MX2021012121A - Un metodo para activar una superficie de un sustrato no conductor o que contiene fibras de carbono para metalizacion. - Google Patents
Un metodo para activar una superficie de un sustrato no conductor o que contiene fibras de carbono para metalizacion.Info
- Publication number
- MX2021012121A MX2021012121A MX2021012121A MX2021012121A MX2021012121A MX 2021012121 A MX2021012121 A MX 2021012121A MX 2021012121 A MX2021012121 A MX 2021012121A MX 2021012121 A MX2021012121 A MX 2021012121A MX 2021012121 A MX2021012121 A MX 2021012121A
- Authority
- MX
- Mexico
- Prior art keywords
- transition metal
- metal ions
- dissolved
- species
- metallization
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Abstract
La presente invención se relaciona con un método para activar una superficie de un sustrato no conductor o que contiene fibras de carbono para la metalización, el método comprende los pasos de (a) proporcionar el sustrato, (b) proporcionar una composición de activación acuosa, libre de paladio que comprende (i) primeras especies de iones de metal de transición disueltos y adicionalmente partículas de metal de los mismos, (ii) uno o más de un agente complejante, (iii) permanente o temporalmente uno o más de un agente reductor, (iv) opcionalmente una o más de una segunda especie de iones metal disueltos que es diferente de la primera especie, donde - al menos de las primera especies, los iones de metal de transición disueltos y las partículas de metal de los mismos están presentes en un equilibrio reversible, con la condición de que - las partículas de metal se forman a partir de los iones de metal de transición disueltos a través de una reducción continua o semicontinua a través de uno o más de un agente reductor, - los iones de metal de transición disueltos se forman a partir partículas de metal a través de la oxidación continua o semicontinua de las partículas y - los iones de metal de transición disueltos y las partículas de metal de los mismos, respectivamente, se involucran repetidamente en la reducción y la oxidación de modo que se forman aglomerados precipitantes de las partículas de metal, (c) poner en contacto el sustrato con la composición de activación de modo que se deposite un metal de transición o una aleación de metal de transición sobre la superficie del sustrato y se obtiene una superficie activada para la metalización.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19167282 | 2019-04-04 | ||
| PCT/EP2020/059313 WO2020201387A1 (en) | 2019-04-04 | 2020-04-01 | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX2021012121A true MX2021012121A (es) | 2021-11-03 |
Family
ID=66092168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX2021012121A MX2021012121A (es) | 2019-04-04 | 2020-04-01 | Un metodo para activar una superficie de un sustrato no conductor o que contiene fibras de carbono para metalizacion. |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20220154343A1 (es) |
| EP (1) | EP3947772A1 (es) |
| JP (1) | JP7455859B2 (es) |
| KR (1) | KR20210143882A (es) |
| CN (1) | CN113614283A (es) |
| BR (1) | BR112021016763A2 (es) |
| CA (1) | CA3135816A1 (es) |
| MX (1) | MX2021012121A (es) |
| SG (1) | SG11202109533QA (es) |
| TW (1) | TWI764121B (es) |
| WO (1) | WO2020201387A1 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202208681A (zh) | 2020-08-27 | 2022-03-01 | 德商德國艾托特克公司 | 活化用於金屬化之非導電或含碳纖維基材之表面的方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4278712A (en) | 1978-08-31 | 1981-07-14 | Surface Technology, Inc. | Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating |
| US4600699A (en) * | 1983-02-14 | 1986-07-15 | Enthone, Incorporated | Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters |
| US4820547A (en) * | 1987-04-24 | 1989-04-11 | Surface Technology, Inc. | Activators for colloidal catalysts in electroless plating processes |
| US5421989A (en) * | 1993-08-31 | 1995-06-06 | Atotech Deutschland Gmbh | Process for the metallization of nonconductive substrates with elimination of electroless metallization |
| KR20060128739A (ko) * | 2005-06-10 | 2006-12-14 | 엔쏜 인코포레이티드 | 비-전도성 기판의 직접적인 금속화 방법 |
| US20080245184A1 (en) * | 2006-06-15 | 2008-10-09 | Woo Ram Lee | Preparation method of metal nano particle using micro mixer |
| EP1876262A1 (en) | 2006-07-07 | 2008-01-09 | Rohm and Haas Electronic Materials, L.L.C. | Environmentally friendly electroless copper compositions |
| FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
| US20140242264A1 (en) | 2011-10-05 | 2014-08-28 | Atotech Deutschland Gmbh | Formaldehyde-free electroless copper plating solution |
| JP6145681B2 (ja) * | 2014-02-07 | 2017-06-14 | 石原ケミカル株式会社 | 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法 |
| EP3181724A3 (en) | 2015-12-14 | 2017-08-16 | Rohm and Haas Electronic Materials LLC | Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes |
| US10151035B2 (en) * | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
| CN107460459A (zh) * | 2017-06-29 | 2017-12-12 | 深圳安德万斯新材料科技有限公司 | 一种纳米铜活化液及其制备方法 |
-
2020
- 2020-04-01 SG SG11202109533Q patent/SG11202109533QA/en unknown
- 2020-04-01 US US17/433,065 patent/US20220154343A1/en active Pending
- 2020-04-01 KR KR1020217034886A patent/KR20210143882A/ko not_active Application Discontinuation
- 2020-04-01 CN CN202080023050.5A patent/CN113614283A/zh active Pending
- 2020-04-01 BR BR112021016763-3A patent/BR112021016763A2/pt unknown
- 2020-04-01 EP EP20713937.9A patent/EP3947772A1/en active Pending
- 2020-04-01 JP JP2021558929A patent/JP7455859B2/ja active Active
- 2020-04-01 TW TW109111142A patent/TWI764121B/zh active
- 2020-04-01 MX MX2021012121A patent/MX2021012121A/es unknown
- 2020-04-01 CA CA3135816A patent/CA3135816A1/en active Pending
- 2020-04-01 WO PCT/EP2020/059313 patent/WO2020201387A1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020201387A1 (en) | 2020-10-08 |
| SG11202109533QA (en) | 2021-10-28 |
| EP3947772A1 (en) | 2022-02-09 |
| US20220154343A1 (en) | 2022-05-19 |
| BR112021016763A2 (pt) | 2021-10-13 |
| JP7455859B2 (ja) | 2024-03-26 |
| JP2022527973A (ja) | 2022-06-07 |
| CA3135816A1 (en) | 2020-10-08 |
| KR20210143882A (ko) | 2021-11-29 |
| TW202041712A (zh) | 2020-11-16 |
| TWI764121B (zh) | 2022-05-11 |
| CN113614283A (zh) | 2021-11-05 |
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