AU1597501A - Process for the non-galvanic tin plating of copper or copper alloys - Google Patents

Process for the non-galvanic tin plating of copper or copper alloys

Info

Publication number
AU1597501A
AU1597501A AU15975/01A AU1597501A AU1597501A AU 1597501 A AU1597501 A AU 1597501A AU 15975/01 A AU15975/01 A AU 15975/01A AU 1597501 A AU1597501 A AU 1597501A AU 1597501 A AU1597501 A AU 1597501A
Authority
AU
Australia
Prior art keywords
copper
tin
tin plating
galvanic
copper alloys
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU15975/01A
Inventor
Jane Bell
Joachim Heyer
Jurgen Hupe
Ingo Kalker
Marlies Kleinfeld
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Enthone Inc
Original Assignee
Enthone OMI Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7928903&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU1597501(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Enthone OMI Inc filed Critical Enthone OMI Inc
Publication of AU1597501A publication Critical patent/AU1597501A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Conductive Materials (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the tin layer.
AU15975/01A 1999-11-12 2000-11-09 Process for the non-galvanic tin plating of copper or copper alloys Abandoned AU1597501A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19954613A DE19954613A1 (en) 1999-11-12 1999-11-12 Process for electroless tinning of copper or copper alloys
DE19954613 1999-11-12
PCT/US2000/030983 WO2001034310A1 (en) 1999-11-12 2000-11-09 Process for the non-galvanic tin plating of copper or copper alloys

Publications (1)

Publication Number Publication Date
AU1597501A true AU1597501A (en) 2001-06-06

Family

ID=7928903

Family Applications (1)

Application Number Title Priority Date Filing Date
AU15975/01A Abandoned AU1597501A (en) 1999-11-12 2000-11-09 Process for the non-galvanic tin plating of copper or copper alloys

Country Status (7)

Country Link
EP (1) EP1230034B1 (en)
JP (1) JP4084569B2 (en)
CN (1) CN1192125C (en)
AT (1) ATE480340T1 (en)
AU (1) AU1597501A (en)
DE (2) DE19954613A1 (en)
WO (1) WO2001034310A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4998704B2 (en) 2007-01-22 2012-08-15 上村工業株式会社 Method for forming substituted tin alloy plating film, substituted tin alloy plating bath, and method for maintaining plating performance
US9175400B2 (en) * 2009-10-28 2015-11-03 Enthone Inc. Immersion tin silver plating in electronics manufacture
DE102010031181A1 (en) * 2010-07-09 2012-01-12 Atotech Deutschland Gmbh Method and arrangement for depositing a metal layer
JP5830242B2 (en) * 2010-12-28 2015-12-09 ローム・アンド・ハース電子材料株式会社 Method for removing impurities from plating solution
JP5715411B2 (en) * 2010-12-28 2015-05-07 ローム・アンド・ハース電子材料株式会社 Method for removing impurities from plating solution
JP5937320B2 (en) * 2011-09-14 2016-06-22 ローム・アンド・ハース電子材料株式会社 Method for removing impurities from plating solution
MA37931A1 (en) * 2012-08-13 2016-07-29 Teni Boulikas Improved methods for treating cancer with reduced renal toxicity

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4749626A (en) 1985-08-05 1988-06-07 Olin Corporation Whisker resistant tin coatings and baths and methods for making such coatings
US5160422A (en) * 1989-05-29 1992-11-03 Shimizu Co., Ltd. Bath for immersion plating tin-lead alloys
JP2833026B2 (en) 1989-07-05 1998-12-09 上村工業株式会社 Electroless tin plating method
US5266103A (en) * 1991-07-04 1993-11-30 C. Uyemura & Co., Ltd. Bath and method for the electroless plating of tin and tin-lead alloy
US5211831A (en) 1991-11-27 1993-05-18 Mcgean-Rohco, Inc. Process for extending the life of a displacement plating bath
US5217751A (en) * 1991-11-27 1993-06-08 Mcgean-Rohco, Inc. Stabilized spray displacement plating process
JP3274232B2 (en) * 1993-06-01 2002-04-15 ディップソール株式会社 Tin-bismuth alloy plating bath and plating method using the same
US5391402A (en) * 1993-12-03 1995-02-21 Motorola Immersion plating of tin-bismuth solder
JP3419995B2 (en) 1996-05-10 2003-06-23 株式会社大和化成研究所 Electroless tin-silver alloy plating bath
JP3660777B2 (en) * 1997-03-06 2005-06-15 日本エレクトロプレイテイング・エンジニヤース株式会社 Method for forming tin alloy film and tin alloy plating bath

Also Published As

Publication number Publication date
EP1230034A4 (en) 2003-01-08
EP1230034A1 (en) 2002-08-14
CN1192125C (en) 2005-03-09
ATE480340T1 (en) 2010-09-15
CN1387465A (en) 2002-12-25
JP2003514120A (en) 2003-04-15
DE60044943D1 (en) 2010-10-21
WO2001034310A1 (en) 2001-05-17
EP1230034B1 (en) 2010-09-08
JP4084569B2 (en) 2008-04-30
DE19954613A1 (en) 2001-05-17

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase