JP2004537847A5 - - Google Patents
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- JP2004537847A5 JP2004537847A5 JP2003504424A JP2003504424A JP2004537847A5 JP 2004537847 A5 JP2004537847 A5 JP 2004537847A5 JP 2003504424 A JP2003504424 A JP 2003504424A JP 2003504424 A JP2003504424 A JP 2003504424A JP 2004537847 A5 JP2004537847 A5 JP 2004537847A5
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- Prior art keywords
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- dielectric material
- thickness
- oxide
- Prior art date
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- 239000003989 dielectric material Substances 0.000 claims 46
- 239000003990 capacitor Substances 0.000 claims 39
- 229910052751 metal Inorganic materials 0.000 claims 37
- 239000002184 metal Substances 0.000 claims 37
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 16
- 229910010271 silicon carbide Inorganic materials 0.000 claims 16
- 238000004519 manufacturing process Methods 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 10
- 229910052710 silicon Inorganic materials 0.000 claims 10
- 239000010703 silicon Substances 0.000 claims 10
- 238000000151 deposition Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 7
- 229910052804 chromium Inorganic materials 0.000 claims 7
- 239000011651 chromium Substances 0.000 claims 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 7
- 229910052737 gold Inorganic materials 0.000 claims 7
- 239000010931 gold Substances 0.000 claims 7
- 229910052697 platinum Inorganic materials 0.000 claims 7
- 229910052719 titanium Inorganic materials 0.000 claims 7
- 239000010936 titanium Substances 0.000 claims 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims 6
- 239000002243 precursor Substances 0.000 claims 6
- 235000012239 silicon dioxide Nutrition 0.000 claims 6
- 239000000377 silicon dioxide Substances 0.000 claims 6
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 150000004767 nitrides Chemical class 0.000 claims 4
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- 239000001301 oxygen Substances 0.000 claims 3
- 229910052760 oxygen Inorganic materials 0.000 claims 3
- 239000012686 silicon precursor Substances 0.000 claims 3
- 239000011261 inert gas Substances 0.000 claims 2
- 238000010276 construction Methods 0.000 claims 1
- 239000012212 insulator Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/878,442 US6972436B2 (en) | 1998-08-28 | 2001-06-11 | High voltage, high temperature capacitor and interconnection structures |
| US09/878,442 | 2001-06-11 | ||
| PCT/US2002/009393 WO2002101767A2 (en) | 2001-06-11 | 2002-03-26 | High voltage, high temperature capacitor structures and methods of fabricating same |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012073492A Division JP5726800B2 (ja) | 2001-06-11 | 2012-03-28 | コンデンサ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004537847A JP2004537847A (ja) | 2004-12-16 |
| JP2004537847A5 true JP2004537847A5 (enExample) | 2006-01-05 |
| JP5004406B2 JP5004406B2 (ja) | 2012-08-22 |
Family
ID=25372039
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003504424A Expired - Lifetime JP5004406B2 (ja) | 2001-06-11 | 2002-03-26 | コンデンサ及びその製造方法 |
