WO2006035397A3 - Aussenstromlos aufgebrachte nickellegierung - Google Patents

Aussenstromlos aufgebrachte nickellegierung Download PDF

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Publication number
WO2006035397A3
WO2006035397A3 PCT/IB2005/053173 IB2005053173W WO2006035397A3 WO 2006035397 A3 WO2006035397 A3 WO 2006035397A3 IB 2005053173 W IB2005053173 W IB 2005053173W WO 2006035397 A3 WO2006035397 A3 WO 2006035397A3
Authority
WO
WIPO (PCT)
Prior art keywords
nickel
nickel alloy
carboxylic acid
complexing agent
different
Prior art date
Application number
PCT/IB2005/053173
Other languages
English (en)
French (fr)
Other versions
WO2006035397A2 (de
Inventor
Doris Bialkowski
Alfons Hollaender
Original Assignee
Ahc Oberflaechentechnik Gmbh
Doris Bialkowski
Alfons Hollaender
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35613047&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2006035397(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ahc Oberflaechentechnik Gmbh, Doris Bialkowski, Alfons Hollaender filed Critical Ahc Oberflaechentechnik Gmbh
Priority to US11/576,177 priority Critical patent/US20080196625A1/en
Priority to EP05784829A priority patent/EP1799881A2/de
Publication of WO2006035397A2 publication Critical patent/WO2006035397A2/de
Publication of WO2006035397A3 publication Critical patent/WO2006035397A3/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys
    • C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
    • C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
    • C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemically Coating (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

Auf einer metallischen Substratoberfläche befindliche, bleifreie Nickelphosphor-Disper­sionslegierung, erhältlich durch außenstromlose Abscheidung in einem Elektrolyten, der 4 bis 7 g/l Nickelionen; 15 bis 40 g/l Hypophospit; mindestens einen Stabilisator; 5 bis 400 mg/l eines Alkylaryloxydialkylbenzylammoniumchlorids oder eines teilweise fluorierten Betains; 50 bis 60 g/l eines carbonsäurehaltigen Komplexbildners A; 5 bis 40 g/l eines von A verschiedenen, carbonsäurehaltigen Komplexbildners B; 4 bis 10 g/l dispergierte Partikel, die sich von der Zusammensetzung Nickel/Phosphor-Legierung unterscheiden; und keine Borsäure oder Borate enthält, sowie damit beschichtete Gegenstände.
PCT/IB2005/053173 2004-09-28 2005-09-26 Aussenstromlos aufgebrachte nickellegierung WO2006035397A2 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US11/576,177 US20080196625A1 (en) 2004-09-28 2005-09-26 Non-Galvanically Applied Nickel Alloy
EP05784829A EP1799881A2 (de) 2004-09-28 2005-09-26 Aussenstromlos aufgebrachte nickellegierung

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004047423.0 2004-09-28
DE102004047423A DE102004047423C5 (de) 2004-09-28 2004-09-28 Außenstromlos aufgebrachte Nickellegierung und ihre Verwendung

Publications (2)

Publication Number Publication Date
WO2006035397A2 WO2006035397A2 (de) 2006-04-06
WO2006035397A3 true WO2006035397A3 (de) 2007-05-31

Family

ID=35613047

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2005/053173 WO2006035397A2 (de) 2004-09-28 2005-09-26 Aussenstromlos aufgebrachte nickellegierung

Country Status (4)

