WO2003037565A3 - Polishing pads and manufacturing methods - Google Patents

Polishing pads and manufacturing methods Download PDF

Info

Publication number
WO2003037565A3
WO2003037565A3 PCT/US2002/034618 US0234618W WO03037565A3 WO 2003037565 A3 WO2003037565 A3 WO 2003037565A3 US 0234618 W US0234618 W US 0234618W WO 03037565 A3 WO03037565 A3 WO 03037565A3
Authority
WO
WIPO (PCT)
Prior art keywords
properties
pads
manufacturing methods
area
polishing pads
Prior art date
Application number
PCT/US2002/034618
Other languages
French (fr)
Other versions
WO2003037565A2 (en
Inventor
West Inc Thomas
Thomas West
Donald P Dietz
Original Assignee
West Inc Thomas
Thomas West
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by West Inc Thomas, Thomas West filed Critical West Inc Thomas
Priority to AU2002350031A priority Critical patent/AU2002350031A1/en
Publication of WO2003037565A2 publication Critical patent/WO2003037565A2/en
Publication of WO2003037565A3 publication Critical patent/WO2003037565A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials

Abstract

Disclosed is a method of manufacturing polymer materials having properties that are determined by selected process conditions. The properties can be modified for a variety of applications. Exemplary applications are pads for chemical mechanical planarization of substrates and pads for polishing substrates. One embodiment of the method includes the steps of providing a polymer sheet having a substrate contacting area, heating the area a sufficient amount, and applying a sufficient amount of mechanical pressure to the area during at least a portion of the heating step to achieve the desired properties for the material.
PCT/US2002/034618 2001-10-29 2002-10-29 Polishing pads and manufacturing methods WO2003037565A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2002350031A AU2002350031A1 (en) 2001-10-29 2002-10-29 Polishing pads and manufacturing methods

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US34096201P 2001-10-29 2001-10-29
US60/340,962 2001-10-29
US10/020,081 2001-12-11
US10/020,081 US20030083003A1 (en) 2001-10-29 2001-12-11 Polishing pads and manufacturing methods

Publications (2)

Publication Number Publication Date
WO2003037565A2 WO2003037565A2 (en) 2003-05-08
WO2003037565A3 true WO2003037565A3 (en) 2003-10-23

Family

ID=26692984

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/034618 WO2003037565A2 (en) 2001-10-29 2002-10-29 Polishing pads and manufacturing methods

Country Status (3)

Country Link
US (1) US20030083003A1 (en)
AU (1) AU2002350031A1 (en)
WO (1) WO2003037565A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
WO2004087375A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US8864859B2 (en) 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
TWI385050B (en) * 2005-02-18 2013-02-11 Nexplanar Corp Customized polishing pads for cmp and methods of fabrication and use thereof
US20070049169A1 (en) * 2005-08-02 2007-03-01 Vaidya Neha P Nonwoven polishing pads for chemical mechanical polishing
US7458885B1 (en) * 2007-08-15 2008-12-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and methods of making and using same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
FR2673574A1 (en) * 1991-03-06 1992-09-11 Delamare Pierre Method of manufacturing polishing discs and discs obtained thereby
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US20010000772A1 (en) * 1999-02-04 2001-05-03 Kramer Stephen J. Method and apparatus for uniformly planarizing a microelectronic substrate

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4046729A (en) * 1975-06-02 1977-09-06 Ppg Industries, Inc. Water-reduced urethane coating compositions
US4171391A (en) * 1978-09-07 1979-10-16 Wilmington Chemical Corporation Method of preparing composite sheet material
US4376148A (en) * 1980-09-18 1983-03-08 Norwood Industries, Inc. Impregnated non-woven sheet material with ionically solubilized resin
US4342805A (en) * 1980-09-18 1982-08-03 Norwood Industries, Inc. Simulated leather sheet material
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
US4496624A (en) * 1982-07-14 1985-01-29 Norwood Industries, Inc. Fibrous web impregnated with coagulated polyurethane and polyolefin admixture
JPS62140769A (en) * 1985-12-16 1987-06-24 Toyo Cloth Kk Manufacture of abrasive cloth
US4841680A (en) * 1987-08-25 1989-06-27 Rodel, Inc. Inverted cell pad material for grinding, lapping, shaping and polishing
US5533923A (en) * 1995-04-10 1996-07-09 Applied Materials, Inc. Chemical-mechanical polishing pad providing polishing unformity
US6287185B1 (en) * 1997-04-04 2001-09-11 Rodel Holdings Inc. Polishing pads and methods relating thereto
US6126532A (en) * 1997-04-18 2000-10-03 Cabot Corporation Polishing pads for a semiconductor substrate
JPH11216663A (en) * 1998-02-03 1999-08-10 Sony Corp Grinding pad, grinding apparatus and grinding method
US6117000A (en) * 1998-07-10 2000-09-12 Cabot Corporation Polishing pad for a semiconductor substrate
US6095902A (en) * 1998-09-23 2000-08-01 Rodel Holdings, Inc. Polyether-polyester polyurethane polishing pads and related methods

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4728552A (en) * 1984-07-06 1988-03-01 Rodel, Inc. Substrate containing fibers of predetermined orientation and process of making the same
US4927432A (en) * 1986-03-25 1990-05-22 Rodel, Inc. Pad material for grinding, lapping and polishing
FR2673574A1 (en) * 1991-03-06 1992-09-11 Delamare Pierre Method of manufacturing polishing discs and discs obtained thereby
US6106754A (en) * 1994-11-23 2000-08-22 Rodel Holdings, Inc. Method of making polishing pads
US5868605A (en) * 1995-06-02 1999-02-09 Speedfam Corporation In-situ polishing pad flatness control
US20010000772A1 (en) * 1999-02-04 2001-05-03 Kramer Stephen J. Method and apparatus for uniformly planarizing a microelectronic substrate

Also Published As

Publication number Publication date
US20030083003A1 (en) 2003-05-01
WO2003037565A2 (en) 2003-05-08
AU2002350031A1 (en) 2003-05-12

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