| JP2012073492A Expired - Lifetime JP5726800B2 (ja) | 2001-06-11 | 2012-03-28 | コンデンサ及びその製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012073492A Expired - Lifetime JP5726800B2 (ja) | 2001-06-11 | 2012-03-28 | コンデンサ及びその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US6972436B2 (enExample) |
| EP (1) | EP1412970B1 (enExample) |
| JP (2) | JP5004406B2 (enExample) |
| KR (1) | KR100949844B1 (enExample) |
| CN (1) | CN1266742C (enExample) |
| AU (1) | AU2002258625A1 (enExample) |
| CA (1) | CA2448006C (enExample) |
| WO (1) | WO2002101767A2 (enExample) |
Families Citing this family (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6956238B2 (en) * | 2000-10-03 | 2005-10-18 | Cree, Inc. | Silicon carbide power metal-oxide semiconductor field effect transistors having a shorting channel and methods of fabricating silicon carbide metal-oxide semiconductor field effect transistors having a shorting channel |
| WO2003047000A1 (en) * | 2001-11-30 | 2003-06-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor device and production method therefor |
| DE10217566A1 (de) * | 2002-04-19 | 2003-11-13 | Infineon Technologies Ag | Halbleiterbauelement mit integrierter, eine Mehrzahl an Metallisierungsebenen aufweisende Kapazitätsstruktur |
| US7084423B2 (en) | 2002-08-12 | 2006-08-01 | Acorn Technologies, Inc. | Method for depinning the Fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
| US6833556B2 (en) | 2002-08-12 | 2004-12-21 | Acorn Technologies, Inc. | Insulated gate field effect transistor having passivated schottky barriers to the channel |
| US7022378B2 (en) * | 2002-08-30 | 2006-04-04 | Cree, Inc. | Nitrogen passivation of interface states in SiO2/SiC structures |
| TWI320571B (en) * | 2002-09-12 | 2010-02-11 | Qs Semiconductor Australia Pty Ltd | Dynamic nonvolatile random access memory ne transistor cell and random access memory array |
| US7221010B2 (en) * | 2002-12-20 | 2007-05-22 | Cree, Inc. | Vertical JFET limited silicon carbide power metal-oxide semiconductor field effect transistors |
| US7026650B2 (en) * | 2003-01-15 | 2006-04-11 | Cree, Inc. | Multiple floating guard ring edge termination for silicon carbide devices |
| US9515135B2 (en) * | 2003-01-15 | 2016-12-06 | Cree, Inc. | Edge termination structures for silicon carbide devices |
| KR100520600B1 (ko) * | 2003-02-17 | 2005-10-10 | 주식회사 하이닉스반도체 | 반도체소자의 캐패시터 제조방법 |
| JP2004319907A (ja) * | 2003-04-18 | 2004-11-11 | Tadahiro Omi | 半導体装置の製造方法および製造装置 |
| US7074643B2 (en) * | 2003-04-24 | 2006-07-11 | Cree, Inc. | Silicon carbide power devices with self-aligned source and well regions and methods of fabricating same |
| US6979863B2 (en) * | 2003-04-24 | 2005-12-27 | Cree, Inc. | Silicon carbide MOSFETs with integrated antiparallel junction barrier Schottky free wheeling diodes and methods of fabricating the same |
| US6812110B1 (en) * | 2003-05-09 | 2004-11-02 | Micron Technology, Inc. | Methods of forming capacitor constructions, and methods of forming constructions comprising dielectric materials |
| KR100947064B1 (ko) * | 2003-08-13 | 2010-03-10 | 삼성전자주식회사 | 반도체 장치의 커패시터 및 이를 구비하는 메모리 장치 |
| CN1864268A (zh) * | 2003-09-02 | 2006-11-15 | 埃皮泰克帝斯克有限公司 | 具有隧道式mis发射结的异质结双极晶体管 |
