JP2008544868A5 - - Google Patents
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- Publication number
- JP2008544868A5 JP2008544868A5 JP2008519451A JP2008519451A JP2008544868A5 JP 2008544868 A5 JP2008544868 A5 JP 2008544868A5 JP 2008519451 A JP2008519451 A JP 2008519451A JP 2008519451 A JP2008519451 A JP 2008519451A JP 2008544868 A5 JP2008544868 A5 JP 2008544868A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- substrate
- aluminum
- polishing composition
- abrasive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 27
- 238000005498 polishing Methods 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 12
- 239000000203 mixture Substances 0.000 claims 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 8
- 229910052782 aluminium Inorganic materials 0.000 claims 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 7
- 229910000838 Al alloy Inorganic materials 0.000 claims 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 4
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 claims 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims 3
- 239000003153 chemical reaction reagent Substances 0.000 claims 3
- 150000007524 organic acids Chemical class 0.000 claims 3
- -1 polyethylene Polymers 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 3
- 239000004677 Nylon Substances 0.000 claims 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 229920001778 nylon Polymers 0.000 claims 2
- 239000004417 polycarbonate Substances 0.000 claims 2
- 229920000515 polycarbonate Polymers 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims 2
- 229910000755 6061-T6 aluminium alloy Inorganic materials 0.000 claims 1
- 239000004698 Polyethylene Substances 0.000 claims 1
- 239000004642 Polyimide Substances 0.000 claims 1
- 239000004793 Polystyrene Substances 0.000 claims 1
- 239000004372 Polyvinyl alcohol Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229920003235 aromatic polyamide Polymers 0.000 claims 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims 1
- 238000007516 diamond turning Methods 0.000 claims 1
- 229920001971 elastomer Polymers 0.000 claims 1
- 229910021485 fumed silica Inorganic materials 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 230000001590 oxidative effect Effects 0.000 claims 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims 1
- 229920000412 polyarylene Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920000573 polyethylene Polymers 0.000 claims 1
- 229920000139 polyethylene terephthalate Polymers 0.000 claims 1
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000002952 polymeric resin Substances 0.000 claims 1
- 239000004926 polymethyl methacrylate Substances 0.000 claims 1
- 229920002223 polystyrene Polymers 0.000 claims 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims 1
- 239000004810 polytetrafluoroethylene Substances 0.000 claims 1
- 229920002451 polyvinyl alcohol Polymers 0.000 claims 1
- 239000004800 polyvinyl chloride Substances 0.000 claims 1
- 229920000915 polyvinyl chloride Polymers 0.000 claims 1
- YOURVSNPCBPILN-UHFFFAOYSA-M potassium hydrogen sulfate hydroxy hydrogen sulfate Chemical compound [K+].OS([O-])(=O)=O.OOS(O)(=O)=O YOURVSNPCBPILN-UHFFFAOYSA-M 0.000 claims 1
- OKBMCNHOEMXPTM-UHFFFAOYSA-M potassium peroxymonosulfate Chemical compound [K+].OOS([O-])(=O)=O OKBMCNHOEMXPTM-UHFFFAOYSA-M 0.000 claims 1
- 239000001384 succinic acid Substances 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 229920002725 thermoplastic elastomer Polymers 0.000 claims 1
- 229920002397 thermoplastic olefin Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/173,518 | 2005-06-30 | ||
| US11/173,518 US8062096B2 (en) | 2005-06-30 | 2005-06-30 | Use of CMP for aluminum mirror and solar cell fabrication |
| PCT/US2006/024789 WO2007120163A2 (en) | 2005-06-30 | 2006-06-22 | Use of cmp for aluminum mirror and solar cell fabrication |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008544868A JP2008544868A (ja) | 2008-12-11 |
| JP2008544868A5 true JP2008544868A5 (enExample) | 2009-07-23 |
| JP5155858B2 JP5155858B2 (ja) | 2013-03-06 |
Family
ID=37618822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008519451A Active JP5155858B2 (ja) | 2005-06-30 | 2006-06-22 | アルミニウム鏡のためのｃｍｐの使用、及び太陽電池の製造 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8062096B2 (enExample) |
| EP (1) | EP1917122B1 (enExample) |
| JP (1) | JP5155858B2 (enExample) |
| KR (2) | KR101178338B1 (enExample) |
| CN (1) | CN101208178A (enExample) |
| IL (1) | IL187706A (enExample) |
| MY (1) | MY146358A (enExample) |
| SG (1) | SG163546A1 (enExample) |
| TW (1) | TWI300735B (enExample) |
| WO (1) | WO2007120163A2 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006126072A1 (en) * | 2005-05-27 | 2006-11-30 | Nortel Networks Limited | Circuit-switched and multimedia subsystem voice continuity with bearer path interruption |
| US20070068605A1 (en) | 2005-09-23 | 2007-03-29 | U.I.T., Llc | Method of metal performance improvement and protection against degradation and suppression thereof by ultrasonic impact |
| JP5599547B2 (ja) * | 2006-12-01 | 2014-10-01 | Ｍｉｐｏｘ株式会社 | 硬質結晶基板研磨方法及び油性研磨スラリー |
| JP2009035461A (ja) * | 2007-08-03 | 2009-02-19 | Asahi Glass Co Ltd | 磁気ディスク用ガラス基板の製造方法 |
| CN101840939A (zh) * | 2009-03-11 | 2010-09-22 | 富士胶片株式会社 | 铝合金基板和太阳能电池基板 |
| JP2011025347A (ja) * | 2009-07-24 | 2011-02-10 | Disco Abrasive Syst Ltd | 金属板の加工方法 |
| KR101232813B1 (ko) * | 2009-09-30 | 2013-02-13 | 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 | 스택 장치의 제작을 위한 관통-베이스 웨이퍼 비아를 노출시키는 방법 |
| KR20140110869A (ko) * | 2011-11-25 | 2014-09-17 | 가부시키가이샤 후지미인코퍼레이티드 | 합금 재료의 연마 방법 및 합금 재료의 제조 방법 |
| US20150251293A1 (en) * | 2012-10-03 | 2015-09-10 | Fujimi Incorporated | Polishing method and method for producing alloy material |
| US9604339B2 (en) | 2012-10-29 | 2017-03-28 | Wayne O. Duescher | Vacuum-grooved membrane wafer polishing workholder |
| US9011207B2 (en) | 2012-10-29 | 2015-04-21 | Wayne O. Duescher | Flexible diaphragm combination floating and rigid abrading workholder |
| US8845394B2 (en) | 2012-10-29 | 2014-09-30 | Wayne O. Duescher | Bellows driven air floatation abrading workholder |
| US9039488B2 (en) | 2012-10-29 | 2015-05-26 | Wayne O. Duescher | Pin driven flexible chamber abrading workholder |
| US9199354B2 (en) | 2012-10-29 | 2015-12-01 | Wayne O. Duescher | Flexible diaphragm post-type floating and rigid abrading workholder |
| US9233452B2 (en) | 2012-10-29 | 2016-01-12 | Wayne O. Duescher | Vacuum-grooved membrane abrasive polishing wafer workholder |
| US8998677B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Bellows driven floatation-type abrading workholder |
| US8998678B2 (en) | 2012-10-29 | 2015-04-07 | Wayne O. Duescher | Spider arm driven flexible chamber abrading workholder |
| EP2915859A4 (en) | 2012-10-31 | 2015-10-28 | Fujimi Inc | POLISHING COMPOSITION |
| CN102941528B (zh) * | 2012-11-20 | 2014-12-17 | 中国人民解放军国防科学技术大学 | 具有高精度超光滑表面的铝合金材料及抛光盘、抛光液和抛光方法 |
| TWI614093B (zh) * | 2013-01-04 | 2018-02-11 | 福吉米股份有限公司 | 研磨用組成物、合金材料、合金材料之硏磨方法及合金材料之製造方法 |
| JP6438191B2 (ja) * | 2013-12-10 | 2018-12-12 | 三菱瓦斯化学株式会社 | ポリカーボネート樹脂フィルムおよびそれを用いた成形体 |
| JP2015203080A (ja) * | 2014-04-15 | 2015-11-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2016163991A1 (en) * | 2015-04-07 | 2016-10-13 | Hewlett-Packard Development Company, L.P. | Methods of polishing |
| MY199592A (en) * | 2017-04-14 | 2023-11-08 | Cmc Mat Llc | Chemical-mechanical processing slurry and methods for processing a nickel substrate surface |
