AU5460898A - Composition and method for polishing rigid disks - Google Patents
Composition and method for polishing rigid disksInfo
- Publication number
- AU5460898A AU5460898A AU54608/98A AU5460898A AU5460898A AU 5460898 A AU5460898 A AU 5460898A AU 54608/98 A AU54608/98 A AU 54608/98A AU 5460898 A AU5460898 A AU 5460898A AU 5460898 A AU5460898 A AU 5460898A
- Authority
- AU
- Australia
- Prior art keywords
- composition
- rigid disks
- polishing
- polishing rigid
- disks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/753,482 US5958288A (en) | 1996-11-26 | 1996-11-26 | Composition and slurry useful for metal CMP |
US08753482 | 1996-11-26 | ||
US08844195 | 1997-04-18 | ||
US08/844,195 US6015506A (en) | 1996-11-26 | 1997-04-18 | Composition and method for polishing rigid disks |
PCT/US1997/021730 WO1998023697A1 (en) | 1996-11-26 | 1997-11-21 | Composition and method for polishing rigid disks |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5460898A true AU5460898A (en) | 1998-06-22 |
Family
ID=27115754
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU54608/98A Abandoned AU5460898A (en) | 1996-11-26 | 1997-11-21 | Composition and method for polishing rigid disks |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU5460898A (en) |
TW (1) | TW442364B (en) |
WO (1) | WO1998023697A1 (en) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6162268A (en) * | 1999-05-03 | 2000-12-19 | Praxair S. T. Technology, Inc. | Polishing slurry |
CN1125861C (en) * | 1999-07-16 | 2003-10-29 | 长兴化学工业股份有限公司 | Composition for chemical and mechanical grinding on semiconductor |
CN1125862C (en) * | 1999-09-20 | 2003-10-29 | 长兴化学工业股份有限公司 | Composite ground in chemical machine for semiconductor processing |
JP4238951B2 (en) * | 1999-09-28 | 2009-03-18 | 株式会社フジミインコーポレーテッド | Polishing composition and method for producing memory hard disk using the same |
US6299795B1 (en) | 2000-01-18 | 2001-10-09 | Praxair S.T. Technology, Inc. | Polishing slurry |
SG90227A1 (en) * | 2000-01-18 | 2002-07-23 | Praxair Technology Inc | Polishing slurry |
US6261476B1 (en) * | 2000-03-21 | 2001-07-17 | Praxair S. T. Technology, Inc. | Hybrid polishing slurry |
US20050028449A1 (en) * | 2001-09-03 | 2005-02-10 | Norihiko Miyata | Polishing composition |
US6604987B1 (en) | 2002-06-06 | 2003-08-12 | Cabot Microelectronics Corporation | CMP compositions containing silver salts |
WO2004111145A1 (en) * | 2003-06-13 | 2004-12-23 | Showa Denko K.K. | Polishing composition and polishing method |
US8013024B2 (en) | 2007-06-29 | 2011-09-06 | Deborah D. L. Chung | High-performance interface materials for improving thermal contacts |
CN113001418B (en) * | 2021-01-28 | 2024-01-26 | 广东朗旗新材料科技有限公司 | Ceramic bond of superhard abrasive tool, superhard abrasive tool and preparation method of superhard abrasive tool |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63274782A (en) * | 1987-05-02 | 1988-11-11 | Mishima Kosan Co Ltd | Lapping fluid for stainless steel |
JP2689706B2 (en) * | 1990-08-08 | 1997-12-10 | 上村工業株式会社 | Polishing method |
US5527423A (en) * | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
EP0792515A1 (en) * | 1994-11-18 | 1997-09-03 | Advanced Micro Devices, Inc. | Method of making a chemical-mechanical polishing slurry and the polishing slurry |
-
1997
- 1997-11-21 WO PCT/US1997/021730 patent/WO1998023697A1/en active Application Filing
- 1997-11-21 AU AU54608/98A patent/AU5460898A/en not_active Abandoned
- 1997-11-26 TW TW86117776A patent/TW442364B/en active
Also Published As
Publication number | Publication date |
---|---|
TW442364B (en) | 2001-06-23 |
WO1998023697A1 (en) | 1998-06-04 |
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