ATE366165T1 - Transparente mikroporöse materialien für cmp - Google Patents

Transparente mikroporöse materialien für cmp

Info

Publication number
ATE366165T1
ATE366165T1 AT03809403T AT03809403T ATE366165T1 AT E366165 T1 ATE366165 T1 AT E366165T1 AT 03809403 T AT03809403 T AT 03809403T AT 03809403 T AT03809403 T AT 03809403T AT E366165 T1 ATE366165 T1 AT E366165T1
Authority
AT
Austria
Prior art keywords
polishing pad
cmp
pad substrate
microporous materials
transparent microporous
Prior art date
Application number
AT03809403T
Other languages
English (en)
Inventor
Abaneshwar Prasad
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cabot Microelectronics Corp filed Critical Cabot Microelectronics Corp
Application granted granted Critical
Publication of ATE366165T1 publication Critical patent/ATE366165T1/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
AT03809403T 2002-10-28 2003-10-06 Transparente mikroporöse materialien für cmp ATE366165T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/282,489 US7435165B2 (en) 2002-10-28 2002-10-28 Transparent microporous materials for CMP

Publications (1)

Publication Number Publication Date
ATE366165T1 true ATE366165T1 (de) 2007-07-15

Family

ID=32107376

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03809403T ATE366165T1 (de) 2002-10-28 2003-10-06 Transparente mikroporöse materialien für cmp

Country Status (10)

Country Link
US (1) US7435165B2 (de)
EP (1) EP1567306B1 (de)
JP (4) JP2006504260A (de)
KR (1) KR101065117B1 (de)
CN (1) CN100589934C (de)
AT (1) ATE366165T1 (de)
AU (1) AU2003264819A1 (de)
DE (1) DE60314772T2 (de)
TW (1) TWI234505B (de)
WO (1) WO2004037490A1 (de)

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US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
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US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN113977453B (zh) * 2021-11-08 2023-01-13 万华化学集团电子材料有限公司 提高抛光平坦度的化学机械抛光垫及其应用
CN115464511B (zh) * 2022-09-19 2023-08-01 厦门大学 一种集多通道孔径检测及纳米孔制备于一体的装置及其使用方法
CN116749074A (zh) * 2023-06-27 2023-09-15 中国地质大学（北京） 一种改善透光晶圆厚度均匀性的方法及装置

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Also Published As

Publication number Publication date
WO2004037490A1 (en) 2004-05-06
DE60314772T2 (de) 2007-10-31
KR20050061569A (ko) 2005-06-22
JP2013201452A (ja) 2013-10-03
KR101065117B1 (ko) 2011-09-16
JP5986268B2 (ja) 2016-09-06
JP2010166078A (ja) 2010-07-29
CN100589934C (zh) 2010-02-17
EP1567306A1 (de) 2005-08-31
DE60314772D1 (de) 2007-08-16
TWI234505B (en) 2005-06-21
CN1708377A (zh) 2005-12-14
TW200420382A (en) 2004-10-16
EP1567306B1 (de) 2007-07-04
JP5675136B2 (ja) 2015-02-25
JP5882947B2 (ja) 2016-03-09
JP2006504260A (ja) 2006-02-02
US20040082276A1 (en) 2004-04-29
JP2015193077A (ja) 2015-11-05
US7435165B2 (en) 2008-10-14
AU2003264819A1 (en) 2004-05-13

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