| US7709403B2 (en) * | 2003-10-09 | 2010-05-04 | Panasonic Corporation | Silicon carbide-oxide layered structure, production method thereof, and semiconductor device |
| US7155359B1 (en) * | 2004-07-02 | 2006-12-26 | Advanced Micro Devices, Inc. | Determination of device failure characteristic |
| US7247550B2 (en) * | 2005-02-08 | 2007-07-24 | Teledyne Licensing, Llc | Silicon carbide-based device contact and contact fabrication method |
| DE102005008195A1 (de) * | 2005-02-23 | 2006-08-24 | Atmel Germany Gmbh | Hochfrequenzanordnung |
| US7619298B1 (en) * | 2005-03-31 | 2009-11-17 | Xilinx, Inc. | Method and apparatus for reducing parasitic capacitance |
| US7855401B2 (en) | 2005-06-29 | 2010-12-21 | Cree, Inc. | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |
| US7525122B2 (en) * | 2005-06-29 | 2009-04-28 | Cree, Inc. | Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides |
| US7598576B2 (en) * | 2005-06-29 | 2009-10-06 | Cree, Inc. | Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices |
| JP2007066944A (ja) | 2005-08-29 | 2007-03-15 | Nissan Motor Co Ltd | 炭化珪素半導体装置及びその製造方法 |
| US7340360B1 (en) * | 2006-02-08 | 2008-03-04 | Advanced Micro Devices, Inc. | Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thickness |
| US7478562B2 (en) * | 2006-05-05 | 2009-01-20 | Kulite Semiconductor Products, Inc. | High temperature LC pressure transducer and methods for making the same |
| US8372697B2 (en) | 2006-05-08 | 2013-02-12 | University Of South Carolina | Digital oxide deposition of SiO2 layers on wafers |
| US7728402B2 (en) * | 2006-08-01 | 2010-06-01 | Cree, Inc. | Semiconductor devices including schottky diodes with controlled breakdown |
| US8432012B2 (en) | 2006-08-01 | 2013-04-30 | Cree, Inc. | Semiconductor devices including schottky diodes having overlapping doped regions and methods of fabricating same |
| EP2631951B1 (en) | 2006-08-17 | 2017-10-11 | Cree, Inc. | High power insulated gate bipolar transistors |
| US20080157291A1 (en) * | 2006-12-27 | 2008-07-03 | Texas Instruments Inc. | Packaging implementation while mitigating threshold voltage shifting |
| US8835987B2 (en) * | 2007-02-27 | 2014-09-16 | Cree, Inc. | Insulated gate bipolar transistors including current suppressing layers |
| US8318562B2 (en) * | 2007-04-02 | 2012-11-27 | University Of South Carolina | Method to increase breakdown voltage of semiconductor devices |
| US9634191B2 (en) | 2007-11-14 | 2017-04-25 | Cree, Inc. | Wire bond free wafer level LED |
| US8431962B2 (en) * | 2007-12-07 | 2013-04-30 | Northrop Grumman Systems Corporation | Composite passivation process for nitride FET |
| US9024327B2 (en) | 2007-12-14 | 2015-05-05 | Cree, Inc. | Metallization structure for high power microelectronic devices |
| US8232558B2 (en) | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
| CN101364481B (zh) * | 2008-09-23 | 2010-12-15 | 宁波碧彩实业有限公司 | 带整流装置的高压电容器 |
| US8106487B2 (en) | 2008-12-23 | 2012-01-31 | Pratt & Whitney Rocketdyne, Inc. | Semiconductor device having an inorganic coating layer applied over a junction termination extension |
| US8288220B2 (en) | 2009-03-27 | 2012-10-16 | Cree, Inc. | Methods of forming semiconductor devices including epitaxial layers and related structures |
