JP7455859B2 - 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法 - Google Patents
非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法 Download PDFInfo
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- JP7455859B2 JP7455859B2 JP2021558929A JP2021558929A JP7455859B2 JP 7455859 B2 JP7455859 B2 JP 7455859B2 JP 2021558929 A JP2021558929 A JP 2021558929A JP 2021558929 A JP2021558929 A JP 2021558929A JP 7455859 B2 JP7455859 B2 JP 7455859B2
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- 239000008273 gelatin Substances 0.000 description 1
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- 235000019322 gelatine Nutrition 0.000 description 1
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- 238000007689 inspection Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910001437 manganese ion Inorganic materials 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000002082 metal nanoparticle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
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- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
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- 239000001267 polyvinylpyrrolidone Substances 0.000 description 1
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
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- 108090000623 proteins and genes Proteins 0.000 description 1
- 102000004169 proteins and genes Human genes 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 125000000719 pyrrolidinyl group Chemical group 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 239000013074 reference sample Substances 0.000 description 1
- 238000002407 reforming Methods 0.000 description 1
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- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
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- 235000000346 sugar Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 150000008163 sugars Chemical class 0.000 description 1
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- 125000000542 sulfonic acid group Chemical group 0.000 description 1
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- 239000004094 surface-active agent Substances 0.000 description 1
- ODBLHEXUDAPZAU-UHFFFAOYSA-N threo-D-isocitric acid Natural products OC(=O)C(O)C(C(O)=O)CC(O)=O ODBLHEXUDAPZAU-UHFFFAOYSA-N 0.000 description 1
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- 229920001567 vinyl ester resin Polymers 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP19167282.3 | 2019-04-04 | ||
| EP19167282 | 2019-04-04 | ||
| PCT/EP2020/059313 WO2020201387A1 (en) | 2019-04-04 | 2020-04-01 | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2022527973A JP2022527973A (ja) | 2022-06-07 |
| JP7455859B2 true JP7455859B2 (ja) | 2024-03-26 |
Family
ID=66092168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021558929A Active JP7455859B2 (ja) | 2019-04-04 | 2020-04-01 | 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US20220154343A1 (es) |
| EP (1) | EP3947772A1 (es) |
| JP (1) | JP7455859B2 (es) |
| KR (1) | KR20210143882A (es) |
| CN (1) | CN113614283A (es) |
| BR (1) | BR112021016763A2 (es) |
| CA (1) | CA3135816A1 (es) |
| MX (1) | MX2021012121A (es) |
| SG (1) | SG11202109533QA (es) |
| TW (1) | TWI764121B (es) |
| WO (1) | WO2020201387A1 (es) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20230054852A (ko) | 2020-08-27 | 2023-04-25 | 아토테크 도이칠란트 게엠베하 운트 콤파니 카게 | 금속화를 위해 비전도성 또는 탄소 섬유 함유 기재의 표면을 활성화하는 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080245184A1 (en) | 2006-06-15 | 2008-10-09 | Woo Ram Lee | Preparation method of metal nano particle using micro mixer |
| JP2015147987A (ja) | 2014-02-07 | 2015-08-20 | 石原ケミカル株式会社 | 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法 |
| JP2017110297A (ja) | 2015-12-14 | 2017-06-22 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | プリント回路基板及びスルーホールの無電解金属化のための環境に優しい安定触媒 |
| CN107460459A (zh) | 2017-06-29 | 2017-12-12 | 深圳安德万斯新材料科技有限公司 | 一种纳米铜活化液及其制备方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4278712A (en) * | 1978-08-31 | 1981-07-14 | Surface Technology, Inc. | Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating |
| US4600699A (en) * | 1983-02-14 | 1986-07-15 | Enthone, Incorporated | Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters |
| US4820547A (en) * | 1987-04-24 | 1989-04-11 | Surface Technology, Inc. | Activators for colloidal catalysts in electroless plating processes |
| US5421989A (en) * | 1993-08-31 | 1995-06-06 | Atotech Deutschland Gmbh | Process for the metallization of nonconductive substrates with elimination of electroless metallization |
| ES2622411T3 (es) * | 2005-06-10 | 2017-07-06 | Enthone, Inc. | Procedimiento para la metalización directa de sustratos no conductores |
| EP1876262A1 (en) | 2006-07-07 | 2008-01-09 | Rohm and Haas Electronic Materials, L.L.C. | Environmentally friendly electroless copper compositions |
| FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
| JP6180419B2 (ja) | 2011-10-05 | 2017-08-16 | アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング | ホルムアルデヒドのない無電解銅めっき溶液 |
| US10151035B2 (en) * | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
-
2020
- 2020-04-01 US US17/433,065 patent/US20220154343A1/en not_active Abandoned
- 2020-04-01 CA CA3135816A patent/CA3135816A1/en active Pending
- 2020-04-01 CN CN202080023050.5A patent/CN113614283A/zh active Pending
- 2020-04-01 BR BR112021016763-3A patent/BR112021016763A2/pt unknown
- 2020-04-01 EP EP20713937.9A patent/EP3947772A1/en active Pending
- 2020-04-01 KR KR1020217034886A patent/KR20210143882A/ko not_active Application Discontinuation
- 2020-04-01 JP JP2021558929A patent/JP7455859B2/ja active Active
- 2020-04-01 MX MX2021012121A patent/MX2021012121A/es unknown
- 2020-04-01 WO PCT/EP2020/059313 patent/WO2020201387A1/en unknown
- 2020-04-01 TW TW109111142A patent/TWI764121B/zh active
- 2020-04-01 SG SG11202109533Q patent/SG11202109533QA/en unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080245184A1 (en) | 2006-06-15 | 2008-10-09 | Woo Ram Lee | Preparation method of metal nano particle using micro mixer |
| JP2015147987A (ja) | 2014-02-07 | 2015-08-20 | 石原ケミカル株式会社 | 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法 |
| JP2017110297A (ja) | 2015-12-14 | 2017-06-22 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ | プリント回路基板及びスルーホールの無電解金属化のための環境に優しい安定触媒 |
| CN107460459A (zh) | 2017-06-29 | 2017-12-12 | 深圳安德万斯新材料科技有限公司 | 一种纳米铜活化液及其制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2021012121A (es) | 2021-11-03 |
| CN113614283A (zh) | 2021-11-05 |
| CA3135816A1 (en) | 2020-10-08 |
| KR20210143882A (ko) | 2021-11-29 |
| WO2020201387A1 (en) | 2020-10-08 |
| BR112021016763A2 (pt) | 2021-10-13 |
| SG11202109533QA (en) | 2021-10-28 |
| TW202041712A (zh) | 2020-11-16 |
| US20220154343A1 (en) | 2022-05-19 |
| JP2022527973A (ja) | 2022-06-07 |
| TWI764121B (zh) | 2022-05-11 |
| EP3947772A1 (en) | 2022-02-09 |
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