JP2005142572A5 - - Google Patents
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- Publication number
- JP2005142572A5 JP2005142572A5 JP2004322683A JP2004322683A JP2005142572A5 JP 2005142572 A5 JP2005142572 A5 JP 2005142572A5 JP 2004322683 A JP2004322683 A JP 2004322683A JP 2004322683 A JP2004322683 A JP 2004322683A JP 2005142572 A5 JP2005142572 A5 JP 2005142572A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- single layer
- layer substrate
- fluoropolymer
- microns
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000758 substrate Substances 0.000 claims description 49
- 239000002356 single layer Substances 0.000 claims description 32
- 229920002313 fluoropolymer Polymers 0.000 claims description 22
- 239000004811 fluoropolymer Substances 0.000 claims description 22
- 229920001721 polyimide Polymers 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 5
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 229920002959 polymer blend Polymers 0.000 claims description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 4
- -1 3-aminophenoxy Chemical group 0.000 description 3
- UUAGAQFQZIEFAH-UHFFFAOYSA-N chlorotrifluoroethylene Chemical group FC(F)=C(F)Cl UUAGAQFQZIEFAH-UHFFFAOYSA-N 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 2
- LDFYRFKAYFZVNH-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenoxy]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 LDFYRFKAYFZVNH-UHFFFAOYSA-N 0.000 description 2
- 229920001780 ECTFE Polymers 0.000 description 2
- 239000002033 PVDF binder Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 229920005575 poly(amic acid) Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- CHJAYYWUZLWNSQ-UHFFFAOYSA-N 1-chloro-1,2,2-trifluoroethene;ethene Chemical group C=C.FC(F)=C(F)Cl CHJAYYWUZLWNSQ-UHFFFAOYSA-N 0.000 description 1
- DUCHOMQDJBOBMI-UHFFFAOYSA-N 2-[4-[4-(2-aminophenoxy)phenyl]phenoxy]aniline Chemical group NC1=CC=CC=C1OC1=CC=C(C=2C=CC(OC=3C(=CC=CC=3)N)=CC=2)C=C1 DUCHOMQDJBOBMI-UHFFFAOYSA-N 0.000 description 1
- ZBMISJGHVWNWTE-UHFFFAOYSA-N 3-(4-aminophenoxy)aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(N)=C1 ZBMISJGHVWNWTE-UHFFFAOYSA-N 0.000 description 1
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 1
- XUSNPFGLKGCWGN-UHFFFAOYSA-N 3-[4-(3-aminopropyl)piperazin-1-yl]propan-1-amine Chemical compound NCCCN1CCN(CCCN)CC1 XUSNPFGLKGCWGN-UHFFFAOYSA-N 0.000 description 1
- AVCOFPOLGHKJQB-UHFFFAOYSA-N 4-(3,4-dicarboxyphenyl)sulfonylphthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 AVCOFPOLGHKJQB-UHFFFAOYSA-N 0.000 description 1
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 1
- OUMMJJIUSKTXBI-UHFFFAOYSA-N 4-[4-[1-[4-(3,4-dicarboxyphenoxy)phenyl]propyl]phenoxy]phthalic acid Chemical compound C=1C=C(OC=2C=C(C(C(O)=O)=CC=2)C(O)=O)C=CC=1C(CC)C(C=C1)=CC=C1OC1=CC=C(C(O)=O)C(C(O)=O)=C1 OUMMJJIUSKTXBI-UHFFFAOYSA-N 0.000 description 1
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 1
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 1
