JP2002294483A5 - - Google Patents
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- Publication number
- JP2002294483A5 JP2002294483A5 JP2001322035A JP2001322035A JP2002294483A5 JP 2002294483 A5 JP2002294483 A5 JP 2002294483A5 JP 2001322035 A JP2001322035 A JP 2001322035A JP 2001322035 A JP2001322035 A JP 2001322035A JP 2002294483 A5 JP2002294483 A5 JP 2002294483A5
- Authority
- JP
- Japan
- Prior art keywords
- seed layer
- metal seed
- wafer
- aperture
- providing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 claims 6
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims 3
- 229910001431 copper ion Inorganic materials 0.000 claims 3
- 239000002184 metal Substances 0.000 claims 3
- 229910052751 metal Inorganic materials 0.000 claims 3
- 239000003792 electrolyte Substances 0.000 claims 2
- 239000002253 acid Substances 0.000 claims 1
- 230000002378 acidificating effect Effects 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24223400P | 2000-10-20 | 2000-10-20 | |
| US60/242234 | 2000-10-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002294483A JP2002294483A (ja) | 2002-10-09 |
| JP2002294483A5 true JP2002294483A5 (enExample) | 2005-09-15 |
Family
ID=22913979
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001322035A Withdrawn JP2002294483A (ja) | 2000-10-20 | 2001-10-19 | シード層修復浴 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6660153B2 (enExample) |
| EP (1) | EP1199383A3 (enExample) |
| JP (1) | JP2002294483A (enExample) |
| KR (1) | KR20020031075A (enExample) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6660154B2 (en) | 2000-10-25 | 2003-12-09 | Shipley Company, L.L.C. | Seed layer |
| US6797146B2 (en) * | 2000-11-02 | 2004-09-28 | Shipley Company, L.L.C. | Seed layer repair |
| US7316772B2 (en) * | 2002-03-05 | 2008-01-08 | Enthone Inc. | Defect reduction in electrodeposited copper for semiconductor applications |
| US8002962B2 (en) | 2002-03-05 | 2011-08-23 | Enthone Inc. | Copper electrodeposition in microelectronics |
| US6676823B1 (en) * | 2002-03-18 | 2004-01-13 | Taskem, Inc. | High speed acid copper plating |
| US6858124B2 (en) * | 2002-12-16 | 2005-02-22 | 3M Innovative Properties Company | Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor |
| US7429401B2 (en) | 2003-05-23 | 2008-09-30 | The United States of America as represented by the Secretary of Commerce, the National Insitiute of Standards & Technology | Superconformal metal deposition using derivatized substrates |
| CN1326216C (zh) * | 2003-12-30 | 2007-07-11 | 中芯国际集成电路制造(上海)有限公司 | 一种避免漩涡效应缺陷的方法 |
| TWI400365B (zh) * | 2004-11-12 | 2013-07-01 | Enthone | 微電子裝置上的銅電沈積 |
| TWI341554B (en) * | 2007-08-02 | 2011-05-01 | Enthone | Copper metallization of through silicon via |
| US7905994B2 (en) | 2007-10-03 | 2011-03-15 | Moses Lake Industries, Inc. | Substrate holder and electroplating system |
| US8262894B2 (en) | 2009-04-30 | 2012-09-11 | Moses Lake Industries, Inc. | High speed copper plating bath |
| US9714474B2 (en) | 2010-04-06 | 2017-07-25 | Tel Nexx, Inc. | Seed layer deposition in microscale features |
| WO2012150736A1 (ko) * | 2011-05-03 | 2012-11-08 | 주식회사 디지아이 | 레이저 직접 구조화용 조성물 및 이를 이용한 레이저 직접 구조화 방법 |
| KR102041646B1 (ko) * | 2014-05-13 | 2019-11-07 | 삼성전기주식회사 | 전극 구조체 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3841979A (en) * | 1971-08-20 | 1974-10-15 | M & T Chemicals Inc | Method of preparing surfaces for electroplating |
| US5004525A (en) * | 1988-08-23 | 1991-04-02 | Shipley Company Inc. | Copper electroplating composition |
| US5051154A (en) * | 1988-08-23 | 1991-09-24 | Shipley Company Inc. | Additive for acid-copper electroplating baths to increase throwing power |
| US4897165A (en) * | 1988-08-23 | 1990-01-30 | Shipley Company Inc. | Electroplating composition and process for plating through holes in printed circuit boards |
| US5328589A (en) * | 1992-12-23 | 1994-07-12 | Enthone-Omi, Inc. | Functional fluid additives for acid copper electroplating baths |
| TW593731B (en) * | 1998-03-20 | 2004-06-21 | Semitool Inc | Apparatus for applying a metal structure to a workpiece |
| KR100656581B1 (ko) * | 1998-09-03 | 2006-12-12 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판의 도금방법 및 장치 |
| EP1111096A3 (en) * | 1999-12-15 | 2004-02-11 | Shipley Company LLC | Seed layer repair method |
| US6354916B1 (en) * | 2000-02-11 | 2002-03-12 | Nu Tool Inc. | Modified plating solution for plating and planarization and process utilizing same |
| DE60123189T2 (de) * | 2000-10-13 | 2007-10-11 | Shipley Co., L.L.C., Marlborough | Keimschichtreparatur und Elektroplattierungsbad |
-
2001
- 2001-10-17 US US09/982,398 patent/US6660153B2/en not_active Expired - Fee Related
- 2001-10-19 JP JP2001322035A patent/JP2002294483A/ja not_active Withdrawn
- 2001-10-19 EP EP01308870A patent/EP1199383A3/en not_active Withdrawn
- 2001-10-19 KR KR1020010064675A patent/KR20020031075A/ko not_active Withdrawn
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