Country Link
US (1) US20080196625A1 (de)
EP (1) EP1799881A2 (de)
DE (1) DE102004047423C5 (de)
WO (1) WO2006035397A2 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8557100B2 (en) * 2008-10-16 2013-10-15 Atotech Deutschland Gmbh Metal plating additive, and method for plating substrates and products therefrom
DE102010011083B3 (de) * 2010-03-12 2011-06-16 Ks Gleitlager Gmbh Gleitlagerverbundwerkstoff
JP2012087386A (ja) * 2010-10-21 2012-05-10 Toyota Motor Corp 無電解ニッケルめっき浴およびそれを用いた無電解ニッケルめっき法
DE102011013881B3 (de) * 2011-03-04 2012-05-03 Ks Gleitlager Gmbh Gleitlagerverbundwerkstoff und daraus hergestelltes Gleitlagerelement
EP2809825B1 (de) * 2012-02-01 2018-07-18 ATOTECH Deutschland GmbH Stromloses vernickelungsbad
JP6631349B2 (ja) * 2015-03-26 2020-01-15 三菱マテリアル株式会社 アンモニウム塩を用いためっき液
GB2538283B (en) 2015-05-14 2021-06-23 Mahle Int Gmbh Plain bearing and method
DE102015210552A1 (de) * 2015-06-09 2016-12-15 Mahle International Gmbh Verfahren zum Beschichten eines Ventils einer Brennkraftmaschine
WO2017077655A1 (ja) * 2015-11-06 2017-05-11 株式会社Ｊｃｕ ニッケルめっき用添加剤およびこれを含有するサテンニッケルめっき浴
CN110892051A (zh) * 2017-07-10 2020-03-17 阿克伦大学 润滑系统中用于金属部件以改善摩擦性能的催化金属涂层
DE102018110905A1 (de) 2018-05-07 2019-11-07 Lucas Automotive Gmbh Elektrode für ein Eloxal-Verfahren
DE102018218205A1 (de) * 2018-10-24 2020-04-30 Mahle International Gmbh Gaswechselventil
CN112853415B (zh) * 2020-12-31 2022-09-02 江门市瑞期精细化学工程有限公司 一种镍磷合金电镀液及其应用
DE102022108533B4 (de) 2022-04-08 2024-06-20 CSB Chemische Spezialbeschichtungen GmbH Verfahren zur Herstellung einer chemisch NiP-Elektrolytdispersion mit einzulagernden Feststoffpartikeln

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US5232744A (en) * 1991-02-21 1993-08-03 C. Uyemura & Co., Ltd. Electroless composite plating bath and method
EP1020542A2 (de) * 1999-01-12 2000-07-19 C. Uyemura & Co, Ltd Lösung zur stromlosen Plattierung von Kompositen und Verfahren zur stromlosen Plattierung von Kompositen
WO2002034964A1 (de) * 2000-10-25 2002-05-02 Ahc Oberflächentechnik Gmbh & Co. Ohg Bleifreie chemisch-nickel-legierung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2884344A (en) * 1957-10-07 1959-04-28 Reynolds Metals Co Nickel plating
US3663377A (en) * 1970-05-08 1972-05-16 Habet M Khelghatian Electroplatable polyolefins
EP0132594B1 (de) * 1983-07-25 1988-09-07 Hitachi, Ltd. Lösung zum stromlosen Plattieren mit Kupfer
AU555641B2 (en) * 1984-03-05 1986-10-02 Omi International Corp. Aqueous electroless nickel plating bath
US4716059A (en) * 1987-02-26 1987-12-29 Allied Corporation Composites of metal with carbon fluoride and method of preparation
US4997686A (en) * 1987-12-23 1991-03-05 Surface Technology, Inc. Composite electroless plating-solutions, processes, and articles thereof
US4873136A (en) * 1988-06-16 1989-10-10 General Electric Company Method for preparing polymer surfaces for subsequent plating thereon, and improved metal-plated plastic articles made therefrom
US5554211A (en) * 1995-11-15 1996-09-10 Mcgean-Rohco, Inc. Aqueous electroless plating solutions

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4483711A (en) * 1983-06-17 1984-11-20 Omi International Corporation Aqueous electroless nickel plating bath and process
US5232744A (en) * 1991-02-21 1993-08-03 C. Uyemura & Co., Ltd. Electroless composite plating bath and method
EP1020542A2 (de) * 1999-01-12 2000-07-19 C. Uyemura & Co, Ltd Lösung zur stromlosen Plattierung von Kompositen und Verfahren zur stromlosen Plattierung von Kompositen
WO2002034964A1 (de) * 2000-10-25 2002-05-02 Ahc Oberflächentechnik Gmbh & Co. Ohg Bleifreie chemisch-nickel-legierung

Also Published As

Publication number Publication date
DE102004047423B3 (de) 2006-02-09
WO2006035397A2 (de) 2006-04-06
DE102004047423C5 (de) 2011-04-21
EP1799881A2 (de) 2007-06-27
US20080196625A1 (en) 2008-08-21

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