EP1230034A4 - Process for the non-galvanic tin plating of copper or copper alloys - Google Patents
Process for the non-galvanic tin plating of copper or copper alloysInfo
- Publication number
- EP1230034A4 EP1230034A4 EP00978519A EP00978519A EP1230034A4 EP 1230034 A4 EP1230034 A4 EP 1230034A4 EP 00978519 A EP00978519 A EP 00978519A EP 00978519 A EP00978519 A EP 00978519A EP 1230034 A4 EP1230034 A4 EP 1230034A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- tin
- tin plating
- galvanic
- copper alloys
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19954613 | 1999-11-12 | ||
DE19954613A DE19954613A1 (en) | 1999-11-12 | 1999-11-12 | Process for electroless tinning of copper or copper alloys |
PCT/US2000/030983 WO2001034310A1 (en) | 1999-11-12 | 2000-11-09 | Process for the non-galvanic tin plating of copper or copper alloys |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1230034A1 EP1230034A1 (en) | 2002-08-14 |
EP1230034A4 true EP1230034A4 (en) | 2003-01-08 |
EP1230034B1 EP1230034B1 (en) | 2010-09-08 |
Family
ID=7928903
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00978519A Expired - Lifetime EP1230034B1 (en) | 1999-11-12 | 2000-11-09 | Process for the non-galvanic tin plating of copper or copper alloys |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1230034B1 (en) |
JP (1) | JP4084569B2 (en) |
CN (1) | CN1192125C (en) |
AT (1) | ATE480340T1 (en) |
AU (1) | AU1597501A (en) |
DE (2) | DE19954613A1 (en) |
WO (1) | WO2001034310A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4998704B2 (en) | 2007-01-22 | 2012-08-15 | 上村工業株式会社 | Method for forming substituted tin alloy plating film, substituted tin alloy plating bath, and method for maintaining plating performance |
US9175400B2 (en) * | 2009-10-28 | 2015-11-03 | Enthone Inc. | Immersion tin silver plating in electronics manufacture |
DE102010031181A1 (en) * | 2010-07-09 | 2012-01-12 | Atotech Deutschland Gmbh | Method and arrangement for depositing a metal layer |
JP5830242B2 (en) * | 2010-12-28 | 2015-12-09 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
JP5715411B2 (en) * | 2010-12-28 | 2015-05-07 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
JP5937320B2 (en) * | 2011-09-14 | 2016-06-22 | ローム・アンド・ハース電子材料株式会社 | Method for removing impurities from plating solution |
MA37931A1 (en) * | 2012-08-13 | 2016-07-29 | Teni Boulikas | Improved methods for treating cancer with reduced renal toxicity |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5435838A (en) * | 1993-12-03 | 1995-07-25 | Motorola, Inc. | Immersion plating of tin-bismuth solder |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4749626A (en) | 1985-08-05 | 1988-06-07 | Olin Corporation | Whisker resistant tin coatings and baths and methods for making such coatings |
US5160422A (en) * | 1989-05-29 | 1992-11-03 | Shimizu Co., Ltd. | Bath for immersion plating tin-lead alloys |
JP2833026B2 (en) | 1989-07-05 | 1998-12-09 | 上村工業株式会社 | Electroless tin plating method |
US5266103A (en) * | 1991-07-04 | 1993-11-30 | C. Uyemura & Co., Ltd. | Bath and method for the electroless plating of tin and tin-lead alloy |
US5217751A (en) * | 1991-11-27 | 1993-06-08 | Mcgean-Rohco, Inc. | Stabilized spray displacement plating process |
US5211831A (en) | 1991-11-27 | 1993-05-18 | Mcgean-Rohco, Inc. | Process for extending the life of a displacement plating bath |
JP3274232B2 (en) * | 1993-06-01 | 2002-04-15 | ディップソール株式会社 | Tin-bismuth alloy plating bath and plating method using the same |
JP3419995B2 (en) | 1996-05-10 | 2003-06-23 | 株式会社大和化成研究所 | Electroless tin-silver alloy plating bath |
JP3660777B2 (en) * | 1997-03-06 | 2005-06-15 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Method for forming tin alloy film and tin alloy plating bath |
-
1999
- 1999-11-12 DE DE19954613A patent/DE19954613A1/en not_active Withdrawn
-
2000
- 2000-11-09 EP EP00978519A patent/EP1230034B1/en not_active Expired - Lifetime
- 2000-11-09 CN CNB008154627A patent/CN1192125C/en not_active Expired - Lifetime
- 2000-11-09 WO PCT/US2000/030983 patent/WO2001034310A1/en active Application Filing
- 2000-11-09 AT AT00978519T patent/ATE480340T1/en not_active IP Right Cessation
- 2000-11-09 DE DE60044943T patent/DE60044943D1/en not_active Expired - Lifetime
- 2000-11-09 AU AU15975/01A patent/AU1597501A/en not_active Abandoned
- 2000-11-09 JP JP2001536299A patent/JP4084569B2/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5435838A (en) * | 1993-12-03 | 1995-07-25 | Motorola, Inc. | Immersion plating of tin-bismuth solder |
Also Published As
Publication number | Publication date |
---|---|
JP4084569B2 (en) | 2008-04-30 |
ATE480340T1 (en) | 2010-09-15 |
AU1597501A (en) | 2001-06-06 |
DE19954613A1 (en) | 2001-05-17 |
CN1192125C (en) | 2005-03-09 |
WO2001034310A1 (en) | 2001-05-17 |
EP1230034B1 (en) | 2010-09-08 |
DE60044943D1 (en) | 2010-10-21 |
CN1387465A (en) | 2002-12-25 |
JP2003514120A (en) | 2003-04-15 |
EP1230034A1 (en) | 2002-08-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE275214T1 (en) | BATH AND METHOD FOR ELECTROLESS PLATING OF SILVER ON METALLIC SURFACES | |
CN1848305B (en) | Electronic assembly wire and flat cable comprising same | |
CN101636514B (en) | Printed board terminal | |
EP1230034A4 (en) | Process for the non-galvanic tin plating of copper or copper alloys | |
US6821323B1 (en) | Process for the non-galvanic tin plating of copper or copper alloys | |
TW429196B (en) | Lead-free weld powder and production method there of | |
EP1024211A3 (en) | Silver alloy plating bath and a method of forming a silver alloy film by means of the same | |
WO2002072923A3 (en) | Electrolyte media for the deposition of tin alloys and methods for depositing tin alloys | |
JP2011111663A (en) | REFLOW Sn PLATED MEMBER | |