| US8294507B2 (en) | 2009-05-08 | 2012-10-23 | Cree, Inc. | Wide bandgap bipolar turn-off thyristor having non-negative temperature coefficient and related control circuits |
| US8193848B2 (en) | 2009-06-02 | 2012-06-05 | Cree, Inc. | Power switching devices having controllable surge current capabilities |
| US8629509B2 (en) * | 2009-06-02 | 2014-01-14 | Cree, Inc. | High voltage insulated gate bipolar transistors with minority carrier diverter |
| US8541787B2 (en) * | 2009-07-15 | 2013-09-24 | Cree, Inc. | High breakdown voltage wide band-gap MOS-gated bipolar junction transistors with avalanche capability |
| US8191217B2 (en) | 2009-08-05 | 2012-06-05 | International Business Machines Corporation | Complimentary metal-insulator-metal (MIM) capacitors and method of manufacture |
| US8375539B2 (en) | 2009-08-05 | 2013-02-19 | International Business Machines Corporation | Method of manufacturing complimentary metal-insulator-metal (MIM) capacitors |
| US8354690B2 (en) | 2009-08-31 | 2013-01-15 | Cree, Inc. | Solid-state pinch off thyristor circuits |
| US9117739B2 (en) | 2010-03-08 | 2015-08-25 | Cree, Inc. | Semiconductor devices with heterojunction barrier regions and methods of fabricating same |
| US8415671B2 (en) | 2010-04-16 | 2013-04-09 | Cree, Inc. | Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices |
| US8683420B2 (en) | 2010-11-17 | 2014-03-25 | Intermolecular, Inc. | Method and system of improved reliability testing |
| US9029945B2 (en) | 2011-05-06 | 2015-05-12 | Cree, Inc. | Field effect transistor devices with low source resistance |
| US9142662B2 (en) | 2011-05-06 | 2015-09-22 | Cree, Inc. | Field effect transistor devices with low source resistance |
| US9269580B2 (en) | 2011-06-27 | 2016-02-23 | Cree, Inc. | Semiconductor device with increased channel mobility and dry chemistry processes for fabrication thereof |
| US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
| US8680587B2 (en) | 2011-09-11 | 2014-03-25 | Cree, Inc. | Schottky diode |
| US9373617B2 (en) | 2011-09-11 | 2016-06-21 | Cree, Inc. | High current, low switching loss SiC power module |
| WO2013036370A1 (en) | 2011-09-11 | 2013-03-14 | Cree, Inc. | High current density power module comprising transistors with improved layout |
| US8664665B2 (en) | 2011-09-11 | 2014-03-04 | Cree, Inc. | Schottky diode employing recesses for elements of junction barrier array |
| US8618582B2 (en) | 2011-09-11 | 2013-12-31 | Cree, Inc. | Edge termination structure employing recesses for edge termination elements |
| JP6042656B2 (ja) | 2011-09-30 | 2016-12-14 | 株式会社日立国際電気 | 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム |
| WO2013077954A1 (en) | 2011-11-23 | 2013-05-30 | Acorn Technologies, Inc. | Improving metal contacts to group iv semiconductors by inserting interfacial atomic monolayers |
| JP5460768B2 (ja) * | 2012-03-21 | 2014-04-02 | 日産自動車株式会社 | 炭化珪素半導体装置の製造方法 |
| US8779509B2 (en) | 2012-07-02 | 2014-07-15 | Infineon Technologies Austria Ag | Semiconductor device including an edge area and method of manufacturing a semiconductor device |
| JP5646569B2 (ja) * | 2012-09-26 | 2014-12-24 | 株式会社東芝 | 半導体装置 |