- QHHKLPCQTTWFSS-UHFFFAOYSA-N 5-[2-(1,3-dioxo-2-benzofuran-5-yl)-1,1,1,3,3,3-hexafluoropropan-2-yl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)(C(F)(F)F)C(F)(F)F)=C1 QHHKLPCQTTWFSS-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000019739 Dicalciumphosphate Nutrition 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910021536 Zeolite Inorganic materials 0.000 description 1
- 239000000443 aerosol Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- NEFBYIFKOOEVPA-UHFFFAOYSA-K dicalcium phosphate Chemical compound [Ca+2].[Ca+2].[O-]P([O-])([O-])=O NEFBYIFKOOEVPA-UHFFFAOYSA-K 0.000 description 1
- 229940038472 dicalcium phosphate Drugs 0.000 description 1
- 229910000390 dicalcium phosphate Inorganic materials 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 125000006160 pyromellitic dianhydride group Chemical group 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/702,754 US7026032B2 (en) | 2003-11-05 | 2003-11-05 | Polyimide based compositions useful as electronic substrates, derived in part from (micro-powder) fluoropolymer, and methods and compositions relating thereto |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005142572A JP2005142572A (ja) | 2005-06-02 |
| JP2005142572A5 true JP2005142572A5 (enExample) | 2007-12-20 |
| JP4237694B2 JP4237694B2 (ja) | 2009-03-11 |
Family
ID=34435550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004322683A Expired - Fee Related JP4237694B2 (ja) | 2003-11-05 | 2004-11-05 | （微細粉末）フルオロポリマーから部分的に誘導され、電子基板として有用なポリイミドをベースとした組成物、およびそれに関連する方法と組成物 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7026032B2 (enExample) |
| EP (1) | EP1529812A1 (enExample) |
| JP (1) | JP4237694B2 (enExample) |
Families Citing this family (79)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003056575A1 (en) * | 2001-12-21 | 2003-07-10 | Pirelli Produtos Especiais Ltda | Pulsed voltage surge resistant magnet wire |
| TW200615142A (en) * | 2004-06-30 | 2006-05-16 | Sumitomo Chemical Co | Films |
| JP5323315B2 (ja) * | 2004-09-15 | 2013-10-23 | 株式会社カネカ | 高い接着性を有するポリイミドフィルムおよびその製造方法 |
| JP2006113226A (ja) * | 2004-10-14 | 2006-04-27 | Sumitomo Electric Fine Polymer Inc | 加圧ローラ用フィルム |
| US20060270066A1 (en) | 2005-04-25 | 2006-11-30 | Semiconductor Energy Laboratory Co., Ltd. | Organic transistor, manufacturing method of semiconductor device and organic transistor |
| JP2007030501A (ja) * | 2005-06-21 | 2007-02-08 | Ist Corp | ポリイミド複合フィルム及びその製造方法 |
| US7550194B2 (en) * | 2005-08-03 | 2009-06-23 | E. I. Du Pont De Nemours And Company | Low color polyimide compositions useful in optical type applications and methods and compositions relating thereto |
| US7651744B2 (en) * | 2005-10-19 | 2010-01-26 | Industrial Technology Research Institute | Liquid crystal display |
| US7662449B2 (en) * | 2005-11-22 | 2010-02-16 | Industrial Technology Research Institute | Liquid crystal display |
| US20070231588A1 (en) * | 2006-03-31 | 2007-10-04 | Karthikeyan Kanakarajan | Capacitive polyimide laminate |
| TWI370833B (en) * | 2006-12-29 | 2012-08-21 | Ind Tech Res Inst | Composition with high transparency, high thermal-resistant, and low coefficient of thermal expansion, and flexible transparent film and optoelectronic device employing the same |
