SG141356A1 - Polishing slurry and polishing method using same - Google Patents

Polishing slurry and polishing method using same

Info

Publication number
SG141356A1
SG141356A1 SG200706865-3A SG2007068653A SG141356A1 SG 141356 A1 SG141356 A1 SG 141356A1 SG 2007068653 A SG2007068653 A SG 2007068653A SG 141356 A1 SG141356 A1 SG 141356A1
Authority
SG
Singapore
Prior art keywords
polishing
slurry
same
magnetic layer
soft magnetic
Prior art date
Application number
SG200706865-3A
Inventor
Kazuei Yamaguchi
Yasuyuki Yokota
Sanaki Horimoto
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of SG141356A1 publication Critical patent/SG141356A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

POLISHING SLURRY AND POLISHING METHOD USING SAME Polishing slurry is caused to be present between a surface of a soft magnetic layer and a polishing tool such as a polishing pad and the surface of the soft magnetic layer and the polishing tool are moved relative to each other. The polishing slurry contains silica particles as abrading particles, compounds containing carboxylic acid and amino polycarboxylic acid and an oxidizing agent as a polishing accelerator, organic and/or inorganic compound of phosphoric acid, nitride and/or nitrite as an anti-corrosion agent and a pH conditioner such that the slurry has pH value between 4 and 11.
SG200706865-3A 2006-09-22 2007-09-13 Polishing slurry and polishing method using same SG141356A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006256756A JP2008074990A (en) 2006-09-22 2006-09-22 Polishing slurry and method

Publications (1)

Publication Number Publication Date
SG141356A1 true SG141356A1 (en) 2008-04-28

Family

ID=39225546

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200706865-3A SG141356A1 (en) 2006-09-22 2007-09-13 Polishing slurry and polishing method using same

Country Status (3)

Country Link
US (1) US20080076327A1 (en)
JP (1) JP2008074990A (en)
SG (1) SG141356A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5407555B2 (en) * 2008-06-11 2014-02-05 信越化学工業株式会社 Abrasive for synthetic quartz glass substrate
EP2289667B1 (en) * 2008-06-11 2019-06-26 Shin-Etsu Chemical Co., Ltd. Polishing agent for synthetic quartz glass substrate
JP5369506B2 (en) * 2008-06-11 2013-12-18 信越化学工業株式会社 Abrasive for synthetic quartz glass substrate
JP2010067681A (en) * 2008-09-09 2010-03-25 Fujifilm Corp Polishing solution and polishing method
JP5326638B2 (en) * 2009-02-18 2013-10-30 富士電機株式会社 Method of manufacturing glass substrate for magnetic recording medium, glass substrate for magnetic recording medium in which it is used, and perpendicular magnetic recording medium
US8815110B2 (en) * 2009-09-16 2014-08-26 Cabot Microelectronics Corporation Composition and method for polishing bulk silicon
JP5617387B2 (en) * 2010-07-06 2014-11-05 富士電機株式会社 Method for manufacturing substrate for perpendicular magnetic recording medium, and substrate for perpendicular magnetic recording medium manufactured by the manufacturing method
CN102399494B (en) * 2010-09-10 2014-12-31 安集微电子（上海）有限公司 Chemical mechanical polishing solution
US8668953B1 (en) * 2010-12-28 2014-03-11 WD Media, LLC Annealing process for electroless coated disks for high temperature applications
CN103887055A (en) * 2013-10-20 2014-06-25 山东嘉诺电子有限公司 High-inductance polishing method of small soft magnetic-ferrite magnetic core
CN103909459B (en) * 2014-04-02 2016-04-27 湖州科富电子科技有限公司 A kind of automatic screening soft magnetic grinding device
JP6379764B2 (en) * 2014-07-10 2018-08-29 日立化成株式会社 Polishing liquid and polishing method
KR20210097749A (en) 2018-12-03 2021-08-09 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. etching composition
JP7545106B2 (en) 2019-08-29 2024-09-04 日産化学株式会社 Polishing composition for oxide-based substrates containing hydrogen peroxide

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6136714A (en) * 1998-12-17 2000-10-24 Siemens Aktiengesellschaft Methods for enhancing the metal removal rate during the chemical-mechanical polishing process of a semiconductor
JP4462599B2 (en) * 2001-08-21 2010-05-12 花王株式会社 Polishing liquid composition
JP2004342294A (en) * 2003-04-21 2004-12-02 Showa Denko Kk Substrate for perpendicular magnetic recording medium, and its manufacturing method
JP2005034986A (en) * 2003-06-27 2005-02-10 Showa Denko Kk Polishing composition and substrate polishing method using the same
JP2005286047A (en) * 2004-03-29 2005-10-13 Nitta Haas Inc Abrasive composition for semiconductor
JP2006077127A (en) * 2004-09-09 2006-03-23 Fujimi Inc Polishing composition and polishing method using the composition
JP4667025B2 (en) * 2004-12-03 2011-04-06 日本ミクロコーティング株式会社 Polishing slurry and method
JP2007088379A (en) * 2005-09-26 2007-04-05 Fujifilm Corp Aqueous polishing slurry and chemical mechanical polishing method
JP4990543B2 (en) * 2006-03-23 2012-08-01 富士フイルム株式会社 Polishing liquid for metal

Also Published As

Publication number Publication date
JP2008074990A (en) 2008-04-03
US20080076327A1 (en) 2008-03-27

Similar Documents

Publication Publication Date Title
SG141356A1 (en) Polishing slurry and polishing method using same
TW200734117A (en) Friction reducing aid for CMP
MY150866A (en) Compositions and methods for polishing silicon nitride materials
MY153666A (en) Cmp method for metal-containing substrates
TW200740970A (en) Composition and method to polish silicon nitride
MY126249A (en) Polishing composition.
MY150651A (en) Polishing composition and polishing method
TW200740972A (en) Metal polishing slurry
TW200621958A (en) CMP polishing agent and polishing method of substrate
MY117521A (en) Polishing composition
MY144163A (en) Polishing composition
PL2050805T3 (en) Coated abrasive grit, method for its manufacture and its application in manufacturing abrasive agents
TW200502341A (en) Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
TW200635704A (en) Composition and method for polishing a sapphire surface
WO2007108925A3 (en) Oxidation-stabilized cmp compositions and methods
ATE338100T1 (en) CMP COMPOSITION CONTAINING SILANE-MODIFIED ABRASIVE PARTICLES
TW200801243A (en) Compositions, methods and systems for polishing aluminum oxide and aluminum oxynitride substrates
TWI256971B (en) CMP abrasive and method for polishing substrate
DE602005002164D1 (en) Polishing composition and polishing method
WO2008102672A1 (en) Polishing slurry, method for manufacturing the polishing slurry, nitride crystalline material and method for polishing surface of the nitride crystalline material
MY155014A (en) Rate-enhanced cmp compositions for dielectric films
MY172434A (en) Chemical mechanical polishing composition for polishing a sapphire surface and methods of using same
MY154310A (en) Onium-containing cmp compositions and methods for use thereof
TW200745316A (en) Copper-based metal polishing compositions and polishing process
TW200609336A (en) Polishing composition and substrate polishing method