| US10926378B2 (en) | 2017-07-08 | 2021-02-23 | Wayne O. Duescher | Abrasive coated disk islands using magnetic font sheet |
| US20220023991A1 (en) * | 2018-11-27 | 2022-01-27 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
| US11691241B1 (en) * | 2019-08-05 | 2023-07-04 | Keltech Engineering, Inc. | Abrasive lapping head with floating and rigid workpiece carrier |
| KR102349153B1 (ko) * | 2019-12-16 | 2022-01-10 | 주식회사 포스코 | 알루미늄 합금용 연마 용액, 그 제조방법 및 이를 이용한 연마 방법 |
| CN116141214B (zh) * | 2022-08-04 | 2024-08-27 | 华侨大学 | 一种可循环利用的混合磨料抛光膜的制备方法 |
Family Cites Families (51)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3662501A (en) * | 1971-01-28 | 1972-05-16 | Ibm | Method for polishing magnetic oxide materials |
| US4769046A (en) | 1985-07-25 | 1988-09-06 | Fujimi Kanmazai Kogyo Kabushiki Kaisha Of Japan | Process for polishing surface of memory hard disc |
| DE3629582A1 (de) | 1986-08-30 | 1988-03-03 | Basf Ag | Verfahren zur oberflaechenbearbeitung scheibenfoermiger vernickelter aluminiumsubstrate |
| JPS63288620A (ja) | 1987-05-22 | 1988-11-25 | Kobe Steel Ltd | アルミニウムの電解複合超鏡面加工方法 |
| JPH01246068A (ja) * | 1988-03-29 | 1989-10-02 | Kobe Steel Ltd | アルミニウム合金基板の鏡面仕上げ方法 |
| SU1629353A1 (ru) * | 1988-08-17 | 1991-02-23 | Предприятие П/Я В-2750 | Раствор дл виброхимического шлифовани деталей из алюминиевых сплавов |
| JPH02185365A (ja) * | 1989-01-12 | 1990-07-19 | Kobe Steel Ltd | アルミニウム合金平板基盤の研磨方法 |
| US5230833A (en) | 1989-06-09 | 1993-07-27 | Nalco Chemical Company | Low sodium, low metals silica polishing slurries |
| US4959113C1 (en) | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
| US5196353A (en) | 1992-01-03 | 1993-03-23 | Micron Technology, Inc. | Method for controlling a semiconductor (CMP) process by measuring a surface temperature and developing a thermal image of the wafer |
| US5209816A (en) * | 1992-06-04 | 1993-05-11 | Micron Technology, Inc. | Method of chemical mechanical polishing aluminum containing metal layers and slurry for chemical mechanical polishing |
| US6614529B1 (en) | 1992-12-28 | 2003-09-02 | Applied Materials, Inc. | In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization |
| JPH06313164A (ja) * | 1993-04-28 | 1994-11-08 | Fujimi Inkooporeetetsudo:Kk | 研磨用組成物 |
| US5658183A (en) | 1993-08-25 | 1997-08-19 | Micron Technology, Inc. | System for real-time control of semiconductor wafer polishing including optical monitoring |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
| JP3270282B2 (ja) | 1994-02-21 | 2002-04-02 | 株式会社東芝 | 半導体製造装置及び半導体装置の製造方法 |
| JP3313505B2 (ja) | 1994-04-14 | 2002-08-12 | 株式会社日立製作所 | 研磨加工法 |
| US5893796A (en) | 1995-03-28 | 1999-04-13 | Applied Materials, Inc. | Forming a transparent window in a polishing pad for a chemical mechanical polishing apparatus |
| US5964643A (en) | 1995-03-28 | 1999-10-12 | Applied Materials, Inc. | Apparatus and method for in-situ monitoring of chemical mechanical polishing operations |
| US5838447A (en) | 1995-07-20 | 1998-11-17 | Ebara Corporation | Polishing apparatus including thickness or flatness detector |
| US5858813A (en) | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
| US5863838A (en) | 1996-07-22 | 1999-01-26 | Motorola, Inc. | Method for chemically-mechanically polishing a metal layer |
| US5872633A (en) | 1996-07-26 | 1999-02-16 | Speedfam Corporation | Methods and apparatus for detecting removal of thin film layers during planarization |
| JP3831982B2 (ja) * | 1996-07-26 | 2006-10-11 | 日産化学工業株式会社 | アルミニウムディスクの研磨用組成物 |
| US5783489A (en) | 1996-09-24 | 1998-07-21 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
| US6039891A (en) | 1996-09-24 | 2000-03-21 | Cabot Corporation | Multi-oxidizer precursor for chemical mechanical polishing |