| US20100209681A1 (en) * | 2007-09-06 | 2010-08-19 | Grant Richard Lee | Polyimide films comprising fluoropolymer coating and methods |
| KR20090067744A (ko) * | 2007-12-21 | 2009-06-25 | 엘지전자 주식회사 | 연성 필름 |
| KR100947607B1 (ko) * | 2007-12-27 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
| KR100947608B1 (ko) | 2007-12-28 | 2010-03-15 | 엘지전자 주식회사 | 연성 필름 |
| US20090297858A1 (en) * | 2008-05-29 | 2009-12-03 | E. I. Du Pont De Nemours And Company | Multilayer insulation for wire, cable or other conductive materials |
| US20100034919A1 (en) * | 2008-08-08 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Melt Processible Semicrystalline Fluoropolymer having Repeating Units Arising from Tetrafluoroethylene, Hexafluoropropylene, and Hydrocarbon Monomer Having a Carboxyl Group and a Polymerizable Carbon-Carbon Double Bond and Multi-Layer Articles Comprising a Layer of the Melt Processible Semicrystalline Fluoropolymer |
| US8574720B2 (en) * | 2009-08-03 | 2013-11-05 | E.I. Du Pont De Nemours & Company | Matte finish polyimide films and methods relating thereto |
| US9631054B2 (en) | 2010-07-23 | 2017-04-25 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US11203192B2 (en) | 2009-08-03 | 2021-12-21 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| US9926415B2 (en) | 2010-08-05 | 2018-03-27 | E I Du Pont De Nemours And Company | Matte finish polyimide films and methods relating thereto |
| CA2696648A1 (en) * | 2010-03-09 | 2011-09-09 | Scott Makepeace | Polyester monofilaments including molybdenum disulphide and industrial textiles made therefrom |
| KR101299652B1 (ko) * | 2011-09-07 | 2013-08-23 | 주식회사 엘지화학 | 불소수지 함유 연성 금속 적층판 |
| US9462688B2 (en) | 2011-09-07 | 2016-10-04 | Lg Chem, Ltd. | Flexible metal laminate containing fluoropolymer |
| US9141157B2 (en) * | 2011-10-13 | 2015-09-22 | Texas Instruments Incorporated | Molded power supply system having a thermally insulated component |
| KR101344006B1 (ko) | 2012-07-11 | 2013-12-23 | 주식회사 엘지화학 | 연성 금속 적층체 |
| WO2014010968A1 (ko) * | 2012-07-11 | 2014-01-16 | 주식회사 엘지화학 | 연성 금속 적층체 |
| JP6235787B2 (ja) * | 2013-03-29 | 2017-11-22 | 東レ・デュポン株式会社 | 高周波回路基板用カバーレイ |
| WO2014183011A2 (en) * | 2013-05-10 | 2014-11-13 | Sabic Innovative Plastics Ip B.V. | Dual layer wire coatings |
| EP2886589A4 (en) * | 2013-09-30 | 2016-06-08 | Lg Chemical Ltd | MOLD METAL LAMINATE AND PROCESS FOR PRODUCING THE SAME |
| KR101598610B1 (ko) | 2013-12-05 | 2016-02-29 | 주식회사 엘지화학 | 연성 금속 적층체 |
| TWI503228B (zh) * | 2013-12-05 | 2015-10-11 | Taimide Technology Inc | 低介電常數之多層聚醯亞胺膜、其疊合體及其製備方法 |
| JP6642433B2 (ja) | 2014-08-01 | 2020-02-05 | Ａｇｃ株式会社 | 樹脂パウダー |
| WO2016024798A1 (ko) * | 2014-08-11 | 2016-02-18 | 주식회사 엘지화학 | 산화 알루미늄 조성물, 이를 포함하는 기판 및 이의 제조 방법 |
| TWI607868B (zh) * | 2014-08-29 | 2017-12-11 | 達邁科技股份有限公司 | 聚醯亞胺膜及其製成和組合方法 |
| KR101797722B1 (ko) | 2014-09-30 | 2017-11-15 | 셍기 테크놀로지 코. 엘티디. | 연성 금속 적층체 및 이의 제조 방법 |
| WO2016052873A1 (ko) * | 2014-09-30 | 2016-04-07 | 주식회사 엘지화학 | 연성 금속 적충제 및 이의 제조방법 |
