JP2004531879A5 - - Google Patents

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Publication number
JP2004531879A5
JP2004531879A5 JP2002570011A JP2002570011A JP2004531879A5 JP 2004531879 A5 JP2004531879 A5 JP 2004531879A5 JP 2002570011 A JP2002570011 A JP 2002570011A JP 2002570011 A JP2002570011 A JP 2002570011A JP 2004531879 A5 JP2004531879 A5 JP 2004531879A5
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JP
Japan
Prior art keywords
substrate
solvent
housing
atmosphere
rotated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002570011A
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English (en)
Japanese (ja)
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JP2004531879A (ja
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Publication date
Priority claimed from US09/795,924 external-priority patent/US6977098B2/en
Priority claimed from US09/895,786 external-priority patent/US7018943B2/en
Application filed filed Critical
Publication of JP2004531879A publication Critical patent/JP2004531879A/ja
Publication of JP2004531879A5 publication Critical patent/JP2004531879A5/ja
Pending legal-status Critical Current

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JP2002570011A 2001-02-28 2002-02-21 基板を均一にコーティングする方法 Pending JP2004531879A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/795,924 US6977098B2 (en) 1994-10-27 2001-02-28 Method of uniformly coating a substrate
US09/895,786 US7018943B2 (en) 1994-10-27 2001-06-30 Method of uniformly coating a substrate
PCT/US2002/005187 WO2002071154A2 (en) 2001-02-28 2002-02-21 Method of uniformly coating a substrate

Publications (2)

Publication Number Publication Date
JP2004531879A JP2004531879A (ja) 2004-10-14
JP2004531879A5 true JP2004531879A5 (enExample) 2005-12-22

Family

ID=27121668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002570011A Pending JP2004531879A (ja) 2001-02-28 2002-02-21 基板を均一にコーティングする方法

Country Status (7)

Country Link
US (1) US7018943B2 (enExample)
EP (1) EP1364256A2 (enExample)
JP (1) JP2004531879A (enExample)
KR (1) KR20040030517A (enExample)
CN (1) CN1265245C (enExample)
AU (1) AU2002252049A1 (enExample)
WO (1) WO2002071154A2 (enExample)

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US7030039B2 (en) * 1994-10-27 2006-04-18 Asml Holding N.V. Method of uniformly coating a substrate
US7018943B2 (en) 1994-10-27 2006-03-28 Asml Holding N.V. Method of uniformly coating a substrate
US6977098B2 (en) * 1994-10-27 2005-12-20 Asml Holding N.V. Method of uniformly coating a substrate
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DE102004019731A1 (de) * 2004-04-20 2005-11-10 Sse Sister Semiconductor Equipment Gmbh Vorrichtung zum Drehbelacken von Substraten
US20060073276A1 (en) * 2004-10-04 2006-04-06 Eric Antonissen Multi-zone atomic layer deposition apparatus and method
US7228645B2 (en) * 2005-01-11 2007-06-12 Xuyen Ngoc Pham Multi-zone shower head for drying single semiconductor substrate
JP4760516B2 (ja) * 2005-12-15 2011-08-31 東京エレクトロン株式会社 塗布装置及び塗布方法
US8092599B2 (en) * 2007-07-10 2012-01-10 Veeco Instruments Inc. Movable injectors in rotating disc gas reactors
CN101526760B (zh) * 2009-04-10 2011-09-07 友达光电股份有限公司 基板处理系统及显影方法
US8906452B1 (en) * 2011-06-03 2014-12-09 Gary Hillman Rapid coating of wafers
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JP6255152B2 (ja) 2012-07-24 2017-12-27 株式会社日立ハイテクノロジーズ 検査装置
CN104810252B (zh) * 2014-01-24 2018-07-06 中芯国际集成电路制造(上海)有限公司 底部抗反射涂层的涂布方法
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US10000049B2 (en) 2014-06-23 2018-06-19 Exel Industries Methods and apparatus for applying protective films
US10315405B2 (en) 2014-06-23 2019-06-11 Exel Industries Methods and apparatus for applying protective films
US9548199B2 (en) * 2014-09-09 2017-01-17 Texas Instruments Incorporated Method of forming a thin film that eliminates air bubbles
WO2016041151A1 (en) * 2014-09-16 2016-03-24 Acm Research (Shanghai) Inc. Coater with automatic cleaning function and coater automatic cleaning method
KR101990704B1 (ko) 2017-11-24 2019-06-18 고려대학교 산학협력단 코팅 비드 영역이 개선된 슬롯 코팅 장치
CN110673444B (zh) * 2019-09-12 2020-06-09 中国科学院上海光学精密机械研究所 超大超重衬底表面光刻胶均匀涂覆的旋涂设备
CN110867529A (zh) * 2019-10-22 2020-03-06 深圳市华星光电半导体显示技术有限公司 真空冷却干燥设备以及显示功能层干燥方法
CN113318941B (zh) * 2020-07-27 2022-10-14 上海先进半导体制造有限公司 在晶圆表面的聚酰亚胺前驱体的旋涂方法和系统
JP7597459B2 (ja) * 2020-09-14 2024-12-10 東京エレクトロン株式会社 原料供給装置及び原料供給方法
US20230229085A1 (en) * 2022-01-19 2023-07-20 Taiwan Semiconductor Manufacturing Company Device and method to promote thickness uniformity in spin-coating

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