| US9991399B2 (en) | 2012-10-04 | 2018-06-05 | Cree, Inc. | Passivation structure for semiconductor devices |
| US9812338B2 (en) | 2013-03-14 | 2017-11-07 | Cree, Inc. | Encapsulation of advanced devices using novel PECVD and ALD schemes |
| US8994073B2 (en) | 2012-10-04 | 2015-03-31 | Cree, Inc. | Hydrogen mitigation schemes in the passivation of advanced devices |
| CN103199081B (zh) * | 2013-04-09 | 2015-12-23 | 上海华力微电子有限公司 | Mim电容器及其制造方法 |
| US9515211B2 (en) * | 2013-07-26 | 2016-12-06 | University Of South Carolina | Schottky barrier detection devices having a 4H-SiC n-type epitaxial layer |
| CN104465608A (zh) * | 2013-09-23 | 2015-03-25 | 中芯国际集成电路制造(上海)有限公司 | Mim电容器及其制造方法 |
| CN104037240A (zh) * | 2014-06-26 | 2014-09-10 | 西安电子科技大学 | SiC MOS电容及制造方法 |
| CN104037239A (zh) * | 2014-06-26 | 2014-09-10 | 西安电子科技大学 | SiC MOS电容及制造方法 |
| CN104037238A (zh) * | 2014-06-26 | 2014-09-10 | 西安电子科技大学 | SiC MOS电容及制造方法 |
| US9461108B2 (en) * | 2014-08-13 | 2016-10-04 | Fairchild Semiconductor Corporation | SiC power device having a high voltage termination |
| JP2016066641A (ja) * | 2014-09-22 | 2016-04-28 | 株式会社東芝 | 半導体装置及び半導体装置の製造方法 |
| US9620611B1 (en) | 2016-06-17 | 2017-04-11 | Acorn Technology, Inc. | MIS contact structure with metal oxide conductor |
| WO2018094205A1 (en) | 2016-11-18 | 2018-05-24 | Acorn Technologies, Inc. | Nanowire transistor with source and drain induced by electrical contacts with negative schottky barrier height |
| US10319582B2 (en) * | 2017-04-27 | 2019-06-11 | Lam Research Corporation | Methods and apparatus for depositing silicon oxide on metal layers |
| US9998109B1 (en) * | 2017-05-15 | 2018-06-12 | Cree, Inc. | Power module with improved reliability |
| CN109887746B (zh) * | 2019-03-06 | 2021-01-01 | 无锡鑫聚电子科技有限公司 | 一种用于高可靠大功率电容器的金属化薄膜及其制备方法 |
| CN111710658A (zh) * | 2020-07-01 | 2020-09-25 | 华虹半导体(无锡)有限公司 | 防分层mim电容及其制作方法 |
| CN111933612B (zh) * | 2020-10-09 | 2021-02-19 | 晶芯成(北京)科技有限公司 | 一种半导体结构的制造方法 |
| TWI795286B (zh) * | 2022-05-06 | 2023-03-01 | 國立陽明交通大學 | 浮動保護環耐壓的穩定方法 |
Family Cites Families (85)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3924024A (en) | 1973-04-02 | 1975-12-02 | Ncr Co | Process for fabricating MNOS non-volatile memories |
| US4466172A (en) | 1979-01-08 | 1984-08-21 | American Microsystems, Inc. | Method for fabricating MOS device with self-aligned contacts |
| JPS61207048A (ja) * | 1985-03-12 | 1986-09-13 | Seiko Instr & Electronics Ltd | 半導体装置 |
| US4875083A (en) | 1987-10-26 | 1989-10-17 | North Carolina State University | Metal-insulator-semiconductor capacitor formed on silicon carbide |
| JPH01239940A (ja) * | 1988-03-22 | 1989-09-25 | Seiko Epson Corp | 半導体装置 |
| JPH0766971B2 (ja) | 1989-06-07 | 1995-07-19 | シャープ株式会社 | 炭化珪素半導体装置 |
| JPH03157974A (ja) | 1989-11-15 | 1991-07-05 | Nec Corp | 縦型電界効果トランジスタ |
| JP2542448B2 (ja) | 1990-05-24 | 1996-10-09 | シャープ株式会社 | 電界効果トランジスタおよびその製造方法 |
| JPH06160174A (ja) | 1991-09-27 | 1994-06-07 | Terumo Corp | 赤外線センサ |
| US5170455A (en) | 1991-10-30 | 1992-12-08 | At&T Bell Laboratories | Optical connective device |
| JP3356816B2 (ja) | 1992-03-24 | 2002-12-16 | セイコーインスツルメンツ株式会社 | 半導体光電気変換装置 |
| JP2704575B2 (ja) * | 1992-04-20 | 1998-01-26 | 日本電信電話株式会社 | 容量素子の製造方法 |
