TW200516134A - Novel slurry for chemical mechanical polishing of metals - Google Patents

Novel slurry for chemical mechanical polishing of metals

Info

Publication number
TW200516134A
TW200516134A TW093125607A TW93125607A TW200516134A TW 200516134 A TW200516134 A TW 200516134A TW 093125607 A TW093125607 A TW 093125607A TW 93125607 A TW93125607 A TW 93125607A TW 200516134 A TW200516134 A TW 200516134A
Authority
TW
Taiwan
Prior art keywords
metals
mechanical polishing
chemical mechanical
slurry
novel slurry
Prior art date
Application number
TW093125607A
Other languages
Chinese (zh)
Other versions
TWI313294B (en
Inventor
Daniel A Feller
Chris Barns
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of TW200516134A publication Critical patent/TW200516134A/en
Application granted granted Critical
Publication of TWI313294B publication Critical patent/TWI313294B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/7684—Smoothing; Planarisation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F3/00—Brightening metals by chemical means
    • C23F3/04—Heavy metals
    • C23F3/06—Heavy metals with acidic solutions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40—Capacitors
    • H01L28/60—Electrodes
    • H01L28/65—Electrodes comprising a noble metal or a noble metal oxide, e.g. platinum (Pt), ruthenium (Ru), ruthenium dioxide (RuO2), iridium (Ir), iridium dioxide (IrO2)

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A slurry for removing metals, useful in the manufacture of integrated circuits generally, and for the chemical mechanical polishing of noble metals particularly, may be formed by combining periodic acid, an abrasive, and a buffer system, wherein the pH of the slurry is between about 4 to about 8.
TW093125607A 2003-09-30 2004-08-26 Novel slurry for chemical mechanical polishing of metals TWI313294B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/676,330 US20050070109A1 (en) 2003-09-30 2003-09-30 Novel slurry for chemical mechanical polishing of metals

Publications (2)

Publication Number Publication Date
TW200516134A true TW200516134A (en) 2005-05-16
TWI313294B TWI313294B (en) 2009-08-11

Family

ID=34377361

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125607A TWI313294B (en) 2003-09-30 2004-08-26 Novel slurry for chemical mechanical polishing of metals

Country Status (7)

Country Link
US (3) US20050070109A1 (en)
EP (1) EP1673416A2 (en)
JP (1) JP2007508692A (en)
KR (1) KR101270417B1 (en)
CN (2) CN1318529C (en)
TW (1) TWI313294B (en)
WO (1) WO2005033234A2 (en)

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US20080148649A1 (en) * 2006-12-21 2008-06-26 Zhendong Liu Ruthenium-barrier polishing slurry
US8541310B2 (en) * 2007-05-04 2013-09-24 Cabot Microelectronics Corporation CMP compositions containing a soluble peroxometalate complex and methods of use thereof
JP2009032807A (en) * 2007-07-25 2009-02-12 Nec Corp Semiconductor device and method of manufacturing the same
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US20100081279A1 (en) * 2008-09-30 2010-04-01 Dupont Air Products Nanomaterials Llc Method for Forming Through-base Wafer Vias in Fabrication of Stacked Devices
US8506831B2 (en) 2008-12-23 2013-08-13 Air Products And Chemicals, Inc. Combination, method, and composition for chemical mechanical planarization of a tungsten-containing substrate
JP5640977B2 (en) 2009-07-16 2014-12-17 日立化成株式会社 CMP polishing liquid for polishing palladium and polishing method
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RU2014101490A (en) 2011-06-19 2015-07-27 Эйбоджен, Инк. DEVICES, SOLUTIONS AND METHODS FOR SAMPLE COLLECTION
US8610280B2 (en) * 2011-09-16 2013-12-17 Micron Technology, Inc. Platinum-containing constructions, and methods of forming platinum-containing constructions
CN102437110B (en) * 2011-11-30 2015-07-29 北京大学 A kind of manufacture method of Graphene vertical interconnecting structure
TWI645511B (en) * 2011-12-01 2018-12-21 美商應用材料股份有限公司 Doped tantalum nitride for copper barrier applications
US8748309B2 (en) * 2012-09-14 2014-06-10 GlobalFoundries, Inc. Integrated circuits with improved gate uniformity and methods for fabricating same
CN104810267B (en) * 2014-01-28 2018-07-10 中芯国际集成电路制造(上海)有限公司 The forming method of metal gates
WO2015154189A1 (en) * 2014-04-10 2015-10-15 Dna Genotek Inc. Method and system for microbial lysis using periodates
CN105754490B (en) * 2016-05-05 2017-07-25 济南大学 A kind of preparation method of the polishing powder polished for carnelian
KR101943704B1 (en) * 2016-06-27 2019-01-29 삼성에스디아이 주식회사 Cmp slurry composition for metal film and polishing method
CN107400889A (en) * 2017-07-26 2017-11-28 江苏盐城环保科技城重金属防治研究中心 A kind of surface treatment method for being molded proof gold product blanks
SG11202006176YA (en) * 2018-01-12 2020-07-29 Fujifilm Corp Chemical solution and method for treating substrate
CN117198858A (en) 2018-02-05 2023-12-08 富士胶片株式会社 Chemical solution, method for producing chemical solution, and method for treating substrate
US11643599B2 (en) * 2018-07-20 2023-05-09 Versum Materials Us, Llc Tungsten chemical mechanical polishing for reduced oxide erosion
US10727076B2 (en) * 2018-10-25 2020-07-28 Taiwan Semiconductor Manufacturing Company Ltd. Slurry and manufacturing semiconductor using the slurry
US11289578B2 (en) 2019-04-30 2022-03-29 Taiwan Semiconductor Manufacturing Company, Ltd. Selective etching to increase threshold voltage spread
JP7278164B2 (en) * 2019-07-11 2023-05-19 東京エレクトロン株式会社 Method for forming ruthenium film and substrate processing system
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Also Published As

Publication number Publication date
TWI313294B (en) 2009-08-11
US20060099817A1 (en) 2006-05-11
WO2005033234A2 (en) 2005-04-14
US20050070109A1 (en) 2005-03-31
EP1673416A2 (en) 2006-06-28
CN1318529C (en) 2007-05-30
KR101270417B1 (en) 2013-06-07
WO2005033234A3 (en) 2006-01-26
CN1618909A (en) 2005-05-25
US20060097347A1 (en) 2006-05-11
JP2007508692A (en) 2007-04-05
CN1992179A (en) 2007-07-04
KR20060089219A (en) 2006-08-08

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees