CN1387465A - Process for non-galvanic tin plating of copper or copper alloys - Google Patents
Process for non-galvanic tin plating of copper or copper alloys Download PDFInfo
- Publication number
- CN1387465A CN1387465A CN00815462.7A CN00815462A CN1387465A CN 1387465 A CN1387465 A CN 1387465A CN 00815462 A CN00815462 A CN 00815462A CN 1387465 A CN1387465 A CN 1387465A
- Authority
- CN
- China
- Prior art keywords
- copper
- tin
- electrolyte
- layer
- complexing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
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- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Conductive Materials (AREA)
- Manufacture And Refinement Of Metals (AREA)
- Electrolytic Production Of Metals (AREA)
Abstract
The invention describes a process for non-galvanic tin plating of copper and copper alloys by precipitation of tin from methanesulphonic acid and tin-containing electrolytes, containing a complexing agent. In describing a process by which a durable tin layer which can be soldered is created, which, at the same time, prevents liberation of the base material, this invention discloses that the electrolytes have at least one foreign metal added to form a diffusion barrier in the tin layer.
Description
The present invention relates to the method for coming copper or copper alloy are carried out non-galvanic tin plating by deposit tin from the electrolyte of stanniferous, this electrolyte is made up of methanesulfonic acid and complexing agent.
Electroless coating tin deposition based on acid and alkaline electrolyte is well known in the prior art, also uses always.Basically be copper and copper alloy to be carried out plating tin, for example be used for pipeline, pipeline section and accessory, cell terminal, lavatory tube connector and the conductor structure of cold water and hot water by ion exchange process.As the source of electrolyte tin, mainly use stannous salt, for example stannic chloride, STANNOUS SULPHATE CRYSTALLINE, tetrafluoro boric acid tin or tin methane sulfonate.
Be implemented in the tin layer that forms electroless deposition on the copper and copper alloy by copper being replaced as tin, thereby can remove copper by complexing agent.
In DE 197 49 328 A1, method in common has been described.The method that the there is described refers to carries out zinc-plated on pipeline, pipeline section and the accessory of copper or copper alloy by chemical deposition tin layer.Suggestion with methanesulfonic acid, tin methane sulfonate, complexing agent and wetting agent as electrolyte.
Tin layer with hitherto known tin deposition process preparation can increase up to no longer including the tin layer of surperficial copper by porous always.Therefore obtainable bed thickness maximum is limited to 2 microns.Its shortcoming is to take place from matrix material, the particularly diffusion of the metal from the matrix material of alloying element, and this can cause unwanted results.For example, thereby the copper of drinking water pipeline may dissolve and enter in the water by tin diffusion, and this impairs health.And, deposit general tin layer and can not prevent from for example from the soldering matrix material, to discharge lead and zinc.In addition, also be a shortcoming owing to diffusion causes the surface soldered difficulty of zinc-plated matrix material.
For fear of above-mentioned shortcoming, the objective of the invention is to design and a kind of copper and copper alloy is carried out the method for non-galvanic tin plating, by this method, can form the durable tin layer of easy welding, simultaneously, this method can prevent the release of matrix material.
As solution, the present invention's suggestion adds at least a external metal to form diffusion impervious layer in the tin layer in electrolyte.
The method of describing in according to the present invention, suggestion use the tin bath that contains at least a external metal to form the tin layer by chemical deposition.In tin bath, add external metal and can realize the inhibition useful, so just set up from preventing from from matrix material, to discharge the diffusion impervious layer of metal to a great extent to diffusion process.Obtained like this advantage is welding characteristic and the tin layer good durability good in the surface.
Therefore, the tin layer that forms by said method not only can form effective corrosion protection, and prevents the stable tin layer of the diffusion of releasable material from base layer basically by using external metal to form.Particularly from the angle of the copper tube of carrying drinking water, this is an advantage, yet, can prevent from the matrix brazing material to external diffusion lead and zinc by spreading stable tin layer.
According to characteristics of the present invention, suggestion as external metal, wherein uses indium to be proved to be effective especially with a kind of metal in silver, bismuth, nickel, titanium, zirconium and the indium.For in the tin layer, forming diffusion impervious layer, in tin bath, add at least a above-mentioned metal as external metal.
According to another characteristics of the present invention, use thiocarbamide and/or its derivative to be complexing agent.Thiocarbamide as complexing agent can make the copper ion of lotus positive electricity discharge.The copper thiourea complex that forms is soluble in electrolyte under greater than 28 ℃ temperature.As the result of complex copper, its current potential is compared decline with the current potential of tin.Then, the more tin deposition of inertia is arranged, so on copper, form the tin layer.The copper ion enrichment in electrolyte that discharges, thus when the concentration of copper during, no longer may operate economically greater than 7g/l, and because under these concentration, tin no longer deposits with gratifying speed.Therefore suggestion is removed copper by deposited copper-thiourea compound in electrolyte solution.In this way, can increase the service life of tin bath basically.By filtering, utilize another characteristics of the present invention can realize the deposition of copper-thiourea compound.
It is favourable that use is carried out the stable tin layer of electroless deposition diffusion according to tin bath of the present invention, and this tin bath preferably contains following ingredients:
1. Xi Yuan,
Stannous salt preferably, tin methane sulfonate for example is 1 to 30g/l tin in tin bath;
2. acid,
Preferably in the tin bath 5 to the methanesulfonic acid of 200g/l, thereby can think that the pH value of tin bath is 0 to 3;
3. complexing agent,
Thiocarbamide or derivatives thereof preferably, 10 to 200g/l;
4.1 wetting agent to 10g/l
5. at least a external metal,
A kind of metal in silver, bismuth, nickel, titanium, zirconium and the indium preferably, the ratio in tin bath are 1 to 500mg/l
In order to use the method for describing among the present invention, the operating temperature of suggestion tin bath is 35 to 80 ℃.In addition, when using described method, also can adopt conventional known method of the prior art.This comprises, for example the cleaning of workpiece, pickling and drying.
Draw according to the following examples about further details of the present invention, in each embodiment, all recommended a kind of electrolyte composition.
Embodiment 1
Thiocarbamide 100g/l
Methanesulfonic acid 100g/l
Tin methane sulfonate 5g/l tin
Wetting agent 5g/l
Bismuth 30mg/l
Embodiment 2
Thiocarbamide 100g/l
Methanesulfonic acid 100g/l
Tin methane sulfonate 15g/l tin
Wetting agent 3g/l
Antioxidant 5g/l
Titanium 5mg/l
Embodiment 3
Thiocarbamide 120g/l
Methanesulfonic acid 140g/l
Tin methane sulfonate 15g/l tin
Wetting agent 5g/l
Antioxidant 5g/l
Indium 50mg/l
By chemical deposition, the method that the present invention describes can form the stable tin layer of diffusion, thereby helps preventing discharging metal by the diffusion impervious layer that adds external metal formation from matrix material.In addition,,, might from electrolyte, remove the copper ion that from copper, discharges, realize prolongation tin bath service life so basically by filtering by using thiocarbamide as complexing agent.And, after this manner, quickened course of reaction basically.
Claims (5)
- One kind from methanesulfonic acid and stanniferous, contain the electrolyte of complexing agent by deposit tin copper and copper alloy carried out the method for non-galvanic tin plating, it is characterized in that electrolyte has at least a external metal that adds to set up diffusion impervious layer in the tin layer.
- 2. according to the method for claim 1, it is characterized in that with a kind of metal in silver, bismuth, nickel, titanium, zirconium and the indium as external metal.
- 3. according to the method for claim 1 and 2, it is characterized in that with thiocarbamide and/or its derivative as complexing agent
- 4. according to the method for any one claim of front, it is characterized in that upgrading electrolyte by the copper that the deposition of copper-thiourea compound is removed in the solution.