| US5185689A (en) | 1992-04-29 | 1993-02-09 | Motorola Inc. | Capacitor having a ruthenate electrode and method of formation |
| US6344663B1 (en) | 1992-06-05 | 2002-02-05 | Cree, Inc. | Silicon carbide CMOS devices |
| US5459107A (en) | 1992-06-05 | 1995-10-17 | Cree Research, Inc. | Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures |
| US5726463A (en) | 1992-08-07 | 1998-03-10 | General Electric Company | Silicon carbide MOSFET having self-aligned gate structure |
| US5587870A (en) | 1992-09-17 | 1996-12-24 | Research Foundation Of State University Of New York | Nanocrystalline layer thin film capacitors |
| US5506421A (en) | 1992-11-24 | 1996-04-09 | Cree Research, Inc. | Power MOSFET in silicon carbide |
| KR100305123B1 (ko) * | 1992-12-11 | 2001-11-22 | 비센트 비.인그라시아, 알크 엠 아헨 | 정적랜덤액세스메모리셀및이를포함하는반도체장치 |
| EP0605980A3 (en) * | 1993-01-07 | 1995-08-02 | Ramtron Int Corp | Layering process for depositing silicon nitride and silicon oxynitride. |
| JPH06252347A (ja) * | 1993-02-25 | 1994-09-09 | Mitsubishi Electric Corp | Mimキャパシタ及びその製造方法 |
| US5479316A (en) * | 1993-08-24 | 1995-12-26 | Analog Devices, Inc. | Integrated circuit metal-oxide-metal capacitor and method of making same |
| US5510630A (en) | 1993-10-18 | 1996-04-23 | Westinghouse Electric Corporation | Non-volatile random access memory cell constructed of silicon carbide |
| JP3254875B2 (ja) * | 1994-02-03 | 2002-02-12 | 富士通株式会社 | 半導体装置の製造方法 |
| JP3521246B2 (ja) | 1995-03-27 | 2004-04-19 | 沖電気工業株式会社 | 電界効果トランジスタおよびその製造方法 |
| JPH0969589A (ja) * | 1995-09-01 | 1997-03-11 | Mitsubishi Materials Corp | 薄膜コンデンサ内蔵型モジュール |
| JPH11261061A (ja) | 1998-03-11 | 1999-09-24 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
| JP4001960B2 (ja) | 1995-11-03 | 2007-10-31 | フリースケール セミコンダクター インコーポレイテッド | 窒化酸化物誘電体層を有する半導体素子の製造方法 |
| US5972801A (en) | 1995-11-08 | 1999-10-26 | Cree Research, Inc. | Process for reducing defects in oxide layers on silicon carbide |
| US6136728A (en) | 1996-01-05 | 2000-10-24 | Yale University | Water vapor annealing process |
| JPH09205202A (ja) | 1996-01-26 | 1997-08-05 | Matsushita Electric Works Ltd | 半導体装置 |
| US5877045A (en) | 1996-04-10 | 1999-03-02 | Lsi Logic Corporation | Method of forming a planar surface during multi-layer interconnect formation by a laser-assisted dielectric deposition |
| US5972788A (en) | 1996-05-22 | 1999-10-26 | International Business Machines Corporation | Method of making flexible interconnections with dual-metal-dual-stud structure |
| JP3889476B2 (ja) * | 1996-05-29 | 2007-03-07 | 三菱電機株式会社 | マイクロ波半導体集積回路の製造方法 |
| JPH1022457A (ja) | 1996-07-03 | 1998-01-23 | Mitsubishi Electric Corp | 容量装置及び半導体装置並びにそれらの製造方法 |
| US5763905A (en) | 1996-07-09 | 1998-06-09 | Abb Research Ltd. | Semiconductor device having a passivation layer |
| US6002159A (en) | 1996-07-16 | 1999-12-14 | Abb Research Ltd. | SiC semiconductor device comprising a pn junction with a voltage absorbing edge |
| US5939763A (en) | 1996-09-05 | 1999-08-17 | Advanced Micro Devices, Inc. | Ultrathin oxynitride structure and process for VLSI applications |
| US6028012A (en) | 1996-12-04 | 2000-02-22 | Yale University | Process for forming a gate-quality insulating layer on a silicon carbide substrate |
