JP2004531879A - 基板を均一にコーティングする方法 - Google Patents

基板を均一にコーティングする方法 Download PDF

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Publication number
JP2004531879A
JP2004531879A JP2002570011A JP2002570011A JP2004531879A JP 2004531879 A JP2004531879 A JP 2004531879A JP 2002570011 A JP2002570011 A JP 2002570011A JP 2002570011 A JP2002570011 A JP 2002570011A JP 2004531879 A JP2004531879 A JP 2004531879A
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JP
Japan
Prior art keywords
wafer
delivery
photoresist
solvent
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002570011A
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English (en)
Japanese (ja)
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JP2004531879A5 (enExample
Inventor
エミール グラー，
トム ツォン，
ジョン ローレン，
エドワード， シー． リー，
ロバート， ピー． マンダル，
ジェームス， シー． グラムボウ，
テッド， シー． ベッツ，
ドナルド， アール． ソアー，
エドモンド， アール． ワード，
Original Assignee
シリコン ヴァレイ グループ インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/795,924 external-priority patent/US6977098B2/en
Application filed by シリコン ヴァレイ グループ インコーポレイテッド filed Critical シリコン ヴァレイ グループ インコーポレイテッド
Publication of JP2004531879A publication Critical patent/JP2004531879A/ja
Publication of JP2004531879A5 publication Critical patent/JP2004531879A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0254—Coating heads with slot-shaped outlet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B05D1/005—Spin coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
    • B05D3/0486—Operating the coating or treatment in a controlled atmosphere
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
    • B05C5/0245—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to a moving work of indefinite length, e.g. to a moving web
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • B05D1/265—Extrusion coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2002570011A 2001-02-28 2002-02-21 基板を均一にコーティングする方法 Pending JP2004531879A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/795,924 US6977098B2 (en) 1994-10-27 2001-02-28 Method of uniformly coating a substrate
US09/895,786 US7018943B2 (en) 1994-10-27 2001-06-30 Method of uniformly coating a substrate
PCT/US2002/005187 WO2002071154A2 (en) 2001-02-28 2002-02-21 Method of uniformly coating a substrate

Publications (2)

Publication Number Publication Date
JP2004531879A true JP2004531879A (ja) 2004-10-14
JP2004531879A5 JP2004531879A5 (enExample) 2005-12-22

Family

ID=27121668

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002570011A Pending JP2004531879A (ja) 2001-02-28 2002-02-21 基板を均一にコーティングする方法

Country Status (7)

Country Link
US (1) US7018943B2 (enExample)
EP (1) EP1364256A2 (enExample)
JP (1) JP2004531879A (enExample)
KR (1) KR20040030517A (enExample)
CN (1) CN1265245C (enExample)
AU (1) AU2002252049A1 (enExample)
WO (1) WO2002071154A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9759669B2 (en) 2012-07-24 2017-09-12 Hitachi High-Technologies Corporation Inspection device

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US6977098B2 (en) * 1994-10-27 2005-12-20 Asml Holding N.V. Method of uniformly coating a substrate
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US7228645B2 (en) * 2005-01-11 2007-06-12 Xuyen Ngoc Pham Multi-zone shower head for drying single semiconductor substrate
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CN101526760B (zh) * 2009-04-10 2011-09-07 友达光电股份有限公司 基板处理系统及显影方法
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US10315405B2 (en) 2014-06-23 2019-06-11 Exel Industries Methods and apparatus for applying protective films
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WO2016041151A1 (en) * 2014-09-16 2016-03-24 Acm Research (Shanghai) Inc. Coater with automatic cleaning function and coater automatic cleaning method
KR101990704B1 (ko) 2017-11-24 2019-06-18 고려대학교 산학협력단 코팅 비드 영역이 개선된 슬롯 코팅 장치
CN110673444B (zh) * 2019-09-12 2020-06-09 中国科学院上海光学精密机械研究所 超大超重衬底表面光刻胶均匀涂覆的旋涂设备
CN110867529A (zh) * 2019-10-22 2020-03-06 深圳市华星光电半导体显示技术有限公司 真空冷却干燥设备以及显示功能层干燥方法
CN113318941B (zh) * 2020-07-27 2022-10-14 上海先进半导体制造有限公司 在晶圆表面的聚酰亚胺前驱体的旋涂方法和系统
JP7597459B2 (ja) * 2020-09-14 2024-12-10 東京エレクトロン株式会社 原料供給装置及び原料供給方法
US20230229085A1 (en) * 2022-01-19 2023-07-20 Taiwan Semiconductor Manufacturing Company Device and method to promote thickness uniformity in spin-coating

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9759669B2 (en) 2012-07-24 2017-09-12 Hitachi High-Technologies Corporation Inspection device

Also Published As

Publication number Publication date
EP1364256A2 (en) 2003-11-26
US20020127334A1 (en) 2002-09-12
AU2002252049A1 (en) 2002-09-19
KR20040030517A (ko) 2004-04-09
CN1503928A (zh) 2004-06-09
WO2002071154A2 (en) 2002-09-12
CN1265245C (zh) 2006-07-19
WO2002071154A3 (en) 2003-02-20
US7018943B2 (en) 2006-03-28

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