- 5. according to the method for claim 4, it is characterized in that copper-thiourea compound filters out.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19954613A DE19954613A1 (en) | 1999-11-12 | 1999-11-12 | Process for electroless tinning of copper or copper alloys |
| DE19954613.4 | 1999-11-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1387465A true CN1387465A (en) | 2002-12-25 |
| CN1192125C CN1192125C (en) | 2005-03-09 |
Family
ID=7928903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB008154627A Expired - Lifetime CN1192125C (en) | 1999-11-12 | 2000-11-09 | Process for non-galvanic tin plating of copper or copper alloys |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP1230034B1 (en) |
| JP (1) | JP4084569B2 (en) |
| CN (1) | CN1192125C (en) |
| AT (1) | ATE480340T1 (en) |
| AU (1) | AU1597501A (en) |
| DE (2) | DE19954613A1 (en) |
| WO (1) | WO2001034310A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052736A (en) * | 2010-07-09 | 2013-04-17 | 埃托特克德国有限公司 | Method and arrangement for depositing a metal coating |
| TWI464295B (en) * | 2010-12-28 | 2014-12-11 | 羅門哈斯電子材料有限公司 | Method for removing impurities from plating solution |
| TWI471456B (en) * | 2011-09-14 | 2015-02-01 | 羅門哈斯電子材料有限公司 | Method of removing impurities from plating liquid |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4998704B2 (en) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | Method for forming substituted tin alloy plating film, substituted tin alloy plating bath, and method for maintaining plating performance |
| US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
| JP5715411B2 (en) * | 2010-12-28 | 2015-05-07 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
| MA37931A1 (en) * | 2012-08-13 | 2016-07-29 | Teni Boulikas | Improved methods for treating cancer with reduced renal toxicity |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
| US5160422A (en) * | 1989-05-29 | 1992-11-03 | Shimizu Co., Ltd. | Bath for immersion plating tin-lead alloys |
| JP2833026B2 (en) | 1989-07-05 | 1998-12-09 | 上村工業株式会社 | Electroless tin plating method |
| US5266103A (en) * | 1991-07-04 | 1993-11-30 | C. Uyemura & Co., Ltd. | Bath and method for the electroless plating of tin and tin-lead alloy |
| US5211831A (en) | 1991-11-27 | 1993-05-18 | Mcgean-Rohco, Inc. | Process for extending the life of a displacement plating bath |
| US5217751A (en) * | 1991-11-27 | 1993-06-08 | Mcgean-Rohco, Inc. | Stabilized spray displacement plating process |
| JP3274232B2 (en) * | 1993-06-01 | 2002-04-15 | ディップソール株式会社 | Tin-bismuth alloy plating bath and plating method using the same |
| US5391402A (en) * | 1993-12-03 | 1995-02-21 | Motorola | Immersion plating of tin-bismuth solder |
| JP3419995B2 (en) | 1996-05-10 | 2003-06-23 | 株式会社大和化成研究所 | Electroless tin-silver alloy plating bath |
| JP3660777B2 (en) * | 1997-03-06 | 2005-06-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Method for forming tin alloy film and tin alloy plating bath |
-
1999
- 1999-11-12 DE DE19954613A patent/DE19954613A1/en not_active Withdrawn
-
2000
- 2000-11-09 EP EP00978519A patent/EP1230034B1/en not_active Expired - Lifetime
- 2000-11-09 AU AU15975/01A patent/AU1597501A/en not_active Abandoned
- 2000-11-09 DE DE60044943T patent/DE60044943D1/en not_active Expired - Lifetime
- 2000-11-09 JP JP2001536299A patent/JP4084569B2/en not_active Expired - Lifetime
- 2000-11-09 WO PCT/US2000/030983 patent/WO2001034310A1/en active Application Filing
- 2000-11-09 CN CNB008154627A patent/CN1192125C/en not_active Expired - Lifetime
- 2000-11-09 AT AT00978519T patent/ATE480340T1/en not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103052736A (en) * | 2010-07-09 | 2013-04-17 | 埃托特克德国有限公司 | Method and arrangement for depositing a metal coating |
| TWI464295B (en) * | 2010-12-28 | 2014-12-11 | 羅門哈斯電子材料有限公司 | Method for removing impurities from plating solution |
| TWI471456B (en) * | 2011-09-14 | 2015-02-01 | 羅門哈斯電子材料有限公司 | Method of removing impurities from plating liquid |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1230034B1 (en) | 2010-09-08 |
| AU1597501A (en) | 2001-06-06 |
| JP2003514120A (en) | 2003-04-15 |
| ATE480340T1 (en) | 2010-09-15 |
| WO2001034310A1 (en) | 2001-05-17 |
| CN1192125C (en) | 2005-03-09 |
| DE19954613A1 (en) | 2001-05-17 |
| EP1230034A4 (en) | 2003-01-08 |
| EP1230034A1 (en) | 2002-08-14 |
| DE60044943D1 (en) | 2010-10-21 |
| JP4084569B2 (en) | 2008-04-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20050309 |
|
| CX01 | Expiry of patent term |