| US6033596A (en) | 1996-09-24 | 2000-03-07 | Cabot Corporation | Multi-oxidizer slurry for chemical mechanical polishing |
| US6149696A (en) * | 1997-11-06 | 2000-11-21 | Komag, Inc. | Colloidal silica slurry for NiP plated disk polishing |
| US5897426A (en) | 1998-04-24 | 1999-04-27 | Applied Materials, Inc. | Chemical mechanical polishing with multiple polishing pads |
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| US6596150B2 (en) | 1998-05-28 | 2003-07-22 | Fuji Photo Film Co., Ltd. | Production method for an aluminum support for a lithographic printing plate |
| US6099389A (en) | 1998-10-05 | 2000-08-08 | The United States Of America As Represented By The United States Department Of Energy | Fabrication of an optical component |
| US6350176B1 (en) * | 1999-02-01 | 2002-02-26 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | High quality optically polished aluminum mirror and process for producing |
| US6554878B1 (en) | 1999-06-14 | 2003-04-29 | International Business Machines Corporation | Slurry for multi-material chemical mechanical polishing |
| JP3097913B1 (ja) | 1999-07-01 | 2000-10-10 | 日本ミクロコーティング株式会社 | ガラス基板の鏡面仕上げ方法 |
| US6429133B1 (en) | 1999-08-31 | 2002-08-06 | Micron Technology, Inc. | Composition compatible with aluminum planarization and methods therefore |
| JP2002059357A (ja) * | 2000-08-23 | 2002-02-26 | Toray Ind Inc | 研磨パッドおよび研磨装置ならびに研磨方法 |
| JP2002100592A (ja) * | 2000-09-20 | 2002-04-05 | Rodel Nitta Co | 研磨パッド |
| US6461227B1 (en) | 2000-10-17 | 2002-10-08 | Cabot Microelectronics Corporation | Method of polishing a memory or rigid disk with an ammonia-and/or halide-containing composition |
| US6612911B2 (en) * | 2001-01-16 | 2003-09-02 | Cabot Microelectronics Corporation | Alkali metal-containing polishing system and method |
| TW548437B (en) | 2001-03-02 | 2003-08-21 | Unaxis Balzers Ag | Optical component and its production method as well as optical switch |
| JP2003100682A (ja) * | 2001-09-25 | 2003-04-04 | Jsr Corp | 半導体ウエハ用研磨パッド |
| US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
| JP3749867B2 (ja) * | 2002-03-08 | 2006-03-01 | 株式会社東芝 | アルミニウム系金属用研磨液および半導体装置の製造方法 |
| US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
| JP2004014744A (ja) * | 2002-06-06 | 2004-01-15 | Toray Ind Inc | 研磨パッド、研磨装置、およびそれを用いた研磨方法 |
| JP3997152B2 (ja) * | 2002-12-26 | 2007-10-24 | 花王株式会社 | 研磨液組成物 |
| US6896591B2 (en) * | 2003-02-11 | 2005-05-24 | Cabot Microelectronics Corporation | Mixed-abrasive polishing composition and method for using the same |
| US6921177B2 (en) * | 2003-02-24 | 2005-07-26 | Raytheon Company | High precision mirror, and a method of making it |
| JP2005001059A (ja) * | 2003-06-12 | 2005-01-06 | Sumitomo Bakelite Co Ltd | 研磨用積層体 |
| US20050159085A1 (en) * | 2003-10-30 | 2005-07-21 | Scott Brandon S. | Method of chemically mechanically polishing substrates |
-
2005
- 2005-06-30 US US11/173,518 patent/US8062096B2/en not_active Expired - Fee Related
-
2006
- 2006-06-22 CN CNA200680023157XA patent/CN101208178A/zh active Pending
- 2006-06-22 JP JP2008519451A patent/JP5155858B2/ja active Active
- 2006-06-22 KR KR1020077030643A patent/KR101178338B1/ko not_active Expired - Fee Related
- 2006-06-22 KR KR1020117020418A patent/KR20110112463A/ko not_active Ceased
- 2006-06-22 WO PCT/US2006/024789 patent/WO2007120163A2/en not_active Ceased
- 2006-06-22 EP EP06851111.2A patent/EP1917122B1/en not_active Not-in-force
- 2006-06-22 SG SG201004697-7A patent/SG163546A1/en unknown
- 2006-06-28 MY MYPI20063084A patent/MY146358A/en unknown
- 2006-06-29 TW TW095123553A patent/TWI300735B/zh not_active IP Right Cessation
-
2007
- 2007-11-27 IL IL187706A patent/IL187706A/en active IP Right Grant
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