| KR101962986B1 (ko) | 2014-11-18 | 2019-03-27 | 셍기 테크놀로지 코. 엘티디. | 연성 금속 적층체 |
| KR101763873B1 (ko) | 2014-11-27 | 2017-08-14 | 주식회사 엘지화학 | 연성 금속 적층체 |
| TWI593753B (zh) * | 2015-03-11 | 2017-08-01 | Taimide Tech Incoporation | Polyimide film and method of forming a radial circuit board from the film |
| CN107429028B (zh) | 2015-04-01 | 2020-06-23 | 三菱铅笔株式会社 | 含氟系树脂的非水系分散体、包含其的产品和它们的制造方法 |
| US9650471B2 (en) | 2015-04-07 | 2017-05-16 | International Business Machines Corporation | Polyhexahydrotriazine dielectrics |
| JP7093608B2 (ja) * | 2015-10-19 | 2022-06-30 | 三菱鉛筆株式会社 | フッ素系樹脂含有ポリイミド前駆体溶液組成物、それを用いたポリイミド、ポリイミドフィルム、およびそれらの製造方法 |
| US9828467B2 (en) | 2016-02-05 | 2017-11-28 | International Business Machines Corporation | Photoresponsive hexahydrotriazine polymers |
| JP6747091B2 (ja) * | 2016-06-23 | 2020-08-26 | 富士ゼロックス株式会社 | 多孔質フィルム、及びその製造方法 |
| KR102353963B1 (ko) | 2016-06-23 | 2022-01-20 | 에이지씨 가부시키가이샤 | 불소 수지 파우더를 포함하는 액상 조성물의 제조 방법 |
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| CN115124716B (zh) * | 2021-03-26 | 2024-04-02 | 财团法人工业技术研究院 | 聚酰亚胺、薄膜组合物及其所形成的薄膜 |
| US20240343027A1 (en) * | 2021-08-13 | 2024-10-17 | Lg Electronics Inc. | Composite polyimide substrate, composite polyimide composition, and printed circuit board using same |
| CN114479458B (zh) * | 2022-01-24 | 2023-03-10 | 北京科技大学 | 一种全有机低介电聚酰亚胺复合薄膜及其制备方法和应用 |
| JP7733591B2 (ja) * | 2022-02-07 | 2025-09-03 | 株式会社有沢製作所 | フッ素樹脂組成物、フッ素樹脂フィルム、積層フィルム、及び金属積層板 |
| EP4574857A1 (en) | 2023-12-21 | 2025-06-25 | Arkema France | (meth)acrylic composition, method for producing said composition and uses thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4749752A (en) * | 1985-04-01 | 1988-06-07 | Shanghai Institute Of Organic Chemistry Academia Sinica | Fluoropolymer alloys |
| JPS6225030A (ja) * | 1985-07-25 | 1987-02-03 | Ube Ind Ltd | ポリイミド粉末の連続成形法 |
| JPH083041B2 (ja) * | 1986-06-30 | 1996-01-17 | 三井東圧化学株式会社 | ポリイミド樹脂組成物 |
| JPH04328161A (ja) * | 1991-04-26 | 1992-11-17 | Nippon Telegr & Teleph Corp <Ntt> | フッ素樹脂含有ポリアミド酸組成物、フッ素樹脂含有ポリイミド組成物及びそれから得られるフィルム |
| US5753358A (en) * | 1994-08-25 | 1998-05-19 | W. L. Gore & Associates, Inc. | Adhisive-filler polymer film composite |
| US5879794A (en) * | 1994-08-25 | 1999-03-09 | W. L. Gore & Associates, Inc. | Adhesive-filler film composite |
| US5766750A (en) * | 1994-08-25 | 1998-06-16 | W. L. Gore & Associates, Inc. | Process for making an adhesive-filler polymer film composite |
| KR0172779B1 (ko) | 1995-03-29 | 1999-03-20 | 김주용 | 감광막 제거 방법 |
| JP3060297B2 (ja) | 1998-02-10 | 2000-07-10 | 株式会社コスモ総合研究所 | 樹脂組成物、成形物及び樹脂組成物の製造方法 |
| KR100733433B1 (ko) | 2000-06-30 | 2007-06-29 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 고주파 전자 부품용 절연 재료 |
-
2003
- 2003-11-05 US US10/702,754 patent/US7026032B2/en not_active Expired - Fee Related
-
2004
- 2004-10-07 EP EP20040023887 patent/EP1529812A1/en not_active Withdrawn
- 2004-11-05 JP JP2004322683A patent/JP4237694B2/ja not_active Expired - Fee Related
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