JP5155858B2 - アルミニウム鏡のためのｃｍｐの使用、及び太陽電池の製造 - Google Patents

アルミニウム鏡のためのｃｍｐの使用、及び太陽電池の製造 Download PDF

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Publication number
JP5155858B2
JP5155858B2 JP2008519451A JP2008519451A JP5155858B2 JP 5155858 B2 JP5155858 B2 JP 5155858B2 JP 2008519451 A JP2008519451 A JP 2008519451A JP 2008519451 A JP2008519451 A JP 2008519451A JP 5155858 B2 JP5155858 B2 JP 5155858B2
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JP
Japan
Prior art keywords
polishing
substrate
aluminum
polishing composition
abrasive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2008519451A
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English (en)
Japanese (ja)
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JP2008544868A (ja
JP2008544868A5 (enExample
Inventor
ブルーシック，ブラスタ
ジェンキンズ，リチャード
トンプソン，クリストファー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CMC Materials LLC
Original Assignee
Cabot Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JP2008544868A publication Critical patent/JP2008544868A/ja
Publication of JP2008544868A5 publication Critical patent/JP2008544868A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B24B13/015—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor of television picture tube viewing panels, headlight reflectors or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/40—Optical elements or arrangements
    • H10F77/42—Optical elements or arrangements directly associated or integrated with photovoltaic cells, e.g. light-reflecting means or light-concentrating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2008519451A 2005-06-30 2006-06-22 アルミニウム鏡のためのｃｍｐの使用、及び太陽電池の製造 Active JP5155858B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/173,518 2005-06-30
US11/173,518 US8062096B2 (en) 2005-06-30 2005-06-30 Use of CMP for aluminum mirror and solar cell fabrication
PCT/US2006/024789 WO2007120163A2 (en) 2005-06-30 2006-06-22 Use of cmp for aluminum mirror and solar cell fabrication

Publications (3)

Publication Number Publication Date
JP2008544868A JP2008544868A (ja) 2008-12-11
JP2008544868A5 JP2008544868A5 (enExample) 2009-07-23
JP5155858B2 true JP5155858B2 (ja) 2013-03-06

Family

ID=37618822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008519451A Active JP5155858B2 (ja) 2005-06-30 2006-06-22 アルミニウム鏡のためのｃｍｐの使用、及び太陽電池の製造

Country Status (10)

Country Link
US (1) US8062096B2 (enExample)
EP (1) EP1917122B1 (enExample)
JP (1) JP5155858B2 (enExample)
KR (2) KR101178338B1 (enExample)
CN (1) CN101208178A (enExample)
IL (1) IL187706A (enExample)
MY (1) MY146358A (enExample)
SG (1) SG163546A1 (enExample)
TW (1) TWI300735B (enExample)
WO (1) WO2007120163A2 (enExample)

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JP2009035461A (ja) * 2007-08-03 2009-02-19 Asahi Glass Co Ltd 磁気ディスク用ガラス基板の製造方法
CN101840939A (zh) * 2009-03-11 2010-09-22 富士胶片株式会社 铝合金基板和太阳能电池基板
JP2011025347A (ja) * 2009-07-24 2011-02-10 Disco Abrasive Syst Ltd 金属板の加工方法
KR101232813B1 (ko) * 2009-09-30 2013-02-13 에어 프로덕츠 앤드 케미칼스, 인코오포레이티드 스택 장치의 제작을 위한 관통-베이스 웨이퍼 비아를 노출시키는 방법
KR20140110869A (ko) * 2011-11-25 2014-09-17 가부시키가이샤 후지미인코퍼레이티드 합금 재료의 연마 방법 및 합금 재료의 제조 방법
US20150251293A1 (en) * 2012-10-03 2015-09-10 Fujimi Incorporated Polishing method and method for producing alloy material
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
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US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
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US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
EP2915859A4 (en) 2012-10-31 2015-10-28 Fujimi Inc POLISHING COMPOSITION
CN102941528B (zh) * 2012-11-20 2014-12-17 中国人民解放军国防科学技术大学 具有高精度超光滑表面的铝合金材料及抛光盘、抛光液和抛光方法
TWI614093B (zh) * 2013-01-04 2018-02-11 福吉米股份有限公司 研磨用組成物、合金材料、合金材料之硏磨方法及合金材料之製造方法
JP6438191B2 (ja) * 2013-12-10 2018-12-12 三菱瓦斯化学株式会社 ポリカーボネート樹脂フィルムおよびそれを用いた成形体
JP2015203080A (ja) * 2014-04-15 2015-11-16 株式会社フジミインコーポレーテッド 研磨用組成物
WO2016163991A1 (en) * 2015-04-07 2016-10-13 Hewlett-Packard Development Company, L.P. Methods of polishing
MY199592A (en) * 2017-04-14 2023-11-08 Cmc Mat Llc Chemical-mechanical processing slurry and methods for processing a nickel substrate surface
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
US20220023991A1 (en) * 2018-11-27 2022-01-27 3M Innovative Properties Company Polishing pads and systems and methods of making and using the same
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
KR102349153B1 (ko) * 2019-12-16 2022-01-10 주식회사 포스코 알루미늄 합금용 연마 용액, 그 제조방법 및 이를 이용한 연마 방법
CN116141214B (zh) * 2022-08-04 2024-08-27 华侨大学 一种可循环利用的混合磨料抛光膜的制备方法

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Also Published As

Publication number Publication date
IL187706A (en) 2012-07-31
TWI300735B (en) 2008-09-11
CN101208178A (zh) 2008-06-25
US20070010098A1 (en) 2007-01-11
JP2008544868A (ja) 2008-12-11
EP1917122B1 (en) 2018-05-16
KR20080015471A (ko) 2008-02-19
KR20110112463A (ko) 2011-10-12
WO2007120163A3 (en) 2008-02-28
SG163546A1 (en) 2010-08-30
US8062096B2 (en) 2011-11-22
EP1917122A2 (en) 2008-05-07
KR101178338B1 (ko) 2012-08-29
TW200714406A (en) 2007-04-16
MY146358A (en) 2012-08-15
WO2007120163A2 (en) 2007-10-25

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