187877A (en) * 1999-12-28 2001-07-10 Nec Corp Slurry for chemical mechanical polishing
JP3841995B2 (en) * 1999-12-28 2006-11-08 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
US6299795B1 (en) * 2000-01-18 2001-10-09 Praxair S.T. Technology, Inc. Polishing slurry
JP2003530227A (en) * 2000-04-07 2003-10-14 キャボット マイクロエレクトロニクス コーポレイション Integrated chemical mechanical polishing
JP3768402B2 (en) * 2000-11-24 2006-04-19 Ｎｅｃエレクトロニクス株式会社 Chemical mechanical polishing slurry
JP4009986B2 (en) * 2000-11-29 2007-11-21 株式会社フジミインコーポレーテッド Polishing composition and polishing method for polishing memory hard disk using the same
US7029373B2 (en) * 2001-08-14 2006-04-18 Advanced Technology Materials, Inc. Chemical mechanical polishing compositions for metal and associated materials and method of using same
US20030077983A1 (en) * 2001-10-12 2003-04-24 International Business Machines Corporation Cleaning polish etch composition and process for a superfinished surface of a substrate
JP2003133266A (en) * 2001-10-22 2003-05-09 Sumitomo Bakelite Co Ltd Polishing composition
JP2003197572A (en) * 2001-12-26 2003-07-11 Sumitomo Bakelite Co Ltd Composition for polishing
KR100457417B1 (en) * 2001-12-28 2004-11-18 제일모직주식회사 Slurry For Polishing Metal Lines
JP2003218071A (en) * 2002-01-28 2003-07-31 Sumitomo Bakelite Co Ltd Composition for polishing
US20030162398A1 (en) * 2002-02-11 2003-08-28 Small Robert J. Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same
US6755721B2 (en) * 2002-02-22 2004-06-29 Saint-Gobain Ceramics And Plastics, Inc. Chemical mechanical polishing of nickel phosphorous alloys
US6582279B1 (en) * 2002-03-07 2003-06-24 Hitachi Global Storage Technologies Netherlands B.V. Apparatus and method for reclaiming a disk substrate for use in a data storage device
JP4707311B2 (en) * 2003-08-08 2011-06-22 花王株式会社 Magnetic disk substrate
US20050139119A1 (en) * 2003-12-24 2005-06-30 Rader W. S. Polishing composition
JP4249008B2 (en) * 2003-12-25 2009-04-02 株式会社フジミインコーポレーテッド Polishing composition and polishing method using the same

Also Published As

Publication number Publication date
CN1613607A (en) 2005-05-11
JP2005081504A (en) 2005-03-31
GB2406098B (en) 2007-09-12
GB0418338D0 (en) 2004-09-22
JP4336550B2 (en) 2009-09-30
MY137560A (en) 2009-02-27
GB2406098A (en) 2005-03-23
TWI359859B (en) 2012-03-11
CN1613607B (en) 2012-02-01
US20050054273A1 (en) 2005-03-10

Similar Documents

Publication Publication Date Title
MY126249A (en) Polishing composition.
MY117521A (en) Polishing composition
MY133305A (en) Polishing composition
MY129818A (en) Method for manufacturing substrate
TW200516133A (en) Polishing kit for magnetic disk
DE602005002164D1 (en) Polishing composition and polishing method
MY144770A (en) Polishing composition
MY142247A (en) Polishing composition
MY150651A (en) Polishing composition and polishing method
WO2010120784A8 (en) Chemical mechanical polishing of silicon carbide comprising surfaces
DE60030444D1 (en) CMP COMPOSITION CONTAINING SILANO MODIFIED GRINDING PARTICLES
GB2439799B (en) Polishing composition for glass substrate
TW200621967A (en) Polishing composition
DK1794173T3 (en) Amplification blocks containing intercalating nucleic acids (INA) containing intercalating pseudonucleotides (IPN)
MY143652A (en) Polishing composition for glass substrate
SG141356A1 (en) Polishing slurry and polishing method using same
MY154861A (en) Polishing liquid composition for magnetic-disk substrate
AU4810200A (en) Slurry composition and method of chemical mechanical polishing using same
TW200518874A (en) Substrate for magnetic disk
TW200516134A (en) Novel slurry for chemical mechanical polishing of metals
TW200710210A (en) Slurry for chemical mechanical polishing of aluminum
MY139074A (en) Polishing composition
TW200609336A (en) Polishing composition and substrate polishing method
ATE529489T1 (en) POLISHING COMPOSITION AND POLISHING METHOD
TW200745316A (en) Copper-based metal polishing compositions and polishing process