JP2004339605A5 - - Google Patents

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Publication number
JP2004339605A5
JP2004339605A5 JP2004094941A JP2004094941A JP2004339605A5 JP 2004339605 A5 JP2004339605 A5 JP 2004339605A5 JP 2004094941 A JP2004094941 A JP 2004094941A JP 2004094941 A JP2004094941 A JP 2004094941A JP 2004339605 A5 JP2004339605 A5 JP 2004339605A5
Authority
JP
Japan
Prior art keywords
metal alloy
photoresist
alloy substrate
coating
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004094941A
Other languages
English (en)
Japanese (ja)
Other versions
JP4603812B2 (ja
JP2004339605A (ja
Filing date
Publication date
Priority claimed from GB0310722A external-priority patent/GB0310722D0/en
Priority claimed from GB0311074A external-priority patent/GB0311074D0/en
Application filed filed Critical
Publication of JP2004339605A publication Critical patent/JP2004339605A/ja
Publication of JP2004339605A5 publication Critical patent/JP2004339605A5/ja
Application granted granted Critical
Publication of JP4603812B2 publication Critical patent/JP4603812B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004094941A 2003-05-12 2004-03-29 改良されたスズめっき方法 Expired - Fee Related JP4603812B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB0310722A GB0310722D0 (en) 2003-05-12 2003-05-12 Improved tin plating method
GB0311074A GB0311074D0 (en) 2003-05-14 2003-05-14 Improved tin plating method

Publications (3)

Publication Number Publication Date
JP2004339605A JP2004339605A (ja) 2004-12-02
JP2004339605A5 true JP2004339605A5 (enExample) 2007-05-10
JP4603812B2 JP4603812B2 (ja) 2010-12-22

Family

ID=33031418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004094941A Expired - Fee Related JP4603812B2 (ja) 2003-05-12 2004-03-29 改良されたスズめっき方法

Country Status (6)

Country Link
US (1) US7695605B2 (enExample)
EP (1) EP1477587A3 (enExample)
JP (1) JP4603812B2 (enExample)
KR (1) KR20040097895A (enExample)
CN (1) CN1550577A (enExample)
TW (1) TW200506105A (enExample)

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US9730333B2 (en) 2008-05-15 2017-08-08 Applied Nanotech Holdings, Inc. Photo-curing process for metallic inks
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JP5740389B2 (ja) 2009-03-27 2015-06-24 アプライド・ナノテック・ホールディングス・インコーポレーテッド 光焼結及び／またはレーザー焼結を強化するためのバッファ層
US8262894B2 (en) * 2009-04-30 2012-09-11 Moses Lake Industries, Inc. High speed copper plating bath
US8440065B1 (en) * 2009-06-07 2013-05-14 Technic, Inc. Electrolyte composition, method, and improved apparatus for high speed tin-silver electroplating
WO2011001847A1 (ja) * 2009-07-01 2011-01-06 Jx日鉱日石金属株式会社 Ｕｌｓｉ微細銅配線埋め込み用電気銅めっき液
US8422197B2 (en) 2009-07-15 2013-04-16 Applied Nanotech Holdings, Inc. Applying optical energy to nanoparticles to produce a specified nanostructure
DE102010011269B4 (de) * 2009-11-10 2014-02-13 Ami Doduco Gmbh Verfahren zum Abscheiden einer für das Drahtbonden geeigneten Palladiumschicht auf Leiterbahnen einer Schaltungsträgerplatte und Verwendung eines Palladiumbades in dem Verfahren
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EP2594662B1 (en) * 2011-11-21 2014-04-09 Atotech Deutschland GmbH Aqueous composition for etching of copper and copper alloys
TW201419315A (zh) 2012-07-09 2014-05-16 Applied Nanotech Holdings Inc 微米尺寸銅粒子的光燒結法
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US9604316B2 (en) 2014-09-23 2017-03-28 Globalfoundries Inc. Tin-based solder composition with low void characteristic
CN104593835B (zh) * 2015-02-04 2017-10-24 广东羚光新材料股份有限公司 用于片式元器件端电极电镀的中性镀锡液
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CN111458328B (zh) * 2020-04-26 2021-03-19 电子科技大学 一种检测印制电路板残留铜层分布的方法
CN112342584A (zh) * 2020-09-29 2021-02-09 扬州市景杨表面工程有限公司 一种心脏起搏器电容器件无磁化铜锡电镀工艺
CN112517859B (zh) * 2020-11-24 2022-07-19 太仓史密斯理查森精密制造有限公司 一种用于芯撑的环保抗变色耐腐蚀镀锡制备工艺
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