| US5837572A (en) | 1997-01-10 | 1998-11-17 | Advanced Micro Devices, Inc. | CMOS integrated circuit formed by using removable spacers to produce asymmetrical NMOS junctions before asymmetrical PMOS junctions for optimizing thermal diffusivity of dopants implanted therein |
| JP3206727B2 (ja) | 1997-02-20 | 2001-09-10 | 富士電機株式会社 | 炭化けい素縦型mosfetおよびその製造方法 |
| DE19809554B4 (de) | 1997-03-05 | 2008-04-03 | Denso Corp., Kariya | Siliziumkarbidhalbleitervorrichtung |
| JPH1117027A (ja) * | 1997-06-19 | 1999-01-22 | Hitachi Ltd | 半導体記憶装置及びその製造方法 |
| US6063698A (en) | 1997-06-30 | 2000-05-16 | Motorola, Inc. | Method for manufacturing a high dielectric constant gate oxide for use in semiconductor integrated circuits |
| JP3180895B2 (ja) | 1997-08-18 | 2001-06-25 | 富士電機株式会社 | 炭化けい素半導体装置の製造方法 |
| CN1267397A (zh) | 1997-08-20 | 2000-09-20 | 西门子公司 | 具有预定的α碳化硅区的半导体结构及此半导体结构的应用 |
| US6100184A (en) | 1997-08-20 | 2000-08-08 | Sematech, Inc. | Method of making a dual damascene interconnect structure using low dielectric constant material for an inter-level dielectric layer |
| US6239463B1 (en) | 1997-08-28 | 2001-05-29 | Siliconix Incorporated | Low resistance power MOSFET or other device containing silicon-germanium layer |
| SE9704150D0 (sv) | 1997-11-13 | 1997-11-13 | Abb Research Ltd | Semiconductor device of SiC with insulating layer a refractory metal nitride layer |
| JPH11191559A (ja) | 1997-12-26 | 1999-07-13 | Matsushita Electric Works Ltd | Mosfetの製造方法 |
| JPH11251592A (ja) | 1998-01-05 | 1999-09-17 | Denso Corp | 炭化珪素半導体装置 |
| JP3216804B2 (ja) | 1998-01-06 | 2001-10-09 | 富士電機株式会社 | 炭化けい素縦形fetの製造方法および炭化けい素縦形fet |
| JPH11266017A (ja) | 1998-01-14 | 1999-09-28 | Denso Corp | 炭化珪素半導体装置及びその製造方法 |
| JPH11238742A (ja) | 1998-02-23 | 1999-08-31 | Denso Corp | 炭化珪素半導体装置の製造方法 |
| US5946567A (en) | 1998-03-20 | 1999-08-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for making metal capacitors for deep submicrometer processes for semiconductor integrated circuits |
| JP3893725B2 (ja) | 1998-03-25 | 2007-03-14 | 株式会社デンソー | 炭化珪素半導体装置の製造方法 |
| US6627539B1 (en) | 1998-05-29 | 2003-09-30 | Newport Fab, Llc | Method of forming dual-damascene interconnect structures employing low-k dielectric materials |
| US6107142A (en) | 1998-06-08 | 2000-08-22 | Cree Research, Inc. | Self-aligned methods of fabricating silicon carbide power devices by implantation and lateral diffusion |
| US6100169A (en) | 1998-06-08 | 2000-08-08 | Cree, Inc. | Methods of fabricating silicon carbide power devices by controlled annealing |
| JP4123636B2 (ja) | 1998-06-22 | 2008-07-23 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US5960289A (en) | 1998-06-22 | 1999-09-28 | Motorola, Inc. | Method for making a dual-thickness gate oxide layer using a nitride/oxide composite region |
| JP2000106371A (ja) | 1998-07-31 | 2000-04-11 | Denso Corp | 炭化珪素半導体装置の製造方法 |
| US6221700B1 (en) | 1998-07-31 | 2001-04-24 | Denso Corporation | Method of manufacturing silicon carbide semiconductor device with high activation rate of impurities |