JP2003049280A5 (en) | ||
EP1091023A3 (en) | Alloy composition and plating method | |
AU2001296025A1 (en) | Method for removing lead from plated cylindrical article made of lead-containingcopper alloy and metal fitting for hydrant, and method for preventing leaching of lead from article made of lead-containing copper alloy and metal fitting for hydrant | |
JP2001131663A (en) | Tin alloy for lead plating | |
JP2006265616A5 (en) | Lead-free tin alloy electroplating bath and dissolution current suppression type tin alloy electroplating method using the plating bath | |
JPH0711477A (en) | Noble metal plated article | |
JPH0611920B2 (en) | Multi-layer plated steel sheet with excellent solderability | |
HUP0302517A2 (en) | Low-alloy copper alloy and hollow section made of it | |
EP0638656A4 (en) | Alloy to be plated, its plating method and plating solution. | |
WO2004001101A3 (en) | Electrolytic bath for the electrodeposition of noble metals and their alloys | |
MY120262A (en) | Lead-free solder powder and process for preparing the same | |
KR100193189B1 (en) | Palladium-tin alloy plating compositions and plating methods for copper and iron-nickel alloys | |
GB2426766A (en) | Sn-zn alloy hot dip plated steel sheet | |
Selivanova | Tin-zinc electroplating of parts for soldering from acid bath | |
Mayes | Tin and tin alloy plating | |
TH53973B (en) | Tin plated electrical connectors |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20020508 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
AX | Request for extension of the european patent |
Free format text: AL;LT;LV;MK;RO;SI |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20021121 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
RIC1 | Information provided on ipc code assigned before grant |
Free format text: 7B 05D 1/18 A, 7C 23C 18/31 B, 7C 23C 18/48 B |
|
17Q | First examination report despatched |
Effective date: 20040820 |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
TPAC | Observations filed by third parties |
Free format text: ORIGINAL CODE: EPIDOSNTIPA |
|
GRAJ | Information related to disapproval of communication of intention to grant by the applicant or resumption of examination proceedings by the epo deleted |
Free format text: ORIGINAL CODE: EPIDOSDIGR1 |
|
17Q | First examination report despatched |
Effective date: 20040820 |
|
17Q | First examination report despatched |
Effective date: 20040820 |
|
TPAC | Observations filed by third parties |
Free format text: ORIGINAL CODE: EPIDOSNTIPA |
|
GRAP | Despatch of communication of intention to grant a patent |
Free format text: ORIGINAL CODE: EPIDOSNIGR1 |
|
GRAS | Grant fee paid |
Free format text: ORIGINAL CODE: EPIDOSNIGR3 |
|
GRAA | (expected) grant |
Free format text: ORIGINAL CODE: 0009210 |
|
AK | Designated contracting states |
Kind code of ref document: B1 Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
|
REG | Reference to a national code |
Ref country code: GB Ref legal event code: FG4D |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: EP |
|
REG | Reference to a national code |
Ref country code: IE Ref legal event code: FG4D |
|
REF | Corresponds to: |
Ref document number: 60044943 Country of ref document: DE Date of ref document: 20101021 Kind code of ref document: P |
|
REG | Reference to a national code |
Ref country code: NL Ref legal event code: VDEP Effective date: 20100908 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20101209 Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: GB Payment date: 20101118 Year of fee payment: 11 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20110110 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: BE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20101219 Ref country code: MC Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101130 |
|
REG | Reference to a national code |
Ref country code: CH Ref legal event code: PL |
|
PLBE | No opposition filed within time limit |
Free format text: ORIGINAL CODE: 0009261 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LI Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101130 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101130 |
|
26N | No opposition filed |
Effective date: 20110609 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R097 Ref document number: 60044943 Country of ref document: DE Effective date: 20110609 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101109 |
|
GBPC | Gb: european patent ceased through non-payment of renewal fee |
Effective date: 20111109 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20101109 |
|
PG25 | Lapsed in a contracting state [announced via postgrant information from national office to epo] |
Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20111109 Ref country code: TR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20100908 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 16 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 17 |
|
REG | Reference to a national code |
Ref country code: FR Ref legal event code: PLFP Year of fee payment: 18 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R082 Ref document number: 60044943 Country of ref document: DE Representative=s name: RAUSCH WANISCHECK-BERGMANN BRINKMANN PARTNERSC, DE |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: DE Payment date: 20191127 Year of fee payment: 20 |
|
PGFP | Annual fee paid to national office [announced via postgrant information from national office to epo] |
Ref country code: IT Payment date: 20191125 Year of fee payment: 20 Ref country code: FR Payment date: 20191125 Year of fee payment: 20 |
|
REG | Reference to a national code |
Ref country code: DE Ref legal event code: R071 Ref document number: 60044943 Country of ref document: DE |