| JP3959856B2 (ja) | 1998-07-31 | 2007-08-15 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| US6246076B1 (en) | 1998-08-28 | 2001-06-12 | Cree, Inc. | Layered dielectric on silicon carbide semiconductor structures |
| US6211035B1 (en) | 1998-09-09 | 2001-04-03 | Texas Instruments Incorporated | Integrated circuit and method |
| US6204203B1 (en) | 1998-10-14 | 2001-03-20 | Applied Materials, Inc. | Post deposition treatment of dielectric films for interface control |
| US6048766A (en) | 1998-10-14 | 2000-04-11 | Advanced Micro Devices | Flash memory device having high permittivity stacked dielectric and fabrication thereof |
| JP2000201050A (ja) | 1998-11-02 | 2000-07-18 | Ngk Insulators Ltd | 表面弾性波装置用基板およびその製造方法 |
| JP3127908B2 (ja) * | 1998-11-20 | 2001-01-29 | 日本電気株式会社 | 半導体装置の製造方法 |
| JP2000183052A (ja) * | 1998-12-18 | 2000-06-30 | Sony Corp | 電子装置の製造方法 |
| US6190973B1 (en) | 1998-12-18 | 2001-02-20 | Zilog Inc. | Method of fabricating a high quality thin oxide |
| US6228720B1 (en) | 1999-02-23 | 2001-05-08 | Matsushita Electric Industrial Co., Ltd. | Method for making insulated-gate semiconductor element |
| JP3443589B2 (ja) | 1999-03-01 | 2003-09-02 | 独立行政法人産業技術総合研究所 | 半導体装置の製造方法 |
| US6238967B1 (en) | 1999-04-12 | 2001-05-29 | Motorola, Inc. | Method of forming embedded DRAM structure |
| JP2000349081A (ja) | 1999-06-07 | 2000-12-15 | Sony Corp | 酸化膜形成方法 |
| JP2001024155A (ja) * | 1999-07-05 | 2001-01-26 | Murata Mfg Co Ltd | Mimキャパシタ、その製造方法、半導体装置、エアブリッジ金属配線、およびその製造方法 |
| JP2001077192A (ja) * | 1999-08-31 | 2001-03-23 | Sony Corp | 半導体装置およびその製造方法 |
| JP4192353B2 (ja) | 1999-09-21 | 2008-12-10 | 株式会社デンソー | 炭化珪素半導体装置及びその製造方法 |
| JP2001144176A (ja) * | 1999-11-12 | 2001-05-25 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
| JP3450242B2 (ja) * | 1999-11-26 | 2003-09-22 | Necエレクトロニクス株式会社 | 化合物半導体集積回路の製造方法 |
| DE10036208B4 (de) | 2000-07-25 | 2007-04-19 | Siced Electronics Development Gmbh & Co. Kg | Halbleiteraufbau mit vergrabenem Inselgebiet und Konaktgebiet |
| US6610366B2 (en) | 2000-10-03 | 2003-08-26 | Cree, Inc. | Method of N2O annealing an oxide layer on a silicon carbide layer |
| US6767843B2 (en) | 2000-10-03 | 2004-07-27 | Cree, Inc. | Method of N2O growth of an oxide layer on a silicon carbide layer |
| US6593620B1 (en) | 2000-10-06 | 2003-07-15 | General Semiconductor, Inc. | Trench DMOS transistor with embedded trench schottky rectifier |
-
2001
- 2001-06-11 US US09/878,442 patent/US6972436B2/en not_active Expired - Lifetime
-
2002
- 2002-03-26 EP EP02728581.6A patent/EP1412970B1/en not_active Expired - Lifetime
- 2002-03-26 AU AU2002258625A patent/AU2002258625A1/en not_active Abandoned
- 2002-03-26 CN CNB028116372A patent/CN1266742C/zh not_active Expired - Lifetime
- 2002-03-26 CA CA2448006A patent/CA2448006C/en not_active Expired - Lifetime
- 2002-03-26 KR KR1020037014452A patent/KR100949844B1/ko not_active Expired - Lifetime
- 2002-03-26 WO PCT/US2002/009393 patent/WO2002101767A2/en not_active Ceased
- 2002-03-26 JP JP2003504424A patent/JP5004406B2/ja not_active Expired - Lifetime
-
2003
- 2003-03-06 US US10/382,826 patent/US6998322B2/en not_active Expired - Lifetime
-
2012
- 2012-03-28 JP JP2012073492A patent/JP5726800B2/ja not_active Expired - Lifetime
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